TWI323559B - Miniature lumped-type bandpass filters for organic ic package substrate - Google Patents

Description

1323559 IX. Description of the Invention: [Technical Field] The present invention provides a Miniature Lumped-Type Bandpass Filter, in particular for embedding an organic IC package substrate (Organic Int Called Circuit) Package Substrate) ensemble bandpass filtering. [Prior Art] Φ At present, the miniaturized lumped bandpass filter mainly uses a Low Temperature Cofired Ceramic (LTCC) substrate. The main reason lies in the low temperature. The co-fired ceramic substrate has a multilayer dielectric with a multi-layer dielectric constant, so it can produce a capacitor with a large capacitance range and a high Q value, forming a key favorable factor for designing a miniaturized lumped bandpass filter. . Miniaturized lumped bandpass filters are fabricated using low temperature co-fired ceramic substrate technology. PI-type capacitors or inductively coupled parallel resonant circuits are mostly used in the design architecture (see Figures 8A and 8B). In the circuit architectures of Figure 8A and Figure 8B, capacitors with large capacitance values must be used in common wireless communication bands. Therefore, it is necessary to provide multiple layers of high dielectric constant thin layer media, such as low temperature co-firing • ceramic substrate process. The bandpass filter can be manufactured. For details, please refer to the following documents (S. Kobayashi and K. Saito, "A miniaturerized ceramic bandpass filter for cordless phone systems, 5, in IEEE MTT-S Int. Microwave Symp. Dig., 1995, pp. 391-394. HS Song, and YS Lee, "A miniaturized 2.4 GHz band multi-layer bandpass filter using capacitively loaded quarter-wavelength slow-wave resonator, 55 1323559 in IEEE MTT-S Int. Microwave Symp. Dig .t 2003 pp 515-518.). 5 The use of low-temperature co-fired ceramic substrate technology to manufacture miniaturized lumped band-passing Bo Yi's has the advantages of high efficiency and good micro-formation effect, but in the application of the ic integrated single-package system module, low-temperature co-firing Ceramic substrate technology has two insurmountable shortcomings. One is that manufacturing and development costs are still much larger than organic substrate technology. Second, due to process limitations, the line density cannot meet the high-density wiring requirements of single-package system modules. . At present, the mainstream 1C package substrate technology on the market is an organic substrate. In addition to the low process cost of the process technology, its high-density wiring capability can meet the design requirements of the miniaturized single package system module. Common organic 1C package substrates, such as laminates and build-up substrates. At present, the organic substrate has a large limitation on the thin dielectric and high-layer metal layout of the high dielectric constant in the process. Therefore, if a capacitor with a large capacitance value is buried, it will occupy an excessively large substrate area, which is not in conformity with the micro-formation. Claim. Therefore, in the design example of the buried bandpass filter in the organic substrate, please refer to the following documents (L. Li, P. Bowles, LT Hwang, and S. Plager, S·, "Embedded passives in organic substrate for bluetooth transceiver module , 55 in Proc. 53rd Electron. Comp. Technol. Conf., 2003, pp. 464-469. L. Li, “Embedded passives in organic substrate for RF module and assembly characterization,” in /Voc. 2004, pp. 74 -82.), due to the capacitor factor, the component size is too large, resulting in poor component performance and lack of practical value. 6 1323559 Although research units have begun to develop embedded high dielectric constant thin layer dielectric in organic substrates, Please refer to the following documents (IR Abothu, PM Raj, D. Balaraman, V. Govind, S. Bhattacharya, MD Sacks, M. Swaminathan, MJ Lance, and RR Tummala, ''Development of high-k embedded capacitors on printed wiring board Using sol-gel and foil-transfer processes, 55 in Proc. 54th Electron. Comp. Technol. Conf., 2004, pp. 514-520. D. Balaraman, PM Raj, R. Abothu, S.

Bhattacharya, M. Sacks, M. Lance, H. Meyer, M.

Swaminathan, and R. Tumrnala, "Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications, 5, in Proc. 55th Electron.

Comp. Tec/mo/. Cc?«/, 2005, pp. 1215-1221.8.), which provides a capacitor with a large enough capacitance value for circuit design, and is currently available in commercial products. However, the process of embedding high dielectric constant materials in organic substrates is still limited by development cost and material characteristics, and it has not been widely used in the manufacture of miniaturized lumped bandpass filters and single package system modules. SUMMARY OF THE INVENTION It is an object of the present invention to provide a miniaturized lumped bandpass filter designed using a τ-type inductor or a capacitively coupled series resonant circuit architecture, such that the miniaturized lumped bandpass filter is suitable for burying Incorporating an organic 1 (: a package substrate. According to a feature of the present invention, a miniaturized lumped band pass filter embedded in an organic IC package substrate includes: a first capacitor having a first plate and a second a second capacitor having a first plate and a second plate 7 1323559, and the first plate of the first capacitor is electrically connected to the first plate of the second capacitor; a first inductor is connected in series to the first plate a second plate of the capacitor; a second inductor connected in series to the second plate of the second capacitor; and a third inductor electrically connected between the first plate of the second capacitor and a ground. The layout of the lumped bandpass filter forms a transmission zero using the capacitive coupling effect generated between the conductor sidewalls of the organic 1C package substrate. According to a feature of the present invention, another buried organic 1C package is provided. The miniaturized lumped bandpass filter of the substrate comprises: a first capacitor having a first plate and a second plate; a second capacitor having a first plate and a second plate, and the first of the first capacitor The first circuit is electrically connected to the first plate of the second capacitor; the third capacitor is electrically connected between the first plate of the second capacitor and a ground; a first inductor is connected in series to the second of the first capacitor And a second inductor connected in series to the second plate of the second capacitor. The layout of the miniaturized lumped bandpass filter is formed by a capacitive coupling effect generated between sidewalls of the conductor of the organic 1C package substrate The transmission of the zero point. The miniaturized lumped bandpass filter embedded in the organic IC package substrate has the advantages of low cost, high efficiency, good micro-formation effect, and easy integration with 1C into a single package system module, and the like. Advantages, the added value of the product can be greatly increased. The foregoing objects or features of the present invention will be described in detail based on the following figures, but it should be understood that the following figures and examples are merely The present invention is not limited or limited. [Embodiment] 8 1323559 Although the present invention will be fully described with reference to the accompanying drawings in which the preferred embodiments of the invention are described, A person may modify the creations described herein and at the same time obtain the effect of the creation of the creations. Therefore, it is to be understood that the following description is a broad disclosure of those skilled in the art and is not intended to limit the invention.

In view of the shortcomings of the prior art, the present invention uses a τ-type inductively coupled series resonant circuit architecture as shown in the first figure to design a miniaturized lumped bandpass filter instead of a PI-type capacitor or an inductively coupled parallel resonant circuit architecture. The first 埠 110, the second 埠 120, the first series resonant circuit 130, the second series resonant circuit 140, the grounding inductance Li/Ui 150, and the ground terminal 160 are included. The first series resonant circuit 130 is composed of a first series inductor and a first series capacitor electrically connected in series, and the second series resonant circuit 140 is composed of a second series inductor and a second series capacitor electrically connected. A series resonant circuit 130 and a second series resonant circuit 140 are electrically connected to each other via a first series capacitor and a second series capacitor. Finally, the first series resonant circuit 130 and the second series resonant circuit 140 are electrically connected in series via a grounding inductor LiW150 and ground. Terminal 160 is electrically connected. Wherein the resonant angular frequency of the series resonant circuit is such that when the T-type inductively coupled series resonant circuit architecture is adopted, the inductor needs to provide a large inductance value and a Q value, and the capacitor only needs to provide a small capacitance value, and these lumped component characteristics This helps to embed this bandpass filter in a low cost organic 1C package substrate. 9 1323559 Found from previous studies on spiral inductors embedded in organic ic package substrates, please refer to the following documents (MF Davis, A. Sutono, K. Lim, J. Laskar, V. Sundaram, J. Hobbs, GE White , and R. Tummala, "RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology, in IEEE MTT-S Int. Microwave Symp. Dig., 2001, pp. 1731-1734. SH Lee, S. Min, D. Kim, S. Dalmia, W. Kim, V. Sundaram, S. Bhattacharya, G. White, F. Ayazi, JS Kenney, M.

Swaminathan, and RR Tummala, “High performance spiral inductors embedded on organic substrates for SOP applications, in IEEE MTT-S lnt. Microwave Symp. Dig., 2002, PP· 2229-2232.) 'Can be implemented in a small area Multi-turn spiral inductor with high inductance value, in the range of commonly used wireless communication frequency, the inductance value can reach 20 nH and the Q value can be greater than 3〇. It has a miniaturized lumped bandpass that realizes a high-performance D-type architecture. The condition of the filter. The present invention also adopts a T-type capacitive coupled series resonant circuit architecture as shown in the second figure to design a miniaturized lumped bandpass filter instead of a ρι-type capacitor or an inductively coupled parallel resonant circuit architecture, and the first figure. The difference is that the grounding capacitor is used to replace the grounding inductance, so it will not be described here. 隹清=阅图图' shows the miniaturization of the embedded IC package substrate of the present invention: The layout of the embodiment, wherein the organic package substrate is made of a four-layer nitrogen resin laminate (Bismaleimide Triazine Laminate) according to the circuit structure shown in the figure. a first string: an inductor 430 is formed on the second layer of the organic 1C package substrate, and the end of the z-series inductor 430 is electrically connected via the first metal via 481. The second layer of the first and second reeds of the Ray I substrate is formed on the second layer of the organic IC package 460, wherein the first series is connected, the first; the series capacitor 47: the other end of the 7 sense 430 The second layer on the first layer and the second layer of the electric string is formed on the gas plate 4^π plate of the organic IC sealing substrate, the second series capacitor 470 in the middle of the eight, and the 460 The first layer of flatness 440 is formed on the second layer of the organic substrate 1 (the seal of the first layer of the first series of the first series of electricity) The first layer of the second series of capacitors is electrically connected to the first and second grounding inductors 45G of the organic ic package substrate. Via the fourth metal connection / column f87 thousand = and the grounding inductance 450 / 0 Zengzu-cho I I am the fourth brother on the four layers. This layout is characterized by the generation of tiny capacitance between the sidewalls Combining the effect, and using the capacitor to achieve a controllable transmission zero point, to strengthen the material designed by the invention (4) with attenuation capability, such as the vibration f or transmission line and other components, can reduce the band pass filter ride (4) The number of components is miniaturized to further reduce the cost. With continued reference to the third figure, the shape of the first series inductor 43 〇, the second series sense 440 and the ground inductor 450 is a rectangular spiral, and the present invention The lumped bandpass filter operates in the 2.5 to 2.9 GHz Worldwide Interoperability f〇r Microwave Access (WiMax) application band. Through derivation, it can be seen that the band-pass filter has a reflection zero at the frequency 4 and the 吒 position of the resonance angle 1323559, and can represent a flat passband range between q and %. Considering the error of the actual organic ic package substrate process, it may cause The phenomenon that the center frequency drifts, so the resonance of the bandpass filter

The angular frequencies 4 and 吟 are set at 2zx2.05G rad/s and 2nx3.35G rad/s, respectively, which is approximately three times the 400MHz bandwidth required by the system. The roll-off rate is determined by the edge shape factor, \ is a parameter between 0 and 1. The closer to 1, the faster the roll-off rate, the system impedance z . It is 50ω. From the characteristic parameters of the above-mentioned band-pass filter, the component values required for the first diagram-type inductively coupled series resonant circuit architecture can be calculated by the following formula:

y ω}ω2

(2)

2Cse^^2 (3) (4) where, the resonant angular frequency of the series resonant circuit can be expressed as

^C〇jC〇2 S¥ (5) and by the characteristic parameters of the above-mentioned band-pass filter, the following formula can be used to calculate the component values required for the T-type capacitive coupling series resonant circuit architecture of the second figure:

/ Z〇 Si+S¥2 1 -λ 1 ω}ωΊ "\ y ωχω2 ως ω\

(6)(7) 12 1323559

2 (8) where 吟 is the resonant angular frequency of the series resonant circuit, which can be expressed as ωΓ=8¥^ω2 (9)

In addition, the layout of the second embodiment of the present invention replaces the grounding inductance 450 in the layout diagram of the first embodiment with a grounding capacitor, that is, designing a miniaturized lumped strip with a second-picture 电容-type capacitive coupling series resonant circuit architecture. Pass filter. The grounding capacitor includes two plates formed on the first layer and the second layer of the organic 1C package substrate, and the first layer of the grounding capacitor and the second series capacitor 470 and the first series capacitor 460 are first The layer plate is electrically connected, and the second layer of the grounding capacitor is electrically connected to the ground via the fourth metal communication post 487. Since the layout diagram of the second embodiment differs from the layout diagram of the first embodiment only in that the grounding inductance 450 is replaced by the grounding capacitance, it will not be described herein.

Please refer to the fourth figure, which is to evaluate the relationship between the value of the circuit component and the heart of the miniaturized lumped bandpass filter using the circuit architecture of the first figure, wherein the lumped bandpass filter operates at 2.5~ 2.9 GHz wireless metro area network application band. It can be seen from the figure that when & falls within the range of 0.7 to 0.78, the required capacitance range is less than 1 pF, and the required inductance value is not more than 20 nH, which is quite suitable for embedding in the organic 1C package substrate. In addition, in order to make the insertion loss less than 2 dB and provide an attenuation of more than 30 dB in the frequency range below 1 GHz, the choice of the heart is approximately equal to 0.748 to 0.755. The required Lw, Cw and approximately 6 nH, respectively. 0.35 pF and 6 nH. 13 1323559 Please refer to Figure 5A for the finished version of the bandpass filter based on the layout of the fourth figure and using a four-layer nitrogen resin plywood substrate. The finished area of the bandpass filter is only 3 mm X 2.5 mm, and the longitudinal section of the finished product is examined. As shown in the fifth panel B, the thickness of each metal layer and the dielectric layer is relatively uniform, and the total thickness is also equivalent. It is meager, only about 0.45 mm, so it can achieve miniaturization.

Please refer to the sixth figure, which shows the actual equivalent circuit diagram of the third figure. The first circuit 610, the second circuit 620, the first series inductance equivalent circuit 630, the second series inductance equivalent circuit 650, the first series capacitor and the second series capacitor electric series equivalent circuit 640 and the grounding inductance Equivalent circuit 660. The actual equivalent circuit of the bandpass filter is more complicated than the original design circuit (first figure) because of the mutual coupling effect between the lumped elements. In the actual equivalent circuit, it can be found that the coupling capacitance c„, 641 formed by the side walls of the metal plates of the two capacitors generates a transmission zero point, which can be calculated by the following formula: (10) 1 I c„, ylLsedCsedicsed+2Cm

Therefore, controlling the size of this coupling capacitor can be used to select the frequency position at which the zero point is transmitted. Taking the band pass filter as an example, the thickness of the copper conductor of the organic 1C package substrate is about 10~20 um. Through measurement and derivation, the coupling capacitance c„, 641 is about 0.025pF, so that the transmission zero point is predicted to fall near 1GHz. Please refer to the seventh A diagram and the seventh B diagram, which respectively show important performance parameters such as reflection coefficient and insertion coefficient of the band pass filter of the present invention. The calculated results of the electromagnetic simulation software (HFSS) are in good agreement with the results measured by the vector network analyzer. The bandpass filter 14 1323559 is embedded in a four-layer nitrogen resin plywood substrate. The passband range is in line with the original expectations. Between 2.05 and 3.35 GHz, the insertion coefficient is greater than -1.2 dB and the reflection coefficient is less than -15 dB between 2.5 and 2.9 GHz in the WiMax band of importance. In addition, in Figure 7B, it can be found near 1 GHz. There is a transmission zero generated by the coupling capacitor, so that the attenuation capability is greater than 40 dB in the frequency range of less than 1.2 GHz, and the results show that the filter of the present invention is quite excellent in performance. Various changes and modifications can be made without departing from the scope and spirit of the invention, and the invention is not limited by the description. Embodiments of the embodiments.

15 1323559 [Simple description of the diagram] The first figure is the τ-type inductively coupled series resonant circuit architecture used in the manufacture of the miniaturized lumped bandpass filter of the present invention. The second figure is a τ-type capacitive coupled series resonant circuit architecture used in the manufacture of the miniaturized lumped bandpass filter of the present invention. The third figure is a layout view of a first embodiment of a miniaturized lumped bandpass filter embedding an organic 1C package substrate according to the present invention. The fourth figure is a diagram to evaluate the relationship between the circuit component values of the miniaturized bandpass filter, the wave/and/etc, and the circuit element using the circuit architecture of the first figure. The fifth A is a finished product of the band pass filter of the present invention. The fifth B is a longitudinal section of the finished product of the band pass filter of the present invention. The sixth figure shows the actual equivalent circuit diagram of the third figure. Figure 7A is a graph showing the reflection coefficient of the bandpass filter of the present invention. Figure 7B is a diagram showing the interpolation coefficients of the band pass filter of the present invention. Figure 8A shows the PI-type capacitive coupling parallel resonant circuit architecture used in the conventional fabrication of miniaturized lumped bandpass filters. Figure 8B shows the PI-type inductively coupled parallel resonant circuit architecture used in the conventional fabrication of miniaturized lumped bandpass filters. [Main component symbol description] 110...first 埠120---second 埠130-di-one series-connected vibration circuit 140-di-second series vibration circuit 16 1323559 150...grounding inductance 160-grounding terminal 410...first 埠420...second 埠430---first series inductance 440--second series inductance 450-grounding inductance 460...first series capacitor 470---second series capacitor 481--first metal connecting column 483--- The second metal connecting column 485---the third metal connecting column 487---the fourth metal connecting column 610...the first 埠620---the second 埠630---the equivalent circuit of the first series inductor 640-- - an equivalent circuit 641 - electrically connected in series with the second series capacitor and the second series capacitor - a coupling capacitor 650 formed by the side walls of the metal plates of the two capacitors - an equivalent circuit 660 of the second series inductance ... grounding inductance Equivalent circuit 17

Claims (1)

1323559 X. Applying for a patent: 1. The miniaturized surface (4) filter for implanting an organic 1C package substrate, including a first plate and a second plate; - I want to be a female I Ί 7 The second flat handle 2 of the input-capacitor has a first flat plate and a second flat plate and the first plate is connected to the first plate of the second capacitor; a 筮-, connected in series with the first capacitor a second plate; a second plate connected in series with the second capacitor; and a second capacitor between the ground terminal and the second capacitor, and a microcapacitance between the sidewalls of the miniaturized bandpass conductor Eight". The way of the layout of the layout makes the combined effect form a controllable transmission 's 2, and the capacitive coupling effect of the first capacitance is generated by the coupling. The second plate of the capacitor _ combines 2. The miniaturized lumnum of the first scope of the patent application 2 has: 1 C seal, r is a substrate of four layers of nitrogen resin pressed Tnazine Laminate. 3. If the miniaturization of the second application of the patent scope is in the first and second layers of the first capacitor, the first layer and the second layer of the first capacitor are the capacitors of the first and second layers. The first flute two flat plates are respectively formed on the first acoustic-arc layer of the organic Ic package substrate, and the first inductance, the second inductance, and the third inductance are all shaped ==C. The second layer of the package substrate, and the ground terminal is formed to be the fourth. 4. In the miniaturized lumped strip of claim 3, the first end of the first inductor is connected via the first metal. 1323559, the second plate of the first capacitor is electrically connected in series with the second end of the first inductor, and the first end of the second inductor is electrically connected to the second port via the second metal via, and the second inductor is The second end is electrically connected in series with the second plate of the second capacitor, wherein the first end of the third inductor is electrically connected to the first plate of the second capacitor via a third metal communication post, and the second end of the third inductor is The fourth metal-connecting column is electrically connected to the grounding end. 5. The miniaturized lumped band-pass filter according to claim 1, wherein the capacitance of the first capacitor and the second capacitor is cw=±, The inductance of the first inductance and the inductance of the second inductance is Z0 y ω \ value U = 2 and the inductance value of the third inductance Α ω = - JL, where Z. arCsed 2Csed^2 is the system impedance, ~ is the edge form factor, The sum of the spectral angular frequency of the band and the % bandpass filter is called series resonance. The resonant angular frequency of the road. 6. The lumped bandpass filter can be applied to the wireless metropolitan area network (WiMax) from 2.5 to 2.9 GHz as in the patented scope item 1 miniaturized lumped bandpass filter. • 7. A miniaturized lumped bandpass filter embedded in an organic 1C package substrate, comprising: a first capacitor having a first plate and a second plate; a second capacitor having a first plate and a second plate, and the first plate of the first capacitor is electrically connected to the first plate of the second capacitor; a third capacitor is electrically connected between the first plate of the second capacitor and a ground; An inductor connected in series to the second plate of the first capacitor; and a second inductor connected in series to the second plate of the second capacitor; 2 1323559 wherein the miniaturized lumped bandpass filter is arranged in such a manner A small capacitance depletion effect is generated between the sidewalls of the conductor and the capacitive coupling effect is used to form a controllable transmission zero, wherein the capacitive coupling effect is coupled between the second plate of the first capacitor and the second plate of the second capacitor 8. The miniaturized lumped bandpass filter of claim 7, wherein the organic 1C package substrate is a substrate of a four-layer nitrogen resin laminate (Bismaidmide Triazine Laminate). The miniaturized lumped bandpass filter of the eighth item, wherein the first and second plates of the first capacitor are respectively formed on the first layer and the second layer of the organic IC package substrate, and the first of the second capacitors Forming on the first layer and the second layer of the organic IC package substrate respectively, the first and second plates of the third capacitor are respectively formed on the first layer and the second layer of the organic 1C package substrate The first inductor and the second inductor are both formed on the second layer of the organic 1C package substrate, and the grounded creep is formed on the fourth layer. 10 = Shen, the miniaturized lumped band of the ninth patent = the first: the first end of the inductor is connected via the _ metal. The second plate of the capacitor and the first string of the first inductor are both itchy, and the second metal connecting column is electrically connected to the first electrical series, wherein the third capacitor: the first capacitor is electrically connected to the first of the second capacitor The flat plate, the cymbal, and the cymbal are electrically connected to the ground by the fourth metal connecting post. a capacitance value C of the t-th valley and the second capacitor, as in the miniaturized lumped bandpass chopper of claim 7, wherein the third 1323559 inductor and the second inductor are Inductance value isee = J '¥ ¥' --Vτ , ωλω2 ωλω2 ω{ ω2 and the capacitance of the third capacitor where ZQ is the system Lsec®l®2 impedance, & edge waveform factor, 〇)] and 〇&gt 2 is the resonant angular frequency of the bandpass filter and % is the resonant angular frequency of the series resonant circuit. 12. The lumped bandpass filter can be applied to the 2.5 to 2.9 φ GHz band of the wireless metropolitan area network (WiMax) as claimed in claim 7 of the miniaturized lumped bandpass filter.