TWI311690B - System and method for providing defect printability analysis of photolithographic masks with job-based automation - Google Patents

Description

1311690 IX. Invention Description: Related applications

The user interface of the network type mask defect copyability analysis system (User Interface F〇r A) is disclosed in US Patent Application No. 10/372,066, filed on Feb. 20, 2003.

Part of the splicing application of the Network-Based Mask Defect Printability Analysis System, which is a U.S. Patent Application Serial No. 09/544,798 filed on Apr. 7, 2000. Method and Apparatus For A Network-Based Mask Defect Printabi 1 i ty

U.S. Patent Application Serial No. 09/544,798, filed on Aug. 7, the U.S. Patent Application Serial No. 09/154,397, and the Visuai Inspection and Verification System, Part of the continuation of the application, and the U.S. Patent Application Serial No. 09/154,397, and the U.S. Provisional Patent Application Serial No. 60/059,306, filed on Sep. 17, 1997, &quot;mask certification and design rule check (Mask Vedficati〇) </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Automated capability wire analysis method and system for dual intensity masks, phase shifting masks, and next generation lithography (NGL) reticle used in integrated circuit processing. Related art descriptions when designing integrated circuits (1C) Engineers often rely on computer simulation tools to help create a preliminary design of the circuit that consists of a specific function. To accurately create this circuit, the circuit conversion part must be broken into Si from iSlay °Ut) ° X ' _ Auxiliary design (10)) Guard to help layout design shape to form into a meeting IG _ _ _ _ _ _ _ Individual components of these circuits, such as gates, field oxide regions, diffusion regions, and metal interconnects 1311690, are created on the semiconductor wire once the circuit is created. Perform this step - the square material arrangement is transferred to the circle 'Then then use this template to optically project the arrangement in the - crystal in the transfer of the arrangement to the physical template layer to create a reticle (eg - chrome-plated quartz: two f-like write reticle material. w: beam machine) This device displays the integrated circuit layout pattern as its period = ί;:; = the optical limit of the shadowing process is more than the shape of the film. In the micro-features, such as the serif and the key head, it can also include the light-path correction (opc) 2 shifting the butterfly, and the version of the butterfly is still called the silk-optic optical limit. The flip-flop of the mask is blocked by the transparent region of the layer of the layer, so that the photoresist layer under it Then, the exposed photoresist layer is then developed, generally by chemically removing the exposed/unexposed areas of the implant layer. The resulting layer is repeated for the process of the mother layer of the ten. The Lai County is the original design of the silk machine. Fortunately, the 'electron beam and other processes used to make these masks. 'In the traditional manufacturing process, 'there will happen. Something is beyond control. Designed in the database and considered by the inspection tool or inspection engineer. A reticle can include a plurality of impervious counties (usually made by secrets) and a complex translucent zone (usually made of quartz). In a bright field reticle, the background is transparent and the circuit 1311690 pattern is defined by imperviousness. The — ’ is defined by a transparent area. Beside the hood, do not opaque and the circuit pattern-isolation zone is not transparent. The spot defect is not included: the refractory defect of the process includes: - edge intrusion in the opaque zone, * transparent inside _Transparent pinhole defects, internal geometric fracture defects, and through-edge defects in the inner part—the opaque area defects may occur in the ridge bridge of the dark county. Within a feature of a similar type. #先罩余中. Defects may also occur when the opc provided on the wafer is defective. Inspecting the palms; the field can be used to create a mask. Then check whether the mask is ί image r and near-field optical microscope) to scan the fresh surface, capture the light and then touch the light image to be able to self-produce the defect on the L body r. Then, it is judged whether the mask to be inspected can be broken or not - the proficiency checker is made offline or by the 2 producers on the banyan tree. The mask - illusion is used to expose the hood if it is within the tolerance set by the user. If a defect that is out of tolerance is found, the reticle inspection does not pass and the reticle is cleaned and/or repaired to correct the defect or the defect is serious enough to be made - a new reticle is touched. This process is made _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Image. Usually, this inspection involves using the mask to expose the crystal 81. The button has been processed to see if there are any defects on the crystal HI and whether the defect is within the tolerance. If the defect is found to be significant, As before, it is necessary to determine whether the defects are repairable or whether a new reticle must be produced. The process is continued until the reticle that produces the desired wafer pattern and passes the wafer level inspection is completed, thereby ending the inspection. The reticle is used in photolithography to expose the corresponding layer in the overall process. The defect inspection is not correct to recognize a defect to avoid a failed wafer processing operation. However, for the desired result ( That is, accurately represent the original design layout on the photoresist material or 7 ^ 11690: two shadow = given photo lithography and / or wafer = special = copyability is mainly related to stepper exposure conditions, - missing two: Special step The exposure conditions for the machine are ', can't be copied, and the pair is not copyable.' These optical micro-machine exposure strips are stuck in the light micro-needle, not the cake or the money, ^ - the reticle lacks the window) 'The defective reticle can still be used to provide the connection: the process does not require a fast and accurate method for analyzing the defects of the reticle used in the photolithography process and the money system The invention provides that the precise pattern transfer from the arrangement to the wafer is the design company's target. Checking the mask defects is a necessary step to ensure the transfer of this fine rhyme. 曰明(I(五)二 hood defects are quite significant, then The right reticle defect that may damage the integrated circuit formed on the wafer is considered to be - does not affect the 1C function = t 缺 黯 黯 黯 , , , , , , 订 订 订 订 订 订 订 订 订 订The feature-type automated defect analysis tool of the present invention can advantageously determine the defect copyability. Specifically, the defect analysis tool can utilize the reticle-capture pattern to simulate the light grass in the group-given step Wafer exposure provided under machine conditions. Capture shadow The broadcast file can be provided with a mask file having a standard mask format file (10). In another embodiment, the non-MFF mask data can be converted into an MFF file. - The user can use the mask file to specify a The task to be performed. It is important that the work defines process-related parameters to provide defect analysis. These parameters may include settings for the reticle/gate, such as reticle type, reticle phase, and/or Transmittance of the reticle. These parameters can be further included with the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The parameters used to carry out the inspection work. These numbers are related to the stepper in the light micro-difficulty exposure hood. The v-input Μ can include the wavelength, numerical aperture, and reduction ratio (she also (8), The method of dilating and arranging the work can be estimated by the method of the smear, the mask, the touch system, and the stepper, so as to improve the accuracy of the copyability judgment. The process of providing defect analysis can be done on the reticle defect. This type of external user input allows the defect analysis tool. For example, in the embodiment, a task management management is performed by a touch-up process - or; This example can be presented in multiple levels for review by the user. =r=r::: per-color representation - predetermined defect is serious: r real f 'U i defect severity. - The most detailed review of the first image / W has a predicted wafer shop and defects - corresponding to the reference image of each - defect j (four) Lang can be shaped by the financial (4) current task _ and Ren Linguo. At the beginning, the user is based on the review of the task results. In the state. This state can be used to make a tree, and the tree is called a new one. 四 ΐ 四 四 四 可 可 可 可 可 可 t t t t t t t t t t t t t

According to another feature of the present invention, the GUI can be CGUi), the GUI has a - containing read-sensitive link, - task hold 9 1311690 line link, and her "joined" single bar. * The multiple setting links can include - the reticle inspection system link. The reticle setting connection and the allowable use of the device are connected to each other, and the user input can be used for the combination of the exposure setting and the parameter. These parameters are the stepping machine parameters of the stepper stepping machine, the stepping machine reduction ratio, the stepping machine value hole connection and the allowable time to input the _ to the detector. The inspection is ==; r combined. These parameters may include 嶋-weighing: 务=;=::r::r for providing a copy of the defect copyability analysis. Parameters such as °ab can include the type of task and reuse the old one: check the parameters of the inspection system of the photolithographic mask: and the defect can be copied = the result of the sex analysis ^ who can view the defect of the light micro can copy a pot °σ This second facet can contain a summary of the severity of the defect. Defects can be the result of a piece of cake. Detailed description of the circle related to the defeated Mei image. One of the ways of copying the photo lithography is to perform a real fee-rich round exposure. However, this method consumes 10 1311690 in terms of time and money. According to the present invention, the feature--the task-based automation capability and the network-based analysis tool can eliminate the need for true light-transmission - the expensive step-by-step defects of the wafer can be copied. Sex. Specifically, such task-based defect analysis tools can utilize the "^" high-resolution optical microscope or scanning electron microscope image) to provide wafer exposure under the conditions of the mold stepper. Therefore, in the past, the mask can be used to simulate the wafer exposure, and the reticle defect can be directly copied. (4) Real crystal _ light. In addition, as ^ will be described 'this simulation can be combined with the reticle, inspection system, and stepper (1 control workflow overview diagram ^ can be painted - can be used - inspection, age repair, or: Γ = In step 101, a mask file can be obtained from an inspection system. In step 101, the implementation can be implemented, the paste orientation can be adjusted, and the time resolution can be recorded. Mask surface = transmittance and phase of the mask material, and defect records (such as defect 丨1 defect classification, defect image, reference image, and difference image), and potted money, the case conversion tool is in the reference chart At 10 o'clock there is a step _ step. In step (10), the case is loaded into a defect analysis tool that produces wafer simulation and defect scores. Μ In step 103, the user can specify a parameter related to the light sheet itself, an inspection system for providing the two masks, and a stepping machine that can be used to expose the mask. = If the result is not available, so that the individual can shoot the scales and make the Wei according to the information = serious: t heavy 3 is the second-class established parameters can be used for all the simulations and defects of the mask 丨 5 sub-tools open . In other words, the defect analysis tool can handle the same on the same level, so that the heterogeneous analysis H has a very efficient way to face each step 1311690. For example, and referring to II 1B, a task request is received from the application server 115 from the - or multi-small station 112 (i.e., the hardware used by the user, = tool analysis tool ill and/or server). /, L 3 computer, workstation, said that the defect analysis tool m can use a task to manage a task 120 (where task 120 can be multi-task D 0 officially for a complex number 120 can be in-system (such as application servo The part of the device is the same as the part of the tool. (The task manager of the other embodiment is the same as the task manager of the other embodiment.) =: In the embodiment, the tool is missing. It can generate a contact with the user station 112. In another implementation, the lighter m and the graphical user interface 113 facilitate the use of the defect-network. The best defect analysis tool U1 can determine the distance from each task. From the liaison, the work is compiled and/or divided into tasks 12〇1 = 1 = this continues and/or the results from task 120 are divided. The results are provided when e-bene 110 is also continuously encoded. Task f (10) real =: real; = H6 can be requested in task 120 task manager 11G by task 12G 3 t, - computer 116 can be in the result of the self-task manager 110, the result is stored. Accessible 117. Note that integration or independent implementation. 17 T application for application server 1 55, in order to refer back to Figure 1Α, since the defect of the reticle quickly provides the user with accurate simulation results, the defect analysis tool can be repaired before being used to manufacture the integrated circuit. Whether the mask is analyzed: it can advantageously shorten the use of the score ===== type=chemical defect 105 to review the defect analysis results. In step (4) (Leveil) review can include simulation and defect score results: 12 1311690 - Cd ^ /, and level 3 (level 3) review may include a detailed analysis of each _ defect. Can review H, etc., in step 1G6, assign a per-defect on the reticle to the embodiment. Multiple users may assign different states to the same-defect, where a state of ==Nostate:=:=. These are provided to the user (4) in the process, 1 in repair, or Example of a Rework Defect Analysis Tool 曰 = = = = = 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷Use of tools (such as system management, second, and full protection), the tool for analysis The required parameters, and the review of the tool user's appeal, α, each stomach contains a main menu stick, which can be used as a navigator to bring the user to the same work. In the embodiment, the operation It must be grouped under the heading according to the following headings: · Settings, Jobs, Review, System Management (Mminist plus i〇n), Dimensions, (Maintenance), and Security (Security) It is to be noted that the pages described below are merely illustrative. Other defect analysis tools may include pages that capture and organize the messages in a similar or different manner. For example, in one embodiment, the tools act to allow multiple servos to respond to user-entered network-type interfaces. The mask is set as a whole and the σ ° and 疋 page allows the user to enter the parameters used to simulate the mask. Specifically, the defect analysis tool can construct a simulation model based on a user-entered parameter. In a real-implementation example, such input parameters may be related to mask settings, stepper settings, and check button settings. Figure 2 depicts a light page 200 that captures and organizes information about a user's desire to analyze a reticle. It should be noted that this reticle is based on a real hood that has been produced and tested. In order to create a new mask item, the user can enter the mask name in the Name text box. This name can be any name assigned to the user (this person may be employed by a design company, a light merchant, or a wafer fabrication facility). In an embodiment, a pull-down menu is available in the reticle type. 13 1311690 PSM) cum between other options to choose from. Appropriate text box. .相位τ The phase and transmittance of the mask (which can be input to a pre-i value of 180 A. The phase shift is the number of phase shifts. In one embodiment, the phase shift is ▲. Transmittance refers to the step The percentage of the transmittance of the entrance wavelength through the background of the reticle. In one embodiment, the preset value of the transmittance is 6 〇%. After the first line of the hood is entered into the area 2gi, the user can click Added n ϋΊ φ to a table 202, which organizes the reticle of the reticle that may be used for simulation. The appropriate edit (_) link in the table 202 can be used to match the reticle type = edit ° in edit mode Any information (ie, r and rate) can be modified. After editing, the user can click the Update button to save the modified information in Table 2〇2. t The light setting is “Page 2〇0, The user can delete the "first cover" by clicking on the left side of the kernel selection mu 02 corresponding to a suitable mask and then clicking delete (10) (10). In this implementation, the user can click on the full side to divide ((4) delete all the masks of the table 202. ; Stepper settings Figure 3 draws - can capture and organize the steps that can be used for defect analysis Advance setting page 3GG should note that this stepper information corresponds to one can be used for === access setting page details, one area can be drawn, and the loser is created - new stepper item, user can text For example, the ';g敎 box allows the name of the stepper to be viewed. The wavelength text box allows input to the wavelength of the stepper source (color) (eg 157, 193, 248 or 365 nm). The hole control (NA) text ^ frame material input from the image measured - the function value of the half of the lens cone cone. The sample NA value can include 55. 55, 〇. 65, 〇 · 7 and 〇 8. Stepper reduction ratio (s Reduction) text is purely allowed to input the ratio of the fresh size to the real wafer size (for example, 2.5, 4 or 5). Note that the specific user interface can be adjusted for different areas. Mechanisms, such as 14 1311690 specific settings under pull list vs. text input. Defocus drop-down The position of the focal plane is allowed to be input. The depth of the image (in nanometers) determines whether the image will be calculated with the #_巧爪孔孔/surface, the plane of the plane of the plane, and the image depth. It is equal to zero. Right He is the first resist/film. In the case of Beishi, the user has to set up a single-defocus model for single defocus and multiple focus, and the multiple divergence between the two. Multiple optical system models of fine defocus values (early micron). These parameters include minimum defocus value (called -min), maximum defocus value (called _max), and defocus The step size ^ is called the - incremental value). It should be noted that all of the above defocus values are relative to the best focus level, and the light source type H- _ can be used to reduce the group input. Additional parameters. For example, _ can have a companion coherence parameter, which indicates the stepper = coherent level. The value of the coherence coefficient is between f and G. The ring can have a corresponding inner radius and an outer impurity parameter. In general, there are no units in this count and the maximum possible outer radius is 1.吏 Multi-pole illumination can have a number of accompanying inner radius, outer radius, and polar parameters. An example with quadrupole illumination for multi-pole illumination. It should be noted that if quadrupole illumination is selected, the inner radius and the outer half (R) are homogenized such that the maximum possible R+r is 丨. Quasar illumination can have phase radii, outer radii, and angle parameters. The angle parameter means the inclusion angle (angle 〇f - 〇η), which is equally distributed from the - side of the - center line. The pattern that falls here becomes the illumination area. Rectangular illumination can have four specified parameters: length (1) and height (7) and its X-direction position (X) and y-direction position (y) relative to an origin. Custom lighting Allowed - the user designs a two-pattern illumination pattern that can be defined by user-specified parameters. In one embodiment, clicking an Advanced button opens a window that allows the user to modify other parameters. Includes empty image, model radius, model level, iteration number, user interface for any lighting description, and/or other settings. The aerial image parameters allow the user to select a pole that calculates the light intensity distribution in the simulated job. For example,: 15 I3l 1690 = Sighing pure 1 field can properly describe the scalar mode of the electromagnetic field may be sufficient for the simple type. 5 'In-the real towel, you must make the secret amount as "pre Set value. Reduced ground, - 2 (b) straight and horizontal field components in the process of operation, so it is more suitable for more complex lighting... Dimensional radius parameters can be specified by the aerial image of the feature Affect the In 222, the degree of image is determined by the degree of image simulation. The model level parameter can determine the level (complexity) of the incoming model. For example, the higher the model level, the model used for aerial imagery. The more complex and precise it is, the minimum number of iteration parameters can specify the minimum number of iterations. After the new step 2 pull type information has been entered into the area 301, the user can click on the new two cows, _ * transfer the education to - Table 302, which can be used for all of the defect analysis - in the embodiment, the information of the stepper can be entered by clicking on the appropriate edit (dirty) on the table 302. In the edit mode, any information (Also '爯, wavelength, NA, etc.) can be modified. After editing, the user can click the __Update button to save the modified information into Table 3〇2. The user can click on the all-click (corresponding to the appropriate stepper), the second iC sand (four) (not to the left of the table 302) and then click on the delete (10) system - where the user can click on the delete (Delete A11) The manner in which all of the steppers of table 302 are deleted is known. Check the system settings 捕捉 捕捉 捕捉 余 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 捕捉 丝 丝 丝 丝 丝 丝 = = = = = = = = = = = = = = = = = = = = = = = Type menu input such as ^ use the field s 'Name (Narae) text box to allow the name of the inspection system (example supplier,) ° VendOT pull-down menu allows the input system to check the system , AMAT, KLA-TeneQr, L brix, and coffee.. Select it to select r may change the model (M〇dei) drop-down menu. For example, if you use ARIS-lOf). 4 ', supplier' The model drop-down menu may list A ARIS_21i and -i〇 (h. Conversely, if the user selects Zyg〇 as the supplier, the model pull-down menu can list KMS 100, KMS 450i, KMS 450g, and KMS 400. After the information about the new inspection system has been entered in the area 401, the user has to click the Add button to transfer the information to a table 402 which organizes the information of the inspection system for providing the mask data. In one embodiment, information about the input inspection system can be compiled by clicking on the appropriate Edit link on the table 402. In edit mode, any information (ie name, supplier, and model) can be modified. After the editing, the user can click on an update name to save the modified information into the table 402. In the inspection system setting page 400, the user can delete the check by clicking a checkbox corresponding to a pick-up pick (shown on the left of the table 402) and then clicking delete (Delete "button" In this embodiment, the user can delete all the inspection systems of the table 402 by clicking the delete all (Aii) red. The eight system management-system management page allows the user to access the establishment of a group. (G Qing, - User account (User A (10) unts), - Data backup (I) ata), a data also ^ (DataRestore) ^ (JobServer) ^ (Status heck) Miscellaneous page. For example, 'group The group creation page may include an account number f that allows the secret manager to store the rights, privileges, and obligations of the person in the system, for viewing, adding, and deleting user account information. Pages can be included—you can display the host, 埠, and silk according to the per-user, early task ship page = can be added with this page. - Status check page can display: service = execution - task., number of tasks, value Material and servo system are idle or positive The maintenance utility ^5 draws - the second dimension of the sample surface _ the user deletes the unwanted analog data. The page 500 allows the user to compress the mask file 3 into ^! Reduce the size of the f library. Secondly, the 'dimensional database】. v into the machine s and 资料, and the data results to transfer to another database, users can use the daily pull-down menu to select the data to be deleted 17 1311690 After the user clicks on the implementation (gq) button, the system can return = calendar = aa her job e Hi y) table 5G2. In - the real towel, (four) 2 can be Yiji = IKRec〇rd ID), mask iD (Mask shame Sequence number (SeHai n Creation Time). When you want to delete all the records shown in Table 502, you can click on the full selection (5) ratio = click delete (10) ete) button. To delete the table 5〇2 In the case where the box of the reduced ID is shown (on the left side of the table), the user can select from the drop-down list _. In the embodiment, the user can pull down from the drop-down list. The list is all selected (followed). Note that selecting all will clear the database of the mask record. That is to delete the silk image but leave other simulation and defect scores in the database. j, the real 16 shot 'Wei Wei analysis aids allow the time to ride the specified information (such as = shell material, defect score data, and established parameters) And the compressed file is sent to an address of the user 2. In order to prepare for the compressed broadcast, the user can click on the record ID button of the page 5〇2 to open the transfer. Page. At this time = name and - path name. The user can click - generate (Gene "C to = and send the compressed file. In the embodiment, the simulation result can also be read from an external source using the maintenance page 5〇〇. Yes = This special simulation result is placed as a _ file in a directory accessible to the defect analysis tool. To read the gambling ambiguity generated by the outside world, the singer can turn to the reading result (fine ^ Results) button 504, thereby opening a read result page. This read result page can draw the user to enter the path name and the file name in the - text box. In addition, the selector can click on the (B Na e) button and use the -Select difficult (Ch〇〇se) dialog box to locate the slaughter. In the implementation of the financial, so that the bribe can be made or redeemed to read the people's job. VIII Security - The Security page (see main menu) retains the privilege of accessing and viewing the mask of the person being read. In general - the system manager can decide - use access to any particular reticle data. In a consistent embodiment, the Green Manager can grant privileges to groups. In another embodiment, all masks (4), privileges, can be granted, accessed, and accessed when a group of 18 1311690 is established. In this case, the ancient safety protection (4) miscellaneous payment and reclaiming can perform the task of persimmon age in the ship--allowing the user to perform the example execution page of the defect analysis task. The title of the page is to select the mask, stepper settings and task type (9) _ Stepper Settmg, And Job Type) area contains three drop-down menus. - The Ι Ι ίίί (lasks in Q earned) drop-down menu shows the queue to be started - the task is executed, and the order of the _ age can be reduced to list the stepper settings. Go to the slaves and the slaves - text == Off stepper slaves fine information. - Task _ (Secret Type) drop-down group to verify the defect to be executed _ test _. In the implementation of the test, this test is called female (self = defect severity score) or simulation. The calculation of the job title is disclosed in the February 28 of the United States. Please refer to the US Patent Paper Case No. 9/8 Calendar No. 3, which is in this article. The execution page _ title is linked to the previous check section nktQPreviQus (5) qing plus Run) - the area 602 contains a nuclear selection. If the user selects this box, the defect tool will again use the __old prescription for the specific mask (if any), and also a series of steps (such as simulation or ADSS). . The title of the binding page 600 is the simulation setting (Simulati〇n such as (4) another area coffee contains various parameters that can be set. For example, the minimum darkness background (the background of the darkness) can specify the minimum image of the mask. The darkness background value, and a maximum brightness background (Maxmum Bright Background) can specify the maximum brightness background value of the mask image. Hall, click into the P white (Advanced) button can open - ask for the input of additional parameter values page. The -, grid size parameter can specify the size of the simulated mesh, which depends on the inspection system and the reduction ratio factor specified in the stepping shot. An output pixel size parameter can specify the size of the output pixel 'this depends on The original reticle pixel size. In the _ embodiment towel, the ship output pixel is equal to the grid size. - The interpolation scale parameter can specify how much the analysis pixel size is smaller than the inspection system pixel size (the smaller the ratio, the more the result Accurate) 19 1311690 Execution page 600 titled ADSS Setting Another area 604 contains - can specify a line spacing pattern or a contact hole △])% Mode parameter. This reference enables the main pattern of the specific mask data, such as contact holes (for contacts and channel patterns) ^ to be lines/spaces (for all non-contact patterns). It is important to note that aADSS is best able to calculate severity scores based on appropriate patterns using different algorithms. An ADSS score setting parameter assigns a score to each of the available colors (e.g., Red, Green, and Yellow). In one embodiment, the pre-e color setting may be green (〇-3·5), yellow (3.5-5), and red (5-1〇). Another area 6〇5 of the execution page 600 titled Threshold Setting defines a CD variation (i.e., tolerance) acceptable to a user (e.g., a positive or negative percentage). In the embodiment, 'different colors' can be used to indicate CD proximity to a given tolerance. For example, the ADss result can change from green to yellow when the wafer of the defective shirt image approaches the tolerance (for example, -5.0% or +1%). The areas 606 and 607 of the line page 600 titled "Use Aut〇Thresh〇lding" and "Use Manual Thresholding" respectively allow the user to set it automatically or manually _ from the defect analysis guard - the aerial image judgement, the edge position on the day 0 circle) 'in one embodiment, the two circles must be selected. Right 疋 selects the automatic setting threshold', then the user has to input the reticle and wafer CD value and a tolerance (if needed) or check-automatically calculate the wafer CD, ie wafer CD = reticle CD / reduction ratio Mechanical bias, in which the user turns in the bias value and the reticle CD is measured by the reticle image. In an embodiment, multiple CD values may be discerned by separating each value by a space. If you choose to manually set the threshold ', the user can manually enter the threshold (such as the nominal value) and the ^ window (see area _). The production port is finely defined—the group can tolerate the #光和散=value, and the copy wafer pattern within this set of values meets the production specifications. In the embodiment, the exposure is - positive and negative percentage. The health parameter can specify the defocus value by reducing the material. The focal parameter is reduced by the plane minus the position of the line/anti-interface. In the actual situation, the positive dispersion = can be clicked to execute (order_start__task. In the embodiment, use the task submission - group mask data. To do this, the user can specify each After the parameter of the task is transferred - 'Submlt' is submitted to the fresh record, the '20 1311690 task', the recipe (recipe) can be displayed at the bottom of the execution page 6 as a reference. In one apricot, can In the implementation of page 6GG bottom of the ship multiple prescriptions. Then the user can, Bei = start the task. ', the annual button to review the review page is best to show the age of the county analysis of the aid data axis. Use You can evaluate this information and perform additional simulations to perform - dimension ^ = additional ADSS to complete the task. And &lt;existing Figure 7 - Feed Time Search - Completed Defect Analysis Task (Level 1) Review Page To search for completed tasks, the user can enter the inspection system used by the user, the date of creation (Created Between and τ〇), and the difficult name provided by ^杳糸 or the user [batch name ( LGt name)]. In the second (five) queen, the lack of time can be produced _ - each of the mask execution - the internal ID (ID) of the task set and used by the database, the system, the date and time (Date in), whether the task has been reviewed or not (Re deleted), Current Inspection Phase (QC Type) ^ (Fab User), (J〇b Status) ^ The inspection system used in the task (inspecti〇n touch (4), inspection system module (Inspection ' and task type coffee (4) (such as simulation or Peng;:,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Carry out the step-by-step review (that is, the third-level review). The standard system judgement (4) position performance - the mask is missing. Figure 仵 彩色 彩色 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 仵 ; ; ; ; ; ; ; ; ; ; ; ; °&quot;marked by a circle) affecting the wafer and requiring η color deficiency (marked by χ in page _) to affect the wafer is doubtful 1 , = 3 Ϊ = analysis: This additional analysis can be performed by an operator or process engineer: μ, in the shape of a triangle) passed the test and is considered a minor defect. In other words 21 1311690 said, green Defects will not be copied on the wafer, and it is necessary to note that the defect score above the 敎 value can be used, so there is no need to repair it. The display is easy to touch, for example, in the _ it is not used - different ways difficult to repair defects Can be - a very serious defect in the flashing red light table (that is, it may be very observable to say that the user can easily distinguish - the mask is there.) A region that has a serious lack of memory, logic, and state. For example, if there is a serious lack of a hood, the reticle is considered to be usable). The ten-to-first squad-pass state (that is, the hundred and eight Ϊ^ and the total number of defects (36 in this case) and the red, yellow, and green knives are available on page 800. The total number of reservations, reservations, and actions can also be provided on page 800. ▲• and the application of the If, the second layer review page _ can also include a defect table, which can be included πΓϋι^Α RF file defect ID or system automation defect score (Na) obtained from non-KU RF file, reference critical dimension measurement ^^隹^ defect type plus ^ (four) defect classification (6) shape center in the best exposure The critical dimension percentage under the most recorded conditions ((10) Hall F), the critical dimension percentage ((10) win) under the most scaly and worst clusters 2, set to the critical dimension of the negative exposure fine, best focus condition Percentage (C_-EBF), set in the positive exposure range, the critical dimension I-score of the best focus condition ((10)-EBF), whether the indication of the Na result (10) s), and the current state of the defect (such as revocation) Or qualified). In one embodiment, all defects are reviewed or filtered to view particular criteria. For example, the wire may only want to see the red coded defect of the defect map 8G1 towel. In this case, 'Let's hear the drop-down bill set in red. The user can also display a defect map in color combination. For example, the user can view yellow and green encoded defects by appropriately setting two pull-down menus. Therefore, the two pull-down menus provide a filter function. In other embodiments, additional filtration conditions may be provided. Such filters may include Defect Type, Holds, Repairs, Re:jects, 22 1311690 Passes, Waives, and ADSS Failed ). After the user clicks the Refresh button, the filtered information can be displayed on the defect map 801 and the defect table (not shown). At this point, the user can choose which one to review on the third level (Level 3) review page. In one embodiment, the available options are: AU Inspection Runs' current job, and the current job with AiMS (Current)

Run AIMS). When the user selects one or more of these options, the defect analysis tool can look for the specified data stored in the database (where the data will have the same mask ID and serial number). To advance to the third level review, the user can click the review (this 乂丨 (10)) button. It is to be noted that after completing the review on the Level 3 review page (see Figure 9), the user can return to the second level review stomach 800 to complete the process. In the embodiment, after all the reviews have been completed, the user can complete the review (Review c_le1; ed) ^ At this point, the user may be prompted to select a name for the menu - Name a The electronic notice of the completion of the review, the summary of the review - written in the - text box, and the notification and related review summary. Figure 9 depicts an example Layer 3 review page 9〇〇. The third layer review allows for the use of f to watch each of the defects and the reference f彡 ride to reduce the fruit. Pro can be marked in the defect image as well as the miscellaneous analog shadow upwards (in this _ _ _ _ _ mark). In one embodiment, if the reticle is coupled to a previous reticle image (eg, pre-repaired) (ie, a square image on the side of the photomask __. Insufficient coffee-shooting. Butterfly tree defect judgment), Pass (that is, the user thinks the page), Reason, and Waive (even if 1 user marked as reserved) Defects do not affect the other bits: by clicking on the (___ age of each user. Hstory section to display the previous history of the defect, for example, showing the 背^ reviewer and the singer - The comment (GQmfflent) section, the screening of these notes can not be edited or deleted. α user added § master, 23 1311690 Click - ADSS label will not show defect score, defect coordinates, stepping Machine parameters, and CD values at different defocus levels for each task parameter. In one embodiment, if there is a previous inspection phase associated with the new task (ie, pre-repair), the user can move by View the defect in a previous task in the manner of a side label next to each image The user can pull the horizontal/vertical line on the image to produce a one-dimensional analysis of the defects on the image. In the embodiment, the user can select (Selecti〇n) (in the menu bar) and then Use the - mouse to click and drag out the line through the line of the desired feature. Use the line function. At this point, the user can click on the analysis in the menu bar (such as coffee) and then select for the analysis (Perform 1). -D Analysis) to generate simulation results. In the embodiment, the user may be prompted to enter six sets of parameters before performing the one-dimensional analysis: Plot 'Measure' model (M〇 Del ), Exposure (Ex_re), Light Mask (Resist) and Resist 〇 These parameter sets are detailed below. The Plot parameter can be used to select the following sample output: aerial image intensity vs. position (Aerial Image Intensity vs. Position) 'Feature Size vs. Exposure Level> &gt; vs. (Feature Size . vs. Def_ ) 'PrQeess WindQw, and the exposed face lion scale (10) i her Tradeoff Curve) ° can choose empty Image intensity vs. position output to produce an intensity profile. Specifically, this output provides a plot of the calculated intensity along the coordinates of the section line. / The feature size vs. the exposure level output can be selected to produce a user-defined number. The φ characteristic part of a line is mutated with the light energy _. Note that the nominal exposure part will get the target feature = small exposure per unit area [choose is called standard 継 (dGse-&amp;__ )]. In the embodiment, the nominal exposure dose is calculated for the selected defocus and then printed on the bottom. - Optional transfer part size vs. Defocus input ^ to the step surface enchantment __3 on the defocus map. If you select this option, you must select the Multi Defocus (Mul1; iple DefGcus) setting. Weaving can be selected to produce the extracted portion of the country line and define the "common process window light, difference vs. defocus". By definition, a single section line process window is the area where the line width is within the user's exposure level and defocus value. The boundaries of this region can be changed in the process window. The &amp;i, #light deviation is purely the exposure dose phase. Similarly, the common process window can be defined as all independent yields. The process window is the total = field of all line widths that are exposed to tolerances. Common system You can select the exposure range to weigh the curve of the green field to the value of the bucket. The value of the water is 10 ° ^ ^, the water output ten nose exposure range / focus depth of the trade-off curve This figure can be derived from the process window map. The curve of the rectangular group cut in the system section is clearly defined by the second window. The Qiu Tong system has a common exposure to the curve. In the embodiment, it is also possible to show that the W' first defocusing area is the largest. It should be noted that the individual exposure range tradeoff curves for each process line are not likely to match any of the individual trade-off curves. The σ ° measurement number allows the user to miss the target, tolerance, and general mode. The target 3 specifies the desired CD size of 2 ίί. The tolerance defines the acceptable CD = used to derive the process window. The 模式 模式 mode is based on the resist line (that is, the feature area adjacent to the _ such as the composite hole or the contact hole axis separation distance) S parameter can be used to refer to the type and simulate single-defocus recording (four) image. The user who wants to perform the y value can select the focus range from the values provided by the defect analysis tool. The user can set the following additional parameters for this simulation job: Model, Rounding Pixel Size' Boundary condition (Boundary c〇nditi〇n), and Defocus Settings. The model parameters select the model to be used for the simulation job. The output pixel size can be recorded as a small scale, which hides the _ fresh pixel size. In an embodiment, the preset value can be set equal to the model grid size. The boundary condition parameter specifies the boundary format of the reticle. The sample boundary format includes Repeat theB〇rder (which extends the image by repeating the border) or double cycle (]). Peri〇dic) (its complex ^ heart image). The defocus setting parameter can be set to Single Defocus or Multiple Defocus. If multiple defocus is selected, the minimum, maximum, and step values may be required. Minimum vaiue is the minimum defocus value in the selected model. The maximum value (Maxi_(4)) is the maximum defocus value in the selected model. The Step value is the step of two adjacent defocus models. 25 1311690 Exposure parameters can be calculated and / or · most converted. In the case of money, the two tools can automatically calculate and apply the appropriate exposure so that the first line will be obtained - equal to the specified target = CD (standard dose). The exposure parameters can also be based on - the same as the two, _ can also be the best "light level of money to make the right to the right - barely fine to

The mask parameters can be used to specify mask information for the - dimensional analysis. For example, use 2 min minimum darkness (Mi-ark) (the gray level of the feature, the minimum allowable value is 〇), and take the large degree of freedom (MaXi_Bright) (which defines the open space gray scale, the highest allowable value is the ). In an embodiment, the defect analysis tool can perform the tasks with preset values. The Anti-Surmitant parameter can be used to specify the photoresist information used to record the pattern map. These photoresists can contain anti-reagent types (such as positive or negative) and process nonlinearity (which is specified by $ The light-to-contrast and the rhyme-type. In the implementation of the financial, the anti-observer can be indicated as the early threshold or the H-pre-specified aerial image intensity threshold model. This value can be set to be the same as the zero-resistance thickness or Infinite gamma. Conversely, the first order specifies the first-order anti-paving mode. If this model is selected, the depth, process nonlinearity, and absorption coefficient must be specified.

Aerial images are best provided - the initial indication of whether a given defect will be copied. If a defect ratio, the stepper wavelength is much smaller and is isolated from the critical part of the circuit, the defect will not appear in the aerial image. Defects and defects close to critical circuit features may require further analysis to determine copyability. In a consistent example, to interactively generate an aerial image of a particular defect, the user can click on the selection on the menu and the highlight in the companion drop-down menu. At this point, the user can click on the Aerial Image on the menu and the calculation in the drop-down menu (Calculate). This set of steps opens a Set Simulation Parameters dialog box with defect settings. The user can set the parameters mentioned in the previous section on Simulation Settings. Once the parameters are set, the defect analysis tool can calculate the simulation and in a proximity to the original light 26 1311690 hood image window __ color 対 / contains -1 + two first cover, the page Γ clear four windows. Two-view (four) 1 and 9G2 respectively represent ί and use the virtual _ color (color not shown) corresponding analog light ti _ respectively to represent the reference mask image (its equivalent _ contains defects = ^ blouse image) and use virtual color (color again The pair of wafer images can be superimposed on top of the virtual color image. The user turned the money by clicking on the option on the morning stick (SeleetiQn)

IBmM (Wafer Image Pl〇t) 〇f-real fine towel, the latest simulation of the latest analysis of the financial will be for the page _ on the shadow of the page _ the previous software database (reP〇Si1: 〇ry) stick temporarily Sex storage other simulations, 4. To access other simulation results of the scale, the maker can transfer the software database bar - drop-down fresh. After the sinister model, the image will be imaged on page 900. ADSS analysis 4 Defect analysis JL was also tested for automatic dumping severity score (A)) SS) analysis. In this analysis, the user can manually select each parameter, or the tool can automatically set the number of such beams. These parameters are related to the threshold, alignment area, and defect area of the wafer and reticle CDs.

To initiate an interactive ADSS analysis for a specific defect, the user can click on Analysis on the menu bar and select ADSS ^ At this point the user can indicate if some parameters are manually set or automatically set. The Threshold parameter defines the intensity profile level that is expected to fall within the area defined by the tolerance associated with each side of the finger edge. The tool refers to the measurement (|Jeasure) parameter if it is from 'moving a and then'. If the parameters are to be manually set, the user must specify the reticle and wafer CD measurements using a Measure tab. The defect analysis tool automatically calculates the ADSS using a value based on CD f. If the parameter is to be automatically set, the defect analysis tool calculates the ADSS with a user-specified threshold and a nominal (e.g., average threshold) threshold parameter. Measurement parameters specify the CD on the reticle and on the wafer for ADSS calculations. In an embodiment 27 1311690: want == one: open ί a number ^ (10) head (four) right unchecked, you must pull at least _ line on the reticle image and specify - value then f these micro and set Na卽#Use to imitate the edge of white private, © 4S A丨^», right to use the user is not a common line (that is, the user selects the automatic selection), the user can refer to &quot;t ^ (:s:wJ :ct:: Implementation ^ @ ΐ The θ-type axis satisfies the light (four) value plus/minus tolerance _ line. In a real case, the value is 〇2, which means that the reticle CD value has a tolerance of 2〇%. The mode parameter is selected by the brittle mode of the _ sign. In the 曰^ ie the measured feature is a contact piece), the measurement method (10)

Amm (Trench) (the distance between adjacent features such as composite holes or contact holes in the measurement). The model and reticle parameters are approximately the same as those described for the one-dimensional analysis and therefore will not be described again. The defect is analyzed by different phases or transmittances. The defect analysis aids can be used to analyze how the defect may change by analyzing the value of one of the defective images. To take this function, the user can click on the option (9) on the menu bar and then click on the Phase in the drop-down menu. The user can manually enter a phase value (for example, from the 〇〇 to the coffee ADSS) Information · After the defect analysis tool performs an ADSS calculation, page 9〇〇 displays the elevation setting (ie, CD threshold, and each difference setting) and the task result. The example task result can contain the following values. Number of Detected Defects can specify the number of defects found. DSS can specify the defect severity score (DSS) of ADSSj. It should be noted that this value can be calculated for different defocus values and exposure levels. - The DSS range from G to 10 can be Color-coded. For example, a green defect in a simulated image can represent a defect in the range of Q to 3, a yellow defect can represent a defect in the range of 3 to 6, and a red defect Represents a 28 1311690 defect in the range of 6 to 1 。. A maximum DSS value specifies the maximum possible DSS value or the maximum DSS value of all defects from the ADSS task. An average DSS (Average DSS) You can specify the average DSS value for all ADSS tasks calculated for this defect. An Alignment Point On Defect can be used to specify the (χ, γ) alignment area on the defect image in the ADSS task. - Reference Alignment Point On Reference) can be used to specify the (X, Y) alignment area on the reference image used in the ADSS task. The Feature Used χ Alignment &amp; Reference value can be specified for Alignment area on the reference image of the ADSS task (χ direction) - For the reference gamma alignment feature (eg dirty (4) F〇r γ lobes 〇n Reference) can be specified for reference images for ADSS tasks Alignment area (γ direction). Use X (Feature Used For X Alignment On Defect) to specify the rotation (χ direction) on the missing image of the ADSS task. - For the feature on the defect (Feature Used) For Y Alignment 〇n Defect Alignment area (Y direction) on the defect image of the task. (10) Image Threshold values may indicate the average threshold for the task of the vine threats = the threshold f (Nommal - Id) for the fiber task. These two values may only occur if the time has been manually set - or multi-sided values. The W^dth Change Limit indicates the tolerance value for the ship mission. In ^, the differences occur only when the user has requested an automated threshold. Generate Reports Users can ship out - a report containing the results of the mission. In the page _, please tell. Towels. The saved report can then be mailed to the appropriate person to = Archive conversion tool The mask manufacturer can use different formats of reticle image. Thus, in accordance with one feature of the present invention, before the reticle image can be loaded into the defect analysis tool library, the reticle image must first be converted to a standard reticle rights format using the file conversion tool. After the slot conversion tool stores the check system settings and the mask settings, it can contain the ZIp standard of the standard mask file format file (*mff format) that is necessary for the fresh image. Figure ίο - Example Sample Conversion Tool Page 1000. In page 1〇〇〇, a setting area specifies the technical settings for the inspection system, mask type, and other information, and a defect table is listed in a user-defined order-output mask defect. In this embodiment, the setting area may include allowing the user to specify a Mask Type (eg, attenuating psM (A_p(4) and two masks), an inspection system (Inspection System) (ie, from a defect analysis tool) The drop-down menu of the name of the Su), the pixel size of the (four) yarn, and the inspection mode (1) (10) - Mode) (that is, the inspection mode according to the inspection system model). The setting area 1〇〇1 can further include the input of the mask into the mask (_ID) (the user knows the Lin of the H), the silk (Serial Numbe〇), the inspection = (Inspection Stage) (eg after repair, pre-repair Park check reference (

Rfe) (ie, the check for the offset value defined by the rotation, x coordinate, and y coordinate). Type (*ti stick case (=) menu allows users to be - supplier special fresh file grid ^ slaughter), will create a - Xinqing file, loaded into an existing mask _ mff job · ageing analysis Save the smock image as another privilege 'open-screen viewer' to select the -KLA RF format reticle image (*.rf f file), or close the file conversion tool. ~ Edit menu (via a preference setting also ^) Title] Allow the use of the path and title of the winning file, the link to the store will contain a "r", will be read into the file directory Path, production shore = ° path like the directory of the archive. In the embodiment, the user may not store the above settings for the file conversion, and the user may create a preset value and/or restore the preset value/person to use. In one embodiment, the Edit menu [via a passer-by) allows the tool to recognize other file types than KLA RF and load it at the same time: 30 13 Π 690 The image file is assigned to the corresponding type and defect ID. In the embodiment, each image type may have a companion or file style. For example, an AIMS broadcast filter is represented as $(10) aims. * 'It is an identification number ($丨(4)), a bottom line (), 3 fat, a universal word that matches any character = (*) P Lai Ming. The user can edit the filter by selecting the magnetic H of the fairy and editing the audit style in the text box. The Image menu allows the user to open a mask information dialog. This dialog shows a mask defect image. In a real-cut towel, the image can include illuminance values (such as Q and 255) for the number of bits, χ and γ seatposts, and the position of the cursor on the image. In the embodiment, the user can select the crane-cursor on the image to check the minimum darkness and maximum brightness background. The user can set the illuminance value by setting the text box of the minimum darkness background and the maximum bright scene. If the user does not set this mirror value, the ship red flag can count this value. In another embodiment, the image group is also expected to be read by the user - not the KLA RF image building. The Help menu provides information about the defect analysis aid and the file conversion aid. It is necessary to note the implementation of the various Wei Deuan (丨咖) mentioned in the previous section of the J1 menu. Defect table 1002 can include defects on the reticle. In an embodiment, these defects may be listed in the order of the selected titles. The list is sorted by defect CD in the preset. In one embodiment, the user may manually add defects or modify in-table defect information to the defect table 1002. The sample table header may contain the defect ID from the KLA RF file (the ID generated by the system if it is a non-KU RF), the X coordinate of the listed defect, the gamma coordinate of the listed defect, the KU RF defect level, and the defect type ( For example, defects, soft defects, or repairs, χ size ((10)), γ size Um), preset defects, and the path of the KLA RF touch or confuse. To receive the -KLARF mask, the user can choose to read klarf (Import KLA RF) from the File menu. At this point, the user can wheel in the mask type (secret), inspection system (inspection system), pixel size (pixel), inspection mode (Inspection Mode), mask (Mask ID), serial number (Serial Number) Check the information of the p-level (inspec gamma stage) and the check reference (Inspecti〇nReference). After selecting the person to be read, the user may review the missing content and edit the information in the table to allow the user to supplement the information missing from the KLA RF. To store this Qing 1311690 broadcast case, the shackler can (4) Mirror a single bribe (Save), to the list of Wei Cun's case, enter the job name, and click on the store button. The stored file can now be used by the defect analysis tool. To receive (ie, read in) the non-KLA RF slot case, the user can wheel in with the type of mask (^1&amp; vomiting yang), checking the system (111 printing 6 丨 011% 纣 coffee), pixels Size (151 1 &amp; sink), Inspection Mode (Inspection Mode), Mask ID (Sesial Number), (Inspection Stage) ^ (Inspection Reference) ^ Information. At this time, the icon of the rideable image (I piano) is selected to be read (ImpQrt), thereby opening the -image right browser. After selecting the file of the person to be read, the user can review the contents of the defect table and edit the information in the form as needed. To convert this non-MFF file into a younger age and store the resulting MFF file, the user can select Save from the file menu, browse to the directory where the file will be stored, enter the file name, and click on the storage button. The stored file can now be used by the defect analysis tool. 〃 In accordance with an embodiment of the present invention, the task-based automated defect analysis tool can be implemented using the Virtual Stepper&lt;g) system approved by Numerical Technologies, lnc. to provide defect review, copyability analysis, and reticle status. In another embodiment, the conversion tool utilizes Data that is also recognized by Numericai Technologies, Inc.

The Exporter tool is implemented to convert a mask image file into a format readable by the defect analysis tool. These tools are best integrated to form a complete workflow. In one embodiment, the defect analysis tool and the file conversion tool can operate on a Wind〇ws 2®® or Unix platform. According to a feature of the present invention, the parameters set in the Mask Setting or Stepper Setting screen are outputted with the state of the security feature. For example, in one embodiment, a user at a manufacturing facility may want to keep information about their step-by-step machine as a business secret. In this case, the user can click on Security on the main menu bar to pull out a window. This window contains an Export button that allows the user to encrypt information about the parameter when clicked. In an embodiment, all information except the name can be encrypted. The user in the manufacturing facility can then send the encrypted stepper file to a reticle library user, who can read the file into a 32 1311690 defect analysis tool. At this point, the RADSS or simulation task can be set using the encrypted stepper without directly accessing the actual stepper parameters used by the manufacturer. Although the exemplary embodiments of the present invention have been described in detail above with reference to the drawings, it is understood that the invention is not limited We do not consider these instructions to be exhaustive or to limit the invention to the explicit forms disclosed. Therefore, there are obviously many modifications and variations. For example, in accordance with other embodiments of the present invention, a system and a computer program product are provided to perform the defect analysis function described above. It is to be noted that the systems and methods described in this specification can be applied to any lithography process technology, including ultraviolet light, deep ultraviolet light (DUV), vacuum ultraviolet light (EUV), light, and electron beams. Accordingly, the scope of the invention is intended to be defined by the appended claims BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an exemplary working flow chart 10 for determining whether a reticle passes inspection, should be repaired, or must be remanufactured (^ Figure 1B rim-system configuration, wherein - the task actor can manage the plural The task will be assigned to a plurality of computing resources. Eight cases of Hi-pages can capture and organize the images that the creator wants to analyze—the county's information is drawn in Figure 3—capable of capturing and organizing information about a defect. Example stepping thief to set the page. ❿ 机 之 4 4 4 4 4 4 4 4 = = = = = = = = = = = = = = = = = = = = = = = = 有 有 有 有 有 有 有 有 有 有The required simulation data and compression settings, and the results of the diversion are transferred to the sample maintenance page of another database. Figure 2 depicts the allowable user search for the data execution time-defect analysis task. - I have finished the page of the page. The result of the 1st floor review of the Fanna 1 review will be out - the allower _ lack of fine goods akisaki _ Figure 9 draws - allows the user to individually watch the preparation of the J brother 2 layers Review page. Example of the results of the third layer review page., trap and &gt; test image pair together with the simulation knot 33 1311^90 Figure ίο depicts a sample file conversion tool page that facilitates the conversion of a non-standardized mask file into a standard mask format file (MFF). Component Symbol Description 110 Task Manager 112 User Station 114 Web Browser 116 Computer 111 Defect Analysis Tool 113 Graphic User Interface 115 Application Server 117 Storage Device 120 Task 200 Mask Settings Page 201, 301, 401, 501, 601, 602, 603, 604, 605, 606 '607, 608 Area 202, 302, 402 502 Table 400 Check System Settings Page 503 Pull-down list 504 New Zealand 700, 800, 900 Review page 901, 902, 903, 904 Window 1001 Setting area 300 Stepper setting page 500 Example maintenance page 501 下拉 下拉 pull-down menu 600 example execution page 801 mask defect map 1000 sample file conversion tool page 1002 defect table 34

Claims (1)

1311690 X. The scope of application for patents: 1. A method for analyzing the reticle in the light lithography's to include: loading the reticle slot into the defect analyzer I. Specifying the reticle file Execution of bribes: where the parameter = _ a used in the process of consistently performing the deficiencies on the hood is the setting and associated with the optical switching system m for the inspection system; = according to the reticle Steps have _ set; the sister exposes the task and assigns it to the computing resource; the parameter defined in the computing resource is executed by the computing resource to output the result of the task, wherein the result A copyability result containing the reticle defect. The method of claim 2, wherein the mask file comprises a standard mask format file (MFF). 3. The method of applying for the second item of the patent scope further includes converting the reticle data into the standard MFF. 4. The method of claim 1, wherein the setting comprises at least one of a reticle type, a phase of the reticle, and a transmission of the reticle. 5. The method of claim 1, wherein the setting comprises at least one of an inspection system supplier and an inspection system model. 6. The method of claim 1, wherein the setting comprises at least one of a wavelength, a numerical aperture 35 13 π 690 diameter, a reduction ratio, a defocus, and an illuminance. 7. If the scope of the patent application is the third item, the task manager is executed. The management and assignment of the task is carried out by a method of claiming patents, which operates in parallel. He Xi Li 1 1. If you apply for patent scope item 7 μ—, go, where the task manager schedules multiple operations resources to perform one or more tasks. The method of clause 1, wherein the result comprises a method for the user to review η. If the application is for the κ) item, wherein the level includes a general summary of the simulation performed on the defect. α If the method of applying for a patent correction is made, the summary of the defect contains the defect score of the defect. !3. The method of applying for a patent reticle), the shot-level includes a defect map of the defect on the reticle. The method of claim 2, wherein the defect map is color coded based on the severity of the defect associated with each defect. 15. If the method of claim 14 is applied, the severity of the defect is indicated by a flash. 6. If the application for patent turns the green of item 10, the shot-scale provides an aerial image of each defect and a reference image of the region corresponding to the image of the defect. !7·If you apply for a patent! The term of the item* includes: the status of each defect is entered according to the review of the result of a user's work. If the team applies for the method of Article 17 of the patent scope, it also includes the basis of the user's review of the results of the task to provide a state history for each defect. 19. If the method of applying for the patent is the oldest method, the method further comprises: using a network device to obtain the result of the task. ° 20·-A system for analyzing a reticle in a light lithography, comprising: applying a servo state for performing a defect analysis tool; a loading device's job-photomask domain defect analysis tool And a device for specifying a task to be performed by the mask file, wherein the task defines a defect on the dragon mask - a parameter used in the process of performing the process, and the parameter includes the light The settings relating to the hood, the settings relating to the inspection system that provides information for the reticle case, and the settings associated with the stepper that can be used to expose the reticle during the photolithography process; 'To perform the task; the task manager arbitrarily assigns the chores to the material and receives the result of the task from the special transport source; and ▲ - the mosquitoes, the ribs out of the task, wherein The results include the copyability results for the defect on the ray mask. 21. The system of claim 20, further comprising a conversion device for converting the mask data into a standard mask format (MFF). For example, the system of claim _2G, wherein the setting includes at least one of a reticle type, a phase of the reticle, and a transmission of the reticle. 37 1311690 23. The system of claim 20, wherein the setting comprises at least one of an inspection system supplier and an inspection system model. 24. The system of claim 20, wherein the setting comprises at least one of wavelength, numerical aperture, reduction ratio, defocus, and illuminance. 25. The system of claim 20, further comprising a memory for storing the parameter of the task and at least one of the results. 26. The system of claim 20, wherein the task manager includes a device for allowing multiple tasks to operate in parallel. 27. The system of claim 26, wherein the task manager includes a scheduling device for scheduling multiple computing resources to perform one or more tasks. 28. If the invention is in the form of a patent, the output device of the towel output includes an access device for accessing the result via multiple review levels. 29. For the system of claim 28, at least one of the review levels: a general summary of the simulations performed on the defect. &gt; 30. As claimed in claim 29, at least the level contains a defect map of the defect on the reticle. 31. The system of claim 30, wherein the output device comprises an encoding device for colorally encoding the defect map based on a defect severity associated with each defect. 32. The system of claim 31, wherein the encoding device for color-coded defect maps comprises a -th-providing device for providing a colored flash for any defect having a high defect severity. 38 J311690 is the system of the 32nd part of the patent scope, at least the level of which provides the corresponding reference image for each defect-air image and the image of the defect. The system for applying for the second item of the patent scope further includes at least one of the following: (10) into the device, and the face is used to review the result of the task, and the state of the parent is one of the defects; and the device provides a device. - The review of the results of the financial _ mission provides a state history for the parent-defect. Therefore, for example, the system-shaped user interface of claim 20 is applied. The I output device provides a system of Figure 3, wherein the wheeled device contacts the person to provide the graphical user interface. 37. A computer program product, comprising: a body, which has a computer readable code included therein, so that the computer analyzes a defect for the lithography code including the cover hood (four) brain readable It is difficult to carry a reticle to the code in the defect analysis tool; use the reticle charm - the task to be executed: the system =:: on, the process used in the process: number ^ the parameter contains The setting related to the mask, the inspection system related to the information provided by the case, the setting of the A*, ,, ^ first cover system and the stepping machine that can be used to expose the mask in the light (4) clothing process There are _ set seven W 39 1311690 to manage the task and give the chores to the county t_ code; use the reticle file and the code defining the parameter task on the computing resource; and output the code of the result of the task, the towel The result includes the photocopyability result of the defect on the reticle. 38. If you apply for the electric refusal product of the singularity, you also include the code to convert the reticle data into a standard reticle format file (foot). 39. The computer program product of claim 37, wherein the management and assignment task is a stone-horse command-task manager. I applied for a computer program product of 39 patents, in which the task management cry allowed multiple tasks to work in parallel. 41: The electric touch program product of claim 37, wherein the code 匕3 of the round result is a code for the user to provide multiple review levels. The electric product “includes the code from the lower axis to the syllabus to the review of the county, and the code of the ruthlessness of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Yu Yu (S 40