1312269 七、指定代表圖： (一） 本案指定代表圖為：第（四）圖。 (二） 本代表圖之元件符號簡單說明： " 3:散熱裝置； - 31 :外框； 32 :風扇本體； 321 :扇葉； 33 ··圓槽；以及 331 :凹槽。 八、本案若有化學式時，請揭示最能顯示發明特徵的 化學式： 九、發明說明： •【發明所屬之技術領域】 本發明係提供一種散熱裝置，特別是有關於一種散熱 裝置之改良。 * 【先前技術】 - 隨著電子資訊工業的突飛猛進，電腦晶片性能不斷的攀升， 對於晶片的體積縮小、運算速度增快與容量加大的要求也越來越 迫切，而這些需求帶動了新晶片製造技術不斷地朝「提高積體密 4 1312269 度」及「縮小晶體間繞線間距離」等方向改進， 也隨之大幅增加，使得晶片的二作溫度也迅速升=:發熱， ，片性能的穩定度與耐久度’未來電子產品（尤其是電腦3=曰 -理器）所引發的散熱需求必社幅增加，而如何提轉效地的^ 決方法’來提升現階段散熱系統的效能，實為發展電子產品之一 重要課題。 一 /而要在狹小且有限的之自由空_，將鹤的熱量散發於電 •腦系統外之環境，通常需要藉助散熱模組；而一般的強制循環散 熱模組，無論是氣冷式或是水冷式，都必須使用冷卻風扇 (,Cooling Fan)直接或間接地把熱量帶走，因此風扇性能的優 劣，將直接影響賴触之散減能。另—方面，由於風扇的加 入，也使其旋轉所產生的氣流鳴音(Aer〇_ac〇ustic)成為電腦的 主要嚼音來社-。因此，若能提高風雜能，_降低其氣流 噪音’則可一併解決上述之散熱與噪音問題。 籲 &於風扇崎流場十分·，當空氣被吸人旋轉扇葉内部， 扇葉表面上、葉片末端間隙（HP)和風扇流道間會有渦流 (Vortex)、溢流(Leakage Fl〇w)與迴流(此邝& F1〇w)等現象產 生，進而降低風扇性能及產生噪音。 明參閱第一圖，係為習知技藝中散熱裝置之示意圖。 圖中，政熱裝置1至少包含一外框n以及一風扇本體12。 /、中將風扇本體12設置於於外框u内，且風扇本體 5 1312269 具有複數«葉12卜㈣扇本體12藉由電源導通後，產 生轉動以達财散熱作H心風扇本體12的扇葉 121於快速轉動時，會在扇葉121之末端附近，形成明顯之氣 流外溢與產㈣流僅驗在麵121流關之流滅舰礙 而降低風量與風壓，㈣也因此產生氣流噪音，而使得其 散熱效果大打折扣。 請參閱第二圖，係為習知技藝中散熱裝置之流道轴向 剖面速度向量分佈圖。财，為4葉121末端附近之流場 所形成之外溢流動速度與產生之21，習知技藝上 ^鑽孔外框u之散熱裝置明顯顯示外溢現象與渦流嚴重 衫響扇# 121流道狀流場’❹卩造成動㈣散降低風屬 性:及產生噪音之因素。由上述可知，影_性能與噪音的 因素，不僅在扇葉121而已，亦同時包含外框U，因此若能妥呈 的設計風扇體顿包含鱗及軸），來減少上述不觀 扇流域料場之因素，則可望提高風扇之性能，同時降似 .氣流嘴音，以符合新-代電腦散熱風扇的需求。 、 傳統提昇風扇性能之方法，大部份 葉外形，此種扇葉之外形設計較困難，且二般風扇 增加而昇高，造成風扇的噪音降低 低其引風口之吸級果。再者，藉由在風扇外框内侧裝ί 1312269 多性孔吸音材料之機制，來降低風扇嗓音的方式其製作步 驟較複雜且成本較高，該機制僅能降低風扇噪音，並不能 提南風扇之效能。 為解決上述習知技藝中所提出的散熱裝置之缺失。本 ' 發明人基於多年從事研究與諸多實務經驗，經多方研究設 計與專題探討，遂於本發明中提出一種散熱裝置以作為解 決前述缺失之一實現方式與依據。 • 【發明内容】 有鑑於上述習知技藝之缺失，本發明之目的係提供一 種散熱裝置可降低上述習知風扇因氣流外溢與衍生之渦流 所產生的氣流噪音，且集中上述習知風扇所分散之風力， 以提升其散熱效果。 依據上述之目的，本發明係揭露一種散熱裝置，且適 用於一電子裝置上，像是一桌上型電腦。此散熱裝置至少 包含一外框以及一風扇本體，其中，外框之材質可為一金 0 屬或一塑膠的硬質材料亦可為一圓型、一方型或一多邊 型，且此外框内設有一圓槽。風扇本體則具有至少一扇葉， 藉以產生至少一氣流且此風扇本體可用以置於上述之圓槽 内。另，圓槽之内壁侧更可設有一或數個凹槽且凹槽可設 於該圓槽之内壁侧之任何位置，而此凹槽可為一同心狀或 ； 其他形狀，藉此消除上述習知之渦流；此渦流即是因扇葉 之一末端讓氣流之漏失所衍生而成的。並藉由消除此渦 * 流，以達同時提升一揚程之效能及降低其噪音之效果。 呈上所述，此發明可一併解決風扇噪音與性能之效 果，已完成之風扇可在不需更換扇葉或外框之情形下，對 7 1312269 其性能與噪音做改良，且不會因為風扇外框附近之遮蔽 物，而降低其性能提昇效果。同時，風扇之外框内侧形成 一溝槽即可使用，製作容易。 茲為使貴審查委員對本發明之技術特徵及所達成之 ' 功效有更進一步之瞭解與認識，下文謹提供較佳之實施例 及相關圖式以為輔佐之用，並以詳細之說明文字配合說明 如後。 • 【實施方式】 為讓本發明之上述目的、特徵、和優點能更明顯易懂， 下文依本發明之散熱裝置特舉一較佳實施例，並配合所附 相關圖式，作詳細說明如下，其中相同的元件將以相同的 元件符號加以說明。 請參閱第三圖，係為本發明之一散熱裝置之示意圖。 圖中，散熱裝置3適用於一電子裝置上，請注意，本例的 電子裝置可為一桌上型電腦、一筆記型電腦或其他，且此 _ 散熱裝置3至少包含一外框31以及一風扇本體32。其中， 外框31之材質可為一金屬或一塑膠的硬質材料且外框31 内可設有一圓槽33，而風扇本體32則可置於圓槽33内， 同時，圓槽33之内壁側則設有一凹槽331。 接續第三圖，請參閱第四圖，係為本發明之一散熱裝 : 置之側視圖。圖中，風扇本體32具有至少一扇葉321，一 般較佳為轴流式風扇，藉以產生至少一氣流，其中，凹槽 • 331為一同心凹槽，此凹槽331具有消除因扇葉321之一 末端而使其氣流之漏失所衍生的一渴流，且藉由消除此渦 流，以提升一揚程之效能及降低噪音之效果。 8 1312269 請參閱第五圖，係為本發明散熱裝置之流道軸向剖面 速度向量分佈圖。圖中，為扇葉末端附近之流場所形成之 外溢流動速度與產生之渦流範圍51，本發明之外框具有凹 - 槽之散熱裝置明顯顯示外溢現象與渦流不影響流場，使整 - 個扇葉流道間之流場十分順暢。而嚴重影響扇葉流道間之 流場，由本發明之外框之凹槽可將外溢之氣流與迴流吞入 其内，並藉由吞入氣流與壁面之摩擦，來消散其動能，進 而減少扇葉翼端間隙之外溢範圍與強度，具有明顯的消散 渦流以及縮小外溢的效果，同時，扇葉翼端與外框間之氣 • 流相當順暢且流速相對提升很多，此即達成提升性能與降 低噪音之效果。 上述之實施例中係以7015風扇為例：其凹槽深度為4 公釐（約為風扇直徑之6%)、寬度為1公釐（約為風扇直徑 之1.4%)、圈數為1圈及刮風角為0°作為實施現本發明之 參數，然，本發明於相關設計上更可考量凹槽深度為風扇 直徑之1%至10%之間的範圍，寬度為風扇直徑之1%至10%之間的 範圍，圈數為1圈至5圈之間的範圍，刮風角為0°至60°之間 φ 的範圍等條件相互配合，經由各項條件之搭配獲得本發明 之散熱裝置最佳效果為：可同時使最大靜壓提升至約 21%、最大流量增加約6 %，並降低約2. 5〜3 dBA之總噪 音值（以上之性能依據AMCA 210-85規範測試；噪音依據 CNS-8753規範在半無響室中量測）。 : 請參閱第六圖，係為本發明之提升性能與降低噪音之 . 散熱裝置製作方法之流程圖。此製作方法之步驟如下： 步称S61 :提供設有一圓槽之一外框； 步驟S62 :對外框加工，以形成至少一凹槽於圓槽之 9 1312269 内壁側；以及 步驟S 6 3 .设置一風扇本體於圓抑内 上述之風扇本體具有至少一扇葉，藉以 凹槽可設於圓槽之内壁侧之任一位置曰，生至少一氣流。其 一末端而使氣流之漏失所衍生之一渦沪—叫、"、有消除因扇葉之 提升一揚程之效能，或具有降低嚷^上藉以’肖除該渦流，具有 -同心凹槽’外框之材質—般較日凹槽—般較佳、為 材料包括為金屬或塑膠。外框一 土』為一硬質材料，硬質 方型或一多邊型等。於相關設:般設計上可為一圓型、— 扇直徑之1%至10%之間的範圍，声上更可考量凹槽深度為風 的範圍’圈數為1圈至5圈之為風扇直徑之1%至10%之間 間的範圍等條件相互配合。的範圍’刮風角為〇。至60。之 以上所述僅為舉例性， 、 本發明之精神與範轉，而對農卜為限制性者。任何未脫離 應包含於後附之申請專赤〃二進仃之等效修改或變更，均 厂扼圍中。 _ 【圖式簡單說明】 第一圖係為習知技藝之〜 第二圖係為習知技藝中散熱裝置f意圖； 分佈圖； …、装置之流道軸向剖面迷度向量 .^三圖料本發明之 :第四圖係為本發明之〜“、、衮置之不意圖； 第五圖係為本發明散執^置之側視圖，· 圖；以及 、置之流這軸向剖面速度向量分佈 第六圖係為本發明之 方法之流程圖。 外性能舆降低噪音之散熱裝置製作 10 1312269 【主要元件符號說明】 I :散熱裝置； II :外框； 12 :風扇本體， 121 :扇葉； 21 :渦流範圍； 3 :散熱裝置； 31 :外框； 32 .風扇本體， 321 :扇葉； 33 :圓槽； 331 :凹槽； 51 :渦流範圍；以及 S61〜S63 :流程步驟。1312269 VII. Designated representative map: (1) The representative representative of the case is: (4). (2) A brief description of the symbol of the representative figure: " 3: heat sink; - 31: outer frame; 32: fan body; 321 : fan blade; 33 · · round groove; and 331: groove. 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: IX. Description of the invention: • Technical field to which the invention pertains The present invention provides a heat dissipating device, and more particularly to an improvement of a heat dissipating device. * [Prior Art] - With the rapid advancement of the electronic information industry, the performance of computer chips continues to rise, and the requirements for shrinking the size of the wafer, increasing the speed of operation and increasing the capacity are becoming more and more urgent. These demands have driven new chips. The manufacturing technology continues to improve in the direction of "increasing the density of 4 1312269 degrees" and "reducing the distance between the windings between crystals", and the number of wafers is also increased rapidly, so that the temperature of the wafer is also rapidly increased. Stability and durability 'The future of electronic products (especially computer 3 = 曰-理器) caused by the increase in cooling demand, and how to improve the effectiveness of the cooling system to improve the efficiency of the current cooling system It is an important topic in the development of electronic products. One / in the narrow and limited free space _, the heat of the crane is emitted outside the electric brain system, usually requires the use of a thermal module; and the general forced circulation cooling module, whether it is air-cooled or It is water-cooled, and the cooling fan must be used to directly or indirectly remove the heat. Therefore, the performance of the fan will directly affect the energy reduction of the touch. On the other hand, due to the addition of the fan, the airflow sound (Aer〇_ac〇ustic) generated by its rotation becomes the main chewing sound of the computer. Therefore, if the wind energy can be improved, and the airflow noise is reduced, the above heat dissipation and noise problems can be solved together.吁 & in Fansaki flow field is very good, when the air is sucked inside the rotating fan blade, there will be vortex (overflow) between the blade surface, the blade end gap (HP) and the fan flow path (Leakage Fl〇 w) and reflow (this 邝 & F1 〇 w) and other phenomena, thereby reducing fan performance and noise. Referring to the first figure, it is a schematic diagram of a heat sink in the prior art. In the figure, the thermal device 1 includes at least an outer frame n and a fan body 12. /, the center fan body 12 is disposed in the outer frame u, and the fan body 5 1312269 has a plurality of «leaf 12 (four) fan body 12, after the power is turned on, the rotation is generated to achieve heat dissipation for the fan of the H-core fan body 12 When the blade 121 rotates rapidly, it will form a clear airflow overflow near the end of the blade 121, and the flow (4) will only reduce the air volume and wind pressure when the flow is blocked on the surface 121. (4) The airflow noise is also generated. , so that its heat dissipation effect is greatly reduced. Please refer to the second figure, which is a vector diagram of the flow path axial profile velocity of the heat sink in the prior art. For the flow area near the end of the 4th leaf 121, the overflow flow velocity is generated and generated 21, and the heat dissipation device of the drilled outer frame u is obviously shown to have an overflow phenomenon and a vortex severe shirt ring fan #121流流流The field '❹卩 动 (4) scatters the wind attribute: and the noise factor. It can be seen from the above that the factors of the performance and the noise are not only in the blade 121 but also in the outer frame U. Therefore, if the fan body is properly designed to include the scale and the shaft, the above-mentioned fanless watershed material is reduced. The factors of the field are expected to improve the performance of the fan, and at the same time reduce the sound of the air nozzle to meet the needs of the new-generation computer cooling fan. Traditional methods for improving the performance of the fan, most of the shape of the blade, the shape of the blade is more difficult to design, and the fan is increased and increased, resulting in a lower noise of the fan and a lower suction level of the air inlet. Furthermore, the mechanism of reducing the sound of the fan is reduced by the mechanism of the 13313269 porous sound absorbing material inside the fan frame. The manufacturing process is complicated and costly. This mechanism can only reduce the fan noise, and can not mention the south fan. Performance. In order to solve the lack of the heat sink proposed in the above prior art. Based on many years of research and many practical experiences, the inventor proposed a heat dissipation device as a solution and basis for solving the aforementioned defects. SUMMARY OF THE INVENTION In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a heat dissipating device which can reduce the airflow noise generated by the above-mentioned conventional fan due to airflow overflow and derived eddy current, and concentrates on the above-mentioned conventional fan dispersion. The wind is used to enhance its heat dissipation. In accordance with the above objects, the present invention discloses a heat sink and is suitable for use on an electronic device such as a desktop computer. The heat dissipating device comprises at least one outer frame and a fan body, wherein the outer frame material can be a gold material or a plastic hard material or a round type, a one type or a polygonal type, and the frame is further provided There is a round groove. The fan body then has at least one blade for generating at least one airflow and the fan body can be used to be placed in the circular groove described above. In addition, the inner wall side of the circular groove may be provided with one or more grooves and the groove may be disposed at any position on the inner wall side of the circular groove, and the groove may be concentric or other shape, thereby eliminating the above A conventional eddy current; this eddy current is derived from the loss of airflow at one end of the blade. And by eliminating this vortex flow, it can simultaneously improve the performance of a lift and reduce the noise. As described above, the invention can solve the effect of fan noise and performance together, and the completed fan can improve the performance and noise of 7 1312269 without replacing the fan blade or the outer frame, and it is not because The shielding near the outer frame of the fan reduces the performance improvement effect. At the same time, a groove can be formed inside the outer frame of the fan, which is easy to manufacture. In order to provide a better understanding and understanding of the technical features of the present invention and the efficiencies achieved, the following examples are provided to facilitate the use of the preferred embodiments and related drawings, and Rear. [Embodiment] In order to make the above objects, features, and advantages of the present invention more comprehensible, the following embodiments of the heat dissipating device according to the present invention, together with the accompanying drawings, are described in detail below. Where the same elements will be described with the same element symbols. Please refer to the third figure, which is a schematic diagram of a heat sink of the present invention. In the figure, the heat sink 3 is suitable for use on an electronic device. Please note that the electronic device of this example may be a desktop computer, a notebook computer or the like, and the heat sink 3 includes at least one outer frame 31 and one Fan body 32. The material of the outer frame 31 can be a metal or a plastic hard material, and a circular groove 33 can be disposed in the outer frame 31, and the fan body 32 can be placed in the circular groove 33, and at the same time, the inner wall side of the circular groove 33 A groove 331 is provided. Following the third figure, please refer to the fourth figure, which is a side view of the heat sink of the present invention. In the figure, the fan body 32 has at least one blade 321 , which is generally preferably an axial fan, to generate at least one air flow, wherein the groove 331 is a concentric groove, and the groove 331 has a fan blade 321 . One end causes a thirst flow caused by the loss of airflow, and by eliminating this eddy current, the effect of one lift and the effect of noise reduction are enhanced. 8 1312269 Please refer to the fifth figure, which is a velocity vector distribution diagram of the axial section of the flow path of the heat sink of the present invention. In the figure, the flow velocity and the generated eddy current range 51 are formed in the flow field near the end of the blade, and the heat dissipation device with the concave-groove in the outer frame of the present invention obviously shows that the overflow phenomenon and the eddy current do not affect the flow field, so that the whole The flow field between the fan blades is very smooth. The flow field between the fan blade channels is seriously affected. The groove of the outer frame of the present invention can swallow the overflow airflow and the backflow, and dissipate the kinetic energy by swallowing the friction between the airflow and the wall surface, thereby reducing the kinetic energy. The fan blade end gap overflows the range and intensity, has obvious dissipating eddy current and reduces the overflow effect. At the same time, the gas flow between the blade wing end and the outer frame is quite smooth and the flow velocity is relatively improved, which achieves the lifting performance and Reduce the effect of noise. In the above embodiment, the 7015 fan is taken as an example: the groove depth is 4 mm (about 6% of the fan diameter), the width is 1 mm (about 1.4% of the fan diameter), and the number of turns is 1 circle. And the wind angle is 0° as a parameter for implementing the present invention. However, the invention can further consider the groove depth to be between 1% and 10% of the fan diameter, and the width is 1% of the fan diameter. In the range between 10%, the number of turns is in the range between 1 turn and 5 turns, and the condition that the wind angle is in the range of 0° to 60° between φ and the like is matched with each other, and the present invention is obtained by the combination of various conditions. The best effect of the heat sink is: the maximum static pressure can be increased to about 21%, the maximum flow rate is increased by about 6%, and the total noise value of about 2. 5~3 dBA is reduced (the above performance is tested according to the AMCA 210-85 specification). The noise is measured in the semi-unscented chamber according to the CNS-8753 specification). : Please refer to the sixth figure for the improvement of performance and noise reduction of the present invention. The steps of the manufacturing method are as follows: Step S61: providing an outer frame provided with a circular groove; step S62: processing the outer frame to form at least one groove on the inner wall side of the 9 1312269 of the circular groove; and step S 6 3 . The fan body has at least one blade in the fan body, and the groove can be disposed at any position on the inner wall side of the circular groove to generate at least one air flow. At one end, the leakage of the airflow is derived from a vortex---, "," to eliminate the effect of lifting the blade due to the lift, or to reduce the 嚷^ on the basis of the vortex, with a concentric groove The material of the outer frame is generally better than the groove of the day, and the material includes metal or plastic. The outer frame is a hard material, a hard square or a polygonal type. In the related design: the general design can be a round type, the range between 1% and 10% of the diameter of the fan, and the sound depth can be considered as the range of the wind. The number of turns is 1 to 5 fans. Conditions such as a range between 1% and 10% of the diameter match each other. The range of the windy angle is 〇. To 60. The above description is only exemplary, and the spirit and scope of the present invention are limited to those of the farmer. Any equivalent modification or change that is not included in the application for inclusion in the attached section is in the factory. _ [Simple diagram of the diagram] The first diagram is the skill of the prior art. The second diagram is the heat sink device f in the conventional technique; the distribution map; ..., the channel axial profile of the device. The fourth embodiment of the present invention is a schematic view of the present invention, and the fifth diagram is a side view of the present invention, and the axial section of the flow. The sixth diagram of the velocity vector distribution is a flow chart of the method of the present invention. External performance 散热 Noise reduction heat dissipation device fabrication 10 1312269 [Main component symbol description] I: heat sink; II: outer frame; 12: fan body, 121: Fan blade; 21: eddy current range; 3: heat sink; 31: outer frame; 32. fan body, 321 : fan blade; 33: round groove; 331: groove; 51: eddy current range; and S61~S63: process step .