TWI334810B - Method and instrument of conjugate polishing process - Google Patents

Description

1334810 IX. Description of the Invention: [Technical Field] The present invention relates to a polishing apparatus and method, and more particularly to a common polishing operation and method for processing a surface of a free-form surface workpiece. [Prior Art] A surface on which a curvature of any point can be arbitrarily changed is called a free-form surface. Such a surface can easily satisfy various functional requirements, whether in terms of aesthetics or function. From the 3C, automobile, electronics... or high-tech aerospace, astronomy, etc. in everyday life, we can see the application of free-form surfaces, making the processing demand of free-form surfaces larger. Since the workpiece with the free-form surface can produce a good application function, the demand for the free-form surface processing of the workpiece is growing, but the processing of the workpiece must have the requirements of accurate shape, low surface roughness and high processing efficiency. Conventional free-form workpiece machining devices or methods do not meet the requirements of free-form surface machining. In general, the processing of free-form surface workpieces is often performed by polishing as a method of precision machining. The Form Error Compensate strategy is used to remove residual errors on the workpiece, so that the shape accuracy of the processed workpiece is improved and the surface is rough. Degree is reduced. This method not only inherits the task of reducing the thickness of the polishing system, but also improves the shape accuracy of the surface of the workpiece. This is done by precisely removing the amount of error at different locations on the workpiece by polishing, but because of the different amounts of error at different locations on the workpiece, the size of the material that needs to be removed at different locations will vary. (s'; 5

^^〇IU rate to remove the amount of material, depending on the polishing rate of the tool, design the knife 2. =The pressure polishing method is based on the fixed time difference of the machining error on the surface of the workpiece, so that the dragon stays in the position of the workpiece wheel for a long time, in order to accurately remove the error liquid dynamic pressure polishing method. The spherical cutter is in contact with the workpiece so that

If the surface has a point contact with the surface of the curved workpiece, and the surface is processed on the surface. Therefore, as long as the curvature of the tool surface is smaller than the minimum curvature on the free-form surface workpiece, it can process Y for the entire surface, but because the contact area is only a small area where the tool is in contact with the workpiece, the efficiency is poor. σ > In terms of high-efficiency processing methods, the prior art also has a sharpening tool design for large-area surface polishing. The sharpening tool uses a soft material as the surface of the tool 'large-area contact with the curved surface' to machine the surface of the workpiece. The point of application of the sharpening tool is a solid on the surface of the soft material of the tool, brigade

A soft foaming material is added between the two, and the soft foaming material can be used to compress the surface of the soft tool with the advantage of the curved surface to perform deformation, and a large-area surface polishing is performed. However, the foamed material which deforms the curved surface due to the plasticity of the soft foaming material cannot effectively provide a supporting force ‘, so that the surface roughness cannot be effectively lowered. The patent document proposes a design of a grinding tool whose tool comprises a sanding component and/or a supporting component, and through the design of the deformable solid of the supporting component, there is a way to make the sanding component conform to the surface of the workpiece, so that the grinding component has a large area and the workpiece. contact. In addition, the solid support member can effectively provide the support force, so that the thickness can be effectively reduced. This method can greatly reduce the thickness of the workpiece by 6 S; 1334810 due to the large-area processing, but the processing rate in the processing area cannot be controlled, so that it cannot be different on the free-form surface. The shape error of the point is accurately removed, and an accurate surface shape cannot be achieved. Therefore, there is no method on the market for precision machining of free-form surfaces. SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing apparatus and method for polishing a pair of free-form workpieces, and further increase the efficiency and precision of the polishing process. In order to achieve the above object, the present invention provides a conjugate polishing apparatus for processing a free-form surface workpiece, comprising: a cutter device having a surface that deforms according to the surface of the free-form surface workpiece, and the tool surface Generating a relative motion with the surface of the free-form surface workpiece; and a load device generating a plurality of discrete input forces according to the surface of the free-form surface workpiece and converting into a continuous output force; wherein the cutter device receives The aforementioned continuous output force acts on the surface of the cutter to polish the surface of the free-form workpiece. The invention further provides a conjugate polishing device for processing an axisymmetric free-form surface workpiece, comprising: a cutter device having a surface of a workpiece which can be freely curved according to the axis symmetry, and a deformed tool surface; and a load device Generating a plurality of discrete input forces; wherein a surface of the aforementioned axisymmetric freeform workpiece and a surface of the tool are in relative motion, and the cutter device receives the plurality of discrete input forces on the tool surface A continuous set of output forces is generated to polish the surface of the aforementioned axisymmetric freeform workpiece. 7 1334810 The present invention further provides a conjugate polishing method for processing a free-form surface workpiece, comprising: generating a relative motion between a tool surface and a surface of the free-form surface workpiece; generating a plurality of different surfaces according to the surface of the free-form surface workpiece a continuous input force; and converting the plurality of discontinuous input forces into at least one continuous output force; and applying the continuous output force to the tool surface to polish the surface of the freeform workpiece. The conjugate polishing apparatus of the present invention which achieves the above object enhances the efficiency of polishing by polishing a surface of a workpiece by a large-area processing such as a line or a surface. And due to the force strategy of the load device of the controllable load, the polishing apparatus produces an adjustable process rate distribution on the workpiece. When the processing rate distribution is similar to the shape error amount distribution, the error of the workpiece is effectively removed and the workpiece accuracy is improved via the appropriate polishing time. The above-mentioned objects and features of the present invention will be described in detail with reference to the accompanying drawings. The present invention will be fully described with reference to the accompanying drawings in which the preferred embodiments of the present invention are described, but it is understood that those skilled in the art can modify the invention described herein while obtaining the present invention. The efficacy of the invention. Therefore, it is to be understood that the following description is a broad disclosure of those skilled in the art and is not intended to limit the invention. SUMMARY OF THE INVENTION The present invention is directed to a conjugate polishing apparatus and method for surface processing of a free-form surface workpiece, which is polished at 1334810 using a conductive force strategy that conforms to the surface. Referring to the first figure, a system architecture diagram of a polishing apparatus according to an embodiment of the present invention is shown. The system architecture of the present invention includes a workpiece 1, a polishing apparatus 2, and a grinding fluid 3. The polishing apparatus 2 is for driving the polishing liquid 3 to perform a polishing process on the surface of the workpiece 1. The polishing apparatus 2 further includes a polishing tool 21 and a load device 22. The polishing tool 21 has a deformable tool surface that cooperates with the surface of the workpiece 1 to form a processing zone on the surface. The load device 22 generates a plurality of discontinuous input forces according to the surface shape error amount distribution of the workpiece 1, and converts the discontinuous input forces into a set of continuous output forces via a guiding device and provides the same. The polishing tool 2 causes the tool surface of the polishing tool 2 to produce a specific load distribution due to continuous input force. The polishing liquid 3 is located between the processing zone of the workpiece 1 and the polishing apparatus 2, and the polishing liquid 3 has a plurality of abrasive grains (not shown) and completely covers the processing area of the surface of the workpiece 1 to The workpiece 1 is polished by means of floating polishing. Wherein, the surface of the tool of the polishing tool 2 and the surface of the workpiece 1 generate a high-speed relative motion. Therefore, when the load device 22 supplies the continuous output force to the polishing tool 21 and causes the tool surface of the polishing tool 21 to generate a load distribution due to a continuous output force, the tool surface of the polishing tool 21 drives the grinding The liquid 3 generates a hydrodynamic pressure effect between the workpiece and the tool, and separates the workpiece and the tool, so that the abrasive particles smoothly flow between the tool and the workpiece, and are polished. Referring to the second figure, a schematic view of the processing of a workpiece according to an embodiment of the present invention is shown. As shown, the workpiece 1 has a freeform surface. And because there is an error profile 11 between the original workpiece surface ηι of the workpiece 1 13 1334810 and the ideal workpiece surface 112, the error profile 11 can be accurately and efficiently removed by the polishing apparatus 2 of the present invention. Improve the surface accuracy of the workpiece. Referring to Figure 2A, there is shown a schematic diagram of the target processing rate of a workpiece according to an embodiment of the present invention. Among them, in order to improve the processing efficiency, the polishing tool 2 of the present invention polishes the workpiece 1 in a line or surface manner to increase the processing area of the workpiece 1. According to the reference hydrodynamic polishing theory, the surface processing rate of the workpiece 1 is controlled by two factors of "speed" and "load". Referring to Figure 2B, there is shown a schematic diagram of the target load distribution of a workpiece according to an embodiment of the present invention. When the line or face is machined, the work point of the workpiece 所有 at all different locations in the processing zone has the same relative speed as the polishing tool 2. Therefore, when the factor of speed is fixed, the processing rate of the workpiece 1 can be effectively controlled by controlling the load factor. Therefore, controlling the load generated by the load device 4 on the polishing tool 2 can effectively control the processing rate of the workpiece i. 4 is a perspective view of a polishing apparatus according to an embodiment of the present invention. The polishing tool 21 of the polishing apparatus 2 is composed of a belt-shaped polishing pad 211, a driving device 212, and a plurality of guide rails 213. The strip-shaped polishing pad 211 is strip-shaped and faces the side of the workpiece, i.e., the tool surface, and is driven by the crucible driving device 212 to produce a high-speed relative motion with the surface of the workpiece 1. The guide 213 is used to provide the strip polishing pad 211 to move within a predetermined trajectory. ^The load device 22 of the polishing device 2 includes an actuator group 221, a plurality of 33 ΐ and ^ 失 且 and 223. The actuator set 221 has a repeating device 2211 for generating such discontinuous input forces and

< S 10 1334810 These discontinuous input forces act on the force block 222. The plurality of link devices 2211 of the actuator group 221 can further receive an external force to control the respective input forces of the respective link devices 2211. The external force can be controlled by an external computer (not shown) according to the surface of the workpiece 1 to cause the respective linkage devices 2211 to accurately generate corresponding input forces. The force guiding block 222 is made of a soft material and can be shaped according to the external force. Therefore, when the power guiding block 222 is subjected to the discontinuous input force provided by the actuator group 221, The force guiding block 222 generates a corresponding output force and outputs the continuous output force. The holder group 223 is used to clamp the power guiding block 222' to cause the power guiding block 222 to move within a preset track, thereby preventing the power guiding block 222 from being affected by an incorrect movement to generate an unexpected wheel. This polishing tool 21 produces an incorrect processing rate. The force guiding block 222 is attached to one side surface of the strip polishing pad 211 with respect to the piece 1 , so when the force guiding block 222 is deformed correspondingly by the force input force, the force guiding block The deformed ribbon polishing pad 211 of 222 produces the set of continuous wheeling forces. This continuous two-six is used for the surface of the workpiece ί to create a stable area on the surface of the workpiece. The relative movement of the tool and the workpiece at an appropriate speed, the second f is filled with the polishing liquid between the polishing device 2 and the workpiece i; = domain, hydraulic pressure effect, the grinding can be driven by the hydraulic pressure effect The liquid 3 honing grain polishes the surface of the processing zone of the workpiece 1. Reference Fig. 5A is an illustration of the polishing apparatus of the present invention. The actuator group is based on the surface of the workpiece i: 3; no discontinuous input force' and then the input force is applied to the guiding surface, so that the guiding block 222 i produces the group continuously The output force, and drive = 1334810 The strip-shaped polished 塾 211 tool surface produces a suitable deformation. Reference is made to Fig. 5B which is a schematic view showing the load distribution of the polishing apparatus acting on the workpiece according to an embodiment of the present invention. The pressure and relative motion state in the contact area of the strip-shaped polishing pad 211 and the workpiece drive the liquid dynamic pressure effect in the polishing liquid 3 in the contact area, so that the surface of the workpiece 1 generates an appropriate load distribution and drives the S-series slurry. The abrasive grains of 3 grind the processing area of the surface of the workpiece 1. Reference is made to Figure 6 which is a system architecture diagram of a polishing apparatus according to another embodiment of the present invention. Therein, a workpiece 12, a rotating shaft 13 of the workpiece 12, a polishing tool 214, and the actuator group 221 and a plurality of link devices 2211 thereof are included. The workpiece 12 is an axisymmetric free surface workpiece and has a rotating shaft 13, and the workpiece 12 is rotated at a high speed according to the rotating shaft 13. The polishing tool 214 is a stationary device and is made of a soft material. In the embodiment shown in FIG. 4, the plurality of linkage devices 2211 of the actuator group 221 generate a plurality of discrete wheel-in forces according to the received external force, and directly apply the input forces to the polishing. The surface of the cutter 214. Although the polishing tool 214 receives the input forces, correspondingly produces a suitable deformation, and causes a continuous set of output forces to act on the surface of the workpiece, and then with appropriate relative motion, the slurry (not shown) is in the tool. A hydrodynamic pressure effect is generated in the workpiece contact area, and the workpiece 12 is polished by the hydraulic pressure control of the abrasive grains (not shown) in the polishing liquid. The common polishing device of the invention improves the control ability of the processing rate of each point in the large area processing area, so that the freely curved surface which is originally quite inaccurate uses the regulation of the large area load distribution to control the processing rate distribution, so that the error in the processing area is large.

12 1334810 has a large amount of error removal, which effectively removes the error of any shape (or contour) of the large free curved surface, which improves the accuracy of the free-form surface. Different from the current low-machining rate of the free-form surface precision polishing method, this processing method can efficiently remove the shape error on a large-area workpiece with high efficiency. In addition, the present invention utilizes the hydrodynamic pressure effect to control the flow of the slurry stably between the workpiece and the cutter to improve the reproducibility of the polishing behavior and facilitate the use of precision machining. In addition, this machining method is different from the general tool feed (displacement) to determine the amount of machining, which does not require high positioning accuracy. Therefore, the conjugate polishing apparatus of the present invention uses a controllable pressure distribution to control the processing rate distribution, thereby saving the high equipment cost of high positioning accuracy, making it a relatively inexpensive precision processing method. It is also possible to machine high-precision free-form surfaces by precisely controlling the load distribution. In the longitudinal direction, the conjugate polishing apparatus of the present invention polishes the surface of the workpiece by a large-area processing such as a line or a surface to increase the efficiency of the polishing process. And because of the guiding strategy of the load device of the controllable load, the polishing device can accurately polish the workpiece with free curved surface. Therefore, the conjugate polishing apparatus of the present invention can perform the polishing process on the surface of the workpiece quickly and accurately under different embodiments. Various changes and modifications can be made without departing from the scope and spirit of the invention, and the invention is not limited by the description. Embodiments of the embodiments are given.

13 1334810 [Brief Description] The first figure is a system architecture diagram of a polishing apparatus according to an embodiment of the present invention. The second figure is a schematic view of the processing of a workpiece according to an embodiment of the present invention. The third A is a schematic view of the target processing rate of the workpiece according to an embodiment of the present invention. The third B diagram is a schematic diagram of the target load distribution of the workpiece according to an embodiment of the present invention. The fourth figure is a perspective view of a polishing apparatus according to an embodiment of the present invention. FIG. 5A is a schematic structural view of a load device according to an embodiment of the present invention. Fig. 5B is a schematic view showing the load distribution of the polishing apparatus acting on the workpiece according to an embodiment of the present invention. Figure 6 is a system architecture diagram of a polishing apparatus according to another embodiment of the present invention. Main component symbol comparison description: 1, 12---workpiece 11 - error wheel gallery 13... rotation axis 2... polishing device 21, 214... polishing tool 211... belt polishing pad 212... drive device 213---rail 22... Load device 221...actuator group

14 1334810 2211... Connecting rod device 222...Induction block 223...Clamping unit 3...Polishing liquid

Claims (1)

1334810 X. Patent application garden: 1. A common polishing device for processing a free-form surface workpiece, comprising: a tool device having a tool surface which can deform the surface of the free-form surface workpiece, and the tool surface Generating a relative motion with the surface of the free-form surface workpiece; and a load device generating a plurality of discrete input forces according to the surface of the free-form surface workpiece and converting into a continuous output force; wherein the continuous output A force acts on the surface of the cutter to polish the surface of the free-form workpiece. 2. The conjugate polishing apparatus of claim 1, wherein the cutter apparatus further comprises a strip-shaped polishing pad, the side surface of the strip-shaped polishing pad being the surface of the cutter. 3. The conjugate polishing apparatus of claim 1, wherein said load means further comprises an actuator set for generating said plurality of discrete input forces. 4. The conjugate polishing apparatus according to claim 3, wherein the actuator group has a plurality of link devices, and each of the link devices receives an external force individually, and responds to the external force to generate the discontinuity. Input force. 5. The conjugate polishing apparatus of claim 4, further comprising a computer control system for controlling an external force received by said respective linkage means based on a surface of said free-form surface workpiece. 6. The conjugate polishing apparatus of claim 1, wherein the load device further comprises a force guiding block that receives the plurality of discontinuous input forces and converts to the continuous output force. 7. The conjugate polishing apparatus of claim 6, wherein the aforementioned force 16 1334810 Blocks are made of soft materials. 8. If the patent application scope is included, the device further includes a preset tracking movement. The conjugate polishing apparatus of the sixth aspect, wherein the load-holding device group is configured to guide the power guiding block to a total of a polishing device of the fourth aspect of the patent range, wherein the plurality of ',# The device is responsive to the external force to produce the discontinuous input force to act on a force block that converts the discontinuous input force to the aforementioned continuous output force. 10. The composite filament of claim 6, wherein the continuous output force of the aforementioned force block acts on the surface pressure of a strip of polishing pad, one side of the strip-shaped polishing pad being the tool surface. 11. The conjugate polishing apparatus of claim 2, wherein the strip-shaped polishing pad and the free-form surface workpiece are filled with a polishing liquid, and the surface pressure system of the strip polishing pad is The aforementioned slurry is driven to generate a hydrodynamic pressure for polishing the aforementioned free-form surface guard. - A total of a number of polishing devices for the reinforcement - axisymmetric freeform workpieces, λΤψ · The axisymmetric free-form surface workpiece is set to generate a plurality of discontinuous input forces; generating "; = weighing = 4 forces, and at the tool surface; producing == 13. as claimed in claim 12 A total of two pairs of 17 S 1334810 said the free-form surface workpiece rotates against the rotating axis to generate the relative motion corresponding to the aforementioned tool device. 14. The conjugate polishing apparatus of claim 12, wherein said load means further comprises an actuator set for generating said plurality of discrete input forces. 15. The conjugate polishing apparatus of claim 14, wherein the actuator assembly has a plurality of linkage devices, and each of the linkage devices receives an external force individually, and responds to the external force to generate the discontinuity. Input force. 16. The conjugate polishing apparatus of claim 15, wherein said discontinuous input force generated by said plurality of linkage means acts on said cutter means, and said cutter means produces said continuous on said cutter surface Output force. 17. The conjugate polishing apparatus of claim 16, wherein the cutter device and the axially symmetric free-form surface workpiece are filled with a polishing liquid, and the cutter device receives the input force of the link device by the The deformation of the cutter device is caused to cause the continuous output force, and the proper relative movement between the workpiece and the cutter is used to drive the slurry to generate a hydraulic pressure, and the free-form workpiece is polished. 18. A conjugate polishing method for machining a free-form surface workpiece, comprising: generating a relative motion between a tool surface and a surface of the free-form surface workpiece; generating a plurality of discrete inputs based on the surface of the free-form surface workpiece And compressing the plurality of discontinuous input forces into at least one continuous output force; and 18 1334810 applying the aforementioned continuous output force to the surface of the tool to polish the surface of the freeform workpiece. 19. The conjugate polishing method of claim 18, further comprising providing a grinding fluid between the surface of the cutter and the surface of the freeform workpiece. 20. The conjugate polishing method of claim 18, further comprising receiving the plurality of discontinuous input forces via a flexible material guide block to cause the continuous output force to be generated. 19