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Application filed by Chin Yee Chemical Industres Co LtdfiledCriticalChin Yee Chemical Industres Co Ltd
Priority to TW096124947ApriorityCriticalpatent/TWI347355B/en
Publication of TW200902691ApublicationCriticalpatent/TW200902691A/en
Application grantedgrantedCritical
Publication of TWI347355BpublicationCriticalpatent/TWI347355B/en
A resin composition for forming a bonding layer of a multilayer flexible printed circuit board, a resin varnish, a porous flexible printed circuit board, and a multilayer flexible printed circuit board