1323633 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種殼體結構，特別是一種電子裝置之殼體 結構。 【先前技術】 隨著無線通訊科技的發展，無線通訊技術目前已經廣泛地 被應用於各種領域，例如影音節目、無線通訊、衛星定位等等， 而訊號收發電路為了因應電子裝置的需求，也逐漸縮小化，並 整合於電子裝置中，以提高使用便利性。 然而隨著電子裝置所具備的無線通訊功能(例如，行動通 訊功能、全球衛星定位功能、無線網路功能或數位廣播功能... 等等)逐漸多元化的需求下，在每一個訊號收發電路整合至電 子裝置内後，電子裝置的製造商還必須將各自的天線配置於電 子裝置所剩的空財，由於天線是峨收發電路中影響無線通 訊品質的重要元件之-’在電子裝置的體積逐漸朝短、小、輕、 薄的設計趨勢發展時，對於電子裝置的製造商㈣，要如何將 各種訊號收發電路的天線整合於電子裝置巾，慑然成為研究人 員待解決的問題之一。 請參照中華民國專利公開號第2006_號，該專利申請 賴露-種電子I置中之天線模組，其最小化所佔用之空間， 錯以於不料其紐之情況下提升該電子裝置設置結構之自 = 增加電子裝置的空間利用並實現電子裝置的微小化與 夕工月匕以及—種具有該天線模組之電子震置。該天線模組 包括由具有可撓性之非導電材料所組成的印刷電路板;設置於 該印刷電路板之上表面的指定位置之天線元件，形成於該印刷 電路板上之接地線俾使該接地線連接至該天線元件之接地 知並於該接地線之一端形成接合部；形成於該印刷電路板上 之饋線俾使該饋線連接至該天線元件之訊號端，並於該饋線之 端形成接合部；以及形成於該印刷電路板上並與該饋線並聯 且具有指定長度之被動線(passive line)。該接地線與饋線之接 口。I5係接合於無線電子裝置的指定位置，且設置於該印刷電路 板上具有該天線元件之天__—部分係形成於該裝置之 外部。 雖然上料射請案已能增加電子裝置的m細，但其 字天線模、、且之部分设置於電子裝置的外部，相當於增加了原本 電子襄置的整體體積’也不符合隱藏式天、_設計需求，因 此，仍有可改進的空間。 【發明内容】 /馨於以上的問題’本發賴供—種電子裝置之殼體結構， 係將訊號收發電路的天線直接與殼财—整合，以充分利用電 子裳置的工間’藉以提昇電子震置的用率。 根據本發騎揭露之電子較之_結構，係於電子農置 =^殼_特定區域上形敍少—溝案，於金屬殼體與 裴置的訊號收發電路電性輕接時，金屬_構成電 之至少一天線。 猎由這種電子裝置之殼體結構，糊殼體與金屬層的結合 6 [S] 形成類似槽孔型天線的結構與運作原理，在外觀上，電子裝置 的天線可與殼體相貼合並局部性外露，除了不佔用過多的電子 裝置内部空間外，由於天線局部性外露的結構特性，使得本發 明之天線增益較以往内置型天線的增益佳。 有關本發_職與實作，紐合圖示作最佳實施例詳細 說明如下。 【實施方式】 根據本發賴揭露之電子錢，包括但不條於個人數位 助理(Personal Digital Assistant，PDA)或行動電話⑽硫 或智慧型手機(Smart Ph0ne)或個人數位助理手機伽副 Digital Assistant ’ PDAPhone)或筆記型電腦··.等電子裝置而 所附圖式健供參考與說日賴，麟用以關本發明。 »月 > …第1A圖」’係為本發明第一實施例之剖面結構 示意圖’如「第1A圖」所示，本發明之殼體結構，包含有介 電層10、金屬殼體11與金屬層12。 "電層10’具有第一表面101與第二表面1〇2，其中介電 層10可以例如是陶究材料。 金屬殼體U，設置於介電層10的第一表面1〇1上，用以 作為包子裝置之天線接地部，而本發明各實施例中的天線包含 有訊號輕射部’用以輕射電子裝置中的訊號收發電路(圖中未 不)輸出之訊敍外界’或接絲自外界之無線減；訊號饋 入部哺訊號收發電路電性輕接，用以接收訊號收發電路輪出 的訊號並細至訊號輻射部，或將訊魏射部接收_無線訊 1323633 號傳送至訊號收發電路；訊號接地部，設置於訊號輻射部周· 圍’用以作為天線之接地迴路。其中金屬殼體11可以例如由 鈦、鋁、銀、銅、鎳、鐵、鈷、鎂或鉑等單一金屬或合成金屬 材質所製成。 另外，本發明各實施例中的每一個天線係分別電性耦接至 各自對應的訊號收發電路，以進行無線訊號的傳輸與處理作 業。 金屬層12，設置於介電層10的第二表面1〇2上，用以作 為電子裝置之天線訊號饋入部與天線輻射部，而天線訊號饋入 部係為一 50歐姆微帶線路。其中金屬層丨2可以例如由鈦、鋁、 銀 '銅、錄、鐵、始、鎮或鉑等單一金屬或合成金屬材質所製 成。 請參照「第1B圖」’係為本發明第二實施例之剖面結構 示意圖，第二實施例與第一實施例不同之處在於：第二實施例 中的金屬殼體11與金屬層12皆設置於介電層1〇的第一表面 101上，其餘材質部分與第一實施例相同，在此不再贅述。 請參照「第1C _」’係為本發明第三實施例之剖面結構 示意圖’第三實施例與第二實施例不同之處在於：第三實施例 中的金屬殼體11無需設置於介電層1〇上，且不具有金屬層 12 ’透過雷射切割、化學蝴或沖壓射出等方式於金屬殼^ 11上形成一個或複數個溝槽圖案，於金屬殼體u與電子裝置 的訊號收發電路電性輕接時’金屬殼體n構成電子震置之天 線’其中溝槽圖案的結構係肋匹配天線的線路阻抗i故可透 8 [S3 過設計溝槽圖案的形狀、大小以調整天線的線路阻抗，其餘材 質部分與第二實施例相同，在此不再贅述。 。月多…、第1D圖」’係為本發明第四實施例之剖面結構 示意圖’ *「第1D圖」麻，本發明之殼體結構，包含有非 金屬殼體20、第一金屬層13與第二金屬層14。 非金屬殼體20，具有第一表面2〇1與第二表面2〇2，其中 非金屬设體20可以例如是夠鋼、丙晞_丁二烯-苯乙稀樹脂 (ABS)、塑膠(例如’聚乙稀(pE)、高密度聚乙稀(❿四）、超 问分子ΐ：聚乙蜍(UHMPE)、聚丙烯(pp)、聚苯乙烯(ps)、丙烯 -丁二烯-苯乙烯樹脂(ABS)、乙烯_乙酸乙烯酯共聚物(EVA)、 聚酸胺(PA) '聚對苯二曱酸乙二酯(pET)及聚氯乙烯(pvc)等 等）。 第一金屬層13，設置於非金屬殼體2〇的第一表面2〇1 上，用以作為電子裝置之天線接地部。其中第一金屬層13可 以例如由鈦、鋁 '銀、銅、鎳、鐵、鈷、鎂或鉑等單一金屬或 合成金屬材質所製成。 第二金屬層14，設置於非金屬殼體20的第二表面202 上’用以作為電子裝置之天線訊號饋入部與天線輻射部，而天 線訊號饋入部係為一 50歐姆微帶線路。其中第二金屬層η 可以例如由鈦、鋁、銀、銅、鎳、鐵、鈷、鎂或鉑等單一金屬 或合成金屬材質所製成。 請參照「第1E圖」，係為本發明第五實施例之剖面結構 示意圖’第五實施例與第四實施例不同之處在於：第五實施例 1323633 中的苐一金屬層13與第二金屬層14皆設置於非金屬殼體2〇-的第一表面201上，其餘材質部分與第四實施例相同，在此不 再贅述。 請參照「第1F圖」’係為本發明第六實施例之剖面結構 示意圖，第六實施例與第五實施例不同之處在於：第六實施例 中非金屬殼體20具有簍空區，而第一金屬層η與第二金屬芦 14係設置於非金屬殼體20的簍空區中，其餘材質部分與第五 實施例相同，在此不再贅述。 睛參照「第2圖」，係為本發明實施例之電子裳置之局部 外觀示意圖，如「第2圖」所示，本發明之電子裝置1〇〇包含 有.第一天線30、第一天線31、第三天線32與金屬殼體。 其中金屬殼體10具有部分溝槽圖案的結構，以分別形成第一 天線30、第二天線31與第三天線32，且第一天線3〇與電子 裝置100的訊號收發電路相電性耦接，藉以收發第一頻率值 (例如，2.4GHz)的無線訊號，第二天線31與電子裝置1〇〇的 訊號收發電路相電性耦接，藉以收發第二頻率值(例如， 900MHz或1800MHz)的無線訊號、第三天線32與電子裝置 100的訊號收發電路相電性輕接，藉以收發第三頻率值(例如， 5GHz)的無線訊號’因此，從電子裝置1〇〇的外觀上可直接看 到第一天、線30、第二天，線31與第三天線32的溝槽圖案，由 於電子裝置1GG中的第-天線2G、第二天線21與第三天線22 整合於金屬殼體10上’除了不佔用過多的電子裝置励内部 工間外’更使得包子裝置1G 0之天線增益較以往内置型天線的 10 增益佳，而本發明實施例中的各天線位置視設計需求可設置於 電子裝置100的金屬殼體10上的任何位置，例如，正面或背 面0 • π參第3A ®」’係、為本發明第一實施例之俯視示意 •。如「第3A圖」所示’本發明之殼體結構，包含有介電層 10、金屬殼體11與金屬層U，其中金屬殼體u可作為天線 接地部，而金屬層丨2可作為天線峨饋人雜天線輻射部， 於金屬層12與金屬殼體11間設置有介電層10,因此，從電 子袭置100白勺外觀上僅可看到介電層10與金屬殼體U。 請荟照「第3B圖」，係為本發明第五實施例之俯視示意 圖。如「第3B圖」所示，本發明之殼體結構，包含有非金屬 殼體20、、第一金屬層13與第二金屬層14，其中第一金屬層 I3可作為天線接地部’而第二金屬層M可作為天線訊號饋入 部鼓線輕射部，第一金屬層13與第二金顧14皆設置於非 金屬威體20的第一表面2〇1上，因此，從電子裝置卿的外 親上可看到非金屬殼體2〇、第一金屬層13與第二金屬層Μ。 接下來’本發明之近場測試的場地為一電波暗室 。（echme Chamber·) ’係以金屬製成之牆面用以隔離外在信 號的干擾在暗_咖電贿波材觸貼赠上肋降低室 内的反射能量’ #進行量測時，待測天線（Ante· Under =st AUT)所H射㈣電磁波參數（如振幅與她）在近場 空間中齡布會被_接收掃描探頭⑶咖㈣p論）所偵測 (發明之貫施例進行量測時的待測天線與接收掃描探頭間的 11 距離為4公尺），其掃描方式可為平面、柱面或球面。這些射. 頻(或简信號以電的形式經由一同⑽輸線（coaxlalcable) 傳，向量網路分析儀（veetQrNet_kAnalyzeF，丽），以 取得，關的數據’而這些數據在後端進行探頭輕射場型校正與 傅利某數值轉換等處理後，即可得到所需的待測天線賴射⑽ 場）場型。 «月，…第4圖」’係為本發明實施例之反射損失示意圖， 反射參數sii在測試點權#為似廳)的值為·ι〇」誦， 反射參數S11在測試點B(頻帛為896MHz)的值為4彻肪， 反射參數S11在測试點C(頻率為960MHz)的值為_6.〇〇26dB， 反射參數S11在測試點D(頻率為i 71GHz)的值為·7而犯， 反射參數sii在測試點E(頻率為〗88GHz)的值為_8 31〇謹， 反射參數S11在測試點F(頻率為丨"GHz)的值為_6 8686犯， 反射參數S11在測試點G(頻率為2 17GHz)的值為_4 56%dB。 請參照「第5A圖」、「第5B圖」與「第5C圖」，係為本 發明貝％例之Η平面之輪射場型圖，係以全球行動通訊系統 (Global System for Mobile Communication，以下簡稱 GSM)的 工作頻率進行測試’其中GSM的測試頻率為824MHz、 896MHz 與 960MHz。 请參照「第5D圖」、「第5E圖」、「第5F圖」與「第5G 圖」，係為本發明實施例之Η平面之輻射場型圖，係分別以數 位通訊系統(Digital Communication System，以下簡稱 DCS)、 個人通訊服務系統(Personal Communication Service ’以下簡稱 [S] 12 1323633 PCS)的工作頻率進行測試，其中DCS的測試頻率為 1710MHz、1880MHz 與 1990MHz，而 PCS 的測試頻率為 2170MHz。相關的增益數值請參照表1，如下： 測試頻率 最大增益 最小增益 平均增益 (MHz) (dBi) (dBi) _ 824 0.81 -11.16 -4.07 H-平面 896 1.14 -10.03 -3.34 960 0.97 -12.01 -4.80 1710 2.89 -25.14 -3.06 1880 6.35 -20.30 -0.20 1990 2.36 -22.47 -4.39 2170 0.10 -18.42 -5.35 表1 請參照「第6A圖」、「第6B圖」與「第6C圖」，係為本 發明實施例之E1平面之輻射場型圖，係以GSM的工作頻率 進行測試’其中GSM的測試頻率為824mhz、896MHz與 960MHz ° 請參照「第6D圖 弟6E圖」、「第证圖」與「第6G 圖」，係為本發明實施例之E1平面之輕射場型圖，係 DCS與PCS的讀頻率進行測試，其中⑽的測試頻 m〇MHz、腦驗與1990MHz，而pcs的測試頻率為 2170MHz。相關的增益數值請參照表2，如下. 13 頻率(MHz) 最大增益 _ 最小增益 _ 平均增益 (_ 824 -0.60 -8.54 -5.23 896 2.57 -11.34 -2.43 Ei-平面 960 -0.33 -12.10 -5.56 1710 2.49 -25.36 -4.02 1880 6.89 -21.96 -0.72 1990 4.29 -19.15 -3.02 2170 0.92 -18.90 -5.04 表2 1323633 請參照「第7A圖」、「第7B圖」與「第7C圖」，係為本 發明實施例之E2平面之輻射場型圖，係以GSM的工作頻率 進行測試，其中GSM的測試頻率為824MHz、896MHz與 960MHz ° 請參照「第7D圖」、「第7E圖」、「第7F圖」與「第7G 圖」，係為本發明實施例之E2平面之輻射場型圖，係分別以 DCS與PCS的工作頻率進行測試，其中DCS的測試頻率為 1710MHz、1880MHz 與 1990MHz，而 PCS 的測試頻率為 2170MHz。相關的增益數值請參照表3，如下： ί S1 141323633 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a housing structure, and more particularly to a housing structure of an electronic device. [Prior Art] With the development of wireless communication technology, wireless communication technology has been widely used in various fields, such as audio and video programs, wireless communication, satellite positioning, etc., and the signal transmission and reception circuit is gradually responding to the needs of electronic devices. Reduced and integrated in electronic devices to improve ease of use. However, with the gradual diversification of the wireless communication functions (such as mobile communication functions, global satellite positioning functions, wireless network functions or digital broadcasting functions, etc.) of electronic devices, in each signal transmitting and receiving circuit After being integrated into the electronic device, the manufacturer of the electronic device must also configure the respective antennas in the empty space left by the electronic device. Since the antenna is an important component in the transceiver circuit that affects the quality of the wireless communication - the volume of the electronic device As the trend toward short, small, light, and thin design progresses, how to integrate the antennas of various signal transmitting and receiving circuits into electronic device towels for manufacturers of electronic devices (4) has become one of the problems to be solved by researchers. Please refer to the Republic of China Patent Publication No. 2006_, which applies for the antenna module of Lai Lu-Xin Electronics I, which minimizes the space occupied, and raises the electronic device settings in case of unexpected The structure itself increases the space utilization of the electronic device and realizes the miniaturization of the electronic device and the electronic work of the antenna module. The antenna module includes a printed circuit board composed of a flexible non-conductive material; an antenna element disposed at a specified position on an upper surface of the printed circuit board, and a grounding wire formed on the printed circuit board The grounding wire is connected to the grounding of the antenna element and forms a joint at one end of the grounding wire; the feeding wire formed on the printed circuit board connects the feeding wire to the signal end of the antenna element, and is formed at the end of the feeding wire a joint; and a passive line formed on the printed circuit board and connected in parallel with the feed line and having a specified length. The ground wire is connected to the feeder. The I5 is bonded to a designated position of the wireless electronic device, and a portion of the printed circuit board having the antenna element is formed outside the device. Although the injection project can increase the size of the electronic device, the word antenna module and the portion of the antenna are disposed outside the electronic device, which is equivalent to increasing the overall volume of the original electronic device. , _ design requirements, therefore, there is still room for improvement. [Summary of the Invention] / The problem of the above is that the housing structure of the electronic device is to integrate the antenna of the signal transmission and reception circuit directly with the shell, so as to make full use of the electronic workplace. The rate of electronic shock. According to the structure of the electronic device disclosed in the present invention, it is based on the electronic farmer=^shell_specific area to describe the less-ditch case, when the metal housing and the signal transmission and reception circuit of the device are electrically connected, the metal _ At least one antenna constituting electricity. Hunting is the shell structure of the electronic device, and the combination of the paste shell and the metal layer 6 [S] forms a structure and operation principle similar to the slot type antenna. In appearance, the antenna of the electronic device can be combined with the shell. Local exposure, in addition to not occupying too much internal space of the electronic device, the antenna gain of the present invention is better than that of the conventional built-in antenna due to the structural characteristics of the antenna being exposed locally. The details of the best example of the present invention are as follows. [Embodiment] The electronic money disclosed in this report includes, but not limited to, Personal Digital Assistant (PDA) or mobile phone (10) sulfur or smart phone (Smart Ph0ne) or personal digital assistant mobile phone digital assistant Digital Assistant 'PDAPhone' or notebook computer and other electronic devices and the reference for the reference to the health and reference, Lin used to close the invention. "Monthly", "1A" is a schematic cross-sectional structural view of the first embodiment of the present invention. As shown in FIG. 1A, the casing structure of the present invention includes a dielectric layer 10 and a metal casing 11. With the metal layer 12. "Electrical layer 10' has a first surface 101 and a second surface 〇2, wherein dielectric layer 10 can be, for example, a ceramic material. The metal housing U is disposed on the first surface 110 of the dielectric layer 10 for use as an antenna ground portion of the bun device, and the antenna in the embodiments of the present invention includes a signal light portion for light exposure. The signal transmitting and receiving circuit in the electronic device (not shown in the figure) outputs the information from the outside world or the wire is wirelessly subtracted from the outside; the signal feeding portion of the signal transmitting and receiving circuit is electrically connected to receive the signal from the signal transmitting and receiving circuit. The signal is radiated to the signal radiating part, or the receiving part of the signal is transmitted to the signal transmitting and receiving circuit; the signal grounding part is disposed at the periphery of the signal radiating part to be used as the grounding loop of the antenna. The metal casing 11 may be made of, for example, a single metal or a synthetic metal such as titanium, aluminum, silver, copper, nickel, iron, cobalt, magnesium or platinum. In addition, each antenna in each embodiment of the present invention is electrically coupled to a corresponding signal transmitting and receiving circuit for performing wireless signal transmission and processing operations. The metal layer 12 is disposed on the second surface 112 of the dielectric layer 10 for use as an antenna signal feeding portion and an antenna radiating portion of the electronic device, and the antenna signal feeding portion is a 50 ohm microstrip line. The metal layer 丨 2 may be made of, for example, a single metal or a synthetic metal material such as titanium, aluminum, silver 'copper, ruthenium, iron, shi, town or platinum. Please refer to FIG. 1B for a cross-sectional structural view of a second embodiment of the present invention. The second embodiment is different from the first embodiment in that the metal casing 11 and the metal layer 12 in the second embodiment are both It is disposed on the first surface 101 of the dielectric layer 1 , and the remaining material portions are the same as those in the first embodiment, and details are not described herein again. Please refer to "1C_" as a schematic cross-sectional view of a third embodiment of the present invention. The third embodiment is different from the second embodiment in that the metal casing 11 in the third embodiment need not be disposed on the dielectric. The layer 1 is on the top of the layer, and the metal layer 12' is formed by laser cutting, chemical butterfly or stamping to form one or a plurality of groove patterns on the metal shell 11 to transmit and receive signals to and from the metal casing u and the electronic device. When the circuit is electrically connected, the metal case n constitutes an electronically placed antenna. The structure of the groove pattern is matched with the line impedance of the antenna. Therefore, the shape and size of the groove pattern can be adjusted to adjust the antenna. The line impedance is the same as that of the second embodiment, and details are not described herein again. . The monthly structure of the first embodiment of the present invention is a cross-sectional structural view of the fourth embodiment of the present invention. The first housing structure comprises a non-metallic housing 20 and a first metal layer 13 . And the second metal layer 14. The non-metallic housing 20 has a first surface 2〇1 and a second surface 2〇2, wherein the non-metal housing 20 can be, for example, steel, propylene-butadiene-styrene resin (ABS), plastic ( For example, 'polyethylene (pE), high-density polyethylene (❿4), super-lattice ΐ: UHMPE, polypropylene (pp), polystyrene (ps), propylene-butadiene- Styrene resin (ABS), ethylene-vinyl acetate copolymer (EVA), polyamine (PA) 'polyethylene terephthalate (pET) and polyvinyl chloride (pvc), etc.). The first metal layer 13 is disposed on the first surface 2〇1 of the non-metal case 2〇 for use as an antenna ground portion of the electronic device. The first metal layer 13 may be made of, for example, a single metal or a synthetic metal material such as titanium, aluminum 'silver, copper, nickel, iron, cobalt, magnesium or platinum. The second metal layer 14 is disposed on the second surface 202 of the non-metal housing 20 for use as an antenna signal feed portion and an antenna radiating portion of the electronic device, and the antenna signal feed portion is a 50 ohm microstrip line. The second metal layer η may be made of, for example, a single metal or a synthetic metal material such as titanium, aluminum, silver, copper, nickel, iron, cobalt, magnesium or platinum. Please refer to FIG. 1E, which is a cross-sectional structural view of a fifth embodiment of the present invention. The fifth embodiment is different from the fourth embodiment in that the first metal layer 13 and the second layer in the fifth embodiment 1323633 The metal layer 14 is disposed on the first surface 201 of the non-metal housing 2〇, and the remaining material portions are the same as those in the fourth embodiment, and details are not described herein again. Please refer to FIG. 1F for a cross-sectional structural view of a sixth embodiment of the present invention. The sixth embodiment is different from the fifth embodiment in that the non-metallic casing 20 has a hollowed out area in the sixth embodiment. The first metal layer η and the second metal layer 14 are disposed in the hollow region of the non-metallic housing 20, and the remaining material portions are the same as those in the fifth embodiment, and details are not described herein again. The present invention is a partial appearance view of an electronic device according to an embodiment of the present invention. As shown in FIG. 2, the electronic device 1 of the present invention includes a first antenna 30 and a first antenna. An antenna 31, a third antenna 32 and a metal housing. The metal casing 10 has a structure of a partial groove pattern to form a first antenna 30, a second antenna 31 and a third antenna 32, respectively, and the first antenna 3 is electrically connected to the signal transmitting and receiving circuit of the electronic device 100. The second antenna 31 is electrically coupled to the signal transceiving circuit of the electronic device 1 to transmit and receive the second frequency value (for example, by means of a wireless signal for transmitting and receiving a first frequency value (for example, 2.4 GHz). The wireless signal of the 900 MHz or 1800 MHz) and the third antenna 32 are electrically connected to the signal transmitting and receiving circuit of the electronic device 100 to transmit and receive a wireless signal of a third frequency value (for example, 5 GHz). The groove pattern of the first day, the line 30, the second day, the line 31 and the third antenna 32 can be directly seen in appearance, because the first antenna 2G, the second antenna 21 and the third antenna 22 in the electronic device 1GG Integrating on the metal casing 10 'except for not occupying too many electronic devices to excite the internal work room', the antenna gain of the bun device 1G 0 is better than that of the conventional built-in antenna, and the antenna positions in the embodiment of the present invention are better. Depending on the design requirements, it can be set in electronic equipment. Any position on the metal casing 10 of 100, for example, the front or back side 0 π 第 3A ® "" is a top view of the first embodiment of the present invention. As shown in FIG. 3A, the casing structure of the present invention includes a dielectric layer 10, a metal casing 11 and a metal layer U, wherein the metal casing u can serve as an antenna ground portion, and the metal layer 丨 2 can be used as The antenna is fed into the antenna radiating portion, and the dielectric layer 10 is disposed between the metal layer 12 and the metal casing 11. Therefore, only the dielectric layer 10 and the metal casing U can be seen from the appearance of the electron attacking device 100. . Please refer to "FIG. 3B" for a top view of a fifth embodiment of the present invention. As shown in FIG. 3B, the housing structure of the present invention includes a non-metallic housing 20, a first metal layer 13 and a second metal layer 14, wherein the first metal layer I3 can serve as an antenna ground portion. The second metal layer M can be used as the antenna signal feeding portion drum light-lighting portion, and the first metal layer 13 and the second metal layer 14 are both disposed on the first surface 2〇1 of the non-metal core 20, and therefore, the electronic device The non-metallic shell 2〇, the first metal layer 13 and the second metal layer 可 can be seen on the outside of the parent. Next, the field of the near field test of the present invention is an anechoic chamber. (echme Chamber·) 'The wall made of metal is used to isolate the interference of external signals. In the dark, the electric energy of the room is reduced. (Ante· Under = st AUT) The H (four) electromagnetic wave parameters (such as amplitude and her) in the near-field space will be detected by the _ receiving scanning probe (3) coffee (four) p theory) The distance between the antenna to be tested and the receiving scanning probe is 4 meters. The scanning method can be flat, cylindrical or spherical. These radio frequencies (or simple signals are transmitted electronically via a coaxlalcable, vector network analyzer (veetQrNet_kAnalyzeF, Li) to obtain, off data' and these data are probed at the back end of the field. After the type correction and the Fourier numerical conversion process, the desired field of the antenna to be tested (10) field can be obtained. «月,...第4图' is a schematic diagram of the reflection loss of the embodiment of the present invention, the value of the reflection parameter sii at the test point weight is "i", and the reflection parameter S11 is at the test point B (frequency) The value of 896 is 896MHz) is 4, the reflection parameter S11 is _6.〇〇26dB at test point C (frequency 960MHz), and the value of reflection parameter S11 is at test point D (frequency is 71 GHz). ·7, the value of the reflection parameter sii at the test point E (frequency is 88 GHz) _8 31 〇, the reflection parameter S11 at the test point F (frequency 丨 " GHz) value _6 8686 guilty, The value of the reflection parameter S11 at the test point G (frequency of 2 17 GHz) is _4 56% dB. Please refer to "5A", "5B" and "5C", which are the shots of the plane of the invention. The system is based on the Global System for Mobile Communication (Global System for Mobile Communication). The working frequency of GSM is referred to as 'the GSM test frequency is 824MHz, 896MHz and 960MHz. Please refer to "5D", "5E", "5F" and "5G", which are radiation pattern diagrams of the plane of the present invention, which are respectively digital communication systems (Digital Communication) System, hereinafter referred to as DCS), personal communication service system (Personal Communication Service 'hereinafter referred to as [S] 12 1323633 PCS) test frequency, DCS test frequency is 1710MHz, 1880MHz and 1990MHz, and PCS test frequency is 2170MHz . For the relevant gain values, please refer to Table 1, as follows: Test frequency maximum gain Minimum gain Average gain (MHz) (dBi) (dBi) _ 824 0.81 -11.16 -4.07 H-plane 896 1.14 -10.03 -3.34 960 0.97 -12.01 -4.80 1710 2.89 -25.14 -3.06 1880 6.35 -20.30 -0.20 1990 2.36 -22.47 -4.39 2170 0.10 -18.42 -5.35 Table 1 Please refer to "6A", "6B" and "6C" as the present invention. The radiation field pattern of the E1 plane of the embodiment is tested at the operating frequency of GSM. The test frequency of GSM is 824mhz, 896MHz and 960MHz °. Please refer to "6D Figure 6E", "Identification Chart" and " Figure 6G is a light field pattern of the E1 plane according to the embodiment of the present invention, which is tested by the reading frequency of DCS and PCS, wherein the test frequency of (10) is m〇MHz, the brain test is 1990MHz, and the test frequency of pcs is 2170MHz. For the relevant gain values, please refer to Table 2, as follows. 13 Frequency (MHz) Maximum gain _ Minimum gain _ Average gain (_ 824 -0.60 -8.54 -5.23 896 2.57 -11.34 -2.43 Ei-plane 960 -0.33 -12.10 -5.56 1710 2.49 -25.36 -4.02 1880 6.89 -21.96 -0.72 1990 4.29 -19.15 -3.02 2170 0.92 -18.90 -5.04 Table 2 1323633 Please refer to "7A", "7B" and "7C" as the present invention. The radiation field pattern of the E2 plane of the embodiment is tested at the operating frequency of GSM. The test frequencies of GSM are 824 MHz, 896 MHz and 960 MHz. Please refer to "7D", "7E", "7F". And the "7G map" is the radiation field pattern of the E2 plane according to the embodiment of the present invention, which is tested at the operating frequencies of DCS and PCS, respectively, wherein the test frequency of the DCS is 1710 MHz, 1880 MHz and 1990 MHz, and the PCS The test frequency is 2170MHz. For the related gain values, please refer to Table 3, as follows: ί S1 14
綜上所述，本發明之電子裝置之壳是體結構，利用殼體與金 屬層的結合形成類似槽孔型天線的結構與運作原理，在外觀 上，電子裝置的天線可與殼體相貼合並局部性外露，除了不佔 ^過多的電子裝置崎空，天線局部料露的結構特 ’使得本發明之天線戦較以往内置型天_增益佳。 雖然本發明以前述讀佳實酬揭露如上，然其並非用以 限定本判’任何熟f相像技藝者，在不脫離本發明 2内’當可作些許之更動與'顯，因此本發明之專利保觀 、視本祝明書騎之申請專利範圍所界定者為準。 【圖式簡單說明】 =认圖係為本發日月第—實施例之剖面結構示意圖； ★—圖ir、為本發明第二貫施例之剖面結構示意圖； 15 第ic圖係為本發明第三實施例之剖面結構示意圖； 第1D圖係為本發明第四實施例之剖面結構示意圖； f1E圖係為本發明第五實施例之剖面結構示意圖； 第1F圖係為本發明第六實施例之剖面結構示意圖； PA圖係為本發明實施例之電子裝置之外觀示意圖； 弟2B圖係為本發明另一實施例之電子褒置之外觀示意圖； 第3A圖係為本發明第一實施例之俯視示意圖； 第3B圖係為本㈣第五實施例之俯視示意圖； 第4圖係為本發明實施例之反射損失示意圖； 第5A圖係為本發明實施例之η平面之触場型圖； 第5Β圖係為本發明實施例之Η平面之轄射場型圖； 第5C圖係為本發明實施例之Η平面之輻射場型圖； 第5D圖係為本發明實施例平面之輻射場型圖； 第5Ε圖係為本發明實施例之Η平面之輕射場型圖； 第坏圖係為本發明實施例之Η平面之輕射場型圖； 第5G圖係為本發明實施例^平面之輻射場型圖； 第6Α圖係為本發明實施例之£1平面之輻射場型圖； 第6Β圖係為本發明實施例之E1平面之輻射場型圖； 第6C圖係為本發明實施例之£1平面之姉場型圖； 第6D圖係為本發明實施例之拉平面之輕射場型圖； 第6E圖係為本發明實施例之£1平面之轄射場型圖； 第6F圖係為本發明實施例之別平面之輕射場型圖； 第6G圖係為本發明實施例之£1平面之輻射場型圖； 16 ί S1 1323633 第7A圖係為本發明實施例之E2平面之辕射場型圖； 第7B圖係為本發明實施例之E2平面之輻射場型圖； 弟7C圖係為本發明實施例之E2平面之輪射場型圖； 第7D圖係為本發明實施例之E2平面之輻射場型圖； 第兀圖係為本發明實施例之E2平面之輕射場型圖； 第冗圖係為本發明實施例之E2平面之輕射場型圖； 第冗圖係為本發明實施例之以平面之輕射場型圖’。 【主要元件符號說明】 10 介電層 11 金屬殼體 12 金屬層 13 第一金屬層 14 第二金屬層 20 非金屬殼體 30 第一天線 31 第二天線 32 第三天線 100 電子裝置 101 第一表面 102 第二表面 201 第一表面 202 第二表面 A 測試點 17 1323633 B 剑試點 C 測試點 D 測試點 E 測試點 F 測試點 G 測試點In summary, the housing of the electronic device of the present invention is a body structure, and the combination of the housing and the metal layer forms a structure and operation principle similar to the slot type antenna. In appearance, the antenna of the electronic device can be attached to the housing. Combined with local exposure, in addition to not occupying too many electronic devices, the structure of the antenna is exposed to the structure of the antenna, which makes the antenna of the present invention better than the built-in type. Although the present invention has been disclosed above in the above-mentioned readings, it is not intended to limit the present invention to any skilled person, and may make some changes and 'displays' without departing from the present invention. The patent protection shall be subject to the definition of the patent application scope of Zhu Mingshu. [Simple description of the drawing] = The drawing is a schematic diagram of the cross-sectional structure of the first embodiment of the present invention; ★ - Figure ir, a schematic sectional structure of the second embodiment of the present invention; 3D is a cross-sectional structural view of a fourth embodiment of the present invention; f1E is a cross-sectional structural view of a fifth embodiment of the present invention; and FIG. 1F is a sixth embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3B is a schematic view showing the appearance of an electronic device according to another embodiment of the present invention; FIG. 3A is a first embodiment of the present invention; FIG. 3B is a top view of the fifth embodiment of the present invention; FIG. 4 is a schematic diagram of reflection loss according to an embodiment of the present invention; FIG. 5A is a touch field type of the n-plane of the embodiment of the present invention. Figure 5 is a radiation pattern diagram of a pupil plane according to an embodiment of the present invention; Figure 5C is a radiation field pattern of a pupil plane according to an embodiment of the present invention; Field map; 5 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图Figure 6 is a radiation pattern of the plane of the £1 plane of the embodiment of the present invention; Figure 6 is a radiation pattern of the plane E1 of the embodiment of the present invention; Figure 6C is a diagram of an embodiment of the present invention. a plane pattern of a plane; a 6D diagram is a light field pattern of the pull plane of the embodiment of the invention; a 6E diagram is a shot pattern of the plane of the £1 plane of the embodiment of the invention; The light field pattern of the plane of the embodiment of the present invention; FIG. 6G is a radiation pattern of the plane of the £1 plane of the embodiment of the present invention; 16 ί S1 1323633 FIG. 7A is the top of the E2 plane of the embodiment of the present invention. FIG. 7B is a radiation field pattern of the E2 plane according to an embodiment of the present invention; FIG. 7C is a wheel field pattern of the E2 plane according to an embodiment of the present invention; and FIG. 7D is an embodiment of the present invention. The radiation pattern of the E2 plane; the second diagram is the light field pattern of the E2 plane according to the embodiment of the present invention; Example E2 of the plane of the light emitted field pattern based embodiment of the present invention; FIG redundant system of the present to the plane of the light emitted field pattern of the embodiment of the invention '. [Main component symbol description] 10 dielectric layer 11 metal case 12 metal layer 13 first metal layer 14 second metal layer 20 non-metal case 30 first antenna 31 second antenna 32 third antenna 100 electronic device 101 First surface 102 second surface 201 first surface 202 second surface A test point 17 1323633 B sword pilot C test point D test point E test point F test point G test point