1325156 九、發明說明： ί發明所屬之技術領域】 本發明係關於一種研磨裝置，特別是適用於一研磨裝置之基 ' 板支架及其固定構件。 * 【先前技術】 平面顯示器，例如：有機發光顯示器（organic light emitting display，OLED)及液晶顯示器（丨iquidcrystaidisp丨町；LCD)，已 廣泛地應用於電腦及通訊領域。 鲁玻璃基板係為平面顯示器的重要關鍵材料之一，其主要應用 ，平面顯示器上的薄膜電晶體及彩色濾光片二處。由於平面顯示 器所使狀賴基板需要有較高光滑度之要求。因此，玻璃材料 I由成型製私形成玻璃基板後，大多須再經過拋光、研磨等後段 加工步驟。再者，彩色濾光片（ε〇1〇Γ· ; cf)上之畫素係以具 有染料之光阻所形成，例如包括紅色、綠色及藍色；然而由於製 私’數機。„又備等因素，光阻會形成不平坦之結構而景多響顯示 面板之畫^表現’因此在製財―般須再經過研磨製程以平坦化 φ 彩色濾、光片之光阻。 …傳、”先的研磨方法係使用—外框將玻璃基板限制於框體内，以 進订研磨「第1A圖與第】b圖」，傳統研磨設備的基板 支架係將定她體13G _於定盤旧表面上，而研磨墊（b砂 M) 120係位於定位框體】3〇内定位框體13〇的尺寸係對應於 =研磨之玻璃基板丨4〇的尺寸，以致於可將玻璃基板刚限制於 •定位内’進而進行玻璃基板刚的加工製程。 * 另傳統基板支架則係於研磨墊丨20及定位框體13Θ外側辦 設一抵擔構件〗50，以pp生丨— 日 以限制定位框體130的移動，如「第2圖」所 1325156 於習知技術中，需使用定位框體將玻璃基板限制於框内，以 進^研磨’碎際上進行研料，蚊健體容§造成玻璃基板 她’而4：成破#。再者’此定位框體係為背膠式，面積較大貼 附不W易造成林問題。並且，當欲進行研磨之玻璃基板的尺 寸改扣，需全數更絲板支架或其上之定位框體，且更換動作 既費時又費工。 【發明内容】 鑒於以上㈣題，本發明提供—種研絲置、其基板支架及 其固定構件，藉轉決先·術所揭露之祕撞造成破片且換線 不易的問題。 以吸附欲 本發明所揭露之基板支架，應用於―研磨裝置上， 研磨之基板，包括一定盤及一固定構件。 、 此固定構件包括研磨墊與制止件。 研磨触胁定盤的表社，其具有複數俯舰， 孔的位置係對應於基板的尺寸。 二開 置基板 制止件則透過研磨墊上之開孔而設置於定盤的表面上 2制止件突㈣研錄，而於侃件之_成-容置區域以設 财為切料，且討由具有高摩擦係 數之材料製成。 明如·^關本發明的特徵與實作1配合圖式作最佳1 【實施方式】 以下舉出具體實施例以詳細說明本發明之内容， 施例詳細說 並以圖式作 1325156 為輔助說明。說明中提及之符號係參照圖式符號。 參照「第3A圖」，其係為根據本發明之基板支架之第一實施 例的立體分解圖，此基板支架可應用於一研磨裝置上，以於研磨 裝置進行基板240 (例如：玻璃基板、晶圓等）研磨時，吸附住欲 研磨之基板240。 此基板支架包括：-定盤2H)及一固定構件。且固定構件包 括研磨塾220與制止件230。 於此’研磨墊220的-表面貼附於定盤21〇的表面上，且於 研磨墊DO上對應於基板24〇的尺寸設置有多個開孔222。制止件 230則分別透過開孔222而設置於㈣训的表面上，並且此制止 件230突出於研磨墊22〇，以於制止件23〇之間形成一容置區域。 於進行基板240研磨時，則可將欲研磨之基板240設置於容置區 域（即將欲研磨之基板⑽限·止件现之間），使其吸附 磨墊220的另一表面。 本例來次’雜「第3B圖」，當欲研磨一矩形基板⑽時， 研磨墊22G上可具有大致上棑列於矩形四周之孔洞（圖中未標 :失:1止Γ230則分別經由·，220上之孔洞而設置於定盤(圖 2,〇之m ’由於制止件230高於研磨塾220，因此可於制止件 磨之==祕欲研磨之基板細之尺寸的娜域，而欲研 卩可設置於此容置區域上，以卿制止件230限制 住奴研磨之基板240的位置。 研磨墊可為—吸附式研磨墊 材料製成，於—鲈社者』田/、百问备擦係數之 為發揮此雜之雜储敍於丨.3;此外， 除，去除方七彳 研磨基板前可先將研磨墊上之水份去 ” * H例如為到刀刮乾或以氣體吹乾。 於此’制止件230可設計為一矩形柱體（如「第3B圖」所 示），此外亦可設計為一 L型柱體（如「第4圖」所示）。當制止 件230為矩形柱體時’可分別在欲研磨之基板24〇的四周設置一 個或夕個制止件23G。而當制止件為L型柱體時，可利用2 個制止件230分別設置於欲研磨之基板施的對角，以達到控制 欲研磨之基板240驗置之效果；跡可在欲研紅基板的 四腳均设置1侧止件230 ’來控制欲研磨之基板的位置。 /、中此些制止件可由塑膠材料製成，較佳係使用耐磨且不易 又形之材料製成’例如.pC (聚碳酸酉旨）或PEEK (聚鱗鱗酮） 等材貝。並且，此些制止件的高度可為大於等於研磨墊高度加上 基板阿度，且較佳局度係實質上等於研磨墊高度加上基板高度。 ，於此，雖然僅以矩形基板進行詳細說明，然亦可運用於各種 幵v狀之基板，此時只需配合基板的形狀、尺寸設置研磨塾上之開 孔以於制止件设置於開孔内時，可幵)成對應於基板的形狀、尺 寸之容置區域。 此外，芩照「第3A圖與第5圖」，於研磨墊220上之開孔222 可對應於複數種尺寸之基板240而設置；換言之，研磨墊22〇可 配合多種尺寸之基板240 ’先行設置對應於多種尺寸之基板的開孔 222舉例來說，參考「第3A圖」，謂方便說明，將外側開孔a〕 稱^第—開孔，而内側開孔222稱之第二開孔，當制止件23〇分 引這過第一開孔而設置於定盤21〇的表面上時，所形成的容置區 域則可供一種尺寸的基板設置其上，而當制止件23〇分別透過第 二開孔而設置於定盤2丨〇的表面上時，所形成的容置區域則可供 =種尺寸的基板設置其上。如此一來，於製程換線時，只需改 义制止件的设置位置（即由其他開孔設置於定盤上），即可進行不 同尺寸之基板的研磨，進叫低製㈣成本。 雖然本發明赠述之較佳實施觸露如上 =明W相像嶋，在纖她== 内’*可作些許之更動與潤飾，因此本發明之專利保 成 本說明書_之申料纖_界定者解。 U圍觀 【圖式簡單說明】 f1A圖係為傳統研磨設備的基板支架的戴面圖； 第1B圖係為傳統研磨設備的基板支架的立體分 =2圖係為另—傳統研磨設備的基板支架_面圖； 解圖弟Μ _為根據本發明之基板支架之第—實施例的立體分 以及 =圖係為根據本發明之基板支架之第二實施例的俯視圖； 弟圖係為根據本發明之基板支架之第三實施例的俯視圖； 四實施例的俯視圖 第5圖係為根據本發明之基板支架之第 【主要元件符號說明】 110.· 120. 130. 140. 150. 210. 220 ‘ 222. 230. 定盤 研磨塾 定位框體 玻璃基板 抵擋構件 定盤 研磨墊 開孔 制止件 1325156 240 基板1325156 IX. INSTRUCTIONS: TECHNICAL FIELD The present invention relates to a polishing apparatus, and more particularly to a base plate holder and a fixing member thereof for use in a polishing apparatus. * [Prior Art] Flat-panel displays, such as organic light-emitting displays (OLEDs) and liquid crystal displays (丨iquidcrystaidisp丨-cho; LCD), have been widely used in computers and communications. Lu glass substrate is one of the key materials for flat panel display, its main application, thin film transistor and color filter on flat panel display. Due to the flat display, the substrate needs to have a higher smoothness. Therefore, after the glass material I is formed into a glass substrate by molding, most of it needs to be subjected to a post-processing step such as polishing or grinding. Further, the pixels on the color filter (ε〇1〇Γ· cf) are formed by photoresist having a dye, for example, including red, green, and blue; however, due to the manufacture of a digital machine. „Replacement and other factors, the photoresist will form an uneven structure and the picture of the multi-loud display panel will be 'represented'. Therefore, in the production of wealth, it is necessary to go through the grinding process to flatten the φ color filter, the light resistance of the light film. "The first grinding method is used - the outer frame is used to confine the glass substrate to the frame to order the polishing "Fig. 1A and Fig. b". The substrate holder of the conventional grinding device will set the body 13G _ The size of the polishing pad (b sand M) 120 is located in the positioning frame. The size of the positioning frame 13〇 corresponds to the size of the ground glass substrate ,4〇, so that the glass can be The substrate is just limited to the inside of the positioning, and the glass substrate is just processed. * In the case of the conventional substrate holder, an abutting member 50 is disposed outside the polishing pad 20 and the positioning frame 13 to limit the movement of the positioning frame 130, as shown in Fig. 2, 1325156. In the prior art, it is necessary to use a positioning frame to confine the glass substrate to the frame, to carry out the grinding on the 'grinding', and the mosquito body § causes the glass substrate to be her. Furthermore, the positioning frame system is a rubberized type, and the large area is not attached to the forest. Further, when the size of the glass substrate to be polished is changed, it is necessary to use all of the wire holders or the positioning frame thereon, and the replacement operation is time consuming and labor intensive. SUMMARY OF THE INVENTION In view of the above (4), the present invention provides a seeding device, a substrate holder and a fixing member thereof, which are problematic in that the fragmentation caused by the collision of the first and the first is caused by the fragmentation and the line change is not easy. The substrate holder disclosed in the present invention is applied to a polishing apparatus, and the substrate to be polished includes a certain disk and a fixing member. The fixing member includes a polishing pad and a stopper. A watch that grinds a threatening plate has a plurality of bows, and the position of the holes corresponds to the size of the substrate. The two open substrate stoppers are disposed on the surface of the fixed plate through the openings in the polishing pad, and the retaining member protrudes from the surface of the fixed plate. Made of a material with a high coefficient of friction. Mingru·^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Description. The symbols mentioned in the description refer to the schema symbols. Referring to FIG. 3A, which is an exploded perspective view of a first embodiment of a substrate holder according to the present invention, the substrate holder can be applied to a polishing apparatus for performing a substrate 240 on a polishing apparatus (eg, a glass substrate, When the wafer or the like is polished, the substrate 240 to be polished is adsorbed. The substrate holder includes: a fixing plate 2H) and a fixing member. And the fixing member includes the grinding boring 220 and the stopping member 230. The surface of the polishing pad 220 is attached to the surface of the fixed plate 21, and a plurality of openings 222 are provided on the polishing pad DO corresponding to the size of the substrate 24''. The stoppers 230 are respectively disposed on the surface of the (4) through the opening 222, and the stopper 230 protrudes from the polishing pad 22A to form an accommodating region between the stoppers 23A. When the substrate 240 is polished, the substrate 240 to be polished may be placed in the accommodating area (i.e., between the substrate (10) and the stopper to be polished) so as to adsorb the other surface of the pad 220. In this example, when the rectangular substrate (10) is to be polished, the polishing pad 22G may have holes substantially arranged around the rectangle (not shown in the figure: missing: 1 stop 230) · The hole on the 220 is set in the fixed plate (Fig. 2, the m' is because the stop member 230 is higher than the polishing boring 220, so it can be used to stop the grinding of the piece == the size of the substrate to be finely ground, The mortar can be disposed on the accommodating area, and the position of the slave polishing substrate 240 is restricted by the squeezing stopper 230. The polishing pad can be made of an adsorption pad material, and the 鲈 者 』 』 The problem of the rubbing coefficient is to play the miscellaneous miscellaneous storage in the 丨.3; in addition, in addition to removing the square 彳 彳 before polishing the substrate, the water on the polishing pad can be removed. * H, for example, to the knife to dry or The gas is blown dry. The 'stop member 230 can be designed as a rectangular cylinder (as shown in Figure 3B), or as an L-shaped cylinder (as shown in Figure 4). When the stopper 230 is a rectangular cylinder, one or one of the stoppers 23G may be respectively disposed around the substrate 24 to be polished. When the L-shaped cylinder is used, the two stoppers 230 can be respectively disposed on the opposite sides of the substrate to be polished, so as to control the effect of the substrate 240 to be polished; the trace can be on the four legs of the red substrate. A side stopper 230' is provided to control the position of the substrate to be polished. /, the stoppers may be made of a plastic material, preferably made of a material that is wear-resistant and not easily shaped, for example, pC (poly Carbonate or PEEK (polyscale ketone), etc., and the height of the stoppers may be greater than or equal to the height of the polishing pad plus the substrate A degree, and the preferred degree is substantially equal to the height of the polishing pad plus The height of the upper substrate. Here, although only a rectangular substrate is used for detailed description, it can be applied to various 幵v-shaped substrates. In this case, it is only necessary to match the shape and size of the substrate to set the opening on the polishing raft to prevent the member. When it is disposed in the opening, it can be formed into a receiving area corresponding to the shape and size of the substrate. Further, referring to "3A and 5", the opening 222 in the polishing pad 220 may correspond to the plural a substrate 240 of a size; in other words, the polishing pad 22 〇Incorporating a plurality of sized substrates 240' to firstly provide openings 222 corresponding to substrates of various sizes. For example, referring to "3A", it is convenient to explain that the outer opening a] is called a first opening. The inner opening 222 is referred to as a second opening. When the stopping member 23 is divided into the first opening and disposed on the surface of the fixing plate 21, the formed receiving area is provided for the substrate of one size. Wherein, when the stopping member 23 is respectively disposed on the surface of the fixing plate 2 through the second opening, the formed receiving region is provided on the substrate of the size of the substrate. When changing the line during the process, it is only necessary to change the setting position of the stopper (that is, the other holes are arranged on the fixed plate), so that the grinding of the substrates of different sizes can be performed, and the cost of the low (four) is entered. Although the preferred implementation of the present invention is as described above, it is possible to make some changes and refinements in the fiber she ==, so the patent of the present invention costs the specification _ solution. U onlookers [simple description of the drawings] f1A is the surface of the substrate holder of the traditional grinding equipment; Figure 1B is the three-dimensional division of the substrate holder of the traditional grinding equipment = 2 is another substrate holder of the traditional grinding equipment The top view and the figure of the first embodiment of the substrate holder according to the present invention are top views of the second embodiment of the substrate holder according to the present invention; FIG. 5 is a plan view of a third embodiment of the substrate holder; FIG. 5 is a diagram of a main component symbol according to the present invention. 110. 130. 140. 140. 150. 210. 220 ' 222. 230. Fixed plate grinding 塾 positioning frame glass substrate resisting member fixed plate polishing pad opening stop 1325156 240 substrate