1311446 九、發明說明： 【發明所屬之技術領域】 造方^發鶴_—種麥克風，_是—種差動式麥克風及其製 【先前技術】 電子產品發展迅迷，除功能需求外，產品趨勢更 =腫、薄:短、小發展’針對可移動式電子產品更是如此， 應用;產業於民生i業、軍事之用途均有其重要地位，如 應用於手财，目前佛辦勒輕ϋ 不影響功能下，趣_元件給予小魏，除小魏;;更= 的將各個树整合在—起以形成整合式單晶片系統 (yStem on Qup; soc)，麥克風（Micr〇ph〇ne)晶片就是 :關鍵躺元件，當前料的麥錢設料是與積體電路 (ntegrated Circuit; IC)分開製作後，再行打線封裝，所以 面積較大，且容易產生旁路電容與雜訊。 又’目前微機電系統_s)麥克風大多採混合（Hybrid) =與電路做整合«，如此科產錄訊之問題，齡能使積 體電路⑽與麥克風得以整合於單—晶片上，將可萌決晶片 成本高、雜峨大與w整合雕後面触大之_。 a 此外，目剷麥克風常依麥克風結構而有所不同，其中一類， 其麥克風經由雜製程而軸_，但是，此製程若採用濕_ 方去不易糊麥歧晶#之背後侧之製程，且使產品良率低， 1311446 若採乾I虫刻方法，雖· 了文D此缺點，但會因蝕刻深度需求大而大 刻的’為了改善此現象’最佳的方法即減少需要餘 、冰又’ /、克㈣設計上是_正面以乾爛方式且一 個導孔，此法僅需鞑黏功丨 乾餘刻一小段深度，主要利用導孔增加所需的1311446 Nine, invention description: [Technical field of invention] Manufacturing party ^ hair crane _ - kind of microphone, _ is a kind of differential microphone and its system [prior art] Electronic product development is fascinating, in addition to functional requirements, products The trend is more swollen, thin: short, small development' is more suitable for mobile electronic products, application; industry has its important position in the use of the people's livelihood, military use, such as applied to the hand, the current Buddha ϋ Without affecting the function, the _ component is given to Xiao Wei, except Xiao Wei;; more = the individual trees are integrated to form an integrated single-chip system (yStem on Qup; soc), microphone (Micr〇ph〇ne The wafer is: the key lying component, the current material of the money is set separately from the integrated circuit (IC), and then the wire package, so the area is large, and easy to generate bypass capacitors and noise. Also, the current 'micro-electromechanical system _s' microphones are mostly hybrid (Hybrid) = integrated with the circuit «, so the problem of the industry's recording, the age can make the integrated circuit (10) and the microphone can be integrated on the single-chip, will be The cost of the dying wafer is high, the scorpion is large, and the w-integrated eagle is big. a In addition, the eye shovel microphone often differs depending on the structure of the microphone. One of the types, the microphone is through the miscellaneous process and the axis _, but if the process is wet, it is not easy to paste the surface of the process, and The product yield is low, 1311446 If the method of picking up the insects, although the shortcomings of the text D, but because of the large demand for etching depth, the best way to improve this phenomenon is to reduce the need for ice, ice And '/, gram (four) design is _ front with dry and rotten and a guide hole, this method only needs to lick the sticky work for a small depth, mainly using the guide hole to increase the required
空間以減少背壓，bn A ，、、、此蜍孔於填膠時，容易阻塞且堆積灰塵，而 k成麥克風晶片之效能大大減低。 【發明内容】 本土月的主要目的在於提供一種差動式麥克風及其製造方 法’擬製作—_體電路⑽整合的差動式麥克風(differential microphone)，不單具備高靈敏度、低雜訊、低偏電壓，更可與 1C整合成-單晶’細解決先概術所存在之問題。 • ’為達上述目的，本㈣所減之—種差械麥克風， 包含有基板、第-金屬層、振動膜以及第二金屬層。 —基板中至少具有-^^腔，於基板上形成—第—金屬層，再 鲁於弟-金屬層上形成振動膜，最後於振細上形成第二金屬層， 其中第-金屬層和振動膜之間，以及振細和第二金屬層之間， 分別具有-振動空間，又第一金屬層以及振動膜分別具有至少一 穿孔’使得共振腔與振動空間藉著各個穿孔而相通，以使共振腔 接收到|源知’產生一氣流於共振腔、各個振動空間以及各個 牙孔間流動，而導致振動膜受到振動以產生相對於第一金屬層和 第二金屬層之振動變化值，即振動膜受到振動時，相對於第一金 屬層會產生-個隸’透過合適之讀取電路或錢將絕對值相 1311446 而相對料二金屬層也會產生-鑛等的差值，總共即產生 振動差值，此振動差值係正比於振動膜之敏感度Space to reduce back pressure, bn A , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , SUMMARY OF THE INVENTION The main purpose of the local month is to provide a differential microphone and its manufacturing method 'prototype _ body circuit (10) integrated differential microphone (differential microphone), not only with high sensitivity, low noise, low bias The voltage can be integrated with 1C - the single crystal 'fine solution to the problem of the first general. • For the above purpose, the differential microphone that is reduced by this (4) includes a substrate, a metal layer, a diaphragm, and a second metal layer. - having at least -^^ cavity in the substrate, forming a -metal layer on the substrate, forming a vibrating film on the di-metal layer, and finally forming a second metal layer on the vibrating layer, wherein the first metal layer and the vibration Between the membranes, and between the vibrating and the second metal layer, respectively, having a vibration space, and the first metal layer and the vibrating membrane respectively having at least one perforation, such that the resonant cavity communicates with the vibration space through the respective perforations, so that The resonant cavity receives the source to generate a gas flow in the resonant cavity, the respective vibration spaces, and the flow between the respective interverting holes, thereby causing the vibrating membrane to be vibrated to generate a vibration variation value with respect to the first metal layer and the second metal layer, that is, When the vibrating membrane is vibrated, it will produce a difference from the first metal layer, which is generated by a suitable reading circuit or money, and the absolute value of the phase is 1311446. Vibration difference, which is proportional to the sensitivity of the diaphragm
Sitivity) ’此為”差動式”之含意’透過振動差值來量化 振動膜之振_敏感度大小。 ^此外在振動膜之四周更可加入懸臂樑，利用懸臂樑一端固 疋之方辆自分佈於振細之觸，狀平敏撐振動膜並消除 製造過程中產生之應力。 又，當剛的封裝麥克風方式，大都針對以背蝕製程的麥克風， 在此’提出新的封I方式，是針對以正面侧製程的麥克風，設 计以-上蓋接合於麥克風之導孔上方，如此可增加所需的空間以 減乂 a壓產生，且可保護導孔以免填膠時阻塞並具有防塵作用。 隨著製程技術之突破以及電子元件之微小化，麥克風之結構 與製造技術亦逐漸成财，整合半導體製程、微機電加工等技術， 即可製作$有別独往純微機電麥克風晶片，由於其輸入電壓 元件體積小，製程可批次化，製作品質敎，可祕表面黏 著技術(Surface Mount Technology ; SMT)組裝。 晶片（chip)化微小型電容式麥克風可以應用產品領域範圍 很廣’包括資訊產品，如筆記型電腦、多媒體監視器、語音輸入 等’而通訊產品有如行動電話手機、藍料機、skype耳機等， 智慧型家電產品、微小雜音器、醫療助聽卜運輸卫具主動式 噪音控制’智慧型語音辨鱗產品，由於具有輕薄小躲，因此 未來更有無窮的潛力，狀在電子整合制產^，如個人數位助 1311446 理(Pe咖al Digital Assistant ; PDA)與行動電話整合於藍芽上 之應用’預期可以顧產業包括有通訊、資訊、家電等，對於智 慧型聲控產品應用將有更大市場潛力。 3 —’町在實财式帽細敘縣糾之詳細概缝優點，复 •内容足骑任何熟習侧聽者了解本發明之技_容並據以實 施’且根據本說明書所揭露之内容、申請專利範圍及圖式，任何 熟習相關技藝者可輕祕理解本發明相關之目的及優點。 鲁 【實施方式】 為使對本發明的目的、構造、特徵、及其功能有進一步的瞭 解，兹配合實_詳細綱如下。以上之本發日肋容之說明 .及以下之實施方式之說明係用以示範與解釋本發明之原理’並且 • 提供本發明之專利申請範圍更進一步之解釋。 *振膜的好壞是影響麥克風元件聲音品質的最重要因素，但因 為標準半導體之製程厚度與㈣上的關，導致振膜的特性會有 鲁所損失’磁制翻巾的絲，目此，本發明提丨-些設計方 式來達到町的效果：增加靈敏度、減少製程殘留應力影響、與 積體電路⑽整合翻—晶片上以及低麵訊滤波。 月 > 閱第1圖」’係為本發明之差動式麥克風之架構圖，主 要包含有基板⑽、第-金屬層⑽、振動膜112以及第 120。 曰 基板102 ’具有至少一共振腔104，此基板102可為矽基板。 第—金屬層106，形成於基板102之上，包含有至少一個穿Sitivity) 'This is the meaning of the differential type' quantifies the vibration-sensitivity of the diaphragm by the vibration difference. In addition, a cantilever beam can be added around the vibrating membrane, and the one end of the cantilever beam is self-distributed to the vibrating touch, and the diaphragm is symmetrical to the diaphragm and eliminates the stress generated during the manufacturing process. Moreover, when the packaged microphone method is mostly for the microphone with the back-etching process, the new method of the first sealing method is proposed for the microphone with the front side process, and the upper cover is designed to be joined above the guiding hole of the microphone. This can increase the space required to reduce the pressure generation, and can protect the guide hole from being blocked during the glue filling and having a dustproof effect. With the breakthrough of process technology and the miniaturization of electronic components, the structure and manufacturing technology of microphones have gradually become rich, integrating semiconductor processes, MEMS processing and other technologies, and it is possible to produce a unique MEMS microphone chip. The input voltage component is small in size, the process can be batched, the quality is made, and the surface mount technology (SMT) is assembled. Chip-based micro-capacitance microphones can be used in a wide range of applications including information products such as notebook computers, multimedia monitors, voice input, etc. Communication products such as mobile phone handsets, blue media, skype headsets, etc. Smart home appliances, tiny megaphones, medical hearing aids, transportation aids, active noise control, 'smart voice discrimination scale products, because of the light and small hiding, so the future has more potential, in the form of electronic integration production ^ For example, the application of personal digital help 1311446 (Peca al Digital Assistant; PDA) and mobile phone integration on the Bluetooth is expected to take into account the industry including communications, information, home appliances, etc., for smart voice control products will have greater Market potential. 3 — 'The town in the real wealth of the caps of the fine-grained county to explain the advantages of the detailed expansion, the complex content of the rider familiar with the side of the listener to understand the technology of the present invention _ and according to the implementation of the contents of To the extent of the patent application and the drawings, any person skilled in the art can understand the objects and advantages of the present invention. [Embodiment] In order to further understand the object, structure, features, and functions of the present invention, the details are as follows. The above description of the embodiments of the present invention is intended to be illustrative and to explain the principles of the invention and to provide a further explanation of the scope of the invention. *The quality of the diaphragm is the most important factor affecting the sound quality of the microphone component, but because of the thickness of the standard semiconductor process and the (4), the characteristics of the diaphragm will be lost to the 'magnetic twisted wire'. The present invention provides a design method to achieve the effect of the town: increase sensitivity, reduce process residual stress effects, integrate integration with the integrated circuit (10), and on-wafer and low-surface filtering. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The substrate 102' has at least one resonant cavity 104, which may be a germanium substrate. a first metal layer 106 formed on the substrate 102 and including at least one
1311446 S’:二第一金屬層1〇6之上下兩側可具有-層第-保護層 第1、於侧過財，第-金屬層106祕職所侵餘，此 弟一金屬層106之材質為導電性材質。 振動膜112，於第-金屬層觸之上，且振動膜ιΐ2和第一 、屬層106之間具有-振動空間11〇，振動膜112具有至少一穿 孔108 ’此振動膜112之材質為導電性材質。 第二金屬層120 ’於振動膜112之上，且振動膜ιΐ2和第二 、，屬層120之間也具有振動空間11〇，且第二金屬層12〇之上下 兩側可具有-層第二保護層134，以避免於侧過程中，第二金 屬層120被侧液所侵#，其材質係為導電性材質。 — #由於第-金屬層⑽與振動膜112之間，以及振動膜⑴與 弟二金屬層120之間’分別具有—振動空間nG，又第一金屬層 1〇6以及振細U2係分別具有至少一穿孔1〇8，共振腔1〇4盘: 個振動空間no藉著各個穿孔⑽而相通，使得共振·4接收 到-聲源時’可提供適t之聲壓，使麥克風可正常收音，產生之 氣流於共振腔1G4、各健動郎11G以及各縛孔⑽間流動， 而使得振動膜112產生相對之振動變化值。 當振動膜112受到振動時，相對於第一金屬層1〇6會產生一 個差值，而相對於第二金屬層12〇也會產生一個對等的差值，總 共即產生S倍之娜紐，此猶差值係正比於振細112之敏 感度（sensitivity)，透過振動差值來量化振動臈112之振動的 敏感度（sensitivity)大小。 1311446 其中，可經由特別設計，使得各個振動空間110以及各個穿 孔108係形成至少一階梯型空間13〇，可作為低頻聲波的濾波器， 用以濾掉低頻雜訊的震波’且此階梯型空間13〇設計於振動膜112 之旁邊，確使振動膜112為自由振膜，以增加靈敏度。 此外，於振動膜112之上下兩侧，分別更可以包含有支撐墊 114 ’用以支撐住振動膜112，此支撐塾114是用來稍微支撐錄1311446 S': The first and second metal layers 1〇6 can have a layer-first protective layer on the upper and lower sides, and the first and second sides of the metal layer 106 are invaded by the secret of the metal layer 106. The material is a conductive material. The vibrating membrane 112 is above the first metal layer, and the vibrating membrane 112 has a vibrating space 11〇 between the first and the genus layer 106, and the vibrating membrane 112 has at least one perforation 108'. The material of the vibrating membrane 112 is electrically conductive. Material. The second metal layer 120' is above the vibrating film 112, and the vibrating film ιΐ2 and the second layer 12 also have a vibration space 11〇, and the second metal layer 12〇 has a layer above and below the second layer The second protective layer 134 is used to avoid the second metal layer 120 being invaded by the side liquid during the side process, and the material is made of a conductive material. —#Because the first metal layer (10) and the vibrating film 112, and between the vibrating film (1) and the second metal layer 120 have a vibration space nG, respectively, the first metal layer 1〇6 and the vibrating U2 system respectively have At least one perforation 1〇8, the resonant cavity 1〇4 disc: the vibration space no communicates through each perforation (10), so that when the resonance·4 receives the sound source, it can provide the sound pressure of the t, so that the microphone can normally receive the sound. The generated airflow flows between the resonant cavity 1G4, each of the moving gangs 11G, and the respective binding holes (10), so that the diaphragm 112 generates a relative vibration change value. When the vibrating membrane 112 is subjected to vibration, a difference is generated with respect to the first metal layer 1〇6, and an equivalent difference is generated with respect to the second metal layer 12〇, and a total of S times This Judgment is proportional to the sensitivity of the vibration 112, and the vibration sensitivity is used to quantify the sensitivity of the vibration of the vibration 臈 112. 1311446 wherein, in a special design, each of the vibration spaces 110 and each of the perforations 108 form at least one stepped space 13A, which can be used as a filter for low-frequency sound waves to filter out shock waves of low-frequency noise and the stepped space 13〇 is designed beside the diaphragm 112 to ensure that the diaphragm 112 is a free diaphragm to increase sensitivity. In addition, on the upper and lower sides of the vibrating membrane 112, respectively, a support pad 114 ′ may be further included for supporting the vibrating membrane 112, and the supporting raft 114 is used for slightly supporting the recording.
動膜112 ’但影響振動膜U2之作用不大，支撐墊114之材質可 和第一保遵層134之材質相同。 於差動式麥克風中也可正面侧出—導孔126，自第一金屬 層106貫穿至第二金屬層12〇，並且使得基板1〇2之共振腔皿 與導孔126之底部互通，用以減少氣流產生之雜，為了保護導 孔126以免填膠時阻塞以及防止灰塵落入其中，可設計一導孔之 封裝結構128 _住導孔126，鱗孔之職結構128具有一凹 槽空間，用來提供所需空間以減少背壓產生，係接合於導孔126 之周圍以封料孔126，視材料決定透獅合方式献電焊方式 等方法，將導孔之封裝結構128接合於導孔126上方以供之後 填膠程序以保護導線。 用本發明之共振腔104、振動空間110以及各個穿孔108係採 式形成’透過多個線，達到可以在短時間内將 各層間决速且確實地姓刻完成。 又於本發日种，為了料產品良率 了 度’故在麥克_二上1 11 1311446 採由正面以乾钮刻方式來增加導孔126的設計，此法僅需乾侧 -小段深度，主要導孔126以及封細設計的雖結構128 來增加所需的空間以減少背壓產生。 #請參閱「m縣本發明之絲式麥紐 • 流程圖’首先，提供-基板，於基板形成至少一共振腔（步驟2⑻， 然後，形成第-金屬層於基板上（步驟220)，接著，形成一振動 膜於第-金屬層上（步驟230)，其中，可於振動膜之上下兩側分 籲卿成支撐墊（步驟232)，以支樓住振動膜，最後，形成第二金 屬層於振細上（步驟施），當中，第—金屬層與振動膜之間、，* 以及振動膜與第二金屬層之間，分別形成有_^動空間，又第一 金屬層、振動膜以及第二金屬層係分別形成具有至少一穿孔，使 得共振腔與振触關著各個？孔_通，以使共振腔接收到一 聲源時，產生-氣流於共振腔、振動空間以及各個穿孔間流動， 而導致振細產生娜之纖變錄，於此即完祕本結構之差 籲動式麥克風結構，可透過混合（Hybrid)貼合方式完成此結構。 然而’於此製造方法中更可包含有形成—支撐柱，係穿過振 動膜以連接第-金屬層以及第二金屬層（步驟242)，用以使得第 -金屬層以及第二金屬層得以保持固定間距，戦振動膜形變， 也更可包含有形成-導孔之步驟，係自第—金朗貫穿至第二金 屬層（步驟244)，用以減少氣流產生之壓力。 此外’於振動膜之周圍可形成有多個懸臂樑，各個懸臂樑係 利用點固定之方式均勻分佈於振動膜之周圍，用以平衡支撐振動 12 1311446 膜並消除製造過程中產生之應力，懸臂樑之個數為4根，平均分 佈於振動膜之四周，但其纖之多寡，可隨振動膜的大小與形狀 而有所不同。 • 又，為了避免於姓刻過程中，第一金屬層以及第二金屬層會 被酬液所賴’因此，可於第—金屬層以及第二金屬層之上下 兩侧分別形成保護層。 /、中，基板可為石夕基板，而第一金屬層、振動膜以及第二金 籲屬層之材貝係為導電性材質，又共振腔、各個振動空間、導孔以 及各個穿孔係採用正面兹刻方式形成，僅透過正面侧，因基板 背π不需侧，不需糊背祕朗話，當麥克風日日日#封裝時， 可減）㈣封裝製程與成本，且各個振動空間以及各個穿孔係設 計排列形成至少-階梯型空間，可用以滤掉低頻雜訊的音波，但 在實做時’亦可考慮背後侧之製程，以達絲後之差動式麥克 風之結構。 13 1311446 310，於穿孔310中先填補可被餘岁丨丨 刻之材質’接著’於第-導電材 料306上鋪上一層第一被蝕刻材質^ 動空間之用 M2，此區係於触刻後做為振 繼續，於第刻材質312上面鋪上—層薄薄的第一支撐 墊314，係用來做為振動膜之下部支撐，繼續形成一第二 料316於第一支撐墊314上，其中定義有一振_⑽以及多個 欲被侧之穿孔320 ’再繼續於其上形成一層薄薄的第二支撐塾 # 324，侧來做為振動膜之上部支揮，然後繼續於上面鋪上一層第 二被触刻材質328 ’此區係於颠刻後做為振動膜318之振動空間 之用’最後在最上層鋪上第三導電材料綱，其巾定義有第二金 屬層334做為上電極層，第二金顧咖之上下兩侧具有第二保 護層娜，以避免於_過程中，第二金屬層咖被侧液或餘 刻氣體所韻’第三導電材料咖之材質可和第_支撐墊314以 及第二支撐墊324之材質相同。 瞻 最後’採用正面姓刻方式’從多個钕刻孔中倒入侧液或利 用侧氣體透過擴散進行_，以將共振腔3〇4、穿孔31〇、第一 被截刻材質312、穿孔320以及第二被姓刻材質328侧掉，僅 透過正面則’因基板3G2背部不需侧，不需利用背面敍刻的 話，當麥克風晶片封裝時，可減少背部封裝製程。 經由特別的制設計，蝴後可形成有—導孔_以及階梯 形狀之空間342 ’如「第31圖」所示，此階梯型空間342可做為 低頻聲波之濾波器。 14 1311446 几,、符傅τ加入支撐柱以及於振動膜318 之四周加上支擇結構’請參閱「第4Α圖」，係為本發明之具有支 撐柱以及細梁之振動膜俯視圖，振動膜318之周圍包含有多根 懸臂樑，這些懸臂樑之材質可和第一支撐塾314以及第 -支撐墊324之材質相同，懸臂樑_係透過點固定之方式均句 1佈Γ動膜318之周圍，用以平衡支撐振動膜並消除製造 過程中產生過多之應力，當製程過程中有殘留應力存在，可經由 =臂=編的偏移，而使振動臈318不會造成本紅變形或龜曲， :圖」中’振動膜318之形狀為_，卿關定之方式 數Τ:Γ=臂樑360於振動膜318之四周'但懸臂樑編個 數之夕养’可Ik振賴318的大小與形狀而有所不同。 而於差動式麥克風結構中加入之支 则以連接第-金屬層以及第二金屬層334，使 2以及第二金屬層334得以保持固定間距，而為了使振 仍為可以振動之自由振臈，於支撐柱350之 、 相接觸，以免影響振動膜318之作用 、振動_ 能過多，過多會直接影響振動細的位移2=數目也不 因此支撐柱350的數目需進行適度地評估，可參閱5^小， 係為本發明之且古*产心 > 閱苐4B圖j， 圖。仅具有支撐柱以及懸臂樑之差動式麥克風剖面結構 最後，請參閱「第5圖」，為用於麥克 結構為導孔340之封裝結構41〇，具有 t構’此封裝 3二间，用來封裝導孔 15 1311446 i4::部分朝上’以接合於導孔340上方’增加空間以減少 U，第6圖」係為加上封裝結構之麥克風剖面結制，此 風結構係具有支撐柱350以及多個懸臂樑36〇。 夕 雖然本發明以前述之實施例揭露如上，然其並_以 不!Γ本發明之精神和細内，所為之更動與潤飾，均 °轉晴物護範圍請參考 【圖式簡單說明】 ―第1圖係為本發明之差動式麥克風之架構圖； 弟2圖係為本發明之差動式麥克風之製造方法流程圖. 第圖广C圖、第叫 第3G圖、第3Η圖以及第31圖係為本 實施例示意圖，· 林發月之差動式麥克風之製程 圖；第4Α圖係為本發明之具有支雜以及懸臂襟之振動膜俯視 第4Β圖係為本發明之具有切桂 風剖面結構圖； 丹卞心產動式麥克 第5圖係為本發明之用於麥克風之封装 第6 _為加上聽結構之麥核剖二構圖: 【主要元件符號說明】 102基板 104共振腔 1311446 106第一金屬層 108穿孔 110振動空間 112振動膜 114支撐墊 120第二金屬層 126導孔 128導孔之封裝結構 130階梯型空間 132第一保護層 134第二保護層 302基板 304共振腔 306第一導電材料 308第一金屬層 309第一保護層 310穿孔 312第一被餘刻材質 314第一支撐墊 316第二導電材料 318振動膜 320穿孔 1311446 324第二支撐墊 328第二被蝕刻材質 330第三導電材料 333第二保護層 334第二金屬層 340導孔 342階梯型空間 350支撐柱 360懸臂樑 410導孔之封裝結構The diaphragm 112' does not affect the diaphragm U2, and the material of the support pad 114 can be the same as that of the first layer 134. In the differential microphone, the front side can also be out-via 126, which penetrates from the first metal layer 106 to the second metal layer 12, and allows the resonant cavity of the substrate 1〇2 to communicate with the bottom of the via 126. In order to reduce the miscellaneous airflow, in order to protect the guiding hole 126 from blocking during the filling and preventing dust from falling into it, a guiding structure of the guiding hole 128_the guiding hole 126 can be designed, and the working structure 128 of the scale hole has a groove space. For providing the required space to reduce back pressure generation, the method is to join the guide hole 126 around the sealing hole 126, depending on the material, the lion-integrated electric welding method is adopted, and the guiding structure 128 of the guiding hole is joined to the guiding structure. A hole 126 is placed over the hole 126 to protect the wire. The resonant cavity 104, the vibrating space 110, and the respective perforations 108 of the present invention are used to form a plurality of lines, so that the layers can be quickly and surely completed in a short time. Also on the date of this issue, in order to improve the yield of the product, the design of the guide hole 126 is increased by the front button on the front side of the microphone 1 2 1311446. This method only needs the dry side - the small depth. The primary via 126 and the structured design 128 are used to increase the space required to reduce back pressure generation. #Please refer to "m County's silk type 麦纽• Flowchart". First, a substrate is provided, at least one resonant cavity is formed on the substrate (step 2 (8), and then a first metal layer is formed on the substrate (step 220), and then Forming a vibrating film on the first metal layer (step 230), wherein the support pad can be formed on the upper and lower sides of the vibrating film (step 232) to support the vibrating film and finally form the second metal The layer is on the vibration (step application), wherein the first metal layer and the vibration are respectively formed between the first metal layer and the vibration film, and between the vibration film and the second metal layer. The film and the second metal layer are respectively formed with at least one perforation, such that the resonant cavity and the vibrating contact are closed to each hole, so that when the resonant cavity receives a sound source, the airflow is generated in the resonant cavity, the vibration space, and each The flow between the perforations causes the vibrating to produce Na's fiber, which is the difference between the structure of the secret microphone structure, which can be completed by hybrid (hybrid) fitting. However, in this manufacturing method Can also include formation-support a column, which passes through the vibrating membrane to connect the first metal layer and the second metal layer (step 242), so that the first metal layer and the second metal layer are maintained at a fixed pitch, and the diaphragm is deformed, and may also include The step of forming a via hole is performed from the first - galen to the second metal layer (step 244) to reduce the pressure generated by the air flow. Further, a plurality of cantilever beams, each cantilever beam, are formed around the diaphragm It is evenly distributed around the diaphragm by means of point fixing to balance the vibration of the 12 1311446 membrane and eliminate the stress generated during the manufacturing process. The number of cantilever beams is 4, which is evenly distributed around the diaphragm, but its The amount of fiber can vary with the size and shape of the diaphragm. • Also, in order to avoid the process of surname, the first metal layer and the second metal layer will be affected by the rewards. The metal layer and the upper and lower sides of the second metal layer respectively form a protective layer. In the middle, the substrate may be a stone substrate, and the first metal layer, the vibration film and the second metal layer of the metal layer are conductive materials. ,also The vibrating cavity, each vibrating space, the guiding hole and each perforation are formed by the front side, only through the front side, because the back π of the substrate does not need the side, and there is no need to confuse the secret, when the microphone is packaged, (4) Packaging process and cost, and each vibration space and each perforation system is arranged to form at least a stepped space, which can be used to filter out the sound waves of low frequency noise, but in practice, the process on the back side can also be considered. In the structure of the differential microphone after the wire, 13 1311446 310, first fill the material that can be engraved by the old man in the perforation 310, and then lay a layer of the first etched material on the first conductive material 306 ^ For the moving space, M2 is used. After the contact is made, the vibration is continued. The first material 312 is laid on the first material 312. The thin first support pad 314 is used as the lower part of the diaphragm to continue to form. A second material 316 is disposed on the first support pad 314, wherein a vibration_(10) and a plurality of perforations 320' to be laterally formed are further formed thereon to form a thin second support 塾#324, as the side Above the diaphragm, Continue to lay a layer of the second touched material 328 'this area is used as the vibration space of the diaphragm 318 after the engraving. Finally, the third conductive material is laid on the uppermost layer, and the towel definition has the second. The metal layer 334 is used as the upper electrode layer, and the second metal layer has a second protective layer on the upper and lower sides to avoid the second metal layer being slanted by the side liquid or the residual gas. The material of the material coffee can be the same as that of the first support pad 314 and the second support pad 324. Finally, 'using the positive surname method', pour the side liquid from the multiple engraved holes or use the side gas to diffuse through the diffusion_ to make the resonant cavity 3〇4, the perforation 31〇, the first truncated material 312, and the perforation 320 and the second surnamed material 328 side off, only through the front side 'Because the back of the substrate 3G2 does not need side, no need to use the back side of the engraving, when the microphone chip is packaged, the back encapsulation process can be reduced. Through the special design, the space 342 of the guide hole _ and the step shape can be formed as shown in Fig. 31. The step space 342 can be used as a filter for low frequency sound waves. 14 1311446 Several, Fu Fu τ is added to the support column and a support structure is added around the diaphragm 318. Please refer to the "4th diagram", which is a top view of the diaphragm with the support column and the thin beam of the present invention, the diaphragm The periphery of the 318 includes a plurality of cantilever beams, and the material of the cantilever beams can be the same as that of the first support 塾 314 and the first support pad 324, and the cantilever beam is fixed by means of a fixed point. Surrounding, used to balance the supporting diaphragm and eliminate excessive stress generated during the manufacturing process. When there is residual stress in the process, the vibration can be caused by the offset of the arm = 308, so that the vibration 臈 318 does not cause the red deformation or the turtle. In the song, in the figure, the shape of the diaphragm 318 is _, the number of the method of qing ding Τ: Γ = the arm beam 360 is around the diaphragm 318 'but the cantilever beam is numbered in the evening. 'Ik 318 Size and shape vary. The branch added to the differential microphone structure is connected to the first metal layer and the second metal layer 334 so that the 2 and the second metal layer 334 are kept at a fixed pitch, and the vibration is still vibrated in order to vibrate. , in the support column 350, in contact, so as not to affect the role of the diaphragm 318, vibration _ can be too much, too much will directly affect the vibration of the fine displacement 2 = the number and therefore the number of support columns 350 need to be moderately evaluated, see 5^小, is the invention and the ancient * birth heart> reading 4B figure j, figure. The differential microphone cross-section structure with only the support column and the cantilever beam. Finally, please refer to "figure 5", which is a package structure 41 for the structure of the via hole 340 for the microphone structure, and has a t-structure of the package 2, The package guide hole 15 1311446 i4:: portion is upwardly 'to be joined above the guide hole 340' to increase the space to reduce U, and the sixth figure is a microphone cross-section of the package structure, the wind structure has a support column 350 and a plurality of cantilever beams 36〇. Even though the present invention has been disclosed above in the foregoing embodiments, the present invention is not limited to the spirit and the details of the present invention, and the changes and retouchings thereof are referred to [the simple description of the drawings]. 1 is a structural diagram of a differential microphone of the present invention; FIG. 2 is a flow chart of a method for manufacturing a differential microphone of the present invention. The figure C, the 3G, and 3 Figure 31 is a schematic view of the embodiment, a process diagram of a differential microphone of Lin Fayue; the fourth drawing is a view of the diaphragm of the present invention having a branch and a cantilever 俯视. Cut Guifeng's cross-sectional structure diagram; Dan's heart-made dynamic microphone 5th diagram is the invention for the microphone package 6th _ is the structure of the nucleus with the listening structure: [Main component symbol description] 102 substrate 104 resonant cavity 1311446 106 first metal layer 108 perforation 110 vibration space 112 vibrating film 114 support pad 120 second metal layer 126 via hole 128 via hole package structure 130 step space 132 first protective layer 134 second protective layer 302 substrate 304 resonant cavity 306 first conductive Material 308 first metal layer 309 first protective layer 310 perforation 312 first engraved material 314 first support pad 316 second conductive material 318 vibrating film 320 perforation 1311446 324 second support pad 328 second etched material 330 third Conductive material 333 second protective layer 334 second metal layer 340 via 342 step space 350 support column 360 cantilever beam 410 lead hole package structure