TWI340418B - Intergrated circuit device, chip, and method of fabricating the same - Google Patents

Intergrated circuit device, chip, and method of fabricating the same

Info

Publication number
TWI340418B
TWI340418B TW095141459A TW95141459A TWI340418B TW I340418 B TWI340418 B TW I340418B TW 095141459 A TW095141459 A TW 095141459A TW 95141459 A TW95141459 A TW 95141459A TW I340418 B TWI340418 B TW I340418B
Authority
TW
Taiwan
Prior art keywords
fabricating
chip
same
circuit device
intergrated circuit
Prior art date
Application number
TW095141459A
Other languages
Chinese (zh)
Other versions
TW200822248A (en
Inventor
Yan Hsiu Liu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW095141459A priority Critical patent/TWI340418B/en
Publication of TW200822248A publication Critical patent/TW200822248A/en
Application granted granted Critical
Publication of TWI340418B publication Critical patent/TWI340418B/en

Links

TW095141459A 2006-11-09 2006-11-09 Intergrated circuit device, chip, and method of fabricating the same TWI340418B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095141459A TWI340418B (en) 2006-11-09 2006-11-09 Intergrated circuit device, chip, and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095141459A TWI340418B (en) 2006-11-09 2006-11-09 Intergrated circuit device, chip, and method of fabricating the same

Publications (2)

Publication Number Publication Date
TW200822248A TW200822248A (en) 2008-05-16
TWI340418B true TWI340418B (en) 2011-04-11

Family

ID=44770723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141459A TWI340418B (en) 2006-11-09 2006-11-09 Intergrated circuit device, chip, and method of fabricating the same

Country Status (1)

Country Link
TW (1) TWI340418B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502335B2 (en) * 2009-07-29 2013-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. CMOS image sensor big via bonding pad application for AlCu Process
JP5532867B2 (en) * 2009-11-30 2014-06-25 ソニー株式会社 SOLID-STATE IMAGING DEVICE, ITS MANUFACTURING METHOD, SOLID-STATE IMAGING ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

Also Published As

Publication number Publication date
TW200822248A (en) 2008-05-16

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