TWI323526B - Antenna-embedded electronic device and assembly method thereof - Google Patents

Antenna-embedded electronic device and assembly method thereof Download PDF

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TWI323526B
TWI323526B TW95147260A TW95147260A TWI323526B TW I323526 B TWI323526 B TW I323526B TW 95147260 A TW95147260 A TW 95147260A TW 95147260 A TW95147260 A TW 95147260A TW I323526 B TWI323526 B TW I323526B
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antenna
circuit board
hole
holes
flat
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TW95147260A
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Chinese (zh)
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TW200826358A (en
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Shao Chin Lo
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Ralink Technology Corp
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1323526 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種天線内敗之電子元件 electronic device),並且特別地,本發明係關於一種具有插件式 (Dip type)内嵌天線之電子元件。 【先前技術】 由於近年來各種無線產品推陳出新,例如手機、無線區域網 籲路、衛星定位系統等等。消費者對於這些無線產品的要求為低價 格、小尺寸、高表現等等,加這些要求使得這些無線產品設計 增加許多_度。例如以802.11η為標準的2.4GHz無線區域網路 • 卡衫’其内部至少要求内含兩支以上的天線,因此如何在一相 當小的區域内之USB介面無線區域網路卡上放置兩支24G ,天線,將是天線工程師所挑戰之課題。 1 ^ ^ t 針對目前市場上這類產品其天線設計概略可分成外接式天 線、二維印刷電路板印刷天線(PCB Printed、晶片式天線 (_Chip antenm)以及三維金屬式天線。請參閱圖一 A,圖一 A係繪 φ 不外接式天線之電子元件之局部内部示意圖。外接式天線的設計 所佔用的主電路板11面積小,外接的天線12因置於產品本體之 外’該天線可調整角度以獲得不同的夭線輕射場(Ant_油i pattern) ’因此表現較佳。然而,外接的天線本身體積龐大,使用 上易受碰撞而受損’並且因為需要額外的高頻接頭14、高頻 線I3、天線外殼等等,天線組裝不易,生產成本過高。 —請參閱圖一 B ’圖―B係繪示二維印刷電路板印刷天線之電 子7C件之局部内部示意圖。二維印刷電路板印刷天線的設計雖可 將天線22直接成形於主電路板21上,但所站用的主電路板a 面積大,其天線輕射場集中於二維空間,表現較差,並且兩支天 5 線22間的隔離度問題較難克服。 内部天線之電子元件之局部 的祕天線32直接成形於主電 離距i地平面積ίϋ小於二維印刷電路板印刷天線。但是仍需 ,在此禁區Α3内不能有其他元件,故所 板31而言仍大。再者晶片式天線32的成本 天,魏較差。另外兩支 局部D: ®—D係—三維金屬式天線之電子元件之 i輻射二維金屬式天線的設計的天線42具有三維天 區A4不得右-杜、。然、而其所需主電路板41面積魔大(其下方禁 外,今>ΐίί ^),且兩支天線間的隔離度關題健存在。另 Γ it 需事後焊接,且多為人工焊接,成本過高。並 使容⑽Α社電祕齡屬天線’ 史塑吝口匕从二ί具有姑主電路板面積小、低成本、易組裝、不 於響產W外錢錢且具有三維天_射場之天線有其必要性。 【發明内容】 法 本發明之-範4係提供-種天線⑽之電子元件及其組裝方 本毛月之另||_係提供一種具有插件式内鼓天線之電子元 〇 根據-較,具體實_,本發明之天線祕之電子元件包含 、路板、一第一平板狀天線以及一第二平板狀天線。該電路板 1323526 包^第-表面、-與該第-表面相對之第二表面、三個第 =二個第二通孔。該等第—通孔貫穿該第—表面以及該 排列成一直線。該等第二通孔貫穿該第—表面t 第j ΐ且排,—直線。該第—平板狀天線包含三個 ί等第二接腳,每-個第』對i 並且,將該第一平板狀天線從該第—表面 入並且穿過該等對應的第-通孔:且該第二平 大,於該電路板設置。同樣地,將該第二平板狀天 面插人該電路板,致使該等第二接腳插[並且穿過 =對應_二通碰且該第二平滅天線大麵胁該 ,置。t該等第一接腳以及該等第二接腳插入前,每; 孔以及母一個第二通孔上可塗佈一層焊料,並且於詨 ίίί等後,將該電路板連同該第二ϊ板狀天線以 及^一祕狀天線通過—迴焊爐致使該 二接腳固定在該等第-通孔以及解第二通孔内。w及第 第二接腳之兩側,並且固定該等第一 ^ u等第二通孔内。此外,該桿料在該等第一接聊 的分佈係對稱,致使該第—平板狀天線以及該第 由於該等第-通孔以及鱗第二通孔上均塗 =在,過迴焊爐後,該焊料已熔化並藉由毛^ ^ 以及該,第二通孔中以及該等第一接腳ί兩 二板線=分,持大致垂直該電路板之該第-表面:及 ,第-表面。並且於鄉—平絲天_及該第 該第—平板狀天線以及該第二平板 接 另外胃該電路板之該第—表面朝上向時,藉由.該等第一 7 1323526 =犬出?該第二表面的高度等於該第二平板狀天線露出於該第二 ,面的,度’該電路板、該第—平板狀天線以及該第二平板狀天 秦了平穩地通過迴烊爐,完鱗接的程序。此外,該第—平板狀 天=及該第二平板狀天線可以金屬板或且具有天線電路的電路 板^成插件式天線。藉此,該第—平板狀球以及 天線可適於自動化生產,並且成本低廉。 卞祕 心Ξϊ,ΐ於該第—平板狀天線以及該第二平板狀天線具有插 =式ι程的伽以及平板狀結翻特徵,本發明之天線内嵌之電 具有佔用電路板面積小、適於自動化生產、低成本以及產 口口體積小型化等特性。 ,於本發明之優點與精神可以藉由以下的發明詳述及所附圖 式付到進一步的瞭解。 【實施方式】 凊參閱圖二A,圖二A係繪示根據本發明之一第一較佳且體 天線内嵌之電子元件5之示意圖。該天線内叙電^元 ί ί $ —電路板51以及—平板狀天線52。該電路板51包含一 一第二表面514以及二個通孔516。該第一表面 =ΐΐίί Ϊ 514相對,並且該等通孔516貫穿該第一表面 2 2 514(未繪示於圖二Α)。該平板狀天線52包 3 _個接腳522,每一個接腳522分別對應該等通孔& 之一 ,通孔516。並且,該平板狀天線52係從該第一表面512插入該 ’致使該等接腳522插入並且穿過該等對應的通孔训 =該平板狀天線52大麵直於該電路板51之該第—表面512 S又1。 由於該平板狀天線52係呈薄板狀,因此其佔用該電路板51 技術戶斤使用的電路板面積。此外,辭板狀天 線52可為-金屬板’此時本發明之天線_之電子元件$可提 8 1323526 之天線’並且可提供之触場可與先前技術中三 式天、_提並論。另外,該平板狀天線52亦可為一具有 路之電路板’例如軟性電路板㈣舰printed circ岭此 ,天線線路之電路板之厚度夠薄(例如G2mm),該電路 ^的效射以忽略,因此本發明之天線_之電子元件5亦可提 狀天雜轉。此外,亦偷該平板狀 狀’因此每一個通孔516可為一狹縫(未顯示於圖 1==:紐天線52插順雜51時,麵可央持 之夭f Hit閱圖二Β,圖二Β係緣示該第—較佳具體實施例 卿板狀天子Ϊ件5之接腳522局部放大側視圖。為了強化 i”狀f線52的固定,該平板狀天線52在插人該電路板51 ί ^516上塗佈一谭料(例如錫膏)p。該焊料P係主 义的通孔516後,再經過-迴焊爐,該烊料 表面。ΐ二般的情況下,該焊料p亦會部分流出至該第= 路板51上,如凝酬定該平板狀天線52於該電 個接=2="7目^中接腳522上的焊料ρ不僅左右對稱致使每一 古側较之力綱而使辭板狀天線52仍可保持垂 ί導ΐ的Ξί 之ϋ"表面512。並且,該谭料ρ不僅具有電 路板之;^表面有撐的功能。此外在該電 „ 衣囟512以及該第一表面514上都有該炫粗p ίΪΪίΓί狀天線&更可穩固地固定在該電_ 51上。至於 t第「表面512上的焊料Ρ以及該第二表 乂 致等於該平板狀天線52突出於該第一表^ 之间度此可使該平板狀天線52不因些微震動而傾倒,以使 9 1323526 #製程更穩定。在實際應用中,該等接腳522突出的高度不以上 述為限。然而於通常情況,該等接腳522仍突出於該第二表面 514,以使得該焊料P熔化後可流出至該第二表面514"以更加 定該等接腳522。 請參閱圖二C,圖二C係繪示根據本發明之一具體實施例之 天線内嵌之電子元件5,之示意圖。與該第一較佳具體實施例比 杈j該天線内嵌之電子元件5,之平板狀天線52,包含三個接腳 52Z’該天線内嵌之電子元件5,之電路板51,亦包含三個對應的通 孔516,,並且該等通孔516,係成一直線。該等接腳522,中之一個 接腳522,做為RF信號置入點,另一個接腳522,則可做為接地 另—個接腳522,可僅單純做為—結構支撐、—天線接點 =線線路之-部分。於實際天線設計中,該等接腳522ι之功能 則視設計而定,不以上述為限。 之夭圖:圖二〇係繪示根據本發明之另-具體實施例 較,兮子兀件5”之示賴。與該第—健具體實施例比 之電子元件5,'之電路板5i”除了包含二個孔洞 川ί供該平板狀天線52”之接腳522',插入外,尚包含一孔洞 洞Μ8 該平板狀天線52”設置於射。當然,該孔 路板51”與該平板狀天線52,,干涉,所以當 ^近昉#可/疋於该電路板51”的位置離該電路板51,,邊緣 Si ’52Ϊ= 該電路板51,,之邊緣形狀以避免與辭板 為該平板歧ί ^^频實施例,因 之高度即可大幅減低。順道一提,該平板狀 天這是因為該外形除考慮 後之平衡,所以有左右不狀天線52”插入該電路板51” 請參閱圖三A,圖 A係繒'示根據本發明之一第二較佳具磨 之天、子元件6之示意圖。該天線⑽之電子元 6卜—第—平板狀天線62第二平板狀天 、-^1。一該€路板&包含一第一表面612、一第二表面仙(未顯 二2 θ二A中)、二個第一通孔616以及三個第二通孔618。該第 二ίϊ 612與該第二表面614相對,並且該等第一通孔616以及 j第-通孔618貫穿該第-表面612以及該第二表面614。該 =二f孔616係成-直線。該等第二通孔618亦係成一直線。 ,第一平板狀天線62包含三個第一接腳622,每一個接腳 =分別對應該等第-通孔616中之一個第一通孔616。該第二 狀天、線63包含三個第二接腳632(未標示於圖三A中),每-618。一接腳632分別對應該等第二通孔618中之一個第二通孔 61 ^二狀天線&係從該第—表面612插人該電路板 /第一接腳622插入並且穿過該等對應的第一通孔 並且该第一平板狀天線62大致垂直於該電路板61之該第一 插设置。同理’該第二平板狀天線63係從該第一表面612 板61 ’致使料第二獅632插人並且穿職等對應 =j Γ8献該第二平嫌天線63纽垂錄該電路板 W之§亥第一表面612設置。 與該第-較佳具體實施烟理,每—個第—通孔616以及第 3上亦可塗佈一焊料P,(未顯示於圖三A中)。該谭料 佈在該等第一通孔616以及該等第二通孔618與該第-媒腳接處之周圍上。並於該等第—接腳622以及該等第二 應的通孔616、618後,再經過—迴焊爐,鱗 - H:毛細現象均勻流入該等第一通孔616以及該等第 ^通=18中以及該等第一接腳622以及該等第二接腳632之兩 侧接k後該焊料P,凝固並分別固定該等第—接腳⑵以及該等第 該等第—通孔616以及該等第二通孔618中,其示 思圖可參閱圖三Β。關於該第二較佳具體實施例之天線内欲之電 11 1323526 子元件6之各部件之其他要求、說明,均與該第一較佳具體實施 例相同,在此不再贅述。並且,前述各具體實施例相對^該第一 較佳具體實施例之變化,於該第二較佳具體實施例之天線内嵌之 6亦有適用,在此亦不再贅述。例如該等第—通孔^16 或該等第二通孔618可為狹縫,該電路板61與該第一平板狀天 線62或該第二平板狀天線避免干涉的解決方案等等。另外, =等=接腳622突出於該第二表面614之高度與該等第二接腳 贴不ί出於該第二表面614之高度可大略相同,使得該第一平板 持大致直:ΪΤ-天線63於經過該週焊爐時,仍能保 明參酬三Β ’圖三Β係繪示根據本發明之—具體實 ^内蚊電子树6ι之做#賴。她於 之電子元件此第二平板狀天線63 ^該^ ΐ輻《Sit二* I614插人。藉此,該第—平板狀天線62之天 與糾二平板狀天線63之天_射#_ 彳ίίΐϋί ° i外,該第二平板狀天線63於插人該電路板㈠ 平板m同,使得該第-平板狀天線62以及該 nt 罐迴焊爐時,仍能保持大致垂直於該 若在經過該迴烊爐’該第一表面612係朝下 632突出;第平板^大天線63於插入該電路板61後該第二接腳 於該表面一612之高度與該等第一平板狀天線62突出 以^第一平杯之间度大略相同,使得該第-平板狀天線62 直於該1忒?63於經過該迴烊爐時,仍能保持大致垂 根據上述該等實施例,本發明之天線 、天線具有插件式製程的優點以及平板拄 # 板狀天線佔用電路板面積小、天後的特徵,使得該平 射場表現下,相舫天線阿度低,在維持相當的天線輻 野衣灯^先術,可提供體積更,]、的產品。 12 1323526 2關四,圖四係—根據本發明之内嵌式天線之組裝方法 之抓私圖。該組裝法包含首先如圖四中步驟sl〇〇 板丄該電路板包含—第一表面、—與該第—表面相對之第、二 表面、二個第一通孔以及三個第二通孔。該等第一 孔貫ί該第—表面以及該第二表面’該等第一通孔大3 直線’該等弟二通孔亦大致成一直線。 ^著,如圖四t步驟S120所示,提供一第一平板 ^-第二平板狀天線。該第—平板狀天線 、 之-個第 苐二接腳對應該等第二通孔中 並且,如圖四中步驟S140所示,在每一個第一 j孔之周圍塗怖一焊料。接著,如圖四中步驟S16G所示’從 並 ^吏該第二平板狀天線係大致垂直㈣電路板之 最後,如圖四中步驟S180所示,通過一迴銲爐 路悍费並固定該等第一接腳以及該等第二接腳“電 ,板上。其中,母一個第一接腳以及第二接腳兩侧上的 /刀佈係對稱,致使該第一平板狀天線以及該第二 ^在里 過該迴焊舰仍祕持大麵餘該祕板。十錄天線扯 另外,該第二平板狀天線於插入該電路板後突出於該 與該等第-接腳突出於該第二表面之高度大略相H 于k第一平板狀天線以及該第二平板狀天線於經過該迴 仍能保持大致垂直於該電路板。若在㈣該迴焊爐乂第 並且穿過該等對應的第—通孔致使 :平板狀天線係大致垂直於該電路板之該第一表面設置 且從該第二表面插入該等第二接腳並且穿過該等對應的^ 13 1323526 接腳突出於兮ί 第:平板狀天線於插入該電路板後該第二 ⑤度與該等第—平板狀天線突出於該第 ’使魏第—平板狀天_及該第二平板 t 迴焊爐時,仍能保持大致垂直於該電路板。順ί 天線設等第二接腳於烊接固定後,若無其他 之雷2;:板=線或ΐ第二平板狀天線可為-具有天線線路 ii iitif:當該第—平板狀天線或該第二平板狀天 2-尸天線線路之電路板時,並且該個電路板之厚 =0.2mm) ’職電路板的效應可以忽、略,因此經由本發明之内^ 3 ίΐί方法組裝出之電子元件亦可提供—近似三維金屬i 天線之天線輻射場。 胃、 因此,本發明之内嵌式天線之組裝方法可將該第一 ,以及該第二平板狀天線視為插件式元件,使得本發明之天線内 肷之電子元件可_ -般插件式製雜該電路板上其他元件 完成焊接’而絲事後稱接天線_序, 及不良率。藉此’該組裝方法可使得本發明之天線内口 = 件適^動化生產,並且鱗平板狀天線若料1路板日=如 的Ϊΐ電路板’其厚度可薄至G‘2職,並且無需特別製 权來製作),本發明之天線内嵌之電子元件之成本即可大幅降低。 明之該平板狀天線的結構特性,其所需的電路板面 小先讀術所需的電路板面積,並且該平板狀天線可同時 在遠電路板上下兩側伸展,使得整個電子元件的高度可較具一 傳統天線的電子元件更低,因此該天線内嵌之電 ^ =畐縮小,更利於產品設計及開發。例如,適用tit 802.11η為標準之2.4GHz無線區域網路卡領域中,size之 USB介面無線區域網路卡(其主電路板面積為6〇χ2〇 _2)可内 插件式内嵌天線以減少天線使用該主電路板的面積並且 路卡整體厚度(含其塑膠外殼)可降低至l0mm以下。 御月ΐΐ以上較佳具體實_之詳述,係希望能更加清楚描述本 二日日後與财,%並非以上稍赌的紐續實施例來對 i 目岐妓脑1各種改變 及/、相等!>生的女排於本發明所欲申請之專利範圍的範嘴内。义 1323526 【圖式簡單說明】 圖一A係繪示外接式天線之電子元件之局部内部示意圖。 加- B係繪示二維印刷電路板印刷天線之電子元件之局部内 邵不思圖。 圖一 C係繪示晶片式天線之電子元件之局部内部示意圖。 圖一 D係繪示三維金屬式天線之電子元件之局部内部示意BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in an antenna, and in particular, to an electronic component having a Dip type embedded antenna. . [Prior Art] Due to the recent development of various wireless products, such as mobile phones, wireless regional network calls, satellite positioning systems, and the like. Consumers' requirements for these wireless products are low price, small size, high performance, etc. Adding these requirements adds a lot to the design of these wireless products. For example, a 2.4GHz wireless local area network with 802.11n standard • cardigan requires at least two or more antennas inside, so how to place two cards on a USB interface wireless area network card in a relatively small area. 24G, antenna, will be the subject of challenges for antenna engineers. 1 ^ ^ t For the current market, the antenna design outline can be divided into external antenna, 2D printed circuit board printed antenna (PCB Printed, chip antenna (_Chip antenm) and 3D metal antenna. See Figure 1A Figure 1A shows a partial internal schematic diagram of the electronic components of the φ non-external antenna. The design of the external antenna occupies a small area of the main circuit board 11 and the external antenna 12 is placed outside the product body. The angle to obtain different 轻 line light shots (Ant_oil i pattern) 'is therefore better. However, the external antenna itself is bulky and vulnerable to collisions in use' and because additional high frequency connectors are required, High-frequency line I3, antenna housing, etc., antenna assembly is not easy, and the production cost is too high. - Please refer to Figure 1B'Bottom-B to show a partial internal schematic diagram of the electronic 7C piece of the two-dimensional printed circuit board printed antenna. The design of the printed circuit board printed antenna can directly form the antenna 22 on the main circuit board 21, but the main circuit board a for the station has a large area, and the antenna light field is concentrated in the two-dimensional space. The performance is poor, and the isolation problem between the two days and 5 lines is more difficult to overcome. The secret antenna 32 of the internal part of the electronic component of the internal antenna is directly formed on the main ionization distance i flat area is smaller than the two-dimensional printed circuit board printed antenna. Still need, there can be no other components in the forbidden zone ,3, so the board 31 is still large. Moreover, the cost of the chip antenna 32 is poor, and the other two parts are D: ® -D system - three-dimensional metal antenna The antenna 42 of the electronic component i-radiation two-dimensional metal antenna has a three-dimensional sky zone A4 which is not right-du, but the required main circuit board 41 area is large (below the outside, now > ΐ ί ^), and the isolation between the two antennas is strong. Another Γ it needs to be welded after the event, and most of them are artificial welding, the cost is too high. And let the capacity (10) Α 电 电 属 属 属 属 属 ' ' ' ' ' ' ' ' It is necessary to have an antenna with a small area, low cost, easy assembly, no money, and a three-dimensional sky-field. [Inventive content] -Electronic components of antenna (10) and their assembly The other part of the present month||_ provides an electronic unit with a plug-in inner drum antenna. According to the comparison, the electronic component of the antenna of the present invention comprises a road board, a first flat antenna and a a second planar antenna. The circuit board 1323526 includes a first surface, a second surface opposite to the first surface, and three second and second second through holes. The first through holes penetrate the first surface And the second through holes extend through the first surface through the first surface t, and the straight line. The first flat antenna includes three second pins, each of which is ii And, the first planar antenna is inserted from the first surface and passes through the corresponding first through holes: and the second flat is disposed on the circuit board. Similarly, the second planar surface is inserted into the circuit board such that the second pins are inserted [and passed through = corresponding_two-way contact and the second flat antenna is covered with a large surface. Before the first pins and the second pins are inserted, each of the holes and the second through hole of the mother may be coated with a layer of solder, and after the 詨 ί, the board is provided with the second ϊ The plate antenna and the secret antenna are passed through the reflow oven to fix the two pins in the first through holes and the second through holes. w and the two sides of the second pin, and are fixed in the first through holes such as the first ^ u. In addition, the distribution of the rods in the first chats is symmetrical, so that the first flat antenna and the second through holes of the first through holes and the scales are coated on the second reflow oven. After that, the solder has been melted and held by the hair and the second through hole and the first and second pins, and the first surface of the circuit board is substantially vertical: and -surface. And in the township - Pingsitian _ and the first - the flat antenna and the second plate connected to the stomach of the first surface of the circuit board facing upwards, by the first 7 1323526 = dog out The height of the second surface is equal to the second flat antenna exposed on the second surface, the degree 'the circuit board, the first flat antenna, and the second flat shaped Tian Qin smoothly pass through the recovery furnace , the process of finishing the scales. Further, the first flat plate type and the second flat antenna may be a metal plate or a circuit board having an antenna circuit. Thereby, the first flat ball and the antenna can be adapted for automated production and are inexpensive.卞 卞 Ξϊ Ξϊ Ξϊ 该 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板 平板Suitable for automated production, low cost and miniaturization of the mouth of the mouth. The advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings. [Embodiment] Referring to Figure 2A, Figure 2A is a schematic diagram of an electronic component 5 embedded in a body antenna according to a first preferred embodiment of the present invention. The antenna is internally provided with a circuit board 51 and a flat antenna 52. The circuit board 51 includes a second surface 514 and two through holes 516. The first surface is opposite to the first surface 2 2 514 (not shown in FIG. 2). The flat antenna 52 includes three pins 522, and each of the pins 522 corresponds to one of the through holes & a through hole 516. Moreover, the flat antenna 52 is inserted from the first surface 512 to cause the pins 522 to be inserted and pass through the corresponding through holes. The flat antenna 52 is directly facing the circuit board 51. The first surface 512 S is again 1. Since the flat antenna 52 is in the form of a thin plate, it occupies the board area used by the circuit board 51. In addition, the slab antenna 52 can be a - metal plate. At this time, the antenna of the present invention can be used to provide an antenna of 8 1323526 and the available touch field can be compared with the three-day method in the prior art. . In addition, the flat antenna 52 can also be a circuit board having a road, such as a flexible circuit board (four) ship printed circ. The thickness of the circuit board of the antenna line is thin enough (for example, G2mm), and the circuit is effectively ignored. Therefore, the electronic component 5 of the antenna of the present invention can also be turned upside down. In addition, the flat shape is also stolen' so that each of the through holes 516 can be a slit (not shown in Fig. 1 ==: when the neon antenna 52 is inserted into the 51, the surface can be held at the same time. FIG. 2 is a partially enlarged side view of the pin 522 of the first preferred embodiment of the slab-shaped celestial element 5. In order to strengthen the fixing of the i-shaped f-line 52, the flat antenna 52 is inserted. The circuit board 51 ί ^ 516 is coated with a tan material (such as solder paste) p. The solder P is tied to the through hole 516, and then passes through the reflow oven, the surface of the material. The solder p also partially flows out onto the first board 51. For example, the solder ρ on the pin 522 of the flat antenna 52 is not only left and right symmetrical. Each of the ancient sides allows the slab antenna 52 to remain 垂 ϋ ϋ 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面On the electric 囟 512 and the first surface 514, the sleek and thick antennas & are more stably fixed on the electric _ 51. As for the second surface 512 The solder bump and the second surface are equal to the extent that the planar antenna 52 protrudes between the first surface, so that the flat antenna 52 can be dumped without being slightly shaken, so that the 9 1323526 # process is more stable. In practical applications, the height at which the pins 522 protrude is not limited to the above. However, in the normal case, the pins 522 still protrude from the second surface 514, so that the solder P can be discharged to the second after being melted. The surface 514" further defines the pins 522. Please refer to FIG. 2C, and FIG. 2C is a schematic diagram of the electronic component 5 embedded in the antenna according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The electronic component 5 embedded in the antenna, the planar antenna 52, includes three pins 52Z', the electronic component 5 embedded in the antenna, and the circuit board 51 also includes three corresponding through holes. 516, and the through holes 516 are in a straight line. One of the pins 522, which is an RF signal insertion point, and the other pin 522, can be used as a grounding connection. Foot 522 can be simply used as - structural support, - antenna contact = line line - part In the actual antenna design, the function of the pins 522 is determined by the design, and is not limited to the above. Figure 2 is a diagram showing the electronic device according to another embodiment of the present invention. The circuit board 5i of the electronic component 5, compared with the first embodiment, includes two holes for the pin 522' of the flat antenna 52", and is inserted. The hole antenna Μ8 includes the flat antenna 52′′ disposed on the beam. Of course, the hole plate 51′′ interferes with the flat antenna 52, so that the position of the circuit board 51” can be From the circuit board 51, the edge Si '52 Ϊ = the edge of the circuit board 51, the shape of the edge is avoided to avoid the embodiment of the board, and the height can be greatly reduced. By the way, the flat shape is because the shape is balanced after consideration, so there is a left and right antenna 52" inserted into the circuit board 51". Referring to Figure 3A, Figure A shows one of the present invention. A schematic diagram of the second preferred grinding day and sub-element 6. The antenna (10) of the antenna (10) - the first flat antenna 62 is a second flat shape, -^1. A slab & includes a first surface 612, a second surface stencil (not shown in the second θ2A), two first through holes 616, and three second through holes 618. The second surface 612 is opposite the second surface 614, and the first through holes 616 and the j through holes 618 extend through the first surface 612 and the second surface 614. The = two f-holes 616 are lined up in a straight line. The second through holes 618 are also in a straight line. The first planar antenna 62 includes three first pins 622, each of which has a first through hole 616 corresponding to one of the first through holes 616. The second day, line 63 includes three second pins 632 (not shown in Figure 3A), each -618. A pin 632 respectively corresponds to a second through hole 61 of the second through hole 618. The second antenna & inserts from the first surface 612 into the circuit board/first pin 622 and passes through the The corresponding first through hole and the first flat antenna 62 are substantially perpendicular to the first insertion of the circuit board 61. Similarly, the second flat antenna 63 is caused to insert the second lion 632 from the first surface 612 of the board 61' and the second lion 632 is inserted and the corresponding corresponding = j Γ 8 is provided for the second flat antenna 63 to record the circuit board. W § hai first surface 612 set. In conjunction with the first preferred embodiment, a solder P may be applied to each of the first through holes 616 and the third (not shown in Figure 3A). The tantalum material is disposed around the first through holes 616 and the second through holes 618 and the first media pad. And after the first pin 622 and the second through holes 616, 618, and then through the reflow oven, the scale-H: capillary phenomenon uniformly flows into the first through holes 616 and the second After the first pin 622 and the two sides of the second pin 632 are connected to k, the solder P solidifies and fixes the first pin (2) and the first one. In the hole 616 and the second through holes 618, the schematic diagram can be referred to FIG. Other requirements and descriptions of the components of the sub-element 6 of the antenna of the second preferred embodiment are the same as those of the first preferred embodiment, and are not described herein again. Moreover, the foregoing specific embodiments are different from the first preferred embodiment, and the antenna embedded in the second preferred embodiment is also applicable, and details are not described herein again. For example, the first through holes ^16 or the second through holes 618 may be slits, a solution for the circuit board 61 to avoid interference with the first flat antenna 62 or the second flat antenna, and the like. In addition, =etc=the height of the pin 622 protruding from the second surface 614 is substantially the same as the height of the second surface 614, so that the first flat plate is substantially straight: - When the antenna 63 passes through the soldering furnace of the week, it can still guarantee the participation of the three Β 图 图 图 图 图 图 图 图 根据 根据 根据 根据 根据 根据 根据 根据 根据 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 She is in the electronic component of this second flat antenna 63 ^ ^ ΐ 《 "Sit II * I614 inserted. Thereby, the second planar antenna 63 is inserted into the circuit board (1), and the second planar antenna 63 is inserted into the circuit board (1), so that the first planar antenna 62 and the second planar antenna 63 are separated from each other. When the first-flat antenna 62 and the nt can reflow furnace are still substantially perpendicular to the first surface 612, the first surface 612 is protruded downward 632; the first large antenna 63 is inserted. After the circuit board 61, the height of the second pin at the surface 612 is substantially the same as the first flat antenna 62 protruding from the first flat cup, so that the first flat antenna 62 is straight to the same. According to the above embodiments, the antenna and the antenna of the present invention have the advantages of a plug-in process and the plate 拄# plate antenna occupies a small area of the circuit board. The latter feature makes the flat field performance, the relative antenna of the antenna is low, and the product can be provided with a larger volume while maintaining a comparable antenna. 12 1323526 2 off four, Figure 4 is a diagram of the assembly method of the in-cell antenna according to the present invention. The assembly method includes first step S1 in FIG. 4, the circuit board includes a first surface, a first surface opposite to the first surface, two first through holes, and three second through holes. . The first hole and the second surface are equal to each other. The first through holes are also substantially straight. ^, as shown in FIG. 4 t step S120, a first flat panel ^-second flat antenna is provided. The first flat antenna, the second and second pins correspond to the second through holes, and, as shown in step S140 in Fig. 4, a solder is applied around each of the first holes. Then, as shown in step S16G in FIG. 4, 'the second flat antenna system is substantially perpendicular to the last (four) circuit board, as shown in step S180 in FIG. 4, through a reflow furnace, and the fixed Waiting for the first pin and the second pin "electrically, the board. wherein the first pin of the female and the / knife of the second leg are symmetric, such that the first flat antenna and the The second ^ in the reflow ship still has a secret face to the secret board. Ten recording antenna pulls another, the second flat antenna protrudes from the circuit board and protrudes from the first leg The height of the second surface is substantially the same as H. The first planar antenna and the second planar antenna can remain substantially perpendicular to the circuit board after the return. If the reflow furnace is first and passes through the (4) The corresponding first through hole causes: the planar antenna is disposed substantially perpendicular to the first surface of the circuit board and the second pins are inserted from the second surface and pass through the corresponding ^ 13 1323526 pins Prominent in 兮ί: the second 5 degrees after the flat antenna is inserted into the board The first-flat antenna protrudes substantially perpendicular to the circuit board when the first "Wei Di-Platform" and the second flat t reflow furnace. The second pin of the antenna is provided. After the splicing is fixed, if there is no other mine 2;: board = line or ΐ second flat antenna can be - with antenna line ii iitif: when the first flat antenna or the second flat shape 2 corpse When the circuit board of the antenna line is used, and the thickness of the circuit board is 0.2 mm), the effect of the circuit board can be neglected, so that the electronic components assembled by the method of the present invention can also be provided - approximately three-dimensional Antenna radiation field of the metal i antenna. The stomach, therefore, the assembly method of the in-cell antenna of the present invention can treat the first and the second planar antenna as a plug-in component, such that the antenna of the antenna of the present invention The component can be _-plug-in type other components on the circuit board to complete the soldering, and the wire antenna is said to be connected to the antenna _ sequence, and the defective rate. Thus, the assembly method can make the antenna inner mouth of the invention = suitable Production, and scale flat antenna if material 1 board day = If the thickness of the circuit board can be as thin as G'2 and does not need to be specially made, the cost of the electronic component embedded in the antenna of the present invention can be greatly reduced. The structural characteristics of the planar antenna are The required board area requires a small board space required for the first reading, and the flat antenna can be extended on both sides of the far board at the same time, so that the height of the entire electronic component can be more than that of a conventional antenna. Low, so the built-in power of the antenna is reduced, which is more conducive to product design and development. For example, the use of tit 802.11η is the standard 2.4GHz wireless area network card field, the size of the USB interface wireless area network card ( The main circuit board area is 6〇χ2〇_2). The internal plug-in type embedded antenna can reduce the area of the main circuit board used by the antenna and the overall thickness of the road card (including its plastic case) can be reduced to below l0mm. The details of the above-mentioned better details of Yuyue Yu are expected to be able to more clearly describe the two-day and future financials, and the percentage is not a sneak sneak peek to the various changes and/or equals !> The raw women's volleyball is within the scope of the patent scope of the invention to be applied for. Yi 1323526 [Simple description of the diagram] Figure 1A shows a partial internal schematic diagram of the electronic components of the external antenna. Plus-B shows the part of the electronic components of the two-dimensional printed circuit board printed antenna. Figure 1C shows a partial internal schematic view of the electronic components of the wafer antenna. Figure 1 D shows a partial internal representation of the electronic components of a three-dimensional metal antenna

山e it A係繪示根據本發明之一第一較佳具體實施例之天線内 肷之電子元件之示意圖。 + B係繪示該第一較佳具體實施例之天線内嵌之電子元件The mountain e it A is a schematic diagram showing the electronic components of the antenna in the antenna according to a first preferred embodiment of the present invention. + B shows the electronic components embedded in the antenna of the first preferred embodiment

之接腳局部放大侧視圖。 1 IT 係繪示根據本發明之一具體實施例之天線内嵌之電子 疋什之示意圖。 ^二Dj系繪示根據本發明之另一具體實施例之天線内嵌之電The pin is partially enlarged to the side view. 1 IT shows a schematic diagram of an electronic device embedded in an antenna according to an embodiment of the present invention. ^二Dj shows the embedded power of the antenna according to another embodiment of the present invention

卞兀件之不思圖。 嵌之康本發明之一第二較佳具體實施例之天線内 元件姆本發明之—紐細狀天助嵌之電子 圖四係一根據本發明之内嵌式天線之組裝方法之流程圖。 【主要元件符號說明】 11、21、31、41 :主電路板 12、22、32、42 :天線 13 :高頻傳輸線 14 :高頻接頭 16 1323526 A3、A4 :禁區 5、5·、5"、6 :天線内嵌之電子元件 51、51’、5Γ、61 :電路板 62 :第一平板狀天線 512、612 :第一表面 516、516’ :通孔 618 :第二通孔 622 :第一接腳 52、52、52π :平板狀天線 63 :第二平板狀天線 514、614 :第二表面 616 :第一通孔 522、522'、522":接腳 632 :第二接腳 ρ、Ρ,:焊料 S100〜S180 :組裝方式之步驟 17I don’t think about it. In the antenna of the second preferred embodiment of the present invention, the present invention is a flow chart of a method for assembling an in-cell antenna according to the present invention. [Main component symbol description] 11, 21, 31, 41: Main circuit board 12, 22, 32, 42: Antenna 13: High-frequency transmission line 14: High-frequency connector 16 1323526 A3, A4: Forbidden area 5, 5·, 5" , 6: electronic components 51, 51', 5, 61 embedded in the antenna: circuit board 62: first planar antenna 512, 612: first surface 516, 516': through hole 618: second through hole 622: One pin 52, 52, 52π: flat antenna 63: second flat antenna 514, 614: second surface 616: first through hole 522, 522', 522 ": pin 632: second pin ρ, Ρ,: Solder S100~S180: Step 17 of the assembly method

Claims (1)

1323526 、‘申請專利範圍: 1、 一種内嵌式天線(Embedded antenna)之組裝方法(A method),包含下列步驟: ^sSembly ⑻提供一電路板(Circuit b〇ard),該電路板包含一第一 (Surface)、一與該第一表面相對之第二表面以及三個 孔(Via hole),該等第一通孔貫穿該第一表面以及該 ^ 面,該等第一通孔大致成一直線; 一'^ (b)提供一第一平板狀天線們咖她酿),該第一平板 包含三個第-接腳㈣,每一個第一接腳對應該等诵 孔中之一個第一通孔;以及 ⑷從該第-表面插人該等第—接腳並且穿過該等對應的 通孔致使該第-平板狀天線係大致垂直於該電路板之該 一表面設置。 μ 2、 如申^專利範圍第i項所述之組裝方法,進一步包含下述步驟: 乂驟⑹之刖,塗佈—焊料(S()lder)於每—個第_通孔之 圍上;以及 在步驟(C)之後,通過一迴銲爐(Reflow fUmace),該焊料熔化 以焊接並固定該等第一接腳於該電路板上。 3、 ΐΓίίΐ範圍第2項所述之組裝方法,其中每一個第一接腳之 兩側上的該焊料的分佈係對稱。 4、 利範圍幻項所述之組裝方法,其中該第一平板狀天線 係一具有天線線路之電路板。 5、 範圍第1項所述之組裝方法’其中該第一平板狀天線 1糸金屬板。 6、月ί利範圍第4項或第5項所述之組裝方法,其中該第一平 板狀天線之厚度約0.2公釐。 7、ΐ申ΐί利範圍第1項所述之組褒方法,其中該電路板包含三個 一、孔,該等第二通孔貫穿該第一表面以及該第__ J第二通孔大致成一直線,並且該組裝方法進4以述;亥 (Φ提供-第二平板狀天線,該第二平板狀天線包含三個第二 接腳,每一個第二接腳對應該等第二通孔中之一個第二通 孔;以及 0)、從該第二表面插人該等第二接腳並且穿過該等對應的第二 ,孔致使該第二平板狀天線係大致垂直於該電路板之該第 二表面設置。 圍第7項所述之組裝方法,其中該等第—接腳突出 ==二表_高度等於該第二平板狀天線露出於該第二表面 的南度。 9、圍第7項所述之組裝方法,其中該等第二接腳突出 -表面的⑤度等於該第—平板狀天線露出於 的咼度。 10、=天子元件(Antemia_embedded eleetnmie deviee), ‘電,板(Circuit board),該電路板包含一第一表面(Surface)、 -與该第-表面相對之第二表面以及二個第—通孔 h〇le),該等第-通孔貫穿該第—表面以及該第二表面;以 及 ,平板狀天線(Plate antenna),包含二個第一接腳(p㈤, 第—接麟應鱗第—通孔+之—個第—通孔並且 從該第-表面插入且穿過對應的第一通孔中致使該第一平 板狀天線大致垂直於該電路板之該第一表面設置。 11、如申請專利範圍第1〇項所述之天線内喪之電子元件,其中每一 19 個第一通孔以一焊料(solder)烊接固定對應的第一接腳。 12、 ,申請專利範圍第Η項所述之天蟓内嵌之電子元件,其中每一個 第一接腳兩側上該焊料的分佈係對稱。 13、 如申請專利範圍第1〇項所述之天線内嵌之電子元件,其中該平 板狀天線係一具有天線線路之電路板。 14、 如申請專利範圍第1〇項所述之天線内嵌之電子元件,其中該 板狀天線係一金屬板。 ^ 15、 如申,專利範圍第π項或第Μ項所述之天線内嵌之電子元件, 其中該平板狀天線之厚度約〇 2公釐。 16、 如申請專利範圍第1〇項所述之天線内嵌之電子元件,宜中該電 ,板包含一第三通孔,該第三通孔貫穿該第一表面以^該第二 平板狀天線包含—第三接腳,該第三接腳對應該 通孔並且插入且穿過該第三通孔,並且該等第一通孔與該 第二通孔大致成一直線。 " 17、 如申請專利範圍第16項所述之天線内嵌之電子元件,進一步包 ΠίίΪ狀天線’其中該電路板包含三個第二通孔,該等 貝穿該第—表面以及該第二表面,該等第二通孔大致 ^一^線’該第二平板狀天線包含三個第二 第二接腳對應該等第二通孔中之一個第n 對應的第二通孔中致使該第二平板狀 直於該電路板之該第二表面設置。 18、 ^申請專利範圍第π項所述之天線内嵌之電子元件,立中該等 第-接腳以及該第三接腳突出於該第二表面的高度等=第1 平板狀天線露出於該第二表面的高度。 、β 19、 如申請專利範圍第17項所述之天線内嵌之電子元件,其中該等 1323526 第二接腳突出於該第一表面的高度等於該第一平板狀天線露出 於該第一表面的高度。1323526, 'Scope of application: 1. An embedded antenna assembly method (A method), comprising the following steps: ^sSembly (8) provides a circuit board (Circuit b〇ard), the circuit board contains a a second surface opposite to the first surface and three via holes, the first through holes penetrating the first surface and the surface, the first through holes being substantially in line A '^ (b) provides a first flat antenna, the first flat plate includes three first-pins (four), each of the first pins corresponding to one of the first ones of the pupils And (4) inserting the first legs from the first surface and passing through the corresponding through holes such that the first planar antenna is disposed substantially perpendicular to the surface of the circuit board. μ 2. The assembly method according to the item i of the patent scope further includes the following steps: After the step (6), the coating-solder (S()lder) is placed around each of the first through holes. And after step (C), the solder is melted by a reflow furnace to weld and secure the first pins on the circuit board. 3. The assembly method of item 2, wherein the distribution of the solder on each of the first pins is symmetrical. 4. The assembly method according to the illusion of the range, wherein the first flat antenna is a circuit board having an antenna line. 5. The assembly method of claim 1, wherein the first planar antenna is a metal plate. 6. The assembly method of item 4 or 5, wherein the first planar antenna has a thickness of about 0.2 mm. The method of grouping according to claim 1, wherein the circuit board comprises three one holes, the second through holes penetrating the first surface and the second through hole In a straight line, and the assembly method is described as follows; Hai (Φ provides - a second flat antenna, the second flat antenna includes three second pins, each of the second pins corresponds to the second through hole a second through hole; and 0) inserting the second pins from the second surface and passing through the corresponding second holes, the holes causing the second planar antenna to be substantially perpendicular to the circuit board The second surface is disposed. The assembling method of item 7, wherein the first-pin protrusion == two-table_height is equal to a southness of the second planar antenna exposed on the second surface. 9. The assembly method of clause 7, wherein the second pin protrudes - 5 degrees of the surface is equal to the degree to which the first flat antenna is exposed. 10, = Tianzi element (Antemia_embedded eleetnmie deviee), 'Electric, circuit board, the circuit board comprises a first surface (Surface), - a second surface opposite the first surface and two first through holes H〇le), the first through-holes extend through the first surface and the second surface; and, the flat antenna comprises two first pins (p(f), the first-connected to the scales- a through hole + a first through hole and inserted from the first surface and passing through the corresponding first through hole causes the first flat antenna to be disposed substantially perpendicular to the first surface of the circuit board. The electronic component in the antenna according to the first aspect of the patent application, wherein each of the 19 first through holes is fixed by a solder to fix the corresponding first pin. 12, Patent Application No. The electronic component embedded in the antenna of the item, wherein the distribution of the solder on each of the first pins is symmetrical. 13. The electronic component embedded in the antenna according to the first aspect of the patent application, wherein The flat antenna is a circuit board having an antenna line. 14. The electronic component embedded in the antenna according to Item 1 of the patent application, wherein the plate antenna is a metal plate. ^ 15, as claimed in the antenna of the patent scope π or Μ The embedded electronic component, wherein the flat antenna has a thickness of about 2 mm. 16. The electronic component embedded in the antenna according to the first aspect of the patent application, wherein the board comprises a third through hole. The third through hole extends through the first surface to include a third pin, the third pin corresponds to the through hole and is inserted through the third through hole, and the first through hole A through hole is substantially in line with the second through hole. " 17. The electronic component embedded in the antenna according to claim 16 of the patent application further includes an 天线ίί antenna, wherein the circuit board includes three second passes a hole passing through the first surface and the second surface, wherein the second through hole comprises a plurality of second second pins corresponding to the second through hole One of the second through holes corresponding to the nth causes the second flat shape The second surface of the circuit board is disposed. 18. The electronic component embedded in the antenna of claim π, wherein the first-pin and the third pin protrude from the second surface The height of the first flat antenna is exposed to the height of the second surface. The electronic component embedded in the antenna according to claim 17, wherein the 1323526 second pin protrudes from the The height of the first surface is equal to the height at which the first planar antenna is exposed at the first surface. 21twenty one
TW95147260A 2006-12-15 2006-12-15 Antenna-embedded electronic device and assembly method thereof TWI323526B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425897A (en) * 2013-09-04 2015-03-18 启碁科技股份有限公司 Crossed transmission module and combination method of crossed transmission module
TWI514662B (en) * 2013-08-28 2015-12-21 Wistron Neweb Corp Cross type transmission module and assembling method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI514662B (en) * 2013-08-28 2015-12-21 Wistron Neweb Corp Cross type transmission module and assembling method thereof
US9786991B2 (en) 2013-08-28 2017-10-10 Wistron Neweb Corp. Cross-type transmission module and assembly method thereof
CN104425897A (en) * 2013-09-04 2015-03-18 启碁科技股份有限公司 Crossed transmission module and combination method of crossed transmission module
CN104425897B (en) * 2013-09-04 2017-11-03 启碁科技股份有限公司 The combined method of staggered form transport module and staggered form transport module

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