TWI317813B - Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same - Google Patents

Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same

Info

Publication number
TWI317813B
TWI317813B TW96100755A TW96100755A TWI317813B TW I317813 B TWI317813 B TW I317813B TW 96100755 A TW96100755 A TW 96100755A TW 96100755 A TW96100755 A TW 96100755A TW I317813 B TWI317813 B TW I317813B
Authority
TW
Taiwan
Prior art keywords
wafer testing
assembling
same
probe card
card assembly
Prior art date
Application number
TW96100755A
Other languages
Chinese (zh)
Other versions
TW200829920A (en
Inventor
Yuan-Chi Lin
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW96100755A priority Critical patent/TWI317813B/en
Priority to JP2007003647A priority patent/JP2007227899A/en
Publication of TW200829920A publication Critical patent/TW200829920A/en
Application granted granted Critical
Publication of TWI317813B publication Critical patent/TWI317813B/en

Links

TW96100755A 2006-01-13 2007-01-09 Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same TWI317813B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW96100755A TWI317813B (en) 2007-01-09 2007-01-09 Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same
JP2007003647A JP2007227899A (en) 2006-01-13 2007-01-11 Probe card with zif connector, assembling method thereof, wafer test system, and wafer test method adopting said system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96100755A TWI317813B (en) 2007-01-09 2007-01-09 Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same

Publications (2)

Publication Number Publication Date
TW200829920A TW200829920A (en) 2008-07-16
TWI317813B true TWI317813B (en) 2009-12-01

Family

ID=44818134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96100755A TWI317813B (en) 2006-01-13 2007-01-09 Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same

Country Status (1)

Country Link
TW (1) TWI317813B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484192B (en) * 2012-12-17 2015-05-11 Nihon Micronics Kk Probe card, inspection device and inspection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484192B (en) * 2012-12-17 2015-05-11 Nihon Micronics Kk Probe card, inspection device and inspection method

Also Published As

Publication number Publication date
TW200829920A (en) 2008-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees