TWI312723B - Manufacturing method of casing with pattern - Google Patents

Manufacturing method of casing with pattern Download PDF

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Publication number
TWI312723B
TWI312723B TW96120207A TW96120207A TWI312723B TW I312723 B TWI312723 B TW I312723B TW 96120207 A TW96120207 A TW 96120207A TW 96120207 A TW96120207 A TW 96120207A TW I312723 B TWI312723 B TW I312723B
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Taiwan
Prior art keywords
manufacturing
casing
pattern
mold
ink pattern
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TW96120207A
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Chinese (zh)
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TW200848240A (en
Inventor
Shih-Ching Yu
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Asustek Comp Inc
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Priority to TW96120207A priority Critical patent/TWI312723B/en
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Publication of TWI312723B publication Critical patent/TWI312723B/en

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  • Moulds For Moulding Plastics Or The Like (AREA)

Description

1312723 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種具圖案之殼體的製造方法。 【先前技術】 隨著消費者對電子產品外觀圖案的要求增加,業者也 在電子產品的外觀上不斷的推陳出新,以求刺激消費者的 購買慾望。同時,為因應大量化生產的要求,增加圖案設 置的製程效率,以及降低生產成本的考量也越來越重要。 而現行將圖案形成至電子產品殼體上後,當殼體上有 許多開孔時,由於油墨圖案係大量印製,因此於油墨圖案 印製時,為節省成本並不會於殼體上的開孔對應處留白。 而這則會使油墨圖案形成至殼體上後,於殼體上的開孔 處,留有油墨圖案的多餘殘料。又,於形成製程上產生位 置的誤差,同樣會於殼體上開孔處留有油墨圖案的多餘殘 料。 而習知技術之去除多餘殘料的方式,係由工作人員利 用一刷子,將殼體上開孔處的油墨圖案多餘殘料刷除,或 利用具有黏性的膠帶,將多餘殘料黏除。然而利用這些方 式,工作人員只能依序對殼體上不同部位孔洞的多餘殘料 做清除,不僅花費時間較長且效率不佳。但若為了增加整 體工作效率而增加人力,則同樣也會造成成本的增加。 又,因工作人員施力不當,而造成不需去除之油墨圖案的 損傷亦會形成產品缺陷,使成本更為增加。 1312723 因此,如何設計一種能增加去除多餘殘料工作效率, 且不需提高成本的具圖案之殼體的製造方法,實屬目前重 要課題之一。 【發明内容】 有鑑於上述課題,本發明之目的為提供一種能增加去 除多餘殘料工作效率,且不需提高成本的具圖案之殼體的 製造方法。 • 緣是,為達上述目的,依據本發明之一種具圖案之殼 體的製造方法包含下列步驟:將一圖案形成至一殼體上, 其中殼體係具有複數個開孔,而圖案係覆蓋該等開孔之至 少一部分。利用一氣體喷出設備去除覆蓋於該等開孔上之 圖案。 綜上所述,因依據本發明之一種具圖案之殼體的製造 方法係利用氣體喷出設備來研磨去除覆蓋於殼體上該等 開孔的圖案。與習知技術相比較,本發明利用氣體喷出設 ® 備可同時研磨去除殼體上不同部位孔洞的多餘殘料,可以 使去除多餘殘料的工作效率更為提升。藉此不僅不需再增 . 加人力成本,更甚者可以減少人力成本,使產品售價更進 一步的下降,並增加產品競爭力。 【實施方式】 以下將參照相關圖式,說明依據本發明較佳實施例之 一種具圖案之殼體的製造方法。 1312723 請參照圖1所示,本發明較佳實施例之一種具圖案之 殼體的製造方法係包含步驟S1及步驟S2。其中,殼體例 如但不限於筆記型電腦、手機、監視器等各類型產品之殼 體。 請同時參照圖1、圖2A至圖2D及圖3所示,步驟S1 係將具有油墨圖案101之薄膜10形成於殼體11表面,其 中殼體11係具有複數個開孔Η,薄膜10係覆蓋該等開孔 Η之至少一部分。 • 薄膜10上係先印製有一欲形成於殼體11上的油墨圖 案101,而殼體11之材料則例如為高分子聚合物或金屬。 當殼體11之材料為高分子聚合物時,圖案的形成方式可 利用模内裝飾(In Mold Decoration, IMD)技術,而當殼 體11的材料為金屬時,圖案的形成方式則可使用熱壓轉 印。其中,模内裝飾技術又可分為模内轉印(In Mold Reprint, IMR)及模内貼合(In Mold Lamination, IML), 而本實施例以模内轉印為例作說明。 ® 以下請參照圖2A至圖2D所示,以簡單說明上述之轉 印的步驟。請先參照圖2A所示,首先是利用一送箔機 . (foil-delivered system,圖中未表示)將印有油墨圖案101 的薄膜10送入一射出成形設備2中,並將薄膜10夾置且 固定於一注入模21及一成形模22之間。接著,請參照圖 2B所示,係將注入模21及成形模22彼此壓合,並利用真 空將薄膜10吸附於注入模21侧。接著,請再參照圖2C 所示,係由注入模21之注入孔21h射入形成殼體11之高 1312723 分子聚合物。最後,請參照圖2D所示,係在殼體u射出 成形後,再將注入模21及成形模22分開,則油墨圖案1〇1 將由薄膜10轉印至殼體U上。 ^承上所述,模内轉印與模内貼合兩者的差異則在於, 膜内貼合於製程後,仍於電子產品的殼體u纟面上保留 有薄膜10作為保護膜,而模内轉印則於油墨圖案1〇1轉 印後將薄膜10去除,只留有油墨圖案101於殼體11上。 又田a又體11為金屬材料時所使用的熱壓轉印,其係利 用熱月b將薄膜10上之油墨圖案1〇1轉印至殼體^金屬表 面上。然形成方式並非本發明之技術重點,於此不予以 述。 接著,請參照圖3所示,當殼體n的設計上有許多 開孔Η時,由於具油墨圖案101的薄膜10係大量印製, ,此’於油墨圖案101印製日夺,為節省成本並不會於開孔 ^對應處留白。這會造成油墨随101形成至殼體U上 ,、’於殼體U上的開❹處,留有油墨圖案ι〇ι的 歹^枓Ρ。X ’於形成製程上產生的位置誤差,也會於殼體 上開孔Η處留有油墨圖案ιοί的多餘殘料ρ。 明同時參照圖1及圖4所示,步驟Μ係利用 軋 、出設備3去除覆蓋於該等開孔Η上之油墨圖案如。 亂體喷出設備3例如為一喷砂研磨機,其係具有 及-氣體壓縮機32,兩者互相連接。氣體噴出备 縮機32吸入氣體後,藉由氣體壓縮機% : —i'、為南虔氣體排出。而氣體壓縮機32 *出的高髮 1312723 氣體經-管道33與由一研磨砂供應管料供應的複數個顆 粒狀研磨石少s混合後,再經由喷嘴31排出。由於喷砂研 磨機亦具有多種不同的態樣,在此僅以上述態樣之喷砂研 磨機為例說明。 上述之喷砂研磨機中,與高壓氣體-同噴射出的該等 研磨砂s具有高動能,而本發明則利用該等研磨砂s 擊殼體11上開孔Η處油墨圖案1〇1的多餘殘料p,藉= 將多餘殘料P研磨去除。又,由於同時有許多不同方^ 研磨砂S排出,因此,同時間亦可研磨去除殼體u上 同部位開孔Η的多餘殘料P。另外,喷砂研磨機藉由 斗:嘴31的選擇,可以設定適當的研磨範圍使去除多餘殘 料Ρ的工作效率更為增加。 、 ^注意者’研磨砂s必須選用不會傷及殼體π表面 、材貝’本實施例所選用的研磨砂s例如為圓球形,且 ^更度小於3 ’而粒度之大小則介於丨釐米與羞米之 y上所述,因依據本發明之一種具圖案之殼體的製造 法係利用一嘴砂研磨機來研磨去除覆蓋於 ^的«。與f知技術相比較,本發明_噴砂研= ^時研磨去除殼體上不同部位孔洞的多餘殘料,而再萨 ::砂研磨機之噴嘴的選擇來設定適當的研磨範圍,可二 2除多餘殘料的工作效率更為提升。另外’藉由適當 此m ’也可避免殼體上之油墨圖案受損的情形。藉 不耑再增加人力成本,更甚者可以減少人力成本, 1312723 使產品售價更進一步的下降,並增加產品競爭力。 以上所述僅為舉例性,而非為限制性者。任何未脫離 本發明之精神與範疇,而對其進行之等效修改或變更,均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為本發明較佳實施例之一種具圖案之殼體的製造 方法的步驟流程; • 圖2A至圖2D為圖1之具圖案之殼體的製造方法的第 一步驟流程示意圖; 圖3為一具圖案之殼體不意圖,以及 圖4為圖1之具圖案之殼體的製造方法的第二步驟流 程示意圖。 元件符號說明: 10 薄膜 ® 101油墨圖案 11 殼體 . 2 射出成形設備 21 注入模 21h 注入孔 22 成形模 氣體嘴出設備 喷嘴 31 1312723 32 氣體壓縮機 33 管道 34 研磨砂供應管 Η 開孔 Ρ 殘料 S 研磨砂 SI、S2 具圖案之殼體的製造方法的步驟流程1312723 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of manufacturing a patterned casing. [Prior Art] As consumers' demands for appearance patterns of electronic products increase, the industry continues to innovate in the appearance of electronic products in order to stimulate consumers' desire to purchase. At the same time, in order to meet the requirements of mass production, it is increasingly important to increase the process efficiency of pattern setting and reduce production costs. However, when the pattern is formed on the electronic product casing, when there are many openings in the casing, since the ink pattern is printed in a large amount, when the ink pattern is printed, the cost is not saved on the casing. The corresponding opening of the opening is white. This, after the ink pattern is formed on the casing, leaves excess residue of the ink pattern at the opening in the casing. Moreover, the positional error in the forming process also leaves excess residue of the ink pattern at the opening in the casing. The conventional technique for removing excess residue is by a staff member using a brush to remove excess residue of the ink pattern at the opening in the casing, or by using a sticky tape to remove excess residue. . However, with these methods, the staff can only remove excess residue from the holes in different parts of the casing in sequence, which takes a long time and is inefficient. However, if the manpower is increased in order to increase the overall efficiency of work, it will also increase the cost. Moreover, due to improper application of the staff, damage to the ink pattern that does not need to be removed may also result in product defects, which further increases the cost. 1312723 Therefore, how to design a manufacturing method of a patterned casing that can increase the efficiency of removing excess residue without increasing the cost is one of the important issues at present. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a method of manufacturing a patterned casing which can increase the work efficiency of removing excess residue without increasing the cost. • The edge is that, in order to achieve the above object, a method of manufacturing a patterned casing according to the present invention comprises the steps of: forming a pattern onto a casing, wherein the casing has a plurality of openings, and the pattern covers the Wait at least part of the opening. The pattern covering the openings is removed by a gas ejection device. In summary, a method of fabricating a patterned housing in accordance with the present invention utilizes a gas ejection device to abrade and remove patterns of the openings covering the housing. Compared with the prior art, the present invention utilizes a gas ejection device to simultaneously grind and remove excess residue of holes in different parts of the casing, thereby improving the work efficiency of removing excess residue. This will not only increase the cost of manpower, but also reduce labor costs, further reduce the price of products and increase product competitiveness. [Embodiment] Hereinafter, a method of manufacturing a patterned casing according to a preferred embodiment of the present invention will be described with reference to the related drawings. 1312723 Referring to Figure 1, a method of fabricating a patterned housing in accordance with a preferred embodiment of the present invention includes steps S1 and S2. Among them, the casing is, for example, but not limited to, a casing of various types of products such as a notebook computer, a mobile phone, and a monitor. Referring to FIG. 1 , FIG. 2A to FIG. 2D and FIG. 3 simultaneously, step S1 forms a film 10 having an ink pattern 101 on the surface of the casing 11 , wherein the casing 11 has a plurality of apertures, and the film 10 is Covering at least a portion of the apertures. • The film 10 is first printed with an ink pattern 101 to be formed on the casing 11, and the material of the casing 11 is, for example, a high molecular polymer or a metal. When the material of the casing 11 is a high molecular polymer, the pattern can be formed by In Mold Decoration (IMD) technology, and when the material of the casing 11 is metal, the pattern can be formed by using heat. Pressure transfer. Among them, the in-mold decoration technology can be further divided into In Mold Reprint (IMR) and In Mold Lamination (IML), and the embodiment is described by taking in-mold transfer as an example. ® The following is a brief description of the steps of the above-described transfer, as shown in Figs. 2A to 2D. Referring first to FIG. 2A, first, a film 10 printed with an ink pattern 101 is fed into an injection molding apparatus 2 by a foil-delivered system (not shown), and the film 10 is clamped. It is disposed between an injection mold 21 and a forming mold 22. Next, referring to Fig. 2B, the injection mold 21 and the molding die 22 are pressed against each other, and the film 10 is adsorbed to the injection mold 21 side by vacuum. Next, referring to Fig. 2C, the injection hole 21h of the injection mold 21 is injected into the high molecular weight 1312723 polymer forming the casing 11. Finally, referring to Fig. 2D, after the injection molding of the casing u and the molding die 22 are separated, the ink pattern 1〇1 is transferred from the film 10 to the casing U. According to the above, the difference between the in-mold transfer and the in-mold bonding is that after the film is adhered to the process, the film 10 remains as a protective film on the surface of the casing of the electronic product. The in-mold transfer removes the film 10 after the transfer of the ink pattern 1〇1, leaving only the ink pattern 101 on the casing 11. The hot press transfer used in the case where the body 11 is a metal material transfers the ink pattern 1〇1 on the film 10 to the metal surface of the casing by the heat month b. However, the manner of formation is not the technical focus of the present invention and will not be described herein. Next, referring to FIG. 3, when the housing n is designed with a plurality of apertures, since the film 10 having the ink pattern 101 is printed in a large amount, the ink pattern 101 is printed on the ink, thereby saving The cost will not be left at the corresponding opening of the hole ^. This causes the ink to be formed on the housing U with the 101, and the ink pattern ι〇ι is left at the opening on the housing U. The positional error produced by X' on the forming process also leaves excess residue ρ of the ink pattern ιοί at the opening of the casing. Referring to Figures 1 and 4 simultaneously, the step Μ is to remove the ink pattern covering the apertures by means of the rolling and discharging device 3. The chaotic ejection device 3 is, for example, a sand blasting grinder having a gas compressor 32 connected to each other. After the gas is discharged from the gas discharge/removal machine 32, the gas is discharged by the gas compressor %: -i'. The high-volume 1312723 gas from the gas compressor 32* is mixed with a plurality of granular grinding stones supplied from a grinding sand supply pipe by a pipe 33, and then discharged through the nozzle 31. Since the blasting grinder also has a plurality of different aspects, only the blasting grinder of the above-described aspect is taken as an example. In the above-mentioned sand blasting machine, the abrasive sands s which are sprayed together with the high-pressure gas have high kinetic energy, and the present invention utilizes the abrasive sands to strike the ink pattern 1〇1 at the opening of the casing 11. Excess residue p, l = remove excess residue P to remove. Further, since a plurality of different abrasive sands S are discharged at the same time, the excess residue P of the same opening portion of the casing u can be removed at the same time. In addition, the blasting mill can set an appropriate grinding range by the selection of the bucket: nozzle 31 to increase the work efficiency of removing excess residue. , ^ Note that 'grinding sand s must be selected to not damage the shell π surface, material shell 'The sand s selected for this embodiment is, for example, spherical, and ^ is less than 3 ' and the size of the particle size is between The method of manufacturing a patterned casing according to the present invention utilizes a mouth sand grinder to grind and remove the cover «. Compared with the f-knowledge technology, the present invention _ sandblasting research = ^ grinding to remove excess residue in different parts of the shell, and then: the selection of the nozzle of the sand grinder to set the appropriate grinding range, can be 2 The work efficiency of the excess residue is further improved. Further, the situation in which the ink pattern on the casing is damaged can be avoided by appropriately arranging this m'. By adding more labor costs, it is even more possible to reduce labor costs, 1312723 to further reduce the price of products and increase product competitiveness. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing the steps of a method for manufacturing a patterned casing according to a preferred embodiment of the present invention; FIG. 2A to FIG. 2D are the first embodiment of the method for manufacturing a patterned casing of FIG. FIG. 3 is a schematic diagram of a second step of the method for manufacturing a patterned casing of FIG. 1 . FIG. Description of the components: 10 Film® 101 ink pattern 11 Housing. 2 Injection molding equipment 21 Injection mold 21h Injection hole 22 Forming mold gas nozzle device nozzle 31 1312723 32 Gas compressor 33 Pipe 34 Grinding sand supply pipe Η Opening Ρ Residual Step S Steps for the manufacturing method of the abrasive sand SI, S2 patterned shell

1111

Claims (1)

1312723 、申請專利範圍: :種2案之殼體的製造方法,包含下列步驟: 門孔1成至—殼體上,其中該殼體係具有複數個 口系你復盍該#開孔之至少—部分; T氣體嘴出設備去除覆蓋於該等開孔上之該及圖 嗔專利㈣第2項所述之製造方法,其中該氣體 噴出設備係為喷砂研磨機。 _ 4、 t申請專利範圍第2項所述之製造方法,其中利用該 設備去除覆蓋於料開孔上之㈣案的步驟 由該乳體噴出設備之該噴嘴射出複數個顆粒,並利用 該等顆粒去除覆蓋於該等開孔上之該圖案。 5、 ,申請專利範圍第4項所述之製造方法,其中該等靡 粒係為研磨砂。 、 磨 6、如申請專利範圍$ 5項所述之製造方法,其中該研 12 1312723 ◊係為圓球形。 如申請專利範圍第5項所述之製造方法 砂之莫氏硬度係小於3。 如申睛專利範圍第5項所述之製造方法 ◊之粒度係介於1釐米至0.15釐米。 其中該研磨 其中該研磨 如申請專利範圍第1項所述之製造方法, 之形成方式係利用一模内裝飾方式。 1〇、如中請專利範圍第9項所述之製造方法, 裝飾方式係為模内轉印或模内貼合。 其中該圖案 其中該模内 11如t請專難_lj;M所述之製造方法, 之形成方式係利用熱壓轉印方式。 12、,中請專利_第1項所述之製造方法,, 係包含一油墨圖案。 13'2請專利範圍^項所述之製造方法, 之材料係為高分子聚合物。 其中該圖案 其中該圖案 其中該殼體 14、 士申δ青專利範圍第1 項所述之製造方法,其中該殼體 1312723 之材料係為金屬。1312723, the scope of patent application: The manufacturing method of the casing of the type 2 case, comprising the following steps: the door hole 1 is formed into a casing, wherein the casing has a plurality of mouth systems, and at least part of the #opening hole And the manufacturing method of the second embodiment of the present invention, wherein the gas ejecting apparatus is a sandblasting grinder. The manufacturing method of claim 2, wherein the step of removing the (4) case covering the opening of the material by using the device emits a plurality of particles from the nozzle of the milk ejection device, and utilizes the same The particles remove the pattern covering the openings. 5. The manufacturing method of claim 4, wherein the granules are abrasive sand. 6. The method of manufacturing according to claim 5, wherein the 12 12 1312723 ◊ is spherical. The manufacturing method described in claim 5 of the patent application has a Mohs hardness of less than 3. The manufacturing method according to the fifth aspect of the invention is in the range of 1 cm to 0.15 cm. Wherein the grinding is performed by the method of manufacturing according to the first aspect of the patent application, which is formed by an in-mold decoration method. 1 . The manufacturing method according to claim 9, wherein the decorative method is in-mold transfer or in-mold bonding. Wherein the pattern, wherein the mold 11 is as difficult as _lj; the manufacturing method described in M is formed by a hot press transfer method. 12. The method of manufacturing according to the above-mentioned patent, which comprises an ink pattern. 13'2 The manufacturing method described in the patent scope is the high molecular weight polymer. The method of the present invention, wherein the housing of the housing 1312723 is metal.
TW96120207A 2007-06-05 2007-06-05 Manufacturing method of casing with pattern TWI312723B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413581B (en) * 2010-02-24 2013-11-01 Cheng Chia Yang A shell with three - dimensional mark and its system
TWI473554B (en) * 2011-10-24 2015-02-11 Wistron Neweb Corp Housing and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413581B (en) * 2010-02-24 2013-11-01 Cheng Chia Yang A shell with three - dimensional mark and its system
TWI473554B (en) * 2011-10-24 2015-02-11 Wistron Neweb Corp Housing and manufacturing method thereof

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