1323235 六、發明說明： 【發明所屬之技術領域】 本發明涉及切割技術領域，尤其涉及一種電路板用 黏膠膜之切割方法。 【先前技術】 目前，印刷電路板（Printed Circuit Board，PCB )及 其元件之成型主要採用刀模切割法。刀模切割法主要分 為鋼刀模與木刀模切割法。刀模切割法雖能節約成本， 但其切割精度較低，具體地，鋼刀模法之切割精度為土 0.1毫米，木刀模之切割精度為±0.2毫米，這將使待切 割體切割後之實際尺寸與理論尺寸栢差較大，.而且，需 要經常更換刀具，例如，於切割電路板用黏膠膜時，需 要將黏膠膜之黏膠層與離型膜一併切斷，然後將兩者一 併用於後續之壓合製程。當用刀模切割法切割黏膠膜26 時，如圖2所示，現有刀模切割法雖能將黏膠膜26之 黏膠層25與離型膜24 —併切斷，但處於高速運動狀態 之刀具21會接觸切割設備之工作台22,造成工作台22 以及刀具21本身受損，這使得兩者使用壽命均縮短， 以致切割設備提前報廢，從而變相地增加了生產成本。1323235 VI. Description of the Invention: [Technical Field] The present invention relates to the field of cutting technology, and in particular, to a method for cutting an adhesive film for a circuit board. [Prior Art] At present, the printed circuit board (PCB) and its components are mainly formed by die cutting. The die cutting method is mainly divided into a steel die and a wood die cutting method. Although the die cutting method can save cost, the cutting precision is low. Specifically, the cutting precision of the steel knife die method is 0.1 mm, and the cutting precision of the wood knife die is ±0.2 mm, which will make the cutting body to be cut. The actual size and the theoretical size are quite different, and the tool needs to be changed frequently. For example, when cutting the adhesive film for the circuit board, the adhesive layer of the adhesive film needs to be cut off together with the release film, and then Both are used in the subsequent press-fit process. When the adhesive film 26 is cut by the die cutting method, as shown in FIG. 2, the existing die cutting method can cut the adhesive layer 25 of the adhesive film 26 and the release film 24, but is at a high speed. The state of the tool 21 will contact the table 22 of the cutting device, causing the table 22 and the tool 21 itself to be damaged, which results in a shortened service life of both, so that the cutting device is scrapped in advance, thereby increasing the production cost in disguise.
近年來，雷射切割法亦較廣泛地應用於電路板及其 元件之成型，參見文獻：Pulse shaping for laser fusion; Martin. W, Johnson. B, Guinn. K; Lawrence Livermore Lab., Livermore, CA, USA; Quantum Electronics, IEEE 4 1323235In recent years, laser cutting has been widely used in the formation of circuit boards and their components. See the literature: Pulse shaping for laser fusion; Martin. W, Johnson. B, Guinn. K; Lawrence Livermore Lab., Livermore, CA , USA; Quantum Electronics, IEEE 4 1323235
Wnal 〇f; Sep 1977, vow 13jissue9?page 865 〇t 切軎il法不用配置刀模，由此可節 田， 〜丄 丨名刀镇費用，且雷射切 告|J法切割之尺寸精度高，為±〇 〇2 射刀 偌π i夂古二 毛水’但雷射切割設 備鉍格同，而且雷射能量高，很容 緣變色，以致發黑，I至…之切列邊 期之分析顧。MW Μ料“性能與後Wnal 〇f; Sep 1977, vow 13jissue9?page 865 〇t cut il method does not need to configure the die, which can be used to save the field, ~ the name of the knife town, and the laser cut | J method cutting dimensional accuracy, It is the same as the 〇〇2 射2 偌 夂 夂 i夂古二毛水', but the laser cutting equipment is the same, and the laser energy is high, it is very discolored, so that it is black, I to ... . MW Μ "performance and after
f發明内容J 板用:種成本低且切割精度高之電路 提:―種電路板用_膜之切割方法。 機包括刀片及i二刀：:刀!;機進行切割’該刀片切割 步驟1.脖隔離腺 法主要包括以下步驟： 9、離膜，將該隔離臈固定於該工作台； 置於該隔離膜，使其與該隔離膜 割深度大切割歸膜進行切割，使切 膜與隔離膜之厚度U 厚度，小於該待切割黏勝 切割先，，之 高，能滿;=;::二::割精度比刀模切割機 切割方法藉由於切精確；其次，本技術方案之 <工作台上設置隔離膜，能避免 5 w 中刀片劃傷卫作台，造成刀片與工作台受損， 攸而此有效提高切割設備之使用壽命。 【實施方式】 下面將結合附圖與實施例，對本技術方案提供之電 路板用黏膠膜之切割方法作進—步之詳細說明。 參見圖1’其為本技術方案之實施例提供之一種電 路板，黏膠膜之切割方法之切割示意圖。該方法採用刀 片切割機進行切割。 △ '刀片切剎機（圖中未示出）包括刀片U與工作 X刀片切副機為電路板生產領域常用之刀片切割 ::4 L ’二片-11可受驅動系統與控制系統等之控制、 °。即 進仃切割。本實施例選用Graphtec公司生產 之FC4200-50型切割機。 王座 鎢之=片二為超鋼材質刻刀，優選主要成份為碳化 ·’- ，、中，碳化鎢之含量不小於90%，且小於 滿Γ速切割對刀片切割性能之要求。本實施 例選用Graphtec公司生產之CBl5U 5sp型刀片。 :工作台12用於放置待切割體。工作台 有靜電吸附功能之卫作台，以於切割操作前 台，切割體之靜電吸附作用，直接將待“ 附於工作台i2上’而不必設置專用卡 體及 於切割過程中，刀片U之運動速率―、運動; 及切割深度等參數可藉由調節刀片切割機之驅動= 及控制系、统進行控制與調整。 =例Γ財法主要包括以下步驟： 工作台12。供隔離膜13，將該隔離膜13固定於該 △該隔^ 13優選靜電韻膜，以進_步增強 :12對隔離膜13之靜電吸附作 隨刀片11運動而於工作台12上移動。“膜13 ㈣優選厚度為議毫米〜g 塑膠;如::薄膜、聚烯烴薄臈或聚氣乙烯薄膜。 其與該隔離膜、：合割峨 電路板用黏膠膜通常包括離型膜、黏 ;了型膜與保護膜分別位於卿層之兩相對: 面，用以保護黏膠層。 十表 護膜:Γ寺膜進行切割之前’先將黏膠膜之保 …、 形成如圖1所示之待切割黏膠膜16,7 黏膠膜16包括離型膜14與黏膠層15。 該 4該離㈣14為電路板領域常用之離型膜，如聚對 本二曱酸乙二醇酯離型膜。 —該黏膠層15由電路板領域常用之㈣劑構成，如 環氧樹脂類膠黏劑或丙烯酸酯類膠黏劑。 將待切割黏膠膜16之離型膜14貼合於隔離膜13。 離型膜14藉由工作台12以及隔離膜13對其之靜電吸 附作用而固定於隔離膜13,以避免切割時，離型膜14 z、站膠層15隨著刀片11運動而於隔離膜13移動。 另外，於切割操作前，亦可不將保護膜除 免切割過程中損傷與污染黏膠層15。此時，待j以避 出)。將待切護膜(圖1中未示 刀。』黏膠膜16之離型膜14與隔離 即可實現黏膠膜16於隔離膜13上之固^。、3貼合’fInventive content J board: a low cost and high cutting precision circuit: "The cutting method for the circuit board." The machine includes a blade and a second knife:: knife!; machine for cutting 'the blade cutting step 1. The neck isolation gland method mainly includes the following steps: 9. The film is separated from the film, and the spacer is fixed on the table; The film is cut with the cutting depth of the separator to cut the film, so that the thickness U of the film and the separator is less than the thickness of the film to be cut first, and the height can be full; =;:: 2: The cutting precision is better than the cutting method of the die cutter. Secondly, the isolation film is provided on the workbench of the technical solution, which can avoid the blade scratching the table in 5 w, causing damage to the blade and the workbench. This effectively increases the service life of the cutting equipment. [Embodiment] Hereinafter, a method for cutting an adhesive film for a circuit board provided by the present technical solution will be described in detail with reference to the accompanying drawings and embodiments. Referring to Fig. 1', a schematic diagram of a cutting method of a method for cutting a magnetic film provided by an embodiment of the present technical solution. This method uses a blade cutter to cut. △ 'Blade cutting machine (not shown) includes blade U and working X blade cutting machine for blade cutting in the field of circuit board production: 4 L 'two piece 11 can be driven by the drive system and control system, etc. Control, °. That is, cutting in and out. In this embodiment, an FC4200-50 type cutting machine manufactured by Graphtec Co., Ltd. is used. Throne Tungsten = Sheet 2 is a super-steel material knives, preferably the main component is carbonized · '-, medium, tungsten carbide content of not less than 90%, and less than the full idling cutting requirements for blade cutting performance. In this embodiment, a CBl5U 5sp type blade manufactured by Graphtec Co., Ltd. is used. : The work table 12 is used to place the body to be cut. The workbench has a static adsorption function, so as to cut the front of the operation, the electrostatic adsorption of the cutting body will be directly attached to the workbench i2 without having to set a special card body and in the cutting process, the blade U Parameters such as movement rate, motion, and depth of cut can be controlled and adjusted by adjusting the drive of the blade cutter and the control system. The example method includes the following steps: Workbench 12. For the isolation membrane 13, The separator 13 is fixed to the Δ, preferably the electrostatic film, to be further enhanced: 12 electrostatic adsorption of the separator 13 is performed on the table 12 as the blade 11 moves. "Film 13 (four) preferred The thickness is about mm ~ g plastic; such as: film, polyolefin thin tantalum or polyethylene film. The adhesive film for the separator and the circuit board usually comprises a release film and a paste; the film and the protective film are respectively located on opposite sides of the layer: a surface for protecting the adhesive layer. Ten watch film: Before the film is cut, the adhesive film is protected first, and the adhesive film 16 to be cut as shown in Fig. 1 is formed. The adhesive film 16 includes the release film 14 and the adhesive layer 15 . The 4 (4) 14 is a release film commonly used in the field of circuit boards, such as a polyethylene terephthalate release film. - The adhesive layer 15 is composed of a (4) agent commonly used in the field of circuit boards, such as an epoxy type adhesive or an acrylate type adhesive. The release film 14 of the adhesive film 16 to be cut is attached to the separator 13. The release film 14 is fixed to the separator 13 by electrostatic adsorption of the table 12 and the separator 13 to prevent the release film 14 z and the station layer 15 from moving along the blade 11 during the cutting. 13 moves. In addition, the protective film may not be damaged or contaminated by the adhesive layer 15 during the cutting process before the cutting operation. At this time, wait for j to avoid). The protective film (not shown in Fig. 1) can be separated from the release film 14 of the adhesive film 16 to achieve the adhesion of the adhesive film 16 to the separator 13.
利用刀片Μ待切割黏膠臈 調即刀片11切割力與切割速率， 刀。J 之切割深度，使切室J喋声女於作 攸而控制刀片n 小於待叫㈣膜割黏膠膜16之厚度， 例由於二=ΖΖ型膜14之厚度之和。本實施 j引陈去了保濩膜，因此，應 該離型m η與黏歸15之厚度大於 14、黏膠層15與該隔離膜：：…於該離型膜 U可切割斷_膜16m之尽度之和’以保證刀片 避免刀片.11劃傷工作”心：割斷隔離膜13,從而 切到六倍Λ 同時避免工作台η受損。 切咅·]力優選（U牛頓〜6牛 又損 米/分〜65米/分。 刀片η之逮率優選1 此外，於切割操作前， 膜時’應調節切割力與刀片之：待：割=膜之保護 離型膜、黏膠層與保護膜之…切封深度大於該 層與保護膜與該隔離膜之厚声小於該離型膜、黏朦 顯高‘度為—，明 邊平整，無毛邊。、^去之切割精度，且樣品切割 8 ⑶3235 本貧施例藉由採用價格比刀模切割機與雷射切割 2均低之刀片切割機作為切割設備，以刀片為切割工 具’能滿足柔性電路板制樣之精度要求，並降低了成 本。本貫施例藉由於切割機之工作台設置隔離膜，能避 免切刮過程中刀片劃傷工作台，造成刀片與工作台受 損，從而有效提高了切割設備之使用壽命。 σUse the blade to cut the adhesive 臈 to adjust the cutting force and cutting rate of the blade 11, knife. The cutting depth of J is such that the cutting chamber J is squeaky and the controlling blade n is smaller than the thickness of the film-cutting adhesive film 16 to be called (4), for example, due to the sum of the thicknesses of the two-type film 14 . In this embodiment, the protective film is removed. Therefore, the thickness of the release type m η and the adhesive layer 15 should be greater than 14, the adhesive layer 15 and the separator::...the release film U can be cut and broken_film 16m The sum of the sums of the 'to ensure that the blade avoids the blade. 11 scratch work." Heart: cut off the separator 13 and cut it to six times Λ while avoiding damage to the table η. Cut 咅 ·] force is preferred (U Newton ~ 6 cattle Also damage the meter / minute ~ 65 m / min. The capture rate of the blade η is preferably 1 In addition, before the cutting operation, the film should be adjusted to the cutting force and the blade: to be: cut = film protection release film, adhesive layer The sealing depth of the protective film is greater than the thicker sound of the layer and the protective film and the isolating film than the release film, and the adhesiveness is high, the brightness is flat, no burrs, and the cutting precision is And the sample is cut 8 (3) 3235. This lean example uses a blade cutter with a lower price than the die cutter and the laser cutter 2 as the cutting device, and the blade as the cutting tool can meet the precision requirements of the flexible circuit board sample preparation. And the cost is reduced. This embodiment can be avoided by providing a separator for the workbench of the cutting machine. During the cutting process, the blade scratches the workbench, causing damage to the blade and the workbench, thereby effectively improving the service life of the cutting device.
、日综上所述，本發明確已符合發明專利之要件，遂依 讀出專利申請。惟，以上所述者僅為本發明之較佳實 =方式’自+不能以此限制本案之中請專利範圍。舉凡熟 心本案技藝之人士援依本發明之精神所作飾 或變化’皆應涵蓋於以下申請專利範圍内。 W 【圖式簡單說明】 圖1係本技術方案之切割方法之㈣示意圖。 圖2係先前技術之刀模切割法之㈣示意圖。 【主要元件符號說明】 刀片 11，21 工作台 12 ’ 22 隔離膜 13 離型膜 14, 24 黏膠層 15，25 黏膠膜 » 26In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is read. However, the above is only the preferred embodiment of the present invention. Any person who is familiar with the skill of the present invention will be covered by the spirit of the present invention. W [Simple description of the drawing] Fig. 1 is a schematic diagram of (4) of the cutting method of the technical solution. Figure 2 is a schematic view of (4) of the prior art die cutting method. [Key component symbol description] Blade 11,21 Workbench 12 ′ 22 Isolation film 13 Release film 14, 24 Adhesive layer 15,25 Adhesive film » 26