TWI313750B - Testing module adopted for various electronic elements - Google Patents

Description

1313750 IX. INSTRUCTIONS: [Technical field of invention] The sub-element provides a test module that can be used for different types of electronic 70-pieces without the need to replace the test module, and can perform different types of electric lifting systems with good convenience and cost saving. [Prior Art] 'P with a convenient memory card that can store data (such as stomach CaniS) is applied to electronic products such as mobile phones, digital cameras, Ξ^ί=Λ(ΤΑ), etc. Solution, the card is based on the performance and the knife has SD s memory card 1 A, Mini_SD memory card 丄 B, 1 C and other types, and each SD memory card 丄 a, Mini_SD record ^ = card Mlrco-SD memory card The bottom surface of 1 C is provided with contacts i 〇a, 1 0 B 1 〇C for the communication number, because the dimensions of each SD memory card 1 A, Mini-SD memory card 1 B, and Mirco-SD memory card 1 c are different. The positions of the joints 丄〇A, 丄〇B, and 10 C are also different. Since the memory card has undergone multiple production and processing processes, the manufacturer will perform test operations to ensure the quality of the product. After the production is completed, the test will be performed to test whether the memory card is damaged, and the defective product will be eliminated. The memory card test machine will test the memory card. For the electrical operation, for example, please refer to the pictures shown in Figures 2, 3 and 4. 'The memory card test machine is equipped with the retire test module 3's Lai Zone 2, and its service 3 system has the base plate 3!

A plurality of test sockets 3 2 having a single probe set 31 are mounted on the board 31, and the positions of the probe sets 31 are corresponding to the contact positions of the single type memory card, for example, the position of the contacts of the card 1A. 1〇a, and the bottom surface of the test socket 3 2 locks a test board 3 3 , the test board 3 3 is also disposed at the position of the corresponding probe set 3 21 , and the loop 3 31 is provided at the end of the probe set 3 21 The top contact and the positioning of the young memory card 1A to be tested can be quickly placed in the top surface of the substrate 3 to lock the introduction plate 34, and the introduction plate 34 is corresponding to each test socket 3 2 The position is provided with a guide hole for the 4 4 i, and the size of each of the holes 3 4 2 is the same as that of the SD memory card 1 A for quick introduction of the SD memory card 待A ' to be tested. 1313750 (Recall that the card 1 A contact 1 〇A is accurately aligned against the test socket 3 2 咕ίΐ21 tip '俾 to use the probe set 3 21 to test the test plate 3 3 β 5 Lf to be tested SD memory card 1 A, and then perform electrical test operations. $, Figures 5 and 6 show that due to various types of memory card size and contact position δ, the operator wants to perform another type of Mirco_SD memory. 1 C test = industry time 'that must replace Mirco_SD memory card c for the entire test module (9) Miscellaneous group 3 eight test suite 3 2 A also for Mirco: 曰t memory card 1 ° contact 10 C The position of the single-probe group 3 21 A is set to = early test circuit 3 3 1 red board 3 3 A, and the substrate 3 1 A = f is placed with the introduction of the applicable Mirco-SD memory card i C Plate 3 4 a, each of the insertion holes of the introduction plate 3 4 2 A size for the Mirco-SD memory card 1 C, in order to accurately import the Mirco-SD memory card 1 c, so that the memory card 1C The contact point 1〇c is accurately pressed against the probe set 3 21 A of the test socket 3 2, and the electrical test operation is performed. Because ^, according to the different types of memory card test operations described above, each test mode is known. Group = single-fine needle check size, _ set single-test probe set j-seat, test board with single test loop, and induction board with insert holes, change, 'test The module can only be used to test a single type of memory card. When the manufacturer wants to test different types of memory cards, the test module of each test area of the memory card tester must be disassembled and replaced. It is used for the test module of the type of memory card to be tested. As a result, the test operation will be different depending on the memory card surface to be tested, and the test module must be disassembled and disassembled, resulting in inconvenient test operation and reduced production capacity. Because of the test, the group only applies to a single type of memory card. When the memory card tester is configured with 4 test areas, one type of memory card, the operator must purchase 4 sets of test modules, if the test one, the type of memory Cards, that is, 12 sets of test modules must be purchased, which not only greatly increases the test cost, but also a large number of test modules occupy a considerable space for storage.故 Therefore, how to design a memory module that does not need to be cumbersome to assemble and disassemble, and to test different types of memory cards, to improve the convenience of operation, save costs and to collect empty modules, is the standard that the industry is committed to research and development. Door ' 1313750 【Abstract】 The purpose of his t-= is to provide a testable type of electronic components that can be applied to the test. Department, each set of difficult electronic components, the ruler has a number of stages to guide a number of sets of guide sets 'type two; use the test set of each of the 'bearing can try purple, pieces can be ordered different _ electronic components The practical benefits of the test are replaced by the test module, so that the profitability is improved and the production efficiency is improved. The purpose of the invention is to provide a type that can be applied without a type of test; a plurality of test sockets on the upper flap, each test contact, and another The test board of the guide group is used for the top of each guide group--^ The test mold __change _ the guide board t hole; thereby 'improving the production efficiency ί effect 换 change ♦ group' Easy to use rubber type: ΐί, :: Waiting: When the test socket can be made of conductive rubber and the electronic components to be tested, it can use conductive rubber loss, = improve the electronic component of the electronic component to be tested = component measurement The group can test different types of electronic Kona three 'if a test module is for different types of electronic components Set; group 2 = web modulus = 1,313,750 cost of the test module, to reduce the test cost effective and practical interest. [Embodiment] 1 In order to make the reviewer further understand the present invention, the embodiment and the drawings are described in detail as follows: f. Please refer to Figures 7, 8, and 9. Applicable to different types of test modules, can be applied to QFN, BGA or memory card and other electronic components test operation 'and can be assembled in the automatic classification machine, test and points _; the following _, _ The test module 4 includes a substrate 4, a plurality of test sockets 4 2 and a test board 44. The substrate 41 is provided with a plurality of receiving holes 4 Ii, and in the bottom two phase, the m-wall county recessed metal screw hole 4 1 3 groove 412, a plurality of test sockets 4 2 are provided according to different types of memory card size and are layer-by-layer concave The first receiving portion 4 2 i, the second receiving portion 4 2 2 and the first placing portion 4 2 3 ', for example, the first receiving portion 4 2 ! can correspond to the size of the SD memory card, and the first mounting portion 4 2 2 can correspond to the size of the Mini-SD memory card, and the third mounting part j 2 3 can correspond to the size of the Mirco-SD memory card, and the third probe set 4 29 corresponds to the contact position of the Mirco-SD memory card. and The circumferential sides of the first receiving portion 4 2丄, the second=<442 2 and the second receiving portion 4 2 3 are respectively provided with guiding surfaces 24 and 425 and corresponding to the type of memory card contacts. The V-knife is provided with a first guide group, a second guide set and a third guide set, and the first guide set, the second guide set and the third guide set may be the first probe set 4 2, the second probe 2 8 and the third probe set 4 2 9, that is, the first-to-first, and the 4 2 7 of the first-mounting portion 4 21 correspond to the contact position of the SD memory card. The second mounting portion 4 2 2 probe group 4 y corresponds to the contact position of the Mini-SD memory card. The third probe group 4 2 9 of the third bearing f ΐ 4 2 3 corresponds to the connection of the Mirco-SD memory card. And the two probes of the first probe set 4 27, the second probe set 4 28 and the third probe set 9 respectively protrude from the top and bottom of the test sleeve 4 2 , and the other two Two-group two test sockets 4 2 formed with a through-hole 4 3丄 connection plate '1313750 4

4 3 0, so that each test socket 4 2 is placed in the receiving hole 4ii of the substrate 41, so that the connecting plate 4 3 0 is inserted into the groove 412, so that the bolt penetrates the connecting plate 4 3 0 The hole 4 31 is screwed into the screw hole 413 of the substrate 41 to lock the two test sockets 4 2 on the substrate 41, and then the test plate 4 4 is locked on the bottom surface of each test sleeve 4 2 . 4 4 is in the corresponding test socket 4 2 first probe group 4 2 7 , second probe group 4 2 8 and third probe group 4 2 9 position respectively provided with a first test circuit 4 41, the first The second test circuit 4 4 2 and the third test circuit 44 3, and the first test circuit 44 1 , the second test circuit 44 2 and the third test circuit 4 4 3 are available for the corresponding first probe group 4 2 7 , The probe ends of the second probe set 1, 4 2 8 and the second probe set 4 2 9 are in contact with each other to complete the assembly operation of the test module 4. The test module 4 of the present invention is disposed in the test area 5 i of the memory card testing machine 5 to perform a test operation to test the SD memory card 6 as an example. Since the size of the first bearing portion 4 2 测试 of the test sleeve 4 2 corresponds to the size of the SD § memory card 6, the SD memory card 6 can be guided by the guiding inclined surface 4 2 4 to be quickly placed and positioned. The SD memory card 6 is limited to be located in the first bearing ^ 4 2 1 ' and the position of the first probe group 4 2 7 is set according to the position of the contact 61 of the SD memory card 6, and the SD to be tested can be made. The contact point 6 of the memory card 6 is accurately aligned against the first probe set 4 2 7 , because the first receiving portion 4 21 , the second receiving portion 4 2 2 and the third receiving portion 4 2 3 are The first probe set 4 27, the second probe set 428, and the third probe set 4 29 have a -(four) difference 'to prevent the SDf card 6 from being pressed against the other The probe set damages the surface, and the first probe set 4 27 can be used to form a path for the contact 6 of the SD memory card 6 to be tested, so that the test board 4 4 will test the signal. Transfer to the SD to be tested § Recall card 6 and executable Test operations. ^青 Refer to Figures 13 and 14 for the 'when the operator performs another type of Μω-SD memory card 7 test operation', there is no need to replace the entire test module, and the second mounting part of the 4 2 2 size corresponds to The size of the Mini-SD memory card 7 is 1313750 and extends to the guide bevel 4 2 5 material Mini~SD memory card 7 is quickly placed into the position of the application 111 " ^ memory card 7 is limited to the second mounting portion 4 2 2, And the first, ', and 4 2 8 positions are based on the position of the contact point 7 1 of the Min Bu SD memory card 7 ϊ = the reference point 7 1 of the test card 'memory card 7 can be accurately aligned. The page is offset by -ςίΓΛ ^ί4 2 8 'In turn, the second probe set 4 2 8 can be used to make the contact point 7 1 of the Mini a card 7 to be tested and the second test circuit 4 4 of the test board 4 4 = 'to make the test board 4 4 The test signal is transmitted to the Mini-SD memory card to be tested and can perform electrical test operations.

_ςΓ, as shown in Figures 15, 5, when the operator performs another type of Mirco. When the card 8 test operation is completed, it is not necessary to replace the entire test module. Since the third mounting portion of the test sleeve 42 has a size corresponding to the size of the Mirco-SD memory card 8, 'the inclined surface can be used. 4 2 6 guiding the Mirco-SD memory card 8 to quickly position: and, the Mirco-SD memory card 8 to be tested is limited to the third mounting portion 4 2 3, and the first probe group 4 2 9 The position is set according to the position of the contact point 81 of the Mirco-SD memory card 8, and the contact 8丄 of the Mirc〇_SD memory card 8 to be tested can be accurately aligned against the third probe group 4 2 9, Further, the third probe set 4 29 can be used to form a path between the contact 8 1 of the Mirco-SD memory card 8 to be tested and the third test back 4 4 3 of the test board 4 4, so that the test board 4 4 transmits the test signal. The electrical test operation can be performed to the "jin (7)-SD memory card 8 to be tested. See the figures 17, 18, and 19, which are another structural diagram of the test module of the present invention. The test module 4A includes There are a substrate 41 A, a test socket 4 2A, a test board 4 4A, and an introduction board 4 5A, 4 5 B, and 4 5 C. The substrate 41A is provided with a plurality of receiving holes 411 A and adjacent to the bottom surface. Socket hole A groove 412A having a screw hole 413A is recessed in the wall thickness between the 411A, and a plurality of guide posts 414A and a screw hole 415A are disposed on the top surface, and the plurality of test sockets 4 2A have an array of probe sets. The set of guides, and the positions of the first probe set 4 2 7A, the second probe set 4 2 8A and the third probe set 4 2 9A respectively correspond to the contact positions of different types of memory cards, for example, the first The probe set 1313750 ' 4 2 7 A can correspond to the contact position of the SD memory card, the second probe set 4 2 8 A can correspond to the contact position of the Mini-SD memory card, and the third probe set 4 2 9 A Then, the position of the joint of the Mirco-SD memory card can be matched, and the probe ends of the first probe group 4 2 7 A, the second probe group 4 2 8 A and the second probe group 4 2 9 A Projecting the top plate and the bottom surface of the test socket 4 2 A respectively, and forming a connecting plate 4 3 0 A with a through hole 4 31A between the two test sets 4 2 A. The test socket 4 2A is placed in the receiving hole 41 1A of the substrate 41A, and the connecting plate 4 3 0 A is placed in the recess 412 A of the substrate 41A, so that the plug passes through the connecting plate 4 3 0 A Hole 4 31 A, and screwed into the screw hole of the substrate 41A _ 41 3 A 'locks the second test socket 4 2 A to the substrate 41A, and then locks a test board 4 4 A on the bottom surface of each of the test sockets 4 2 A, and each test board 4 4 A is corresponding to each other. The test socket 4 2A first probe set 4 2 7A, the second probe set 4 2 8 A and the third probe set 4 2 9 A are respectively provided with a first test circuit 4 41 A, a first test loop 4 4 2 A and the third test circuit 4 4 3 A, and the first test circuit 4 41 A, the second test circuit 4 4 2 A and the third test circuit 4 4 3A are available for the corresponding first probe group 4 2 7A, the second probe set 4 2 8A and the third probe set 4 2 9A have the probe ends abutting, and the applicable induction board can be installed above the substrate 41A according to the type of memory card to be tested. • 45A, 45B, 45C, each of the induction boards 4 5A, 4 5 B, 4 5 C are provided with insertion holes corresponding to the size of a single type of memory card 4 51 A, 4 5 1 B , 4 51C ' for example, the introduction plate 4 5 A insertion hole 4 51A size corresponds to the size of the SD memory card 'Importing plate 4 5 B insertion hole 4 5 1 B size corresponds to the size of the Mini-SD memory card, and the introduction plate 4 5 c Inserting holes 4 5 1 C size corresponds to Mirco-S The size of the D memory card, and the guide plates 4 5 A, 4 5 B , and 4 5 C are provided on the circumferential sides of the insertion holes 4 51A, 451B, and 451C to provide guide surfaces 4 5 2 8 , 4526 , and 452 (:, Guide holes 4 5 3 A, 4 5 3 B, 4 5 3 C and through holes 4 54A, 454B, 454C, h I313750 are respectively disposed at positions of the corresponding substrate 4 1 八 枉 414 A and the screw holes 41 5 A The introduction board 4 5 A is mounted on the substrate 41 A as an example, and the introduction board 4 5 A can be placed on the outside of the guide post 414 A of the substrate 41A by using the via hole 4 5 3 A, and placed on the substrate 41A, and The insertion holes 4 51A are placed in the test sockets 4 2 A ' and the bolts are inserted through the through holes 4 5 4A of the introduction plate 4 5 A, and screwed into the screw holes 41 5 A ' of the substrate 41A to make the introduction plate 4 5 A lock is fixed on the substrate 41 A, and the assembly work of the test module 4A is completed. Referring to FIG. 20 and FIG. 21, another embodiment of the test module 4A of the present invention tests the SD memory card 6. The substrate 4 1 A can be locked to the induction board of the SD memory card 6 5 A. Since the size of the insertion hole 4 51 A of the introduction plate 4 5 A is the same as that of the SD memory card 6, the SD memory card 6 to be tested can be guided quickly by the guide inclined surface 452A of the insertion hole 4 5 1 A. Placement positioning, because the position of the first probe set 4 2 7 A of the test socket 4 2 A is set according to the position of the contact point 6 1 of the SD memory card 6, and the SD memory card 6 to be tested is placed in the induction board. After the 4 5 A is placed in the hole 4 51A, the contacts 61 can be accurately aligned against the first probe set 4 2 7 A of the test socket 4 2 A, since the top ends of the probes are stretchable. Actuation, the other surface of the SD memory card 6 to be tested can be pressed against the second probe set 4 2 8 A and the third probe set 4 2 9 A, to utilize the first probe set 4 2 A makes the contact 61 of the SD memory card 6 to be tested and the first test circuit 4 41A of the test board 4 4A form a path, so that the test board 4 4 A transmits the test signal to the SD memory card 6 to be tested and can execute the electricity. Sex test work. Referring to Figures 2 and 2, the other test module 4A of the present invention does not need to replace the entire test module when performing another type of Mini-SD memory card 7 test operation, but only needs to change the test. The induction plate of the module 4A is attached to the substrate 4 1 A to be fitted with the induction plate 4 5 B for the Mini-SD memory card 7 , because of the size of the insertion hole 4 5 1 B of the introduction plate 4 5 B The size of the Mini-SD memory card 7 is the same as that of the Mini-SD memory card 7, and the Mini-SD memory card 7 to be tested can be quickly placed into position by using the guiding slope 4 5 2 B of the insertion hole 4 51B, and the Mini-to be tested is made. The SD memory card 7 is limited to the insertion hole 4 51B, since the position of the test sleeve 4 2 A second probe set 12 1313750 • 4 2 8 A is set according to the position of the contact point 7 1 of the Mini-SD memory card 7 , The contact point 7 1 of the Mini-SD memory card 7 to be tested can be accurately aligned against the second probe set 4 2 8 A of the test socket 4 2 A, and the Mini-SD memory card 7 to be tested is other. The surface of the board can be pressed against the first probe set 4 2 7A and the third probe set 4 2 9 A '俾 to connect the Mini-SD memory card 7 to be tested with the second probe set 4 2 8 A Point 71 and test board 4 4 A second test loop 4 4 2 A forms a path for the test board 4 4 A to transmit the test signal to the river to be tested !!) The memory card 7 can perform electrical test operations. Please refer to FIG. 24, FIG. 5, another structural test module 4a of the present invention, when performing another type of Mirco-SD memory card 8 test operation, 'there is no need to replace the entire test module' and only need to be changed. The induction board of the test module 4A is attached to the substrate 4 1 A for the mounting device V] the introduction board 4 5 C of the irco-SD memory card 8 , because the insertion hole 4 of the introduction board 4 5 C The 5 1 C size is the same size as the Mirco-SD memory card 8, and the Mirco-SD memory card 8 to be tested can be quickly placed and positioned using the guide bevel 4 5 2 ci of the insertion hole 4 51C. The viirC0-SD memory card 8 is limited to the insertion hole 4 51C, since the position of the third probe set 4 2 9 of the test socket 4 2 A is set according to the position of the contact 8 1 of the Mirco-SD memory card 8 , The contact point 8 1 of the Mirco-SD memory card 8 to be tested can be accurately aligned against the third probe set 4 2 9A of the test socket 4 2A, and the other surface portions of the plate 4 5 C are introduced. Then, the first probe set 4 2 7A and the second probe set 4 2 8 ^ can be pressed to make the contact 81 of the Mirco-SD memory card 8 to be tested with the third probe set 4 2 9 A Test board 4 4 A third test loop 4 4 3 A Passage into the test board 4 4 A test signal is transmitted to the test of Mirco-SD memory card 8 may perform the electrical test operations. Referring to FIG. 26, the test socket 4 2A of another structural test module 4 A of the present invention may be an insulating base, and the first guide set, the second guide set and the third guide set Then, it may be a first conductive rubber group 4 3 2A, a second conductive rubber ^ 4 3 3 A and a third conductive rubber group 4 3 4 A, respectively, since each conductive rubber group is soft 13 1313750 due to damage to the surface, Achieve the practical benefits of improving the quality of the memory card to be tested.毋 组 组 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ ·: ϊί test module test but partial top view of the memory card. Figure 6 Figure 7 Figure 8 Figure 9

Figure · S-type another test module to measure SMirc 〇 __SD tactics another - test module test Mlrco-SD record. The parts of the test module of the invention are separated. Partial reduction of the map. The appearance of the test module of the present invention.筮^叫. A partial cross-sectional view of the test module of the present invention. g diagram: The test module of the present invention is configured to measure the i i the present hair _ Wei _ _ memory card. Figure 1 2 · The test module of the present invention is a top view. J 1 3: The test module test JJ of the present invention: The test module of the present invention is tested with a Mini, and is shown in the figure. ^ 6 图··本发_试模_.卩Top view. ί 2: ir another structural test Part of the module = diagram view. 1 ^ Ξ · · Appearance of a structural test module of the invention. Section 2. Partial cross-sectional view of another structural test module. G, the present invention - structural test Module test SD 3 top view. Brother 2 2 Figure: This hair (four) -, 纟 _ job model _ trial hard = ^ front shed. Top view. (8) s reminiscent of the card part 1313750 2 2 Figure 'The invention another - structural test Module test Chi (four) memory card front view. 丨 2nd • The invention is another - pay test try butterfly test group (10) (8) memory card. Top view. 1 Figure 25: The invention is another - knot test module job break (7), Front view of the memory card. Figure 2-6. Schematic diagram of another structural guide set of the other-structure test set. [Key element symbol description] [Literature]

SD memory card: 1 A Mini-SD memory card: 1 B Contact: 10 C Test module: 3, 3 A Test socket: 3 2, 3 2 A Test board: 3 3, 3 3 A Import board: 3 4, 3 4 A Placement hole: 3 4 2, 3 4 2 A [Invention] Test module: 4, 4 A Substrate: 41, 41 A Groove: 412, 412A Guide post · 414 A Test socket: 4 2, 4 2 A Second bearing part: 4 2 2 Third bearing part: 4 2 3 Leading inclined surface: 4 2 4 Leading inclined surface: 4 2 6 First probe set: 4 2 7, 4 2 7A Two probe sets: 4 2 8 , 4 2 8 A Contact: 10 A Mirco-SD Memory card: 1 C Test area: 2 Substrate: 31, 3 1 A Probe set: 3 21, 3 21 A Test loop: 3 31, 3 31 A Leading bevel: 3 41 accommodating hole: 41 1、4 1 1 A Screw hole: 413, 4 1 3 A Screw hole: 415 A First bearing part: 4 21 Leading bevel: 4 2 5 15 1313750

First probe set: 4 2 9 , 4 2 9 A

Connection plate: 430, 430A Through hole: 431, 431A First conductive rubber group: 4 3 2 A Second conductive rubber group: 4 3 3 A

Third conductive rubber group: 4 3 4A Test board: 4 4, 4 4 A First test circuit Second test circuit Third test circuit

44 1,44 1 A 442,44 2A 44 3,44 3A Import plate.4: 5 A, 4 5 B > 4 5 C Placement 孑L : 4 5 1 A % 4 5 1 B 4 5 1 C Bevel: 4 5 2A 4 5 2 B % 4 5 2 C Guide hole: 4 5 3 A, 4 5 3 B, 4 5 3 C Through hole: 4 5 4 A, 4 5 4 B, 4 54C SD memory card: 6 Contacts: 6 1 Mini-SD Memory Card: 7 Contacts: 7 1 Mirco-SD Memory Card: 8 Contacts: 8 1 16

Claims (1)

-1313750 X. Patent application scope: 1. A test module applicable to different types of electronic components, which is provided with at least one test socket on the substrate, and a test board on the bottom surface of the test sleeve, the main feature of which is : The test socket is provided with a plurality of sockets according to different types of electronic components, and each of the sockets is provided with a guide group that is guided to the test board at a corresponding applicable type of electronic component. 2 ·=Please refer to the scope of the patent range w for the measurement of different types of electronic components. 4, and, 3, the substrate is opened with a plurality of accommodating holes for mounting test sets 3. According to the application of the scope of the patent application, the test module of the different types of electronic components can be applied. The substrate is provided with a screw slot and the test socket is provided. The connecting plate is provided with a through hole at a position corresponding to the screw hole of the corresponding groove of the connecting plate for the penetrator to be locked. The measurement of the different types of electronic components described in the first paragraph of the patent scope is as follows. The mounting portion of the test socket is provided with a guide slope on the circumferential side. The test module of the different types of electronic components described in item 1 of the H-patent patent range, wherein the test set of the test set is a probe set. 6 · The scope of the patent range can be different. The test module of the electronic component is applied to (4), BGA or memory card, etc. ΐSpecial 3 Ϊ Ϊ 1 can be applied to different types of electronics The measurement and the secret of the components (10) from the age of the face, to the automatic class; the test module of the electronic component is mounted on the substrate. The test panel is provided on the bottom surface of the i-recording stand, and the main plurality of sets are mixed. M should be independent of the position of the electronic component contact point to the guide group of the board, and the upper position of the substrate is suitable for 4 5 7 8 17 * 1313750 Measure the size of the electronic component type with the insertion plate for the insertion hole. 9. The test module of the different types of electronic components described in item 8 of the patent application scope wherein the substrate is provided with a plurality of receiving holes for mounting test sockets. The test module applicable to different types of electronic components according to the eighth aspect of the patent application, wherein the top surface of the substrate is provided with at least one guide post, and the introduction plate is at the position of the corresponding substrate guide post. Guide holes are provided. The test module of the different types of electronic components according to the eighth aspect of the patent application, wherein the top surface of the substrate is provided with a plurality of screw holes, and the introduction plate is disposed at a position corresponding to the screw hole of the substrate. There are through holes for the bolt to be locked through. , 2 3 4 · 6 7. The test module applicable to different types of electronic components according to item 8 of the patent application scope, wherein the substrate is provided with a concave hole with a screw hole on the bottom surface of the wall between the two receiving holes The slot is provided with a connecting plate between the two test sockets, and a through hole ' is provided at a position corresponding to the screw hole of the corresponding groove of the connecting plate for the bolt to penetrate and lock. According to the invention, the test group of the different types of electronic components described in the eighth aspect of the patent is in which the guide set of the test socket is a probe set. According to the application of the scope of the patent application, the group of different types of electronic components can be applied, and the guide set of the test socket is a conductive rubber group. 'According to the application of the 8th item of the special Nawei, the ugly type of electronic element (2) The size of the insertion hole of the introduction board can correspond to the single-class 2 ΐf ί 围 第 第 第 第 第 第 第 第The component of the guide plate is provided with a guide slope on the side of the guide. Testing; L, 3 electronic components of different types of electronic components "applied to QFN, BGA or memory card ϋΐ 2 2 can be different _ electronic components, the test module is installed on the automatic sorting machine, Automate test and classification operations at 18 8 1313750. 19