TWI317804B - Hot plate with cooling stand - Google Patents

Hot plate with cooling stand

Info

Publication number
TWI317804B
TWI317804B TW96143624A TW96143624A TWI317804B TW I317804 B TWI317804 B TW I317804B TW 96143624 A TW96143624 A TW 96143624A TW 96143624 A TW96143624 A TW 96143624A TW I317804 B TWI317804 B TW I317804B
Authority
TW
Taiwan
Prior art keywords
hot plate
cooling stand
stand
cooling
hot
Prior art date
Application number
TW96143624A
Other languages
Chinese (zh)
Other versions
TW200923311A (en
Inventor
Chia Kang Wang
Jesse Chan
Original Assignee
Grand Plastic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grand Plastic Technology Co Ltd filed Critical Grand Plastic Technology Co Ltd
Priority to TW96143624A priority Critical patent/TWI317804B/en
Publication of TW200923311A publication Critical patent/TW200923311A/en
Application granted granted Critical
Publication of TWI317804B publication Critical patent/TWI317804B/en

Links

TW96143624A 2007-11-16 2007-11-16 Hot plate with cooling stand TWI317804B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96143624A TWI317804B (en) 2007-11-16 2007-11-16 Hot plate with cooling stand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96143624A TWI317804B (en) 2007-11-16 2007-11-16 Hot plate with cooling stand

Publications (2)

Publication Number Publication Date
TW200923311A TW200923311A (en) 2009-06-01
TWI317804B true TWI317804B (en) 2009-12-01

Family

ID=44728527

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96143624A TWI317804B (en) 2007-11-16 2007-11-16 Hot plate with cooling stand

Country Status (1)

Country Link
TW (1) TWI317804B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111696871B (en) * 2020-02-28 2022-11-08 浙江铖昌科技股份有限公司 Chip mounting method
CN113996907B (en) * 2021-11-29 2022-06-10 浙江龙际立尔半导体科技有限公司 Heating plate manufactured by diffusion welding and welding method

Also Published As

Publication number Publication date
TW200923311A (en) 2009-06-01

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