TWI347155B - - Google Patents

Info

Publication number
TWI347155B
TWI347155B TW094118442A TW94118442A TWI347155B TW I347155 B TWI347155 B TW I347155B TW 094118442 A TW094118442 A TW 094118442A TW 94118442 A TW94118442 A TW 94118442A TW I347155 B TWI347155 B TW I347155B
Authority
TW
Taiwan
Application number
TW094118442A
Other languages
Chinese (zh)
Other versions
TW200601915A (en
Inventor
Ohazama Hidetaka
Original Assignee
Pioneer Tohoku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Tohoku Corp filed Critical Pioneer Tohoku Corp
Publication of TW200601915A publication Critical patent/TW200601915A/en
Application granted granted Critical
Publication of TWI347155B publication Critical patent/TWI347155B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW094118442A 2004-06-28 2005-06-03 Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus TW200601915A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004189980A JP4443324B2 (en) 2004-06-28 2004-06-28 Flexible wiring board and manufacturing method thereof, semiconductor chip mounting flexible wiring board, electronic device

Publications (2)

Publication Number Publication Date
TW200601915A TW200601915A (en) 2006-01-01
TWI347155B true TWI347155B (en) 2011-08-11

Family

ID=35780090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118442A TW200601915A (en) 2004-06-28 2005-06-03 Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus

Country Status (4)

Country Link
JP (1) JP4443324B2 (en)
KR (1) KR20060048605A (en)
CN (2) CN1717147B (en)
TW (1) TW200601915A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934325B2 (en) 2006-02-17 2012-05-16 株式会社フジクラ Printed wiring board connection structure and printed wiring board connection method
CN101206681B (en) * 2006-12-21 2011-05-18 英业达股份有限公司 Signal wire regulation means and system
CN201007989Y (en) 2007-02-06 2008-01-16 北京京东方光电科技有限公司 Left-and-right pendulum type wiring structure
CN102131344B (en) * 2009-11-19 2013-01-09 友达光电股份有限公司 Layout method and circuit board
JP5528906B2 (en) * 2010-05-28 2014-06-25 株式会社ジャパンディスプレイ Display device
CN103928415A (en) * 2013-03-01 2014-07-16 厦门天马微电子有限公司 Structure of pin region
US10149382B2 (en) 2016-11-18 2018-12-04 Ricoh Company, Ltd. Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus
JP7006062B2 (en) * 2016-11-18 2022-02-10 株式会社リコー Wiring board, wiring member, liquid discharge head, liquid discharge unit, liquid discharge device
CN107203075B (en) * 2017-05-22 2020-02-07 京东方科技集团股份有限公司 Touch display panel and liquid crystal display device
JP7306337B2 (en) * 2020-06-25 2023-07-11 トヨタ自動車株式会社 Wiring board manufacturing method
WO2023087210A1 (en) * 2021-11-18 2023-05-25 Boe Technology Group Co., Ltd. Driving apparatus, display apparatus, and method of fabricating driving apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204067A (en) * 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd Method of manufacturing circuit board module

Also Published As

Publication number Publication date
JP2006013230A (en) 2006-01-12
CN101674705A (en) 2010-03-17
JP4443324B2 (en) 2010-03-31
CN1717147A (en) 2006-01-04
CN1717147B (en) 2010-05-05
KR20060048605A (en) 2006-05-18
CN101674705B (en) 2011-12-28
TW200601915A (en) 2006-01-01

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