TWI325292B - Material use rate modeling system and computer readable medium recording the same - Google Patents

Description

= 3⁄4 No.: TW3592PA IX. Description of the Invention: [Technical Field] The present invention relates to a material utilization simulation system and a computer readable medium recording the same, and in particular, an optimal substrate can be calculated Material utilization simulation system for utilization and optimal circuit board size and computer readable media for recording it. [Prior Art] In the manufacturing process of electronic products, the production process control of circuit boards is an important key to affect the overall production cost. Ten people decide the size of the electronic components and the size of the circuit board, and then cooperate with the circuit designer's wiring simulation and testing. After the circuit layout is completed by the person performing the actual wiring, the pattern is handed over to the board manufacturer for production. Among them, the main cost difference space depends on whether the designer of the organization smears the preferred set size, that is, whether the utilization rate of the substrate used to produce the circuit substrate is maximized within the feasible range. As the substrate utilization rate increases, the less material is wasted, and the bargaining space with the board manufacturer is greater. Since the shape of the circuit substrate is often an irregular geometry, if it is not properly aligned or designed in a preferred size, a large amount of sheet material is wasted, and the cost was wasted in a large amount of production.

Sanda number: TW3592PA [Summary of the Invention] The analogy of the material (four) material and the recording of the circuit board size of the circuit board are reduced. According to the present invention, a utilization ratio of a material-substrate is proposed. The A-plate includes a 5 J car 杈 ,, which is used for at least a thunder/an 4 plate, a working plate. Including... One ▲ 3 system includes 1 number setting unit, - size parameter and - substrate size selection unit, "weiwei board size selection unit size is early ί ° layer number setting unit is used to set the number of layers of the circuit board, = Reference = fixed unit m to determine at least the financial parameters. The size of the substrate is selected from - 70 to the size of the y substrate for selection, and the size of the working board is selected to be supplied; - the size of the board is available for selection. When the size of the circuit substrate is sized, the processing unit calculates the utilization rate of the substrate according to the number of layers of the circuit substrate, the size parameter, the substrate size, and the size of the working board. According to the present invention, a computer readable medium is provided having a plurality of computer executable instructions to perform a method to simulate the utilization of a substrate. The substrate includes at least one work board including at least one circuit substrate. The party $ includes the following steps. First, setting the number of layers of the circuit substrate; then, setting at least one size parameter; then, setting the size of the substrate; then, setting the size of the working board; and then, when the size of the circuit substrate is known, according to the electrical substrate The number of layers, the size parameters, the size of the substrate, and the size of the work board 'calculate the utilization of the substrate. In order to make the above contents of the present invention more obvious and easy to understand, the following is a special mention of 1325292

Sanda number: TW3592PA The preferred embodiment' is described in detail with reference to the accompanying drawings. [Embodiment] • The stomach reference material is in accordance with the present invention - a block of the material utilization simulation system of the "example" Figure 7. Material use rate (MUR) simulation system 10 is used to simulate the utilization of the substrate. Please refer to Figure 2, which shows the schematic diagram of the substrate, the working board and the circuit board. 2, the substrate 1 is the original plate, and there are a plurality of circuit boards 3' which have been printed and finished, that is, a circuit board (PCB), which is generally called a circuit board. i is further divided into a plurality of smaller working boards 2. That is, each of the bases includes at least one working board 2, and each working board includes at least one circuit board 3. In this embodiment, each block is used. The substrate 1 includes four working boards 2 and each of the working boards 2 includes four circuit boards 3 as an example. For the purpose of cutting, the long side and the wide side of each circuit board 3 are spaced from the edge of the substrate 1. Each of the circuit boards 3 is D1 and D2' The distance is m. In addition, the distance between each working plate 2 is D4. In the present embodiment, μ is, for example, 5 mm. When the substrate 1 is six layers, m and D2 are, for example, i7, and the substrate 1 is four layers. When m2 and D2 are, for example, 14 mm; when the substrate is two layers, D1 and D2 are, for example, llmm. As shown in Fig. 1, the material utilization simulation system 1 includes a layer number setting unit 110 and a size parameter setting unit. 120, the substrate ruler selects the unit 13G, 4 as the ruler selection unit 14G and the processing unit 15A. The layer number setting unit UG, the size parameter setting unit 12 (), the substrate ruler 8 1325292

Sanda number: TW3592PA

The size selection unit 130 and the work board size selection unit 140 are parameter setting units, for example, a subprogram, a function, an object or a module, and the processing unit 150 is a computing device, such as a processor. ). The number of layers setting unit 110 is used to set the number of layers of the circuit substrate. The size parameter setting unit 120 is configured to set at least one size parameter. The size parameter in the embodiment includes a reserved boundary width. For example, D1 and D2' in FIG. 2 further include a working plate pitch D4 and a circuit substrate pitch D3. In this embodiment, after the layer number and size parameter setting of the circuit substrate is completed, the material utilization simulation system 10 enables the substrate size selection unit 130 to provide a feasible substrate size for the user to select. . As a result, subsequent calculation errors are not caused by some parameters in the system that are not set. Similarly, the present embodiment preferably enables the work board size selection unit I40 after the substrate size is selected to provide a work board size for the user to select. When the size of the circuit board 3 is known, the processing unit 150 calculates the utilization rate of the substrate 1 based on the number of layers of the circuit board, the size parameter, the substrate size, and the size of the work board. The processing unit can further calculate the number of circuit boards 3 on a substrate 1. In addition, the material utilization simulation system 10 of the present embodiment further includes a cost database 160' for recording at least one unit cost of the substrate, that is, the unit price of the substrate 1 per unit area. The processing unit obtains the unit cost of the substrate by connecting the cost database 160, and calculates the unit cost of each circuit board 1 based on the number of the circuit boards 3. The technical field to which the present invention pertains is generally known, and the technology of the present invention is not limited thereto. When the size of the circuit substrate 3 is unknown, and the utilization ratio of the substrate 1 9 1325292 Sanda number: TW3592PA is known, the processing unit , 150 can calculate that the condition of each circuit substrate is not the size of the circuit substrate 3 When the system is 1 ,, the material utilization simulation system, the system 1 can be = board 1: the overall utilization of the circuit board 3 size. The whistle _ used _ to calculate each of the above material utilization simulation system can be recorded in the computer readable frequency = writing 兀

Machine or fast _ memory, for computer discs, •, hard disk / fine. Be taken and installed after installation. The material utilization rate is reduced. H) Preferably, the parameter setting unit of the user interface window material utilization rate line H) obtains the parameter data input or input by the user through the (4) interface window. Referring to Fig. 3, a flow chart of the material utilization simulation and the circuit board size measurement and calculation method of the preferred embodiment of the invention, and the reference numerals of the figures 〖 and 2 are also referred to. First, as shown in step 301, the user sets the number of layers of the circuit substrate via the number of layers. For example, in this embodiment, an eight-layer board is used, and the number of layers is set to 8.曰 Next, as shown in step 302, the user sets the size parameter via the size parameter setting unit 120. For example, as shown in FIG. 2, the long side and the wide side of the circuit board 3 are set to be 17.5 mm in the same manner as the edge distance D1 and D2 of the substrate 1, and the distance D3 between each circuit board 3 is set to 5 mm. The distance D4 between the work plates is set to 5 mm. In addition, the execution sequence of steps 301 and 3〇2 may also be reversed, and step 302 may be performed before step 3〇1. Then, as shown in step 303, the user sets the size of the substrate via the substrate size selection sheet 1325292 _: TW3592PA 130. Next, as shown in step 3456, the user sets the size of the work board via the work board size selection unit 140. For example, under the above-mentioned parameters, the option of the substrate size provided by the material utilization simulation system 10 includes 1029 mm x 219 mm and 927 mm > 1219 mm, and the corresponding working plate sizes are 511.81 mm >< 609.6 mm and 461.01, respectively. Mmx609.6mm.

Next, the flowchart is divided into two parts. When the size of the circuit substrate 3 is known, the user inputs the size of the circuit substrate 3, the material utilization simulation system 10 performs steps 305a-308a; when the utilization rate of the substrate 1 is known, the user utilizes the substrate 1. The rate input 'then material utilization module 10 performs steps 305b-308b. It should be noted here that the circuit board 3 is not necessarily a single substrate, but may be a patchwork of several circuit boards. When the shape of the circuit board 3 is irregular, the maximum length and the maximum width are respectively set. It is assumed that the substrate size is selected to be 1029 mm x 219 mm in step 303, the working plate size is selected to be 511.81 mm x 609.6 mm in step 304, and the size of the set circuit substrate is 270 mm x 35 mm. Then, in step 305b, the processing unit 150 calculates that the utilization rate of the substrate 1 is 80.94%; then, in the step 3〇6b, the processing unit 150 calculates that the number of the circuit substrates 3 of one substrate 1 is 16. Then, in step 307b, the cost database 160 provides the stored substrate unit cost. Next, in step 308b, the processing unit 160 calculates the unit cost of the circuit substrate 3. And under the same parameter setting conditions, if the user does not 1325292

Sanda number: TW3592PA Given the size of the circuit board, but setting the utilization rate of the substrate 1 to 81.9%, in step 305a, the processing unit 150 can calculate the size of the circuit board 3 from the utilization ratio. Subsequent steps 306a-308a perform the same actions as steps 306b-308b. The material utilization simulation system disclosed in the above embodiments of the present invention and the computer readable medium recording the same can allow the user to calculate whether the utilization rate of the substrate is reasonable according to the size of the designed circuit substrate; or, the user can Enter an acceptable utilization rate and let the system calculate the size of the circuit substrate that meets the utilization. In view of the above, the present invention has been disclosed above in a preferred embodiment, and is not intended to limit the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

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Sanda Number: TW3592PA [Simple Description of the Drawings] FIG. 1 is a block diagram of a material utilization simulation system according to a preferred embodiment of the present invention; • FIG. 2 is a diagram showing a substrate, a working board, and a circuit substrate. FIG. 3 is a flow chart showing a method for material utilization simulation and circuit board size calculation according to a preferred embodiment of the present invention.

[Main component symbol description] 1 : Substrate 2 : Working plate 3 : Circuit substrate 10 : Material utilization simulation system 110 : Layer number setting unit 120 : Size parameter setting unit 130 : Substrate size selection unit 140 : Working plate size selection unit 150 : Processing unit 160: cost database 13

Claims (1)

1325292 Sanda number: TW3592PA 6. The system of claim 5, further comprising a database of at least one substrate unit cost. 7. The system of claim 6, wherein the processing unit calculates a unit cost of the circuit substrate based on the unit cost of the substrate and the number of the circuit substrate. 8. The system of claim 1, wherein the processing unit is configured to calculate a size of the circuit substrate when the size of the circuit substrate is unknown and the utilization of the substrate is known. 9. A computer readable medium having a plurality of computer executable instructions for performing a method of simulating utilization of a substrate, the substrate comprising at least one work board, the work board comprising at least one circuit substrate, the method comprising: (a) setting the number of layers of the circuit substrate; (b) setting at least one size parameter; (c) setting the size of the substrate; (d) setting the size of the working plate; and (e) when the size of the circuit substrate is When known, the utilization of the substrate is calculated based on the number of layers of the circuit substrate, the size parameter, the size of the substrate, and the size of the working board. 10. The computer readable medium of claim 9, wherein the method (c) of the method sets a plurality of size parameters including a reserved boundary width, a working board spacing, and a circuit substrate spacing. 11. The computer readable medium of claim 9, wherein the method further comprises: calculating a number of circuit substrates based on the utilization rate of the substrate. 15 1325292. The computer readable medium of claim 9, wherein the method further comprises: 'providing at least one substrate unit cost; and: according to the substrate unit cost and the circuit substrate The quantity is calculated by calculating the unit cost of the circuit substrate. 13. The computer readable medium according to claim 9, wherein in the step (e) of the method, when the size of the circuit substrate is unknown and the utilization rate of the substrate is known, the circuit substrate is calculated. The size.