TWI315399B - - Google Patents

Info

Publication number
TWI315399B
TWI315399B TW95140391A TW95140391A TWI315399B TW I315399 B TWI315399 B TW I315399B TW 95140391 A TW95140391 A TW 95140391A TW 95140391 A TW95140391 A TW 95140391A TW I315399 B TWI315399 B TW I315399B
Authority
TW
Taiwan
Application number
TW95140391A
Other languages
Chinese (zh)
Other versions
TW200821574A (en
Inventor
shui-jin Wang
Cong-Min Chen
Kai-Ming Wang
Xue-Long Chen
wei-ji Li
Original Assignee
Univ Nat Cheng Kung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Cheng Kung filed Critical Univ Nat Cheng Kung
Priority to TW95140391A priority Critical patent/TW200821574A/en
Publication of TW200821574A publication Critical patent/TW200821574A/en
Application granted granted Critical
Publication of TWI315399B publication Critical patent/TWI315399B/zh

Links

TW95140391A 2006-11-01 2006-11-01 System and method for measuring junction temperature and thermal resistance of light emitting diode TW200821574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95140391A TW200821574A (en) 2006-11-01 2006-11-01 System and method for measuring junction temperature and thermal resistance of light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95140391A TW200821574A (en) 2006-11-01 2006-11-01 System and method for measuring junction temperature and thermal resistance of light emitting diode

Publications (2)

Publication Number Publication Date
TW200821574A TW200821574A (en) 2008-05-16
TWI315399B true TWI315399B (en) 2009-10-01

Family

ID=44770552

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95140391A TW200821574A (en) 2006-11-01 2006-11-01 System and method for measuring junction temperature and thermal resistance of light emitting diode

Country Status (1)

Country Link
TW (1) TW200821574A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104391004A (en) * 2014-11-27 2015-03-04 陕西科技大学 Device and method for testing heat radiation performance of lossless lamp
US9110125B2 (en) 2012-08-14 2015-08-18 Industrial Technology Research Institute Method and apparatus for detecting relationship between thermal and electrical properties of semiconductor device
US9557368B2 (en) 2012-08-16 2017-01-31 Industrial Technology Research Institute Method of measuring thermal electric characteristics of semiconductor device
TWI833464B (en) * 2022-11-24 2024-02-21 長聖儀器股份有限公司 Thermal resistance measurement results consistency device for cooling modules

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404923B (en) * 2008-07-07 2013-08-11 Ind Tech Res Inst Standard Test Method for PN Joint Temperature of Light Emitting Diodes
EP2296436B1 (en) * 2009-09-07 2018-11-14 Nxp B.V. System and method for output flux measurement of a light emitting diode
CN103543174B (en) * 2013-10-30 2015-05-13 工业和信息化部电子第五研究所 Testing method and system of junction-loop thermal resistance

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9110125B2 (en) 2012-08-14 2015-08-18 Industrial Technology Research Institute Method and apparatus for detecting relationship between thermal and electrical properties of semiconductor device
US9557368B2 (en) 2012-08-16 2017-01-31 Industrial Technology Research Institute Method of measuring thermal electric characteristics of semiconductor device
CN104391004A (en) * 2014-11-27 2015-03-04 陕西科技大学 Device and method for testing heat radiation performance of lossless lamp
TWI833464B (en) * 2022-11-24 2024-02-21 長聖儀器股份有限公司 Thermal resistance measurement results consistency device for cooling modules

Also Published As

Publication number Publication date
TW200821574A (en) 2008-05-16

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees