1330283 I t 九、發明說明： 【發明所屬之技術領域】 本發明係與光學顯示模組有關，更詳而言之是指一 具有散熱結構之光學顯示模組，尤係可改善^示=因曰 散熱不良而導致的顯示異常之情形。 5 【先前技術】 以手機為例之電子產品，係朝輕薄短小與具有多功能 方向研發’惟，手機具備之功能越多者，相對^使用更月夕匕 的電子元件，然而在手機内部可供佈件的有限空間裡，^ 10數的電子元件彼此設置接近，各電子元件於作動產生的二 能若過高時，將容易對鄰近的電子元件產生不當的影響。… 以第一圖所示之手機用液晶顯示模組i為例，其s驅動 1C 2設置於液晶面板3上，其LED4設置於軟性印刷電路 板5上，軟性印刷電路板5被彎折致使LED 4對應導光板 I5 6，同時LED 4鄰近驅動ic 2 ;上述各構件中，驅動IC 2 不僅作為控制液晶面板3顯示特定影像外，更内建有溫度 補偵電路以隨時偵測液晶面板3的溫度，並適時地調節該 溫度對液晶分子所造成之影響，藉以使得液晶面板3維持 著良好的顯示效果；而為獲得良好顯示效果者，亦可選擇 2〇提升LED 4輝度(luminance)的方式來強化液晶面板3所需 之背光源，惟，LED 4之輝度越高時，係伴隨著高熱能的 產生，而就目前的液晶顯示模組丨而言，其LED 4係鄰近 驅動《：2設置，因此，驅動1(：：2極容易感應到1^〇4發光 時產生的高溫影響，致發生誤判液晶面板3溫度，導致溫 4 1330283 • * 度補^電路作出錯誤的補償動作，反倒造成液晶面板3顯 不異常；其次’ LED 4容易因封裝材料導熱不佳致使電产 導通後溫度升高，此—情形亦可能造成驅動1C 2對液晶面^ 板3溫度的誤判。 【發明内容】 _本發明之主要目的在於提供_種具有散熱結構之光學 顯不模組，其可降低顯示器之光源發光時的週遭溫度。 一本發明之次要目的在於提供-種具有散熱結構之光學 10顯示模組，係可改善顯示器之驅動IC對溫度造成誤判而導 致顯示面板顯示異常之情形。 緣以達成上述之目的，本發明所提供之一種具有散熱 結構之光學顯示模組包括有一液晶面板、一電性設置於^ 液晶面板上的麟IO-電性連獅軸IC的軟性印刷電 15路板、複數個第一銲墊、複數個第二銲墊、至少一光源以 及-導熱體，其中該軟性印刷電路板設有複數個貫穿正面 與背面的連通孔；該第一、第二銲塾對應該些連通孔且分 別設於該雜印刷電路板之正面與#面，並透過該些連通 孔相互連接；該光源電性連接於該些第一銲墊上；該導熱 2〇體與該些第二銲墊貼合；藉此，該光源發光時所產生的熱 能可依序經由第-銲塾及第二銲墊，再傳導至該導熱體’，’、 藉以降低光源週遭的溫度。 【實施方式】 5 I3302§3 請參照第二至五圖所示，係為本發明一較佳實施例之 具有散熱結構之光學顯示模組10,該光學顯示模組10包括 有一液晶面板12、一驅動1C 14、一軟性印刷電路板16、 四個第一銲墊18、四個第二銲墊2〇、二光源如圖所示係為 5 LED 22與一導熱體24，其中： 該液晶面板12正面具有相鄰接之一顯示區121與一非 顯示區122，該驅動1C 14電性連接於該液晶面板12之非 顯π區122上，且内建有溫度補償電路以偵測液晶面板12 溫度並適時調節過高或過低的溫度，藉以降低該溫度對液 1〇 晶分子所造成之影響。 。亥軟性印刷電路板16具有一軟片本體16ι，以及於該 軟片本體161相對之兩端分別形成一訊號輸入端162與一 訊號輸出端163，該訊號輸入端162與硬質系統電路板(圖 未示）電性連接，該訊號輸出端163與該驅動IC 14電性連 I5接，該軟性印刷電路板16於組裝時被彎折使得其軟片本體 161置於該液晶面板12背面下方（第四、五圖參照），該軟 片本體161接近訊號輸出端163之一侧具有數個貫穿軟片 本體161正面161a與背面161b的連通孔164。 該些第一銲墊18以二個為一組的方式設置於該軟片本 2〇體161正面161a，且覆蓋該些連通孔164，於每一組的第 一銲墊18上連接有一個LED 22。 。亥些第二銲墊20以二個為一組的方式而設置於該軟片 161背面161b’且各該第二銲墊2〇分別對應著一個第 一銲墊18,並透過該些連通孔164與所對應的第一銲墊 6 U30283 電性連接。 ，得-提的是，上述LED 22與第—銲墊18接觸的面 積係运小於各個第-銲塾18或是各個第二鲜塾2〇的面積。 5县』t體I4係為具有高導熱特性之絕緣材料所製成的 長矩形片體，其-面係緊貼抵於該軟片本體ΐ6ι之背面 祕’且完全地覆蓋該些第二銲墊20並與第二銲墊2〇表 面接觸。 以上即為本發明之具有散熱結構之光學顯示模組⑺各 構件及其相關位置之說明，茲敘述其功效於後： 1〇 在LED 22被驅動發光並產生熱能釋放時，熱能透過其 與該些第一銲墊18的接觸面傳導至整個第一銲墊18，由ς 各第一銲墊18的表面積遠大於LED 22與第一銲墊18接觸 的面積，因此可增加散熱速度，熱能並再經由各該連通孔 I64而傳導至對應的第二銲墊20,以及由第二銲墊2〇再傳 15遞至導熱體24，由於第二銲墊20亦以表面積大於[ED 22 /、第if·塾18接觸面積的方式設置，因此能將經由連通孔 164所傳導過來的熱能自第二銲墊2〇與導熱體24間的縫 隙’以及自導熱體24的表面而再次散逸於空氣中，俾收加 速散熱目的，並使LED 22週遭的溫度迅速降低，以避免驅 2〇動1C 14内建之溫度補償電路對週遭溫度的可能誤判，進而 導致溫度補償電路對液晶面板丨2作出錯誤的補償動作。 另說明的是，本發明之光學顯示模組1〇可依需求而再 增《•又一金屬框26，如第六、七圖所示，該金屬框26主要罩 δ又於該軟片本體161的外側，其具有一内抵面261，且該内 7 1330283 抵面261與該導熱體24異於該第二銲墊2〇之一面貼合， 目此’被傳導至該導熱體24的触’更將透過該金屬框 而散逸於空氣中，是以，由上述說明可知，本發明光學顯 示模組10之LED 22發光時產生的熱能經過多道散熱元件 .5的逐步分散，達成對LED22週遭溫度降溫的目的。‘ • 第八至十圖所示係為本發明另一較佳實施例之光學顯 不杈組40，該光學顯示模組4〇具有與第六圖大致相同之結 構，即包含有一液晶面板4 2、一驅動〖c 4 4、一軟性印刷^ 路板46、四個第一銲墊48、四個第二銲墊5〇、二led & 1〇與一金屬框54，所不同處在於本實施例之光學顯示模組4〇 更包含有一以聚合物(polyimide)材料製成的覆蓋膜56，該 覆盍膜56係附著於該軟性印刷電路板46製作時所預留的 凹陷部461中，並完全遮蓋該些第二銲墊5〇，使得覆蓋膜 56表面與軟性印刷電路板46之軟片本體462表面平齊，而 15本實施例之金屬框54更於對應覆蓋膜56位置預先沖製有 籲一向内凹陷的抵部541 ’在金屬框54被安裝完成時，其抵 部541 —面緊抵該覆蓋膜56表面，此結構具有比第七圖所 揭示結構更短的熱傳導路徑，因此可加快熱能的散逸，其 次，覆蓋膜56具有隔離第二銲墊5〇與金屬框54之效，藉 20以保護第二銲墊％，亦即當所有構件組裝後經測試時，若 發現測試異常而須拆卸金屬框54時，覆蓋膜56能有效防 止金屬框54被拆卸過程中可能對第二銲墊造成的刮擦 (scratch)及剝離(peeling)現象，進而避免軟性印刷電路板46 中的銅箱遭到氧化。 8 1330283 . * 以上所述僅為本發明之數個較佳可行實施例而已，舉 凡應用本發明說明書及申請專利範圍所為之等效結構變 化，理應包含在本發明之專利範圍内。 Ι3302§3 【圖式簡單說明】 第一圖為一般液晶顯示模組之示意圖 結構之光學 第二圖為本發明一較佳實施例之具有散埶 顯示模組的立體分解圖。 …、 5 帛三圖為第二圖之背面示意圖。 第四圖為剖面圖’揭示第二圖之光 之態樣。 予顯不模組組裝後 f五圖為第四圖之局部放大圖。 苐六圖類同第二阓 ω設一金屬框。 *晷不第一圖之光學顯示模組更增 第七圖為剖面圖，揭一 態樣。 不第六圖尹各構件組裝完成後之 第八圖為本發明另 圖 較佳實施例之具有散熱結構之光 學顯示模組的立體分解 第九圖揭示第八+ 面示意圖。 _肀液晶面板及軟性印刷電路板之背 第十圖為剖面圖 之態樣。 揭示第八圖之光學顯示模組組裝後 15 1330283 【主要元件符號說明】1330283 I t IX, invention description: [Technical field of the invention] The present invention relates to an optical display module, and more particularly to an optical display module having a heat dissipation structure, in particular, can improve显示 A display abnormality caused by poor heat dissipation. 5 [Prior Art] Electronic products, such as mobile phones, are developed in a light, short, and multi-functional way. However, the more functions a mobile phone has, the more electronic components it uses, but the inside of the mobile phone. In the limited space of the fabric, the electronic components of the number of 10 are close to each other, and if the two components of the electronic components are too high, it will easily affect the adjacent electronic components. Taking the liquid crystal display module i of the mobile phone shown in the first figure as an example, the s drive 1C 2 is disposed on the liquid crystal panel 3, the LED 4 is disposed on the flexible printed circuit board 5, and the flexible printed circuit board 5 is bent. The LED 4 corresponds to the light guide plate I5 6 and the LED 4 is adjacent to the driving ic 2; among the above components, the driving IC 2 not only displays the specific image for controlling the liquid crystal panel 3, but also has a temperature compensation circuit built therein to detect the liquid crystal panel 3 at any time. The temperature, and timely adjust the effect of the temperature on the liquid crystal molecules, so that the liquid crystal panel 3 maintains a good display effect; and in order to obtain a good display effect, it is also possible to select 2 〇 to enhance the brightness of the LED 4 The method is to strengthen the backlight required for the liquid crystal panel 3. However, the higher the brightness of the LED 4 is accompanied by the generation of high thermal energy, and in the current liquid crystal display module, the LED 4 is adjacent to the driver: 2 setting, therefore, the drive 1 (:: 2 is very easy to sense the high temperature effect generated when 1 ^ 〇 4 light, causing a misjudgment of the temperature of the liquid crystal panel 3, resulting in a temperature 4 1330283 • * degree compensation circuit to make a wrong compensation action, The liquid crystal panel 3 is not abnormal; secondly, the LED 4 is prone to increase the temperature of the electrical product due to poor thermal conductivity of the packaging material, which may cause misjudgment of the temperature of the liquid crystal panel 3 by the driving 1C 2 . The main purpose of the present invention is to provide an optical display module having a heat dissipation structure, which can reduce the ambient temperature when the light source of the display is illuminated. A secondary object of the present invention is to provide an optical device having a heat dissipation structure. The display module is capable of improving the display panel by the driver IC of the display and causing the display panel to be abnormally displayed. In order to achieve the above object, the optical display module having the heat dissipation structure provided by the present invention includes a liquid crystal panel. a soft printed electric circuit board, a plurality of first pads, a plurality of second pads, at least one light source, and a heat conductor, which are electrically disposed on the liquid crystal panel, the IO-electrical lion shaft IC The flexible printed circuit board is provided with a plurality of communication holes extending through the front surface and the back surface; the first and second soldering pads correspond to the communication holes and are respectively disposed on the printed circuit The front side of the circuit board and the #面 are connected to each other through the connecting holes; the light source is electrically connected to the first pads; the heat conducting body is bonded to the second pads; thereby, the light source The heat energy generated during the illuminating can be sequentially transmitted to the heat conductor ', ' through the first soldering pad and the second soldering pad, thereby reducing the temperature around the light source. [Embodiment] 5 I3302§3 Please refer to the second to The optical display module 10 includes a liquid crystal panel 12, a driving 1C 14 , a flexible printed circuit board 16 , and a fourth embodiment of the present invention. The first bonding pad 18, the four second bonding pads 2, and the two light sources are shown as 5 LED 22 and a thermal conductor 24, wherein: the front surface of the liquid crystal panel 12 has an adjacent display area 121 and a non-display area 122, the driving 1C 14 is electrically connected to the non-display area 122 of the liquid crystal panel 12, and has a temperature compensation circuit built therein to detect the temperature of the liquid crystal panel 12 and adjust the temperature too high or too low. In order to reduce the effect of this temperature on the liquid 1 crystallized molecule. . The flexible printed circuit board 16 has a film body 16ι, and a signal input terminal 162 and a signal output terminal 163 are formed on opposite ends of the film body 161, and the signal input terminal 162 and the hard system circuit board (not shown) Electrically connected, the signal output terminal 163 is electrically connected to the driving IC 14 , and the flexible printed circuit board 16 is bent during assembly so that the film body 161 is placed under the back surface of the liquid crystal panel 12 (fourth, Referring to the fifth drawing, the film body 161 has a plurality of communication holes 164 extending through the front surface 161a and the rear surface 161b of the film body 161 on one side of the signal output end 163. The first pads 18 are disposed on the front surface 161a of the film body 2 in a manner of two, and cover the communication holes 164. One LED is connected to the first pads 18 of each group. twenty two. . The second pads 20 are disposed on the back surface 161b ′ of the film 161 in two groups, and each of the second pads 2 对应 corresponds to a first pad 18 and passes through the communication holes 164 . It is electrically connected to the corresponding first pad 6 U30283. It is noted that the area in which the LED 22 is in contact with the first pad 18 is smaller than the area of each of the first butt 18 or each of the second squeegee. The 5th county "t body I4" is a long rectangular piece made of an insulating material having high thermal conductivity, and its surface is closely attached to the back surface of the film body ΐ6ι and completely covers the second pads. 20 and in contact with the surface of the second pad 2 . The above is the description of the components of the optical display module (7) having the heat dissipation structure of the present invention and their related positions, and the effect thereof is described as follows: 1. When the LED 22 is driven to emit light and generates thermal energy, the thermal energy passes through the The contact faces of the first pads 18 are conducted to the entire first pads 18. Since the surface area of each of the first pads 18 is much larger than the area where the LEDs 22 are in contact with the first pads 18, the heat dissipation speed and heat energy can be increased. Then, it is conducted to the corresponding second pad 20 via each of the communication holes I64, and is transferred from the second pad 2 to the heat conductor 24. Since the second pad 20 also has a surface area larger than [ED 22 /, The first if塾18 contact area is provided so that the thermal energy conducted through the communication hole 164 can be dissipated into the air from the gap between the second pad 2 and the heat conductor 24 and from the surface of the heat conductor 24. In the middle, the purpose of accelerating heat dissipation is accelerated, and the temperature around the LED 22 is rapidly reduced to avoid possible misjudgment of the surrounding temperature by the built-in temperature compensation circuit of the 1C 14 , thereby causing the temperature compensation circuit to make a liquid crystal panel 丨 2 Wrong compensation Make. In addition, the optical display module 1 of the present invention can be further added as needed. • Another metal frame 26, as shown in the sixth and seventh figures, the metal frame 26 is mainly covered by the δ and the film body 161. The outer side has an inner abutting surface 261, and the inner surface of the heat-conducting body 24 is affixed to the surface of the second soldering pad 2, and is in contact with the heat-conducting body 24 The heat dissipation generated by the LEDs 22 of the optical display module 10 of the present invention is gradually dispersed by the plurality of heat dissipating components. The purpose of cooling the surrounding temperature. The eighth to tenth embodiments show an optical display module 40 according to another preferred embodiment of the present invention. The optical display module 4 has substantially the same structure as the sixth embodiment, that is, includes a liquid crystal panel 4. 2. One drive 〖c 4 4, one soft printing ^ board 46, four first pads 48, four second pads 5 〇, two led & 1 〇 and one metal frame 54, the difference is The optical display module 4 of the present embodiment further includes a cover film 56 made of a polyimide material, and the cover film 56 is attached to the recess portion 461 reserved when the flexible printed circuit board 46 is fabricated. And completely covering the second pads 5〇 such that the surface of the cover film 56 is flush with the surface of the flexible film body 462 of the flexible printed circuit board 46, and the metal frame 54 of the present embodiment is further positioned corresponding to the corresponding cover film 56. When the metal frame 54 is mounted, the abutting portion 541 is pressed against the surface of the cover film 56, and the structure has a shorter heat conduction path than the structure disclosed in the seventh figure. Therefore, the dissipation of thermal energy can be accelerated, and secondly, the cover film 56 has isolation The bonding pad 5 is effective against the metal frame 54 by 20 to protect the second bonding pad %, that is, when all the components are assembled and tested, if the metal frame 54 is to be removed when the test abnormality is found, the cover film 56 can effectively prevent The scratching and peeling of the second pad may occur during the disassembly of the metal frame 54, thereby preventing the copper box in the flexible printed circuit board 46 from being oxidized. 8 1330283 . * The above description is only a few preferred embodiments of the present invention, and equivalent structural changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention. Ι3302§3 [Simple description of the drawings] The first figure is a schematic diagram of a general liquid crystal display module. The second embodiment of the present invention is an exploded perspective view of a preferred embodiment of the present invention. ..., 5 帛 Figure 3 is the back view of the second figure. The fourth figure is a cross-sectional view' showing the light of the second figure. After the module is assembled, the f five figure is a partial enlarged view of the fourth figure. The six-figure type is similar to the second one. * The optical display module of the first picture is more added. The seventh picture is a sectional view, which reveals the aspect. Fig. 8 is a perspective exploded view of the optical display module having a heat dissipating structure according to a preferred embodiment of the present invention. The ninth drawing reveals an eighth + side view. _肀The back of the LCD panel and the flexible printed circuit board The tenth figure is the aspect of the sectional view. After the assembly of the optical display module of the eighth figure is disclosed 15 1330283 [Description of main component symbols]
10 1510 15
10 光學顯示模組 12 液晶面板 121 顯示區 122 非顯示區 14 驅動1C 16 軟性印刷電路板 161 軟片本體 161a 正面 161b 背面 162 訊號輸入端 163 訊號輸出端 164 連通孔 18 第一銲墊 20 第二銲墊 22 LED 24 導熱體 26 金屬框 261 内抵面 40 光學顯示模組 42 液晶面板 44 驅動1C 46 軟性印刷電路板 461 凹陷部 462 軟片本體 48 第一銲墊 50 第二銲墊 52 LED 54 金屬框 541 抵部 56 覆蓋膜 11 2010 Optical display module 12 LCD panel 121 Display area 122 Non-display area 14 Drive 1C 16 Flexible printed circuit board 161 Film body 161a Front 161b Back 162 Signal input 163 Signal output 164 Communication hole 18 First pad 20 Second solder Pad 22 LED 24 Thermal conductor 26 Metal frame 261 Inner surface 40 Optical display module 42 Liquid crystal panel 44 Drive 1C 46 Flexible printed circuit board 461 Recessed portion 462 Film body 48 First pad 50 Second pad 52 LED 54 Metal frame 541 abutment 56 cover film 11 20