TWI318859B - - Google Patents

Info

Publication number
TWI318859B
TWI318859B TW094147455A TW94147455A TWI318859B TW I318859 B TWI318859 B TW I318859B TW 094147455 A TW094147455 A TW 094147455A TW 94147455 A TW94147455 A TW 94147455A TW I318859 B TWI318859 B TW I318859B
Authority
TW
Taiwan
Application number
TW094147455A
Other languages
Chinese (zh)
Other versions
TW200726372A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW094147455A priority Critical patent/TW200726372A/en
Priority to US11/540,395 priority patent/US20070152486A1/en
Publication of TW200726372A publication Critical patent/TW200726372A/en
Application granted granted Critical
Publication of TWI318859B publication Critical patent/TWI318859B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW094147455A 2005-12-30 2005-12-30 Method of manufacturing fixture base of microelectromechanical elements and circuit boards and its structure thereof TW200726372A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094147455A TW200726372A (en) 2005-12-30 2005-12-30 Method of manufacturing fixture base of microelectromechanical elements and circuit boards and its structure thereof
US11/540,395 US20070152486A1 (en) 2005-12-30 2006-09-29 Mounting seat for an integrated circuit and a circuit board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094147455A TW200726372A (en) 2005-12-30 2005-12-30 Method of manufacturing fixture base of microelectromechanical elements and circuit boards and its structure thereof

Publications (2)

Publication Number Publication Date
TW200726372A TW200726372A (en) 2007-07-01
TWI318859B true TWI318859B (en) 2009-12-21

Family

ID=38223605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147455A TW200726372A (en) 2005-12-30 2005-12-30 Method of manufacturing fixture base of microelectromechanical elements and circuit boards and its structure thereof

Country Status (2)

Country Link
US (1) US20070152486A1 (en)
TW (1) TW200726372A (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688328A (en) * 1985-12-20 1987-08-25 Rca Corporation Method for fabricating a printed circuit board assembly and method for the manufacture thereof
JPS6378717A (en) * 1986-09-22 1988-04-08 Fuji Xerox Co Ltd Manufacture of composite member of metal plate and synthetic resin
JP3404813B2 (en) * 1992-09-04 2003-05-12 住友電気工業株式会社 Aluminum nitride sintered body and method for producing the same
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
US5705450A (en) * 1996-12-17 1998-01-06 The Dow Chemical Company A1N sintered body containing a rare earth aluminum oxynitride and method to produce said body
JP2000239542A (en) * 1999-02-18 2000-09-05 Matsushita Electric Ind Co Ltd Powder composition and its production, and heat- conductive substrate and it production
US7662661B2 (en) * 2004-08-16 2010-02-16 Harvatek Corporation Method of manufacturing a substrate structure for increasing cutting precision and strength thereof

Also Published As

Publication number Publication date
TW200726372A (en) 2007-07-01
US20070152486A1 (en) 2007-07-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees