TWI309670B - Process for filling a three-dimensional cavity using an insert - Google Patents

Process for filling a three-dimensional cavity using an insert Download PDF

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TWI309670B
TWI309670B TW90106434A TW90106434A TWI309670B TW I309670 B TWI309670 B TW I309670B TW 90106434 A TW90106434 A TW 90106434A TW 90106434 A TW90106434 A TW 90106434A TW I309670 B TWI309670 B TW I309670B
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Taiwan
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insert
reaction
composition
epoxy
cavity
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TW90106434A
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Chinese (zh)
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Dean Anthony Bugg
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Huntsman Adv Mat Switzerland
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Description

1309670 Δ7 _____B7 _ ____ 五、發明說明(I ) (請先閱讀背面之注意事項再填寫本頁) 本發明係有關一種黏結性嵌入物,特別是用以塡充三 度空間腔洞’更特別者在夾層式複合物的核心內之腔洞者 ,一種製造該嵌入物之方法及一種使用該嵌入物塡充三度 空間腔洞之方法。 固體黏結性嵌入物對於塡充三度空間腔洞的用途係已 知者。已知的嵌入物爲,例如,具有圓柱型且由拼合塑膠 材料所構成,例如經固化的環氧樹脂材料。”拼合 "(syntactic)要了解者係意指包括空心微球體所構成的材料 ,因而具有頗爲低的密度但具有良好的機械性能。彼等嵌 入物特別可用來強化夾層板例如蜂巢型複合物。使用彼等 圓柱型嵌入物的強化方法包括將板中要強化的部位之核心 移除一圓形截面。然後將膨脹性黏接膠帶切割成所需的尺 寸並包裹該嵌入物。在從該膠帶移除離型膜之後,即將該 嵌入物安裝到該蜂巢板的腔洞內。最後,將該核心材料、 嵌入物、黏接膠帶及’視情況選用地,附加的覆蓋核心材 料外側之表層材料等的組裝體置於適當的溫度下共_固化而 形成經強化的複合結構。 本發明的目的爲幫助固體嵌入物得應用。於此方面, 令人課異地發現若使用特殊的固體嵌入物時,可以避免使 用到爲了將該嵌入物固疋到周圍板內所用的另外的黏著工 具例如前面提及的黏接膠帶。 因此,本發明的一項主體爲一種黏結性嵌入物,特別 是用以塡充三度空間腔洞,更特別者在夾層式複合物的核 心內之腔洞者,該嵌入物在周溫下爲固體且其特徵在於其 3 1本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ~~------ 1309670 A7 _______B7__ 五、發明說明(y ) 係由固體可固化性組成物所構成,其在經熱固化時可膨脹 且能夠黏著地黏結。 對於本申請案的目的而言,”周溫”意指較佳者低於35 °C之溫度,例如1〇至30°C。,’黏結性"(coherent)意指該嵌 入物於周溫下爲固態經預成型一體(monolithic)物件,而非 粉末狀者。 本發明嵌入物較佳者係由固體可膨脹性可固化型環氧 組成物所構成。 此種固體可固化型環氧組成物特別者爲包括下列之組 成物: (A) 環氧樹脂或含環氧基的化合物與 (B) 固體化性胺系統,其可與(A)反應而得一產物,較 佳者具有在55至120°C之間的Kofler Heaat Bank熔點, 其含量不足以在爲(A)與(B)所選的反應條件下容許或促成 化學膠凝且莫在其所含的所有環氧基加成性氫基被環氧基 所消耗掉之前或之時基本上會停止固化, (C) —用於(A)及(A)與(B)的反應產物之硬化劑,其不 同於(B)且其在爲(A)與(B)所選的反應條件下基本上係保持 f 實質地不反應, I (D)—膨脹劑,其在爲(A)與(B)所選的反應條件下具有 I 低反應性或較佳者不具反應性,及,視需要地 ^ (E)習用添加劑, 該組成物係經由(A)與(B)在(C)實質地不會與(A)及(A) 和(B)的反應產物發生反應之條件下反應而固體化。 4 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) F裝---- 1309670 A7 __ B7_ _ 五、發明說明(4 ) 彼等組成物爲’例如’在WO-A-97/19124中所更詳钿 地說明者。 在該組成物因(A)與(B)的反應而固體化之前,係將$ 分(A)、(B)、(C)、(D)和(E)以任何方便的批式或連續式操 作予以摻合在一起,但其方式要爲至少使(A)與(B)變得均 勻。(A)與(B)的反應可以在任何適當的溫度和條件下進行 ,但其限制條件爲其本身,及其所產生的放熱反應性熱, 都不可以在其進行時引起(C)或(D)實質地發生反應。 環氧樹脂或含有環氧基的化合物(A)可爲環氧丙基醚、 環氧丙基胺、環氧丙基酯、或環脂族化合物或彼等的組合 ,於需要時包括_素化形式。較佳的環氧樹脂和摻合物爲 在通常爲低於12〇°C的適當溫度下爲適當的液體以與其他 成分順利地混合者。在室溫下爲液體的環氧樹脂或含有環 氧基的化合物或彼等的摻合物係最方便者。 將液體请脂轉化所用的較佳固體化系統(B)主要爲其相 對於所採用的環氧物質最具反應性的基爲第一胺或第二胺 之化合物或諸化合物的混合物。在爲(A)與(B)所選的反應 條件下具有環氧基反應性的第三胺係不爲本發明所接受者 〇 對於成分(B)特別有用者爲芳族和環脂族第一和第二胺 類及彼等的摻合物。彼等胺類,特別者芳族胺類,的主要 優點爲低反應速率加上彼等與樹脂的反應產物在正常周溫 下的極爲長使用壽命。使用來自彼等胺類的大部份化合物 時,彼等與樹脂的反應產物所具壽命都大幅地超過樹脂與 5 rm先閱讀背面之>i意事項再填寫本頁) I n >1 n t— n_ 一 -OJI n . 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐) 1309670 A7 ___B7__ 五、發明說明(k ) 彼等的主硬化劑(c)之反應產物所具壽命。某些脂環族、雜 環族和脂族胺類也可以有效地作爲升級劑(advancing agents)且於彼等的胺基氫原子被環氧樹脂所消耗掉時會 停止反應者也視爲本發明的一部份。於所有情況中,必要 者爲於固體化反應中產生的第三胺在爲(A)與(B)所選反應 條件下及其後的貯存中都對環氧基具有非常低的反應性。 該等固體化性胺類通常且大部份的針對環氧化合物(A)呈二 官能性及/或多官能性者,不過單官能胺類若對某種特別 組成物有用時也可以使用到某些程度。 二官能性胺類可以用任何合意比例與二官能性環氧樹 脂使用,但其大於二官能胺的比例只能達到不會發生膠凝 反應之水平。該固體化系統可以含有各種其他的基不過彼 等基在(A)和(B)的反應下對涉及的環氧基只可具有非常低 或不具有反應性。最有用的固體化系統可在室溫下於約2 -14天期ή逐漸反應到實質地完全者。該固體化系統的含 量必須爲使得在彼等所具胺基氫原子於對(Α)和(Β)的反應 所設定的條件下全部實質地與環氧物質(Α)反應之時’其產 物也不會化學膠凝且具有較佳地高於55°C且低於l2〇°C之 熔點。 對於環氧化合物(A)和在(A)與(B)之間的反應產物所用 的硬化劑系統(C),除了會優先地與升級劑(B)反應的酸酐 之外,可以從廣多種在環氧化學領域中熟知者之中選出。 可用硬化劑的典型但非完全的例子爲芳族胺類例如二胺基 二苯基楓’三氟化硼一胺複合物,潛伏咪唑(Latent 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注音?事項再填寫本頁) %裝 訂---------' 1309670 五、發明說明(<) imidazoles),羧酸,雙胍類,醯胼類,二氰胺,潛伏環氧 胺加成物,及經取代脲類。如已解釋過者’硬化劑的一項 主要要求爲在(A)與(B)正在反應時其不應該會實質地發生 反應。可以將一種或數種硬化劑一起使用’其中某些可能 加速其他者的固化反應,但其限制條件爲彼等要遵從上文 才提及的要求。 膨脹劑(D)可爲任何者,只要其不會不利地干擾到固體 環氧組成物的產生或其令人滿意的固化能力即可。所得膨 脹作用可能導自化學反應或物理反應或兩者。一項重要的 特徵爲該發泡劑於該固體環氧組成物的製造中’或在其以 任何形式在正常工作場所溫度或更低溫度下貯存之中’都 不應引起實質的發泡反應。所有明顯的膨脹都應該在實際 的固化循環過程中實現。適當膨脹劑的例子包括偶氮二碳 醯胺,偶氮二異丁腈,苯磺醯胺,二亞硝基五亞甲基四胺 ,氧雙苯磺1醯胼,對一甲苯磺醯基醯肼及可膨脹性塑膠例 如在Expancel商品名下銷售者。彼等大部份爲具有變異組 成的球形殼,例如聚偏二氯乙烯及/或聚丙烯腈加上其他 經共聚合添加劑,且其內部裝著有或無空氣的異戊烷。 其他可用來修改經固化或未經固化的組成物所具物理 性質之其他添加劑包括但不限於對硬化劑(C)所用的加速劑 ,搖變劑,靱化劑,濕潤劑,界面活性劑,纖維材料,染 料,色素’阻燃劑,烟霧壓制劑,偶合劑,助流劑,易溶 玻璃和安定劑。 還有另一類重要添加劑爲可用於廣多種本發明目的之 7 本紙張尺度適用中國國豕標準(CNS)A4規格X 297公爱) (請先閱讀背面之注意事項再填寫本頁)1309670 Δ7 _____B7 _ ____ V. Description of Invention (I) (Please read the note on the back and then fill out this page) The present invention relates to a cemented insert, especially for filling a three-dimensional cavity 'more special' A cavity in the core of a sandwich composite, a method of making the insert, and a method of using the insert to fill a three-dimensional cavity. Solid-adhesive inserts are known for the use of three-dimensional space cavities. Known inserts are, for example, cylindrical and composed of a split plastic material, such as a cured epoxy material. "Syntactic" is understood to mean a material consisting of hollow microspheres, and thus has a relatively low density but good mechanical properties. These inserts are particularly useful for reinforcing sandwich panels such as honeycomb composites. The reinforcement method using these cylindrical inserts involves removing the core of the portion of the panel to be strengthened by a circular section. The intumescent adhesive tape is then cut to the desired size and the insert is wrapped. After the tape removes the release film, the insert is installed into the cavity of the honeycomb plate. Finally, the core material, the insert, the adhesive tape, and the 'optionally, the outer cover of the core material are additionally attached. The assembly of the surface material or the like is co-cured at a suitable temperature to form a strengthened composite structure. The object of the present invention is to assist the application of the solid insert. In this respect, it has been found that if a special solid embedding is used. In the case of the article, it is possible to avoid the use of additional adhesive means for adhering the insert to the surrounding panel, such as the aforementioned adhesive tape. One subject of the invention is a cementitious insert, in particular for filling a three-dimensional cavity, more particularly a cavity in the core of a sandwich composite, the insert being solid at ambient temperature And its characteristic is that its paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) ~~------ 1309670 A7 _______B7__ V. Invention description (y) is solid curable a composition comprising a swellable and adhesively bondable upon heat curing. For the purposes of the present application, "circumferential temperature" means preferably a temperature of less than 35 ° C, for example 1 Torr to 30 ° C., 'coherent' means that the insert is a solid monolithic article at ambient temperature, rather than a powder. The insert of the present invention is preferably solid. It is composed of an expandable curable epoxy composition. The solid curable epoxy composition is particularly composed of the following composition: (A) epoxy resin or epoxy group-containing compound and (B) solidification Amine system which reacts with (A) to give a product, preferably at 55 The melting point of Kofler Heaat Bank between 120 ° C and its content is not sufficient to allow or contribute to chemical gelation under the reaction conditions selected for (A) and (B) and to remove all epoxy groups contained therein. The hydrogen group is substantially stopped before or after being consumed by the epoxy group, (C) - a hardener for the reaction product of (A) and (A) and (B), which is different from (B) And it substantially maintains f substantially unreacted under the reaction conditions selected for (A) and (B), I (D) - expansion agent, which is selected for the reaction conditions of (A) and (B) I have low reactivity or preferably no reactivity, and, if necessary, (E) conventional additives, the composition is substantially not (A) via (A) and (B) The reaction is carried out under the conditions in which the reaction products of (A) and (B) are reacted to be solidified. 4 The paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (please read the note on the back and fill out this page) F---- 1309670 A7 __ B7_ _ V. Invention description (4 Their compositions are described, for example, in more detail in WO-A-97/19124. Before the composition is solidified by the reaction of (A) and (B), the points (A), (B), (C), (D) and (E) are in any convenient batch or continuous The operations are blended together in such a manner as to at least make (A) and (B) uniform. The reaction of (A) with (B) can be carried out at any suitable temperature and condition, but the limitation itself and the exothermic heat of reaction generated by it cannot be caused (C) or (D) Substantially reacts. The epoxy resin or the epoxy group-containing compound (A) may be a glycidyl ether, a glycidylamine, a glycidyl ester, or a cycloaliphatic compound or a combination thereof, and includes a _ Form. Preferred epoxy resins and blends are those which are suitably liquid at a suitable temperature, typically below 12 ° C, to be smoothly mixed with the other ingredients. Epoxy resins or epoxy-containing compounds or blends thereof which are liquid at room temperature are most convenient. The preferred solidification system (B) used for the conversion of the liquid to the lipid is primarily a compound or a mixture of compounds having the first or second amine which is most reactive with respect to the epoxy species employed. The third amine group having epoxy group reactivity under the reaction conditions selected for (A) and (B) is not accepted by the present invention. For the component (B), it is particularly useful as aromatic and cycloaliphatic a blend of the first and second amines and theirs. The main advantages of these amines, especially aromatic amines, are the low reaction rates plus the extremely long service life of their reaction products with the resin at normal ambient temperatures. When using most of the compounds from their amines, their reaction products with the resin have a lifetime that exceeds that of the resin and 5 rm. Read the back of the back. I want to fill in this page. I n >1 Nt-n_一-OJI n . This paper size applies to China National Standard (CNS) A4 specification (210 297 297 mm) 1309670 A7 ___B7__ V. Invention description (k) The reaction product of their main hardener (c) With a long life. Certain alicyclic, heterocyclic, and aliphatic amines can also be effectively used as advancing agents and will stop treating when their amine-based hydrogen atoms are consumed by the epoxy resin. Part of the invention. In all cases, it is necessary that the third amine produced in the solidification reaction has very low reactivity to the epoxy group under the selected reaction conditions for (A) and (B) and subsequent storage. These solidified amines are generally and mostly bifunctional and/or polyfunctional for the epoxy compound (A), but monofunctional amines can also be used if they are useful for a particular composition. To some extent. The difunctional amines can be used in any desired ratio with the difunctional epoxy resin, but the ratio of the difunctional amines is greater than the level at which the gelation reaction does not occur. The solidification system may contain various other groups which, under the reaction of (A) and (B), may only have very low or no reactivity with respect to the epoxy groups involved. The most useful solidification system can gradually react to substantially complete conditions at room temperature for about 2-14 days. The content of the solidification system must be such that when all of the amine-based hydrogen atoms are reacted with the epoxy substance (Α) under the conditions set for the reaction of (Α) and (Β), the product It also does not chemically gel and has a melting point preferably above 55 ° C and below 12 ° C. The hardener system (C) used for the epoxy compound (A) and the reaction product between (A) and (B), in addition to the acid anhydride which preferentially reacts with the upgrading agent (B), can be widely used. Selected among those well known in the field of epoxy chemistry. Typical but non-exhaustive examples of useful hardeners are aromatic amines such as diaminodiphenyl maple' boron trifluoride monoamine complex, latent imidazole (Latent 6 paper scale applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the phonetic on the back? Please fill out this page again) %Binding ---------' 1309670 V. Inventions (<) imidazoles), Carboxylic Acids, Biguanides , hydrazines, dicyandiamide, latent epoxy amine adducts, and substituted ureas. As already explained, one of the main requirements for hardeners is that they should not react substantially when (A) and (B) are reacting. One or several hardeners may be used together. Some of them may accelerate the curing reaction of others, provided that they are subject to the requirements mentioned above. The expansion agent (D) may be any as long as it does not adversely interfere with the production of the solid epoxy composition or its satisfactory curing ability. The resulting swelling effect may be derived from a chemical reaction or a physical reaction or both. An important feature is that the blowing agent should not cause substantial foaming reaction in the manufacture of the solid epoxy composition or in its storage in any form at normal workplace temperatures or lower. . All significant expansion should be achieved during the actual curing cycle. Examples of suitable bulking agents include azodicarbonamide, azobisisobutyronitrile, benzenesulfonamide, dinitrosopentamethylenetetramine, oxybisbenzenesulfonate, p-toluenesulfonyl Tantalum and expandable plastics are for example sold under the trade name Expancel. Most of them are spherical shells with a variable composition, such as polyvinylidene chloride and/or polyacrylonitrile plus other copolymerized additives, and are internally filled with or without isopentane. Other additives which may be used to modify the physical properties of the cured or uncured composition include, but are not limited to, accelerators, shakers, oximes, humectants, surfactants, used for the hardener (C), Fiber materials, dyes, pigments 'flame retardants, aerosol presses, coupling agents, glidants, soluble glass and stabilizers. There is another important class of additives that can be used for a wide variety of purposes. The paper size is applicable to China National Standard (CNS) A4 specification X 297 public interest) (please read the notes on the back and fill out this page)

1309670 A7 ________B7 五、發明說明(L ) 塡料,其可單獨地使用或以兩種或兩種以上不同塡料的混 合物之形式使用。 雖則一般而言,任何塡料材料都可用於本發明中,不 過適當的塡料特別包括空心微球體,例如用玻璃,碳,矽 酸鹽或各種塑膠材料所製成者。彼等微球體的一項共同特 徵爲彼等的低密度,其對於糊也賦予低密度且爲彼等用途 之首要理由。另一項考慮爲彼等給予經固化組成物砂磨或 平滑化的相對容易性。 另一類要在此處特別提及的塡料爲導電性塡料。彼等 塡料的存在可促成在製造本發明黏結性嵌入物之時或在使 用即可使用的嵌入物依下文所述塡充一腔洞之時,藉助於 例如感應線圏以感應方式加熱該可固化型組成物^ 上文提及的環氧組成物可視需要透過(A)和(B)的謹慎 選擇而製備成具有低或高的熔融黏度(melt viscosity)者 。依據(C)以選擇,彼等可在100至15(TC,例如在約120 °C下於30分鐘至數小時內,或在180°C至260°C下於數? 內,固化。再者,經由謹慎地選擇(A),(B)和(C)可以得到 廣範圍的合意機械性質和熱性質,且經由導入添加劑(E)也 可以達到物理性質和機械性質之順利修改。 本發明嵌入物較佳者爲在周溫下具有貯存穩定性者’ 更特別者在周溫下可以穩定地貯存三個月及更久,尤其是 比6個月更久者。 本發明嵌入物可以,例如,藉助於下述程序予以製造 :其中係將於周溫下爲固體的膨脹性可固化型組成物’例 (請先閱讀背面之注意事項再填寫本頁)1309670 A7 ________B7 V. Description of the Invention (L) Dilution, which may be used singly or in the form of a mixture of two or more different tanning materials. Although generally, any dip material can be used in the present invention, and suitable dip materials include, in particular, hollow microspheres, such as those made of glass, carbon, niobate or various plastic materials. A common feature of their microspheres is their low density, which also gives low density to the paste and is the primary reason for their use. Another consideration is that they give the relative ease of sanding or smoothing the cured composition. Another type of dip that is specifically mentioned here is a conductive crucible. The presence of such materials may facilitate the inductive heating of the adhesive insert of the present invention or when using a ready-to-use insert to fill a cavity as described below, for example by means of a sensing wire Curable Compositions ^ The epoxy compositions mentioned above may be prepared to have a low or high melt viscosity by careful selection of (A) and (B). According to (C), they can be cured at 100 to 15 (TC, for example, at about 120 ° C for 30 minutes to several hours, or at 180 ° C to 260 ° C for several times. A wide range of desirable mechanical and thermal properties can be obtained by careful selection of (A), (B) and (C), and smooth modification of physical and mechanical properties can also be achieved by introducing the additive (E). Preferably, the insert has a storage stability at ambient temperature. More particularly, it can be stably stored at a peripheral temperature for three months and longer, especially longer than six months. The insert of the present invention can, For example, it is manufactured by the following procedure: an example of an intumescent curable composition which is solid at ambient temperature (please read the back note first and then fill out this page)

本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 1309670 A7 B7 五、發明說明(q ) 如,相應的環氧組成物,在其不會實質地膨脹也不會膠凝 或固化的條件下形成一合意的形狀。該方法爲本發明的另 一目的。 於此目的而言,可以將固體可膨脹可固化性組成物予 以,例如,在充分溫和的條件下熔化使其不會實質地膨脹 也不會膠凝或甚至固化,然後澆鐃成合意的物理形式,例 如使用模子。 於上文所述方法的另一特殊具體實例中,係將一液態 可固體化的組成物固體化形成在周溫下爲固體的可膨脹可 固化組成物。 假若使用例如在WO-A-97/19124中所述者及上文提及 的組成物來製造本發明嵌入物時,可以經由使其靜置於周 溫下一段數小時至數天(例如5小時至14天)之時間而進 行液態起始組成物的固體化。若需要加快固體化時,可以 經由加熱達^,但其限制條件爲所用的溫度不可以促使(C) 與(A)或與(A)和(B)的反應產物發生反應,其方式可爲直接 加熱或用(A)與(B)完成反應所發出的熱,或經由添加加速 劑例如不會不利地影響軟化點穩定性的羧酸。 液態組成物的固體化當然也可以與裝入物的成型同日寺 進行。 本發明另有一部份爲一種塡充在一第一材料,例如蜂 巢式材料,內的三度空間腔洞之方法,其中係將本發明嵌 入物放置於該腔洞內宜予以加熱,較佳者在壓力下,由是 使該嵌入物中所含可固化組成物熔化,膨脹與固化,由是 (請先閱讀背面之注意事項再填寫本頁)This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 1309670 A7 B7 V. Invention Description (q) If the corresponding epoxy composition does not substantially expand or gel Or a desired shape is formed under curing conditions. This method is another object of the invention. For this purpose, the solid expandable curable composition can be applied, for example, to melt under sufficiently mild conditions so as not to substantially swell or gel or even solidify, and then poured into a desirable physics Form, for example using a mold. In another particular embodiment of the method described above, a liquid, solidizable composition is solidified to form an expandable curable composition that is solid at ambient temperature. If the insert of the invention is produced using, for example, the compositions described in WO-A-97/19124 and the above-mentioned compositions, it can be allowed to stand at ambient temperature for a period of hours to days (for example 5 The solidification of the liquid starting composition was carried out for a period of from hour to 14 days. If it is necessary to accelerate the solidification, it can be heated to reach the temperature, but the limitation is that the temperature used does not promote the reaction of (C) with (A) or with the reaction products of (A) and (B). The heat generated by the completion of the reaction by direct heating or (A) and (B), or the addition of an accelerator, for example, a carboxylic acid which does not adversely affect the stability of the softening point. The solidification of the liquid composition can of course also be carried out in the same day as the formation of the charge. Another aspect of the invention is a method for filling a three-dimensional space cavity in a first material, such as a honeycomb material, wherein the insert of the present invention is placed in the cavity to be heated, preferably. Under pressure, the curable composition contained in the insert is melted, expanded and solidified. (Please read the back note first and then fill out this page)

H 1« n n n ·*-0、 n ϋ n I n I 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 1309670 Α7 Β7 五、發明說明($ 實質地完全塡充在該第一材料內的腔洞。 '门^該方法的—特Ϊ具體實例中,係在加熱之前於該腔 洞的至少-側用適當的覆蓋材料予以覆蓋,再利用加埶將 該覆蓋材料黏著地黏結到該第一材料。 本翻嵌入物十分地適合提供對荷重承載元件贿子 或螺絲等在通常不能獲得此等支撐的材料,例如蜂巢式材 料之內的支撐。所以,上述塡充一材料中的腔洞之方法的 —特殊具體實例包括將一荷重承載性元件固定到該嵌入物 之程序步驟。 如上文提及者’可以經由,例如,感應方式進行加熱 。當然’顯然地該嵌入物必須包括充分的電感應性材料以 期能夠感應地加熱。此種電感應性材料可爲粒狀材料例如 導電性塡料或導電性緊密性物體等經摻加到嵌入物’例如 金屬釘子或螺絲者。H 1« nnn ·*-0, n ϋ n I n I Wood paper scale applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 1309670 Α7 Β7 V. Invention description ($ Substantially fully charged in this a cavity in the first material. In the specific example, the method is covered with a suitable covering material on at least the side of the cavity before heating, and then the covering material is adhered by twisting. Bonding to the first material. The tumbling insert is well suited to provide support for a load bearing element such as a bribe or a screw, such as a honeycomb material, which is generally not capable of obtaining such support. A particular embodiment of the method of cavities in a material comprises the procedural step of securing a load bearing element to the insert. As mentioned above, the heating can be performed via, for example, induction. Of course, the embedding is apparently The material must include sufficient electrically inductive material to be inductively heated. Such an electrically inductive material can be incorporated into the insert as a particulate material such as a conductive crucible or a conductive compact object. ' For example, metal nails or screws.

J 實施例1:本發明自黏著性可膨脹嵌入物之製造 Araldite GY 260 (得自 Ciba SC 的双酚 Α 環氧樹脂)l〇〇pbw 二氰胺 齊 $ 讨 t 4.3 pbw 2.2 pbw 10.6 pbw 6.0 pbw 50 pbw 1.5 pbw (請先閱讀背面之注意事項再填寫本頁) .線.J Example 1: Preparation of self-adhesive expandable insert of the present invention Araldite GY 260 (bisphenolphthalein epoxy resin from Ciba SC) l〇〇pbw dicyanamide $4.3 pbw 2.2 pbw 10.6 pbw 6.0 Pbw 50 pbw 1.5 pbw (please read the notes on the back and fill out this page). Line.

Chlorotoluron 3,3’一二甲基4,4’_二胺基二環己基甲烷 環己胺Chlorotoluron 3,3'-monomethyl 4,4'-diaminodicyclohexylmethane cyclohexylamine

Eccospheres IG 10 (空心微球體)Eccospheres IG 10 (hollow microspheres)

Expancel 551 Du (未膨脹的熱塑膠微球體) 乍 本紙張尺度適用中國國家標準(CyS)A4規格(210 x 297公釐) 1309670 A7 B7 五、發明說明(1 ) 將上述配方的全部成分使用機械混合機在真空下一起 充分地混合5分鐘。將混合物轉移到尺寸爲25.4毫米高且 直徑12.7毫米之圓柱形模子內。使該混合物靜置於室溫下 約17小時接著在60°C下加熱2小時。然後將樣品冷却到 23°C,該樣品成爲固體。 實施例2 : 將根據實施例1製成的固體圓柱形塊保持在模子內但 將上表面打開。將樣品與模子放置在12〇°C烘箱內60分鐘 。然後取出模子與樣品使其冷却回到室溫。在樣品從烘箱 取出時可以看到樣品的體積增加。固化之前的樣品密度爲 0.66克/立方公分而固化之後樣品的密度爲0.52克/立方 公分。樣品的壓縮性質係根據檢驗規範ASTM D695測量。 得到下列諸項結果: i 23°C壓縮強度 37.5 MPa 23°C壓縮模數 1182 MPa 177°C壓縮強度 7.7 MPa 177°C壓縮模數 127 MPa 實施例3 : 對於表1與表2中的組成物3/1至3/9以類似於實施 例1的方式處理。該等表中也列出詳細的加工條件,以及 根據實施例2加工後諸樣品所得性質。 11 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) · n n I ί I 一-OJ· n m n i I n I . 瘦齊郎智慧材轰笱員31^費乂 0咋: 1309670Expancel 551 Du (unexpanded thermoplastic microspheres) 乍This paper scale applies to Chinese National Standard (CyS) A4 specification (210 x 297 mm) 1309670 A7 B7 V. Description of invention (1) Use all the ingredients of the above formula using machinery The mixer was thoroughly mixed together under vacuum for 5 minutes. The mixture was transferred to a cylindrical mold having a size of 25.4 mm and a diameter of 12.7 mm. The mixture was allowed to stand at room temperature for about 17 hours and then heated at 60 ° C for 2 hours. The sample was then cooled to 23 ° C and the sample became a solid. Example 2: A solid cylindrical block made according to Example 1 was held in a mold but the upper surface was opened. The sample and mold were placed in a 12 ° C oven for 60 minutes. The mold and sample were then removed and allowed to cool back to room temperature. The volume of the sample can be seen as the sample is removed from the oven. The sample density before curing was 0.66 g/cm 3 and the density of the sample after curing was 0.52 g/cm 3 . The compressive properties of the samples were measured according to inspection specification ASTM D695. The following results were obtained: i 23 ° C compressive strength 37.5 MPa 23 ° C compression modulus 1182 MPa 177 ° C compressive strength 7.7 MPa 177 ° C compression modulus 127 MPa Example 3 : For the composition in Table 1 and Table 2 The materials 3/1 to 3/9 were treated in a manner similar to that of Example 1. Detailed processing conditions are also listed in the tables, as well as the properties obtained from the samples after processing according to Example 2. 11 This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page) · nn I ί I I-OJ· nmni I n I . Wisdom material smasher 31^费乂0咋: 1309670

7 7 A B 五、發明說明(U)表1 成分 3/1 3/2 3/3 3/4 3/5 Araldite GY260 100 100 100 100 100 二氰胺 4.3 4.3 4.3 4.3 Chlorotoluron 2.2 2.2 2.2 2.2 HY2954 10.6 10.6 10.6 10.6 10 環己胺 6.0 6.0 6.0 6.0 Eccospheres IG 101 50.0 50.0 50 50 20 Expancel 551 DU 1.5 1.5 - - 0,5 AffiN - - - 0.2 Metalinks - - 二胺基二苯基 18 Phoschek P30 25 Paraloid EXL 2600 10.0 升級時間表 在23t下16 小時+在60 °(:下2小時 在23°C下16 小時+在60 °(:下2小時 在23。。下16 小時+在60 °(:下2小時 在23°C下16 小時+在60 °0:下2小時 在23°C下16 小時+在60 它下2小時 固化時間表 在120°C下 1小時 在120°C下 1小時 在120°C下 1小時 在120°C下 1小時 在177°C下 3小時 密度克/立方公分(升 級後) J 0.66 0.69 0.68 0.62 密度克/立方公分(固 化後) 0.52 0.59 0.61 0.46 0.90 壓縮強度(MPa) 23 °C 37.49 50.93 64.16 27.3 80.5 壓縮模數(MPa) 23 °C 1182 1448 1939 1315 2024.7 壓縮強度(MPa) 177〇C 7.7 11.1 壓縮模數(MPa) 177〇C 127 99.2 鋁蓋片剪切強度 (MPa) 12.9 15.0 13 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) (請先閱讀背面之注意事項再填寫本頁) 1309670 A7 B7 五、發明說明Qx) 表2 成分 3/6 3/7 3/8 3/9 Araldite GY260 100 100 100 100 二氰胺 - - 4.3 - Chlorotoluron - - 2.2 - HY2954 10 - 10.6 10.6 環己胺 - 10 6.0 6.0 Eccospheres IG 101 20 20 - 10 Expancel 551 DU 0.5 0.5 1.5 1.5 AIBN - - - - Metalinks - - - 48.0 二胺基二苯基 18 34.5 - - Phoschek P30 25 25 - - BFr—乙胺 0.6 1.0 - - 升級時間表 在23 °C下16 小時+在60°C 下2小時 在23°C下16 小時+在60°C 下2小時 在23 °C下16 小時+在60°C 下2小時 在23 °C下16 小時+在60°C 下2小時 固化時間表 在177°C下3 小時 在177°C下3 小時 在120°C下1 小時 在120°C下1 小時 密度克/立方公分(升級後) 1.3 1.0 密度克/立方公分(固化後) 0.91 0.90 1.3 0.9 壓縮強度(MPa) 23°C 64.0 68.1 117.5 49.1 壓縮模數(MPa) 23。。 1475.8 1718 2027 1823 壓縮強度(MPa) 177°C 14.3 33.9 壓縮模數(MPa) 177°C 325.9 926.6 鋁蓋片剪切強度(MPa) 39.8 4.1 (請先閱讀背面之注意事項再填寫本頁) --------訂·-------- 堡聲耶^曰逢〔-时 έ n57iu-yzr iRir乍· 14 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐)7 7 AB V. INSTRUCTIONS (U) TABLE 1 COMPOSITION 3/1 3/2 3/3 3/4 3/5 Araldite GY260 100 100 100 100 100 Dicyanamide 4.3 4.3 4.3 4.3 Chlorotoluron 2.2 2.2 2.2 2.2 HY2954 10.6 10.6 10.6 10.6 10 Cyclohexylamine 6.0 6.0 6.0 6.0 Eccospheres IG 101 50.0 50.0 50 50 20 Expancel 551 DU 1.5 1.5 - - 0,5 AffiN - - - 0.2 Metalinks - - Diaminodiphenyl 18 Phoschek P30 25 Paraloid EXL 2600 10.0 Upgrade schedule at 23t for 16 hours + at 60 ° (: 2 hours at 23 ° C for 16 hours + at 60 ° (: 2 hours at 23 °. Under 16 hours + at 60 ° (: for 2 hours at 16 hours at 23 ° C + 2 hours at 60 ° 0: 16 hours at 23 ° C + at 60 ° 2 hours under the curing schedule at 120 ° C for 1 hour at 120 ° C for 1 hour at 120 ° C 1 hour at 120 ° C for 1 hour at 177 ° C for 3 hours density gram / cubic centimeter (after upgrade) J 0.66 0.69 0.68 0.62 density gram / cubic centimeter (after curing) 0.52 0.59 0.61 0.46 0.90 compressive strength (MPa) 23 °C 37.49 50.93 64.16 27.3 80.5 Compression modulus (MPa) 23 °C 1182 1448 1939 1315 2024.7 Strong compression Degree (MPa) 177〇C 7.7 11.1 Compression Modulus (MPa) 177〇C 127 99.2 Aluminum Cover Sheet Shear Strength (MPa) 12.9 15.0 13 This paper scale applies to China National Standard (CNS) A4 specification (210 x 297 mm) (Please read the notes on the back and fill out this page) 1309670 A7 B7 V. INSTRUCTIONS Qx) Table 2 Composition 3/6 3/7 3/8 3/9 Araldite GY260 100 100 100 100 Dicyanamide - - 4.3 - Chlorotoluron - - 2.2 - HY2954 10 - 10.6 10.6 Cyclohexylamine - 10 6.0 6.0 Eccospheres IG 101 20 20 - 10 Expancel 551 DU 0.5 0.5 1.5 1.5 AIBN - - - - Metalinks - - - 48.0 Diaminodiphenyl 18 34.5 - - Phoschek P30 25 25 - - BFr-ethylamine 0.6 1.0 - - Upgrade schedule at 23 °C for 16 hours + at 60 °C for 2 hours at 23 °C for 16 hours + at 60 °C for 2 hours at 16 hours at 23 °C + 2 hours at 60 °C at 16 °C for 16 hours + at 60 °C for 2 hours Curing schedule at 177 °C for 3 hours at 177 °C for 3 hours at 120 °C 1 hour at 120 ° C 1 hour density / cubic centimeter (after upgrade) 1.3 1.0 density / cubic centimeter (after curing) 0.91 0.90 1.3 0.9 pressure Strength (MPa) 23 ° C 64.0 68.1 117.5 49.1 Compression modulus (MPa) 23. . 1475.8 1718 2027 1823 Compressive strength (MPa) 177°C 14.3 33.9 Compressive modulus (MPa) 177°C 325.9 926.6 Aluminum cover sheet shear strength (MPa) 39.8 4.1 (Please read the back note before completing this page) - -------定·-------- 堡声耶^曰逢[-时έ n57iu-yzr iRir乍· 14 This paper scale applies to China National Standard (CNS) A4 specification (210 χ 297 MM)

Claims (1)

六、申請專利範圍 1·一種塡充第一種材料內三度空間腔洞之方法’其中 係將一種周溫下爲固體且由包含下列成分之經熱固化時可 膨脹並能夠黏著地結合之固體可固化組成物所構成的黏結 性嵌入物置於該腔洞內並予以加熱: (A) 環氧樹脂或含環氧基的化合物與 (B) 固體化性胺系統,其與(A)反應而得一產物,其存 在量不足以在爲(A)與(B)所選的反應條件下容許或引起化 學膠凝’且其在所含的所有活性環氧基加成性氫基被環氧 基消耗掉之前或之時基本上會停止固化, (C) 一種用於(A)及(A)與(B)的反應產物之硬化劑,其 不同於(B)且其在爲(A)與(B)所選的反應條件下係實質地保 持不反應, (D) —種膨脹劑’其在爲(A)與(B)所選的反應條件下具 有低反應性,及,視需要地 (E) 習用添加劑, 該組成物已經由(A)與(B)在(C)實質上不會與(A)及(A)和(B) 的反應產物發生反應之條件下反應被固體化; 由是使該嵌入物內所含之可固化組成物熔化、膨脹及 固化,藉此完全地塡充該第一種材料內的腔洞。 2.如申請專利範圍第1項之方法,其中在加熱之前, 係於該腔洞的至少一側上用一種覆蓋材料予以覆蓋,並利 用加熱使該覆蓋材料黏著地結合到該第一材料。 3·如申請專利範圍第1或2項之方法,其中該黏結性 嵌入物係在壓力下被加熱。 1 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項寫本頁) 裝 訂 1309670 1 C8 D8 六、申請專利範圍 4·如申請專利範圍第1或2項之方法,其中該加熱係 以感應方式進行。 5.如申請專利範圍第1或2項之方法,其中係於該加 熱之前或之後將一種荷重承載性元件固定到該嵌入物上。 6·如申請專利範圍第1或2項之方法,其中該第一材 料爲一種蜂巢式材料。 7·如申請專利範圍第1或2項之方法,其中該嵌入物 係由固體可膨脹性可固化環氧組成物所構成。 8·如申請專利範圍第7項之方法,其中該可固化環氧 組成物在周溫下具有貯存穩定性。 9. 如申請專利範圍第1項之方法,其中該由固體化性 胺系統(Β)與(Α)反應得到的產物具有在55至120°C之間的 Kofler Heat Bank 熔點。 10. 如申請專利範圍第1項之方法,其中該膨脹劑(D) 在爲(A)與(B)所選的反應條件下不具反應性。 Π.如申請專利範圍第1項之方法,其中該習用添加劑 (E)包含塡料。 12.如申請專利範圍第11項之方法,其中該塡料包含 空心微球體。 I3·如申請專利範圍第11或12項之方法,其中該塡料 包含導電性材料。 I4·根據申請專利範圍第1或2項之方法,其中該嵌入 物已經在其不會實質地膨脹或膠凝或固化之條件下形成一 種合意的形狀。 . 2 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公變) (請先閱讀背面之注意事項、寫本頁) :裝_ 訂 1309670 ABC3 六、申請專利範圍 15. 如申請專利範圍第14項之方法,其中該嵌入物已 經由一種液態可固體化組成物形成,而該液態可固體化組 成物已經被固體化而形成一種在周溫下爲固體的可膨脹性 可固化組成物。 16. 如申請專利範圍第15項之方法’其中該液態組成 物的固體化作用係在該嵌入物成型的同時進行° (請先閲讀背面之注意事項寫本頁) 裝 訂 中國國家標準(CNS)A4規格(210 X 297公釐)6. Patent application scope 1. A method for filling a three-dimensional space cavity in a first material A cohesive insert of solid curable composition is placed in the cavity and heated: (A) epoxy or epoxy-containing compound and (B) solidified amine system, which reacts with (A) A product is obtained which is not present in an amount sufficient to permit or cause chemical gelation under the reaction conditions selected for (A) and (B) and which is included in all of the active epoxy-addition hydrogen groups contained therein. The curing is substantially stopped before or at the time of consumption of the oxy group, (C) a hardening agent for the reaction product of (A) and (A) and (B), which is different from (B) and which is (A) And substantially no reaction with (B) the selected reaction conditions, (D) a type of expansion agent' which has low reactivity under the reaction conditions selected for (A) and (B), and Requires (E) a conventional additive, which has been produced by (A) and (B) in (C) substantially not with the reaction products of (A) and (A) and (B) The reaction conditions should be solidified; is the inner of the insert may be contained in the curable composition is melted, expanded and cured, thereby completely filling a cavity, Chen within the first material. 2. The method of claim 1, wherein the covering material is covered with a covering material on at least one side of the cavity prior to heating, and the covering material is adhesively bonded to the first material by heating. 3. The method of claim 1 or 2, wherein the adhesive insert is heated under pressure. 1 This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back to write this page) Binding 1309670 1 C8 D8 VI. Patent application scope 4. If the patent application scope is 1 Or the method of item 2, wherein the heating is performed inductively. 5. The method of claim 1 or 2, wherein a load bearing member is attached to the insert before or after the heating. 6. The method of claim 1 or 2, wherein the first material is a honeycomb material. The method of claim 1 or 2, wherein the insert is composed of a solid expandable curable epoxy composition. 8. The method of claim 7, wherein the curable epoxy composition has storage stability at ambient temperature. 9. The method of claim 1, wherein the product obtained by the reaction of the solidified amine system (Β) with (Α) has a Kofler Heat Bank melting point between 55 and 120 °C. 10. The method of claim 1, wherein the expansion agent (D) is non-reactive under the reaction conditions selected for (A) and (B). The method of claim 1, wherein the conventional additive (E) comprises a dip. 12. The method of claim 11, wherein the dip consists of hollow microspheres. The method of claim 11 or 12, wherein the material comprises a conductive material. The method according to claim 1 or 2, wherein the insert has formed a desired shape under conditions in which it does not substantially swell or gel or solidify. 2 This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 metric) (please read the notes on the back, write this page): _ _ 1309670 ABC3 VI. Patent application scope 15. If you apply for a patent The method of claim 14, wherein the insert has been formed from a liquid solidizable composition that has been solidified to form a swellable curable composition that is solid at ambient temperature Things. 16. The method of claim 15 wherein the solidification of the liquid composition is carried out while the insert is being formed. (Please read the note on the back to write this page.) Binding the Chinese National Standard (CNS) A4 size (210 X 297 mm)
TW90106434A 2001-03-20 2001-03-20 Process for filling a three-dimensional cavity using an insert TWI309670B (en)

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