TWI346648B - - Google Patents
Info
- Publication number
- TWI346648B TWI346648B TW093116023A TW93116023A TWI346648B TW I346648 B TWI346648 B TW I346648B TW 093116023 A TW093116023 A TW 093116023A TW 93116023 A TW93116023 A TW 93116023A TW I346648 B TWI346648 B TW I346648B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003158802 | 2003-06-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200503952A TW200503952A (en) | 2005-02-01 |
| TWI346648B true TWI346648B (en) | 2011-08-11 |
Family
ID=37131018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093116023A TW200503952A (en) | 2003-06-04 | 2004-06-03 | Corundum for filling in resin and resin composition |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100709548B1 (en) |
| TW (1) | TW200503952A (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW197458B (en) * | 1991-02-14 | 1993-01-01 | Ciba Geigy Ag | |
| US5929138A (en) | 1996-11-05 | 1999-07-27 | Raychem Corporation | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
| US6096414A (en) | 1997-11-25 | 2000-08-01 | Parker-Hannifin Corporation | High dielectric strength thermal interface material |
| JP3444199B2 (en) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | Thermal conductive silicone rubber composition and method for producing the same |
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2004
- 2004-06-03 KR KR1020057023150A patent/KR100709548B1/en active IP Right Grant
- 2004-06-03 TW TW093116023A patent/TW200503952A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060025545A (en) | 2006-03-21 |
| TW200503952A (en) | 2005-02-01 |
| KR100709548B1 (en) | 2007-04-20 |