TWI349163B - - Google Patents

Info

Publication number
TWI349163B
TWI349163B TW095120076A TW95120076A TWI349163B TW I349163 B TWI349163 B TW I349163B TW 095120076 A TW095120076 A TW 095120076A TW 95120076 A TW95120076 A TW 95120076A TW I349163 B TWI349163 B TW I349163B
Authority
TW
Taiwan
Application number
TW095120076A
Other languages
Chinese (zh)
Other versions
TW200719082A (en
Inventor
Teruhiro Uematsu
Toru Takahashi
Koji Saito
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200719082A publication Critical patent/TW200719082A/en
Application granted granted Critical
Publication of TWI349163B publication Critical patent/TWI349163B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095120076A 2005-06-20 2006-06-06 Photoresist film roll and method for producing the same TW200719082A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005179813A JP2006350245A (en) 2005-06-20 2005-06-20 Photoresist film roll and method for producing the same

Publications (2)

Publication Number Publication Date
TW200719082A TW200719082A (en) 2007-05-16
TWI349163B true TWI349163B (en) 2011-09-21

Family

ID=37570277

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120076A TW200719082A (en) 2005-06-20 2006-06-06 Photoresist film roll and method for producing the same

Country Status (5)

Country Link
JP (1) JP2006350245A (en)
KR (1) KR20080016941A (en)
CN (1) CN101203807B (en)
TW (1) TW200719082A (en)
WO (1) WO2006137243A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5109606B2 (en) * 2007-11-15 2012-12-26 コニカミノルタホールディングス株式会社 Organic electroluminescence device manufacturing method and protective film
JP5181224B2 (en) * 2008-04-28 2013-04-10 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method, and printed wiring board manufacturing method
CN105676593B (en) * 2016-01-19 2019-07-16 杭州福斯特应用材料股份有限公司 A kind of photosensitive dry film of stable storing and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5246901U (en) * 1975-09-30 1977-04-02
JPS5611407Y2 (en) * 1976-10-02 1981-03-14
JPS61279847A (en) * 1985-06-05 1986-12-10 Nitto Electric Ind Co Ltd Image forming material
JPH0810790B2 (en) * 1988-04-27 1996-01-31 ソマール株式会社 Printed circuit board cover lay film pressing sheet
JP2730630B2 (en) * 1988-08-19 1998-03-25 日立化成工業 株式会社 Laminated element and method for preventing oozing thereof
JPH05267831A (en) * 1992-03-17 1993-10-15 Matsushita Electric Ind Co Ltd Manufacture of printed wiring board and manufacture of dry film for printed wiring board
KR970009975B1 (en) * 1993-12-31 1997-06-19 Hyundai Electronics Ind Patterning method of photoresist for charge storage electrode in the semiconductor device
KR100399444B1 (en) * 1995-06-30 2004-04-29 주식회사 하이닉스반도체 Edge reinforced phase reversal mask and its manufacturing method
JPH10115912A (en) * 1996-10-09 1998-05-06 Dainippon Printing Co Ltd Method for laminating photosensitive dry film resist
JPH1124251A (en) * 1997-06-30 1999-01-29 Dainippon Printing Co Ltd Dry film, manufacture thereof, method and device for transferring to the dry film
JP2000058506A (en) * 1998-08-06 2000-02-25 Mitsubishi Electric Corp Manufacture of semiconductor device and semiconductor device
JP2002099079A (en) * 2000-09-22 2002-04-05 Hitachi Chem Co Ltd Packaged body, method of packaging photosensitive element, method of preventing edge fusion of photosensitive element, and method of preventing winding dislocation of photosensitive element
JP2004034439A (en) * 2002-07-02 2004-02-05 Nec Kagoshima Ltd Laminator

Also Published As

Publication number Publication date
WO2006137243A1 (en) 2006-12-28
TW200719082A (en) 2007-05-16
JP2006350245A (en) 2006-12-28
KR20080016941A (en) 2008-02-22
CN101203807B (en) 2011-09-14
CN101203807A (en) 2008-06-18

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