TWI339869B - Integrated circuit reducing voltage drop - Google Patents

Integrated circuit reducing voltage drop

Info

Publication number
TWI339869B
TWI339869B TW096131047A TW96131047A TWI339869B TW I339869 B TWI339869 B TW I339869B TW 096131047 A TW096131047 A TW 096131047A TW 96131047 A TW96131047 A TW 96131047A TW I339869 B TWI339869 B TW I339869B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
voltage drop
reducing voltage
circuit reducing
drop
Prior art date
Application number
TW096131047A
Other languages
Chinese (zh)
Other versions
TW200910482A (en
Inventor
Wu Pin Chan
Jian Liang Chen
Original Assignee
Ali Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ali Corp filed Critical Ali Corp
Priority to TW096131047A priority Critical patent/TWI339869B/en
Publication of TW200910482A publication Critical patent/TW200910482A/en
Application granted granted Critical
Publication of TWI339869B publication Critical patent/TWI339869B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW096131047A 2007-08-22 2007-08-22 Integrated circuit reducing voltage drop TWI339869B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096131047A TWI339869B (en) 2007-08-22 2007-08-22 Integrated circuit reducing voltage drop

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096131047A TWI339869B (en) 2007-08-22 2007-08-22 Integrated circuit reducing voltage drop

Publications (2)

Publication Number Publication Date
TW200910482A TW200910482A (en) 2009-03-01
TWI339869B true TWI339869B (en) 2011-04-01

Family

ID=44724380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096131047A TWI339869B (en) 2007-08-22 2007-08-22 Integrated circuit reducing voltage drop

Country Status (1)

Country Link
TW (1) TWI339869B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217717B2 (en) 2015-11-18 2019-02-26 Stmicroelectronics (Rousset) Sas Distribution of electronic circuit power supply potentials

Also Published As

Publication number Publication date
TW200910482A (en) 2009-03-01

Similar Documents

Publication Publication Date Title
TWI372325B (en) Voltage reference circuit
GB0619827D0 (en) Voltage reference circuit
EP2130216A4 (en) Isolated integrated circuit devices
HK1127827A1 (en) Integrated circuit
TWI347167B (en) Circuit module
EP2222040A4 (en) Interface circuit
EP2129620A4 (en) Nanowire circuit architecture
TWI367581B (en) Circuit structure
HK1115657A1 (en) Integrated circuit assembly
HK1121874A1 (en) Integrated circuit
TWI371874B (en) Integrated circuit structures
EP2172828A4 (en) Reference voltage generation circuit
EP2091153A4 (en) Voltage switching circuit
EP2434544A4 (en) Integrated circuit
AU321303S (en) Circuit breaker
GB0708324D0 (en) Ultra-low-power circuit
EP2119011A4 (en) Integrated circuit fuse array
TWI366971B (en) Semiconductor integrated circuit
TWI341648B (en) Osciuating circuit
TWI327691B (en) Voltage supply circuit
TWI341447B (en) Voltage regulating circuit
TWI346381B (en) Capacitor in an integrated circuit
TWI365390B (en) Layout circuit
EP2178115A4 (en) Semiconductor integrated circuit
GB0915231D0 (en) Output circuit