TWI340054B - - Google Patents
Info
- Publication number
- TWI340054B TWI340054B TW095129475A TW95129475A TWI340054B TW I340054 B TWI340054 B TW I340054B TW 095129475 A TW095129475 A TW 095129475A TW 95129475 A TW95129475 A TW 95129475A TW I340054 B TWI340054 B TW I340054B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005234431 | 2005-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200726559A TW200726559A (en) | 2007-07-16 |
TWI340054B true TWI340054B (en) | 2011-04-11 |
Family
ID=37757497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095129475A TW200726559A (en) | 2005-08-12 | 2006-08-11 | Cutting off processing system for brittle material and method for the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4815444B2 (en) |
KR (1) | KR100971042B1 (en) |
TW (1) | TW200726559A (en) |
WO (1) | WO2007020835A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007055000A (en) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | Method and device for cutting article to be processed made of nonmetal material |
CN101878088B (en) * | 2007-11-27 | 2013-08-14 | 三星钻石工业股份有限公司 | Laser machining device |
CN101909806B (en) * | 2007-12-27 | 2013-06-12 | 三星钻石工业股份有限公司 | Laser processing apparatus |
WO2009084489A1 (en) * | 2007-12-28 | 2009-07-09 | Mitsuboshi Diamond Industrial Co., Ltd. | Laser working apparatus, and laser working method |
JP5590642B2 (en) * | 2009-02-02 | 2014-09-17 | 独立行政法人国立高等専門学校機構 | Scribing apparatus and scribing method |
JP2011131229A (en) * | 2009-12-24 | 2011-07-07 | Hitachi High-Technologies Corp | Laser beam machining method, laser beam machining apparatus, and solar panel manufacturing method |
CN103534089B (en) | 2011-05-13 | 2016-08-17 | 日本电气硝子株式会社 | Duplexer, the cutting-off method of duplexer and the processing method of duplexer and the shearing device of fragility plate object and cutting-off method |
JP6379392B2 (en) * | 2013-05-28 | 2018-08-29 | Agc株式会社 | Glass substrate cutting method and glass substrate manufacturing method |
CN105171938B (en) * | 2015-09-19 | 2017-07-11 | 哈尔滨奥瑞德光电技术有限公司 | C is to quick determinations of the sapphire ingot a to flat side and processing method |
CN105328353B (en) * | 2015-10-30 | 2017-03-22 | 安徽江淮汽车集团股份有限公司 | cutting platform of laser cutting machine |
CN105512400A (en) * | 2015-12-09 | 2016-04-20 | 大连理工大学 | Cutting process simulation process for brittle materials |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03489A (en) * | 1989-05-24 | 1991-01-07 | Nippon Sekigaisen Kogyo Kk | Cracking method and cracking device for brittle material by using laser for which concentrated thermal stress generated in work is used as heat source |
JP2700136B2 (en) * | 1994-06-02 | 1998-01-19 | 双栄通商株式会社 | How to cut brittle materials |
JPH10116801A (en) * | 1996-10-09 | 1998-05-06 | Rohm Co Ltd | Method for dividing substrate and manufacture of light emitting element using the method |
JP2000247671A (en) * | 1999-03-04 | 2000-09-12 | Takatori Corp | Method for cutting glass |
KR100721391B1 (en) * | 1999-11-24 | 2007-05-23 | 어플라이드 포토닉스 아이엔씨. | Method and apparatus for separating non-metallic materials |
JP2002100590A (en) * | 2000-09-22 | 2002-04-05 | Sony Corp | Splitting device and method therefor |
JP2002178179A (en) * | 2000-12-12 | 2002-06-25 | Sony Corp | Cracking device and method for the same |
JP2003002676A (en) * | 2001-06-19 | 2003-01-08 | Seiko Epson Corp | Method for splitting substrate and method for producing liquid crystal device |
-
2006
- 2006-08-08 JP JP2007530956A patent/JP4815444B2/en not_active Expired - Fee Related
- 2006-08-08 KR KR1020087002145A patent/KR100971042B1/en not_active IP Right Cessation
- 2006-08-08 WO PCT/JP2006/315658 patent/WO2007020835A1/en active Application Filing
- 2006-08-11 TW TW095129475A patent/TW200726559A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100971042B1 (en) | 2010-07-16 |
KR20080023265A (en) | 2008-03-12 |
WO2007020835A1 (en) | 2007-02-22 |
JPWO2007020835A1 (en) | 2009-02-26 |
JP4815444B2 (en) | 2011-11-16 |
TW200726559A (en) | 2007-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |