TWI307897B - Input circuit and method for n-bit prefetch in a semiconductor memory device - Google Patents
Input circuit and method for n-bit prefetch in a semiconductor memory device Download PDFInfo
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
- E05D15/00—Suspension arrangements for wings
- E05D15/40—Suspension arrangements for wings supported on arms movable in vertical planes
- E05D15/42—Suspension arrangements for wings supported on arms movable in vertical planes with pivoted arms and horizontally-sliding guides
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
- E05C17/00—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith
- E05C17/02—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith by mechanical means
- E05C17/04—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith by mechanical means with a movable bar or equivalent member extending between frame and wing
- E05C17/12—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith by mechanical means with a movable bar or equivalent member extending between frame and wing consisting of a single rod
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
- E05D15/00—Suspension arrangements for wings
- E05D15/04—Suspension arrangements for wings with arms fixed on the wing pivoting about an axis outside of the wing
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
- E05D15/00—Suspension arrangements for wings
- E05D15/48—Suspension arrangements for wings allowing alternative movements
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- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
- E06B3/34—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with only one kind of movement
- E06B3/341—Tilt-and-turn wings
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
- E05D15/00—Suspension arrangements for wings
- E05D15/48—Suspension arrangements for wings allowing alternative movements
- E05D2015/487—Tilting or swinging movements
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
- E05Y2201/00—Constructional elements; Accessories therefor
- E05Y2201/60—Suspension or transmission members; Accessories therefor
- E05Y2201/622—Suspension or transmission members elements
- E05Y2201/684—Rails; Tracks
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
- E05Y2900/00—Application of doors, windows, wings or fittings thereof
- E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
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Description
1307897 九、發明說明: 【發明所屬之技術領域】 且更特定而言係關 本發明係關於一種半導體記憶裝置, 於一種半導體記憶裴置之資料輸入電路 【先前技術】 大體而言’半導體記憶裝置執行資料預提取操作以增加 資料存取時間。資料預提取操作係1回應於寫指令而於 内部傳送資料之方法。通常,半導體記憶裝置之資料輸入1307897 IX. Description of the invention: [Technical field to which the invention pertains] and more particularly to a semiconductor memory device, a data input circuit for a semiconductor memory device [Prior Art] Generally speaking, a semiconductor memory device Perform data pre-fetch operations to increase data access time. The data prefetching operation 1 is a method of internally transmitting data in response to a write command. Usually, data input of semiconductor memory devices
電路以同步於系、統時脈方式來執行資料預提取操作。資料 輸入電路回應於寫指令,預提取某些輸人資料,即2位元 資料、4位元資料及8位元資料。 由於要求半導體記憶裝置以更高速度工作’待預提取資 料之位元數目亦增加。雙倍資料迷率同步動態隨機存取記 憶體(DDR SDRAM)e^—f料存取之地元預提取操作 發展至4位元預提取操作’丨目前發展至8位元預提取操 作0 資料輸入電路一般包括複數個+ 後數個电路,即,數目對應於待 預提取資料之位元數目的鎖存器。 圖1為先月!j技術中半導體記情担里^ q 子脰尤II裝置之2位兀預提取資料輸 入電路的方塊圖。 該資料輸入電路包括:络彳私@ . 较衝早兀10,其用於接收來自外 部裝置之資料DQ;同步控制單元2〇,其用於產生複數個 同步控制訊號DSRP、加砰及吻廳;及同步單元3〇, 其用於使緩衝單元1G之輪出同步於該複數個同步控制訊號 112587.doc 1307897 DSRP、DSFP及DSTROB,以輸出經對準之資料DIO_OR及 DIO_OF。 緩衝單元10包括:緩衝器12,其用於接收來自外部裝置 之資料;及延遲單元14,其用於將緩衝器12之輸出延遲一 預定時間,並將延遲資料提供給同步單元30。 同步控制單元20包括:緩衝器21,其用於接收資料選通 訊號DQS及參考訊號VREF ;驅動器22,其用於接收緩衝 器21之輸出,以輸出第一及第二同步控制訊號DSRP及 | DSFP ;緩衝器24,其用於接收時脈訊號CLK及反相時脈訊 號/CLK ;驅動器25,其用於驅動該驅動器25之輸出,以輸 出内部時脈訊號ICLK ;及訊號產生器26,其用於接收内 部時脈訊號ICLK及啟用訊號EN,以產生第三同步控制訊 號DSTROB。 藉由邏輯組合内部時脈訊號ICLK與啟用訊號EN,產生 第三同步控制訊號DSTROB。在將2位元資料輸入並對準 於該資料輸入電路中之後,經對準之2位元資料以系統時 > 脈(即時脈訊號CLK)進行同步化。啟用訊號EN產生自用以 回應於一寫指令執行操作之電路,且隨後被提供給訊號產 生器26。 同步單元30包括:對準單元32,其用以回應於第一及第 二同步控制訊號DSRP及DSFP而對準缓衝單元10之輸出; 跨域單元36,其用於使對準單元32之輸出同步於第三同步 控制訊號DSTROB,以輸出經對準之資料DIO_OR及 DIO OF。 112587.doc •1307897 對準單元32包括··第—#左„ 弗鎖存益33,其用以回應於第—同 步控制訊號腹P,鎖存緩衝單元1〇之輸出;第 二 34,其用以回應於第_同 益 弟—同步控制訊號DSFp,鎖存第— 子益33之輸出;及第三鎖存器&其用以回應於第 控制訊號DSFP,分別鎖存緩衝單元1Q之輸出。…The circuit performs data pre-fetching operations in synchronization with the system and clock mode. The data input circuit responds to the write command and pre-fetches certain input data, that is, 2-bit data, 4-bit data, and 8-bit data. Since the semiconductor memory device is required to operate at a higher speed, the number of bits of the data to be pre-fetched also increases. Double data rate synchronous dynamic random access memory (DDR SDRAM) e^-f material access pre-extraction operation to 4-bit pre-fetch operation '丨currently developed to 8-bit pre-fetch operation 0 data input The circuit typically includes a plurality of + last few circuits, i.e., a number of latches corresponding to the number of bits of data to be prefetched. Figure 1 is a block diagram of the 2-digit pre-fetch data input circuit of the semiconductor sensation in the technology of the first month! The data input circuit comprises: a network private@@ 。 , , 10, which is used for receiving data DQ from an external device; a synchronization control unit 2 〇, which is used to generate a plurality of synchronous control signals DSRP, coronation and kiss room And a synchronization unit 3〇 for synchronizing the rotation of the buffer unit 1G to the plurality of synchronization control signals 112587.doc 1307897 DSRP, DSFP and DSTROB to output the aligned data DIO_OR and DIO_OF. The buffer unit 10 includes a buffer 12 for receiving data from an external device, and a delay unit 14 for delaying the output of the buffer 12 for a predetermined time and providing the delay data to the synchronization unit 30. The synchronization control unit 20 includes a buffer 21 for receiving the data selection communication number DQS and the reference signal VREF, and a driver 22 for receiving the output of the buffer 21 for outputting the first and second synchronous control signals DSRP and | a buffer 24 for receiving the clock signal CLK and the inverted clock signal /CLK; a driver 25 for driving the output of the driver 25 to output an internal clock signal ICLK; and a signal generator 26, It is used to receive the internal clock signal ICLK and the enable signal EN to generate a third synchronous control signal DSTROB. The third synchronous control signal DSTROB is generated by logically combining the internal clock signal ICLK with the enable signal EN. After the 2-bit data is input and aligned in the data input circuit, the aligned 2-bit data is synchronized in the system time > pulse (instant pulse signal CLK). The enable signal EN is generated from a circuit for performing an operation in response to a write command and is then supplied to the signal generator 26. The synchronization unit 30 includes an aligning unit 32 for aligning the output of the buffer unit 10 in response to the first and second synchronization control signals DSRP and DSFP, and a cross-domain unit 36 for aligning the unit 32 The output is synchronized to the third synchronous control signal DSTROB to output the aligned data DIO_OR and DIO OF. 112587.doc • 1307897 Alignment unit 32 includes ·····# left „ 锁存 latch benefit 33, which is used to respond to the first synchronous control signal belly P, latching the output of buffer unit 1〇; second 34, In response to the first _Di brother-synchronous control signal DSFp, latching the output of the first sub-bene; and the third latch & in response to the first control signal DSFP, respectively latching the buffer unit 1Q Output....
跨域單元36包括:第四鎖存器37,其用心貞存第二鎖存 器34之輸出,以輸出經對準之資料di〇一〇r;及第五鎖疒 器38,其用於鎖存第三鎖存器35之輸出,以輸出經對準: 資料dio_〇f,其中第四及第五鎖存器37及38回應於第三 同步控制§fl號DSTROB執行鎖存操作。 圖2為圖i中所示的習知資料輸入電路之一操作的時序 圖。 作 下文中將參看圖1及圖2來描述該習知資料輸入電路之操 緩衝單元10接收來自外部裝置之資料〇尺及〇F,並輸出内 部資料DIN。資料〇玟及01?在以資料選通訊號dqS2上升時 序及下降時序進行同步化之狀態下分別輸入緩衝單元W t。資料0R為回應於資料選通訊號DQS之第一上升轉變時 序而輪入緩衝單元1〇中之第一輸入資料。資料卯為回應於 資料選通§fl说DQS之第一下降轉變時序而輸入緩衝單元1〇 中之第二輸入資料。 同步控制單元20接收資料選通訊號DQS及參考訊號 VREF,並產生以資料選通訊號DQS之上升時序及下降時 序分別進行同步化的第一及第二同步控制訊號DSRp及 112587.doc .1307897 ' DSFP。 對準單元32之第一鎖存器33回應於第一同步控制訊號 DSRP,鎖存内部資料DIN,即資料0R。第二鎖存器34回 應於第二同步控制訊號DSFP,鎖存第一鎖存器33之輸 出。第三鎖存器35回應於第二同步控制訊號DSRF,鎖存 • 内部資料DIN,即資料0F。gp,分別在第二鎖存器34及第 . 三鎖存器35處並列鎖存順序輸入的資料0R及0F。 同步控制單元20回應於有效啟用訊號EN,產生以内部 • 時脈ICLK進行同步化之第三同步控制訊號DSTROB。 啟用訊號EN回應於資料輸入開始時時脈訊號CLK之上升 轉變時序而生效,且回應於時脈訊號CLK之下一上升轉變 時序而失效。 跨域單元36之鎖存器37及38回應於第三同步控制訊號 DSTROB,分另4鎖存鎖存器34及35之輸出F0_RAF0_F,並 分別輸出經對準之資料DIO—OR及DIO_OF。由於第三同步 控制訊號DSTROB以内部時脈訊號ICLK進行同步化,因此 ® 經對準之資料DIO_OR及DIO—OF為與時脈訊號CLK同步而 對準之資料。 出於參考目的,詞語”跨域”表示將一參考訊號改變為一 傳送訊號之操作。在以上描述中,資料選通訊號DQS改變 為時脈訊號CLK,作為用於傳送資料之參考訊號。 大體而言,在DDR SDRAM中,核心區域之所有内部操 作皆與時脈訊號CLK同步執行。因此,資料輸入電路執行 一跨域操作,將資料選通訊號DQS改變為時脈訊號CLK, 112587.doc 1307897 ' 作為料料資料之參考訊號。 圖3為先前技術中之半導體記憶裝置之顿元預提取資料 輸入電路的方塊圖。 j資料輸人電路包括緩衝單元4()、同步控制單元%及同 '旱凡仙。該4位元預提取資料輸入電路具有與圖1所示之 2位兀預提取資料輸入電路大體相同之構造。排列於同步 ^元的中之鎖存器之數目大於圖i中同步單元财之鎖存 益數目。此係由於同步單元6〇鎖存並對準串列輸入之4位 元資料’該資料以資料選通訊號DQS之上升時序或下降時 序進行同步化。 同步控制單元50回應於資料選通訊號DQS產生第—及第 二同步控制訊號DSRP及DSFP,且回應於内部時脈訊號 ICLK產生第三同步控制訊號DSTROB2。在鎖存單元66之 鎖存操作之後,由同步控制單元5〇產生第三同步控制訊號 DSTROB2。 圖4為圖3中所示的資料輸入電路之一操作的時序圖。 下文中將參看圖3及圖4來描述4位元預提取資料輸入電 路之操作。 緩衝單元40接收輸入自外部裝置之資料,並輸出内部資 料 DIN 〇 ' 同步控制單元50接收資料選通訊號dqS及參考訊號 VREF,並產生以資料選通訊號DQS之上升時序及下降時 序分別進行同步化的第一及第二同步控制訊號DSRp^ DSFP 〇 112587.doc -10- 1307897 對準單元62將與第一及第二同步控制訊號DSRP及DSFP 同步而順序傳送之内部4位元資料DIN(即第一資料〇R、第 二資料0F、第三資料1R及第四資料1F)對準為對準成兩列 類型的資料 R〇_R、F〇_F、1?1_11及 F1_F。 同步控制單元50接收時脈訊號CLK及/CLK,並回應於啟 用訊號EN2產生第三同步控制訊號dSTr〇b2。The cross-domain unit 36 includes a fourth latch 37 that carefully stores the output of the second latch 34 to output the aligned data, and a fifth latch 38 for The output of the third latch 35 is latched to output the aligned data dio_〇f, wherein the fourth and fifth latches 37 and 38 perform a latch operation in response to the third synchronous control §fl number DSTROB. Figure 2 is a timing diagram of the operation of one of the conventional data input circuits shown in Figure i. The operation buffer unit 10 of the conventional data input circuit will receive the data gauges and 〇F from the external device and output the internal data DIN, as will be described hereinafter with reference to Figs. The data 〇玟 and 01 输入 are respectively input to the buffer unit W t in a state in which the data selection communication number dqS2 is synchronized and the falling timing is synchronized. The data 0R is the first input data that is inserted into the buffer unit 1〇 in response to the first rising transition timing of the data selection communication number DQS. The data is input to the second input data in the buffer unit 1〇 in response to the data strobe §fl indicating the first falling transition timing of the DQS. The synchronization control unit 20 receives the data selection communication number DQS and the reference signal VREF, and generates first and second synchronous control signals DSRp and 112587.doc .1307897 'synchronized by the rising timing and the falling timing of the data selection communication number DQS, respectively. DSFP. The first latch 33 of the aligning unit 32 latches the internal data DIN, that is, the material 0R, in response to the first synchronous control signal DSRP. The second latch 34 is responsive to the second synchronous control signal DSFP to latch the output of the first latch 33. The third latch 35 latches the internal data DIN, that is, the material 0F, in response to the second synchronous control signal DSRF. Gp, the sequentially input data 0R and 0F are latched in parallel at the second latch 34 and the third latch 35, respectively. The synchronization control unit 20 generates a third synchronization control signal DSTROB synchronized with the internal • clock ICLK in response to the active enable signal EN. The enable signal EN takes effect in response to the rising timing of the clock signal CLK at the beginning of the data input, and fails in response to a rising transition timing below the clock signal CLK. The latches 37 and 38 of the cross-domain unit 36, in response to the third synchronous control signal DSTROB, latch the outputs F0_RAF0_F of the latches 34 and 35, respectively, and output the aligned data DIO-OR and DIO_OF, respectively. Since the third synchronous control signal DSTROB is synchronized by the internal clock signal ICLK, the aligned data DIO_OR and DIO-OF are the data aligned with the clock signal CLK. For reference purposes, the term "cross-domain" means the operation of changing a reference signal to a transmitted signal. In the above description, the data selection communication number DQS is changed to the clock signal CLK as a reference signal for transmitting data. In general, in DDR SDRAM, all internal operations in the core region are performed synchronously with the clock signal CLK. Therefore, the data input circuit performs a cross-domain operation to change the data selection communication number DQS to the clock signal CLK, 112587.doc 1307897 ' as a reference signal for the material data. Figure 3 is a block diagram of a prior art pre-fetch data input circuit of a semiconductor memory device of the prior art. j data input circuit includes buffer unit 4 (), synchronous control unit % and the same 'Yan Fanxian. The 4-bit pre-fetch data input circuit has substantially the same configuration as the 2-bit pre-fetch data input circuit shown in FIG. The number of latches arranged in the sync element is greater than the number of latches in the sync unit of Figure i. This is because the sync unit 6 is latched and aligned with the 4-bit data of the serial input. This data is synchronized by the rising timing or falling timing of the data selection communication number DQS. The synchronization control unit 50 generates the first and second synchronization control signals DSRP and DSFP in response to the data selection communication number DQS, and generates a third synchronization control signal DSTROB2 in response to the internal clock signal ICLK. After the latch operation of the latch unit 66, the third sync control signal DSTROB2 is generated by the sync control unit 5A. 4 is a timing diagram showing the operation of one of the data input circuits shown in FIG. The operation of the 4-bit prefetch data input circuit will be described hereinafter with reference to Figs. 3 and 4. The buffer unit 40 receives the data input from the external device, and outputs the internal data DIN 〇'. The synchronization control unit 50 receives the data selection communication number dqS and the reference signal VREF, and generates synchronization by the rising timing and the falling timing of the data selection communication number DQS. The first and second synchronous control signals DSRp^DSFP 〇112587.doc -10- 1307897 The aligning unit 62 sequentially transmits the internal 4-bit data DIN in synchronization with the first and second synchronous control signals DSRP and DSFP ( That is, the first data R, the second data 0F, the third data 1R, and the fourth data 1F are aligned to be aligned into two columns of data R〇_R, F〇_F, 1?1_11, and F1_F. The synchronization control unit 50 receives the clock signals CLK and /CLK and generates a third synchronization control signal dSTr〇b2 in response to the enable signal EN2.
跨域單元66鎖存R〇_R、F0_F、F1—r&f1-F,並將其輸 出為與第三同步控制訊號DSTR〇B2同步之經對準之資料 DIO OR、DIO OF、DI〇—1R^DI〇—1F。 因此,藉由圖4所示之習知4位元預提取資料輸入電路之 預提取操作,將順序輸入之4位元資料⑽ϋ及㈣ 準為4位元經對準之資料m〇—〇R、m〇一〇f、di〇丨汉及 DIO IF 。 — 如以上料’資料輸人電路具有複錢㈣成兩列之 存器°首先’資料輸人電路使用鎖存器將所有位元資料: 列為對準為兩列中之一 % # 07弟貝枓,其次,將該第一 料重新排列為並列對準之第_杳#jL ^ 弟—貝枓。為將串列輸入之資) 排列為並列對準之資料 所要衣的鎖存器數目為2N-1+N, 二正正數。需要2N-1個鎖存3|用 ’甘裔用於第一次排列,且雷| 個鎖存器用於第二次排列。 ㈣且需要 若用於預提取操作之資料相_ s ^ 科位兀之數目增加,則可能 更多鎖存器。因此,需I & 則了此 目,日+西 而要用於預提取操作之更大位元| 技.¾ ,, 導體圮憶裝置中之資料輸入Ί 路。身料輸入電路之而锫描丄 〜貝ττ钿八与 、曰σ引起製造半導體記憶裝置3 H2587.doc 1307897 成本上升。 【發明内容】 本發明提供一種資料輸入電路之各種實施例,該資料輸 入電路即使是在預提取操作之資料位元數目增加時仍可最 小化該預提取操作所需之電路面積。 根據本發明之第一實施例,提供一種用於N位元預提取 ’ 之一半導體記憶裝置之一輸入電路,其包括:-控制訊號 產生單70,其用以回應於一時脈訊號及一資料選通訊號, 產生複數個控制訊號,其中外部輸入資料以該資料選通訊 唬進行同步化;及一同步單元,其用於藉由多於三次的資 料對準操作,將輸入資料對準為^^位元並列對準之資料, 其中N為大於二之整數。 根據本毛明之第二實施例,提供一種半導體記憶裝置之 輸入電路,其包括:一控制訊號產生單元,其用以回應於 —資料選通訊號產生複數個對準控制訊號,且回應於一時 _ 脈訊號產生複數個跨域控制訊號’其中外部輸入資料以該 資料選通訊號進行同步化;一對準單元,其用於藉由多於 兩次的資料對準操作,將^^位元輸入資料對準為並列對準 之資料;及一跨域單元,其用於使該對準單元之輪出與該 專跨域控制訊號同步’以輸出N位元經對準之並列資料, 其中N為二或更大的整數。 根據本發明之弟二實施例,提供一種半導體記憶裝置之 輸入電路,其包括:一控制訊號產生單元,其用以回應於 一時脈訊號及一資料選通訊號,產生第一及第二對準控制 112587.docThe cross-domain unit 66 latches R〇_R, F0_F, F1_r&f1-F and outputs it as aligned data DIO OR, DIO OF, DI〇 synchronized with the third synchronous control signal DSTR〇B2. —1R^DI〇—1F. Therefore, by the pre-fetch operation of the conventional 4-bit pre-fetch data input circuit shown in FIG. 4, the sequentially input 4-bit data (10) and (4) are 4-bit aligned data m〇-〇R , m〇一〇f, di〇丨han and DIO IF. — If the above information 'data input circuit has the money (4) into two columns of the memory ° first 'data input circuit using the latch to all the bit data: listed as one of the two columns % # #弟弟Bessie, secondly, rearrange the first material into a parallel alignment of the first _杳#jL^ brother-Bei. In order to arrange the serial input, the number of latches in the required clothing is 2N-1+N, and the number is two positive. 2N-1 latches 3| are required for 'the first time, and the thighs are used for the second time. (d) and if there is an increase in the number of data phases _ s ^ for the prefetch operation, there may be more latches. Therefore, I & I need this, the day + west to be used for the larger bit of the pre-fetch operation | technology. 3⁄4,, the data input circuit in the conductor memory device. The body input circuit is 锫 丄 贝 贝 τ τ τ 与 与 与 引起 引起 引起 引起 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造 制造SUMMARY OF THE INVENTION The present invention provides various embodiments of a data input circuit that minimizes the circuit area required for the pre-fetch operation even when the number of data bits in the pre-fetch operation increases. According to a first embodiment of the present invention, there is provided an input circuit for N-bit pre-extraction of one of the semiconductor memory devices, comprising: - a control signal generating unit 70 for responding to a clock signal and a data Selecting a communication number, generating a plurality of control signals, wherein the external input data is synchronized by the data selection communication; and a synchronization unit for aligning the input data to ^ by more than three data alignment operations ^ Bits are aligned in parallel, where N is an integer greater than two. According to a second embodiment of the present invention, an input circuit of a semiconductor memory device is provided, comprising: a control signal generating unit for generating a plurality of alignment control signals in response to the data selection communication number, and responding to a momentary_ The pulse signal generates a plurality of cross-domain control signals, wherein the external input data is synchronized by the data selection communication number; an alignment unit is used to input the ^^ bit by more than two data alignment operations Data alignment is data for parallel alignment; and a cross-domain unit for synchronizing the rotation of the alignment unit with the cross-domain control signal to output N-bit aligned parallel data, where N Is an integer of two or more. According to a second embodiment of the present invention, an input circuit of a semiconductor memory device includes: a control signal generating unit for generating first and second alignments in response to a clock signal and a data selection communication number Control 112587.doc
-12- 1307897 訊號及複數個跨域控制訊號,其中外部輸入資料以該資料 選通訊號進行同步化;一對準單元,其用以回應於該第— 及該第二對準控制訊號,將N位元輸入資料對準為對準成 兩列之資料;及一跨域單元,其用於藉由兩次資料同步操 作,以使該對準單元所對準之資料與該複數個跨域控制訊 號同步,以輸出N位元經對準之並列資料,其中N為二或 更大的整數。 ~ 根據本發明之第四實施例,提供一種用於N位元預提取 之-半導體記憶裝置之輸入電路,其包括:一第一資料對 準單疋,其用以回應於與一資料選通訊號同步之一第一控 制訊號,對準並輸出順序輸入之預定數目的外部ν位元資 料,其中該Ν位元資料輸入以該資料選通訊號之轉變時序 進行同步化;一鎖存單元,其用以回應於一同步於一系統 時脈之第二控制訊號,鎖存該資料對準單元之一輸出丨及 一第二對準單元,其用以回應於與該系統時脈同步而產生 之一第三控制訊號,將該資料對準單元所對準之資料及該 鎖存單元所鎖存之資料對準為並列對準之Ν位元資料。 根據本發明之第五實施例,提供一種用位元預提取 之一半導體記憶裝置之輸入電路,其包括:一資料對準單 =二其用於對準並輸出順序輸入之預定數目的外部Ν位元 資料;一第一跨域單元,其用以回應於一第一跨域控制訊 號,鎖存該資料對準單元之一輸出;及一第二跨域單元, 二用以回應於一第二跨域控制訊號,將該資料對準單元所 對準之資料及該第一跨域單元所鎖存之資料鎖存為並列對 H2587.doc -13· 1307897 準之N位元資料。-12- 1307897 signal and a plurality of cross-domain control signals, wherein the external input data is synchronized by the data selection communication number; an aligning unit is responsive to the first and the second alignment control signals, N-bit input data is aligned to be aligned into two columns of data; and a cross-domain unit is used for two data synchronization operations to align the data aligned by the alignment unit with the plurality of cross-domains The control signal is synchronized to output N-bit aligned data in parallel, where N is an integer of two or more. According to a fourth embodiment of the present invention, an input circuit for a N-bit pre-extraction-semiconductor memory device is provided, comprising: a first data alignment unit for responding to a data selection communication Synchronizing one of the first control signals, aligning and outputting a predetermined number of external ν bit data sequentially input, wherein the Ν bit data input is synchronized by the transition timing of the data selection communication number; a latch unit, In response to a second control signal synchronized to a system clock, latching an output unit of the data aligning unit and a second aligning unit for generating synchronization with the clock of the system And a third control signal, the data aligned by the data alignment unit and the data latched by the latch unit are aligned into the aligned bit data. According to a fifth embodiment of the present invention, there is provided an input circuit for pre-fetching a semiconductor memory device with a bit, comprising: a data alignment sheet = two for a predetermined number of external Ν for aligning and outputting sequential inputs Bit data; a first cross-domain unit for latching an output of one of the data alignment units in response to a first cross-domain control signal; and a second cross-domain unit for responding to a first The second cross-domain control signal, the data aligned by the data alignment unit and the data latched by the first cross-domain unit are latched into a parallel pair of N-bit data of H2587.doc -13·1307897.
根據本發明之第六實施例,提供一種用於N位元預提取 之一半導體記憶裝置之操作方法,其包括:使用—對準單 疋’將順序輸人之外部N位元資料中之預定數目㈣位元 資料對準為並列對準之第―難元資料;將該第—m位元 資料鎖存為第二資料;個該對準單元將㈣位元資料中 之其它資料對準為第三並列資料;及將該第二資料及該第 —資料對準為並列對準之N位元資料。 【實施方式】 下文中將參看附圖詳細描述根據本發明之半導體記憶裝 置之8位元預提取資料輸入電路。 圖5為根據本發明之第—實施例之半導體記憶裝置之8位 元預提取資料輸入電路的方塊圖。 ”如以所示,用於操作8位元預提取之資料輸入電路包括 緩衝單元70、同步控制單元80及同步單元9〇。 緩衝單元7G包括:緩衝器7卜其用於接收來自外部裝置 之資料DQ,及延遲單元72,其用於將緩衝器71之輸出延 遲預定時間,以輸出為内部資料DIN至同步單元9〇中。 同步控制單兀80包括:緩衝器8!,其用於接收資料選通 訊號DQS及/DQS;,驅動器82,其用於接收缓衝器8ι之輸 出以刀別輸出第-及第二同步控制訊號DSRp及DSFp ; 緩衝器83’其用於接收時脈訊號CLK及/CLK;驅動器84, 其用於驅動該驅動器84之輸出, ICLK ;及訊號產生器85,其用 並輸出為内部時脈訊號 於接收該内部時脈訊號 112587.doc -14· 1307897 ; ICLK及啟用訊號ΕΝ以產生第三同步控制訊號DSTROB4。 同步單元90包括對準單元92、延遲單元94及跨域單元 96 ° 對準單元92將内部資料DIN對準為對準成兩列之資料。 延遲單元94使對準單元92之輸出延遲一預定時間,以輸出 • 至延遲單元94中。此處,該預定時間為給定來用於增加不 . 充分的操作裕度之時間,該時間由資料選通訊號DQS之轉 變時序與時脈訊號CLK及/CLK之轉變時序之間的短差值形 • 成跨域。該差值稱為關於DDR SDRAM之tDQSS。 對準單元92包括總共十五個鎖存器。對準單元92之十五 個鎖存器經排列以便將與資料選通訊號DQS之轉變時序同 步而順序輸入之第一資料對準為對準成兩列之第二資料。 延遲單元94包括八個延遲器,其用於分別延遲輸出自對 準單元92之第二資料,以輸出為第三資料至跨域單元96 中〇 跨域單元96包括八個鎖存器,其用於鎖存輸出自延遲單 胃元94之第三資料,以輸出8位元經對準之並列資料 DIO—OF、DIO—1F、DIO—2F、DIO_3F、DIO_OR、 DIO一 1R、DIO_2R及 DIO—3R。 因此,8位元預提取資料輸入電路將與資料選通訊號 DQS同步而順序輸入之8位元資料(即OR、OF、1R、1F、 2R、2F、3R及3F)對準為8位元經對準之並列資料,即 DIO_OF 、DI0_1F 、DI02F 、DIO_3F 、DIO_OR、 DIO 1R、DIO 2R及 DIO 3R。 112587.doc -15- 1307897 ; 此處,第一及第二同步控制訊號DSRP及DSFP分別順序 生效四次。第三同步控制訊號DSTROB在第八資料3F輸入 資料輸入電路之後生效。 圖6為展示根據本發明第二實施例之半導體記憶裝置之8 位元預提取資料輸入電路的方塊圖。 • 如圖6所示,8位元預提取資料輸入電路包括:緩衝單元 . 1〇〇,其用於接收來自外部裝置之資料DQ,以輸出為内部 資料DIN ;同步控制單元200,其用於接收資料選通訊號 • DQS與/DQS及時脈訊號CLK與/CLK,以產生複數個控制 訊號 DSRP、DSFP、DSTROB2及 DSTROB4 ;及同步單元, 其用於使緩衝單元100之輸出同步於該複數個控制訊號 DSRP、DSFP ' DSTROB2及 DSTROB4,以輸出為 8位元經 對準之資料,即,DIO—OR、DIO_lR、DIO_2R、 DIO_3R、DIO_OF、DI0_1F、DIO_2F及 DIO_3F。 此處,同步單元包括對準單元300、第一跨域單元400及 第二跨域單元500。該同步單元首先將内部資料DIN對準為 ® 成兩列之經對準之資料,且其次對準為成四列之經對準之 資料,且隨後最終對準為經對準之8位元並列資料。詳言 之,對準單元300回應於第一及第二同步控制訊號DSRP及 DSFP,將輸出自緩衝單元100之8位元串列資料對準為成 四列之第一 4位元資料及成兩列之第二4位元資料。第一跨 域單元400回應於第一跨域控制訊號DSTROB2,鎖存成四 列之第一 4位元資料。在第一跨域單元400鎖存第一 4位元 資料之後,成兩列之第二4位元資料被傳送至延遲單元340 I12587.doc -16- 1307897 ; 中。第二跨域單元500回應於第二跨域控制訊號 DSTROB4,鎖存輸出自第一跨域單元400之第一 4位元資 料及輸出自對準單元300之第二4位元資料,以輸出為經對 準之8位元並列資料,即DIO_OR、DIO_lR、DIO_2R、 DIO_3R、DIO_OF、DIO_lF、DIO_2F及 DIO_3F。 • 對準單元300包括:鎖存單元320,其用於將自缓衝單元 . 100串列輸出之8位元資料中選定的4位元資料對準為成兩 列之第一 4位元資料;及延遲單元340,其用於接收並延遲 • 該第一 4位元資料,以將其輸出至第一跨域單元400中。 鎖存單元320包括七個鎖存器321至327(該七個鎖存器 321至327排列為兩列),且回應於第一或第二同步控制訊 號DSRP及DSFP分別鎖存先前鎖存器之輸出。鎖存器321及 323鎖存自緩衝單元100之内部資料DIN。 詳言之,鎖存器321回應於第一同步控制訊號DSRP鎖存 内部資料DIN。鎖存器322回應於第二同步控制訊號DSFP 鎖存鎖存器321之輸出,並將其輸出至鎖存器324中。鎖存 ® 器323回應於第二同步控制訊號DSFP鎖存内部資料DIN。 鎖存器324回應於第一同步控制訊號DSRP鎖存鎖存器322 之輸出。鎖存器325回應於第一同步控制訊號DSRP鎖存鎖 存器323之輸出。鎖存器326回應於第二同步控制訊號 DSFP鎖存鎖存器324之輸出。鎖存器327回應於第二同步 控制訊號DSFP鎖存鎖存器325之輸出。即,鎖存器321、 324及325回應於第一同步控制訊號DSRP分別進行鎖存操 作。鎖存器322、323、326及327回應於第二同步控制訊號 112587.doc -17- 1307897 - DSFP分別進行鎖存操作。 延遲單元340包括四個延遲器342、344、346及348。該 四個延遲器342、344、346及348分別將鎖存器322、326、 323及327之輸出延遲一預定時間,以將其輸出至第一跨域 單元400中。由於延遲單元340具有對應於自鎖存單元320 • 傳送之訊號的鎖存器,因此延遲單元340可獨立延遲輸出 . 自鎖存單元320之資料訊號。該四個延遲單元342、344、 346及348使用由複數個反相器所得之傳播延遲,或由一電 • 阻器及一電容器所得之RC延遲值,以用於延遲操作。 第一跨域單元400包括四個鎖存器420、440、460及 480,其用於回應於第一跨域控制訊號DSTROB2分別鎖存 四個延遲器342、344、346及348之輸出。 第二跨域單元500包括八個鎖存器510至580,其用於回 應於第二跨域控制訊號DSTROB4,分別鎖存輸出自四個 延遲器342、344、346及348之第二4位元資料,及輸出自 四個鎖存器420、440、460及480之第一 4位元資料。 B 一排列於對準單元300中之鎖存器、第一跨域單元400及 第二跨域單元500可為D正反器,且含有一用於執行邊緣觸 發操作之電路。 同步控制單元200包括:對準控制單元220,其用於產生 與資料選通訊號DQS之上升緣及下降緣分別同步之第一及 第二同步控制訊號DSRP及DSFP ;及跨域控制單元240,其 用以回應於啟用訊號EN2與EN4及時脈訊號CLK及/CLK, 產生第一及第二跨域控制訊號DSTROB2及DSTROB4。 112587.doc -18· 1307897 ; 對準控制單元220包括:緩衝器222,其用於接收資料選 通訊號DQS及/DQS ;及驅動器224,其用於接收緩衝器222 之輸出並產生第一及第二同步控制訊號DSRP及DSFP。 跨域控制單元240包括:時脈輸入單元242,其用於接收 時脈訊號CLK及反相時脈訊號/CLK並產生内部時脈 • ICLK ;及跨域控制訊號產生單元244,其用以回應於啟用 . 訊號EN2產生與内部時脈ICLK同步之第一跨域控制訊號 DSTROB2,及回應於啟用訊號EN4產生與内部時脈ICLK i 同步之第二跨域控制訊號DSTROB4。 時脈輸入單元242包括:緩衝器242a,其用於接收時脈 訊號CLK及反相時脈訊號/CLK ;及驅動器242b,其用於接 收緩衝器242a之輸出並產生内部時脈ICLK。 跨域控制訊號產生單元244包括:第一產生單元244a, 其用以回應於啟用訊號EN2,產生與内部時脈ICLK同步之 第一跨域控制訊號DSTROB2 ;及第二產生單元244b,其 用以回應於啟用訊號EN4,產生與内部時脈ICLK同步之第 B 二跨域控制訊號DSTROB4。 第一產生單元244a對内部時脈ICLK及啟用訊號EN2執行 一邏輯操作以產生第一跨域控制訊號DSTROB2。第二產 生單元244b對内部時脈ICLK及啟用訊號EN4執行一邏輯操 作以產生第二跨域控制訊號DSTROB4。 藉由一控制電路回應於一寫指令執行一操作來產生啟用 訊號EN2及EN4,且啟用訊號EN2及EN4回應於内部時脈訊 號ICLK生效及失效。 112587.doc -19· 1307897 • 圖7為說明圖6所示的資料輸入電路之一操作的時序圖。 下文中將參看圖6及圖7來描述根據本發明之第二實施例之 8位元預提取資料輸入電路。 此處,圖7中之’R’及’F’為縮寫,其用於區別與資料選通 訊號DQS之上升緣及下降緣分別同步而輸入之資料。圖7 - 中’R'及'F’之前之自然數表示資料之輸入次序。 . 如圖7所示,首先資料與資料選通訊號DQS之上升緣及 下降緣同步而順序輸入至輸入缓衝單元i 〇〇中。 鲁 輸入緩衝器100接收外部資料輸入並輸出相同資料作為 内部資料DIN。 對準控制單元220產生與資料選通訊號dqs之上升緣及 下降緣分別同步之第一及第二同步控制訊號DSRp及 DSFP。由於本發明之第二實施例接收8位元資料,因此第 一及第一同步控制訊號DSRP及DSFP分別具有四個轉變時 間。 對準單元300之鎖存單元320回應於第一及第二同步控制 •訊號DSRP及DSFP,將輸入8位元資料之第一4位元資料鎖 存為兩列。即,鎖存單元32〇回應於第一及第二同步控制 訊號DSRP及DSFP,使用鎖存器321至327將順序輸入之4位 元資料(即OR、OF、1R及1F)鎖存為兩列。 延遲單元340延遲被鎖存器3 22、326、323及327鎖存之 資料(即 OR、OF、1R 及 1F),以將輸出 F〇—R、F1_R、F〇_F 及F1_F輸出至第一跨域單元400中。 此外,當啟用訊號EN2回應於第四資料(即1F)之輸入時 112587.doc -20- 1307897According to a sixth embodiment of the present invention, there is provided a method for operating a semiconductor memory device for N-bit pre-fetching, comprising: using a - alignment unit to sequentially input a predetermined one of the external N-bit data The number (four) of the bit data is aligned to the first-difficult element data of the parallel alignment; the first m-bit data is latched into the second data; and the alignment unit aligns the other data in the (four) bit data with Third parallel data; and aligning the second data and the first data into N-dimensional data aligned in parallel. [Embodiment] Hereinafter, an 8-bit pre-fetch data input circuit of a semiconductor memory device according to the present invention will be described in detail with reference to the accompanying drawings. Figure 5 is a block diagram showing an 8-bit pre-fetch data input circuit of a semiconductor memory device in accordance with a first embodiment of the present invention. As shown, the data input circuit for operating 8-bit pre-fetching includes a buffer unit 70, a synchronization control unit 80, and a synchronization unit 9. The buffer unit 7G includes a buffer 7 for receiving from an external device. The data DQ, and a delay unit 72, is for delaying the output of the buffer 71 by a predetermined time to output as internal data DIN to the synchronization unit 9A. The synchronization control unit 80 includes a buffer 8! for receiving The data selection communication numbers DQS and /DQS;, the driver 82 for receiving the output of the buffer 8i to output the first and second synchronization control signals DSRp and DSFp; the buffer 83' for receiving the clock signal CLK and /CLK; driver 84, which is used to drive the output of the driver 84, ICLK; and the signal generator 85, which is used as an internal clock signal to receive the internal clock signal 112587.doc -14·1307897; ICLK and enable signal ΕΝ to generate third synchronous control signal DSTROB 4. Synchronization unit 90 includes alignment unit 92, delay unit 94 and cross-domain unit 96 ° Alignment unit 92 aligns internal data DIN into two columns of data Delay unit 94 delays the output of the aligning unit 92 for a predetermined time to output to the delay unit 94. Here, the predetermined time is given to increase the time of the insufficient operating margin, which is selected by the data. The short difference between the transition timing of the communication number DQS and the transition timing of the clock signals CLK and /CLK is in the cross-domain. This difference is referred to as the tDQSS for the DDR SDRAM. The alignment unit 92 includes a total of fifteen locks. The fifteen latches of the aligning unit 92 are arranged to align the first data sequentially input in synchronization with the transition timing of the data selection communication number DQS into the second data aligned in two columns. 94 includes eight delays for respectively delaying the output of the second material of the self-aligned unit 92 to output the third data to the cross-domain unit 96. The cross-domain unit 96 includes eight latches for The latch outputs the third data from the delayed single stomach element 94 to output the 8-bit aligned parallel data DIO-OF, DIO-1F, DIO-2F, DIO_3F, DIO_OR, DIO-1R, DIO_2R and DIO-3R Therefore, the 8-bit pre-fetch data input circuit will be selected with the data. The 8-bit data (ie, OR, OF, 1R, 1F, 2R, 2F, 3R, and 3F) sequentially input by the signal DQS is aligned to the 8-bit aligned parallel data, namely DIO_OF, DI0_1F, DI02F, DIO_3F. , DIO_OR, DIO 1R, DIO 2R, and DIO 3R. 112587.doc -15- 1307897 ; Here, the first and second synchronous control signals DSRP and DSFP are sequentially applied four times in sequence. The third synchronous control signal DSTROB takes effect after the eighth data 3F input data input circuit. 6 is a block diagram showing an 8-bit pre-fetch data input circuit of a semiconductor memory device in accordance with a second embodiment of the present invention. • As shown in FIG. 6, the 8-bit pre-fetch data input circuit includes: a buffer unit. 1〇〇, which is used to receive data DQ from an external device to output as internal data DIN; and a synchronization control unit 200 for Receiving data selection communication number • DQS and /DQS timely pulse signals CLK and /CLK to generate a plurality of control signals DSRP, DSFP, DSTROB2 and DSTROB4; and a synchronization unit for synchronizing the output of the buffer unit 100 to the plurality of Control signals DSRP, DSFP 'DSTROB2 and DSTROB4, the output is 8-bit aligned data, ie DIO-OR, DIO_lR, DIO_2R, DIO_3R, DIO_OF, DI0_1F, DIO_2F and DIO_3F. Here, the synchronization unit includes an alignment unit 300, a first cross-domain unit 400, and a second cross-domain unit 500. The synchronization unit first aligns the internal data DIN into two aligned data, and secondly aligned into four columns of aligned data, and then finally aligned to aligned octets. Parallel data. In detail, the aligning unit 300 aligns the 8-bit serial data output from the buffer unit 100 into the first 4-bit data in four columns in response to the first and second synchronous control signals DSRP and DSFP. The second 4-bit data of the two columns. The first inter-domain unit 400 is latched into the first four bits of the four columns in response to the first cross-domain control signal DSTROB2. After the first cross-domain unit 400 latches the first 4-bit data, the second 4-bit data in two columns is transferred to the delay unit 340 I12587.doc -16 - 1307897; The second cross-domain unit 500 responds to the second cross-domain control signal DSTROB4, and latches the first 4-bit data output from the first cross-domain unit 400 and the second 4-bit data output from the self-aligned unit 300 to output It is the aligned 8-bit side-by-side data, namely DIO_OR, DIO_lR, DIO_2R, DIO_3R, DIO_OF, DIO_lF, DIO_2F and DIO_3F. The aligning unit 300 includes: a latching unit 320 for aligning the selected 4-bit data of the 8-bit data outputted from the buffering unit 100 into two columns of the first 4-bit data. And a delay unit 340 for receiving and delaying the first 4-bit data to output it to the first cross-domain unit 400. The latch unit 320 includes seven latches 321 to 327 (the seven latches 321 to 327 are arranged in two columns), and latches the previous latches in response to the first or second synchronous control signals DSRP and DSFP, respectively. The output. The latches 321 and 323 are latched from the internal data DIN of the buffer unit 100. In detail, the latch 321 latches the internal data DIN in response to the first synchronous control signal DSRP. The latch 322 responds to the output of the second synchronous control signal DSFP latch latch 321 and outputs it to the latch 324. The latch ® 323 latches the internal data DIN in response to the second synchronous control signal DSFP. The latch 324 latches the output of the latch 322 in response to the first synchronous control signal DSRP. The latch 325 latches the output of the latch 323 in response to the first synchronous control signal DSRP. Latch 326 is responsive to the output of second sync control signal DSFP latch latch 324. The latch 327 is responsive to the output of the second synchronous control signal DSFP latch latch 325. That is, the latches 321, 324, and 325 perform latching operations in response to the first synchronous control signal DSRP, respectively. Latches 322, 323, 326, and 327 are responsive to the second synchronous control signal 112587.doc -17-1307897 - DSFP for latching operations, respectively. Delay unit 340 includes four delays 342, 344, 346, and 348. The four delays 342, 344, 346, and 348 delay the outputs of the latches 322, 326, 323, and 327, respectively, for a predetermined time to output them to the first cross-domain unit 400. Since the delay unit 340 has a latch corresponding to the signal transmitted from the latch unit 320, the delay unit 340 can independently delay the output of the data signal from the latch unit 320. The four delay units 342, 344, 346, and 348 use a propagation delay obtained by a plurality of inverters, or an RC delay value obtained by a resistor and a capacitor for delay operation. The first cross-domain unit 400 includes four latches 420, 440, 460, and 480 for latching the outputs of the four delays 342, 344, 346, and 348, respectively, in response to the first cross-domain control signal DSTROB2. The second cross-domain unit 500 includes eight latches 510-580 for responding to the second cross-domain control signal DSTROB4, respectively latching the second four bits output from the four delays 342, 344, 346 and 348. Metadata, and the first 4 bits of data output from the four latches 420, 440, 460, and 480. B. The latches, first cross-domain unit 400, and second cross-domain unit 500 arranged in the aligning unit 300 may be D flip-flops and include a circuit for performing edge triggering operations. The synchronization control unit 200 includes an alignment control unit 220 for generating first and second synchronization control signals DSRP and DSFP synchronized with rising and falling edges of the data selection communication number DQS, and a cross-domain control unit 240, The first and second cross-domain control signals DSTROB2 and DSTROB4 are generated in response to the enable signals EN2 and EN4 and the pulse signals CLK and /CLK. 112587.doc -18·1307897; The alignment control unit 220 includes a buffer 222 for receiving the data selection communication numbers DQS and /DQS, and a driver 224 for receiving the output of the buffer 222 and generating the first and The second synchronous control signals DSRP and DSFP. The cross-domain control unit 240 includes a clock input unit 242 for receiving the clock signal CLK and the inverted clock signal /CLK and generating an internal clock • ICLK; and a cross-domain control signal generating unit 244 for responding The enable signal .EN2 generates a first cross-domain control signal DSTROB2 synchronized with the internal clock ICLK, and a second cross-domain control signal DSTROB4 synchronized with the internal clock ICLK i in response to the enable signal EN4. The clock input unit 242 includes a buffer 242a for receiving the clock signal CLK and the inverted clock signal /CLK, and a driver 242b for receiving the output of the buffer 242a and generating the internal clock ICLK. The cross-domain control signal generating unit 244 includes: a first generating unit 244a for generating a first cross-domain control signal DSTROB2 synchronized with the internal clock ICLK in response to the enable signal EN2; and a second generating unit 244b for In response to the enable signal EN4, a second B-domain control signal DSTROB4 synchronized with the internal clock ICLK is generated. The first generating unit 244a performs a logic operation on the internal clock ICLK and the enable signal EN2 to generate the first cross-domain control signal DSTROB2. The second generating unit 244b performs a logic operation on the internal clock ICLK and the enable signal EN4 to generate a second cross-domain control signal DSTROB4. The enable signals EN2 and EN4 are generated by a control circuit in response to a write command, and the enable signals EN2 and EN4 are asserted and disabled in response to the internal clock signal ICLK. 112587.doc -19· 1307897 • Fig. 7 is a timing chart illustrating the operation of one of the data input circuits shown in Fig. 6. An 8-bit pre-fetch data input circuit according to a second embodiment of the present invention will hereinafter be described with reference to Figs. 6 and 7. Here, 'R' and 'F' in Fig. 7 are abbreviations for distinguishing the data input in synchronization with the rising edge and the falling edge of the data strobe signal DQS. Figure 7 - The natural numbers before 'R' and 'F' indicate the order in which the data is entered. As shown in Fig. 7, first, the data is sequentially input to the input buffer unit i 同步 in synchronization with the rising edge and the falling edge of the data selection communication number DQS. The input buffer 100 receives the external data input and outputs the same data as the internal data DIN. The alignment control unit 220 generates first and second synchronization control signals DSRp and DSFP synchronized with the rising edge and the falling edge of the data selection communication number dqs, respectively. Since the second embodiment of the present invention receives 8-bit data, the first and first synchronous control signals DSRP and DSFP have four transition times, respectively. The latch unit 320 of the aligning unit 300 locks the first 4-bit data of the input 8-bit data into two columns in response to the first and second synchronization control signals DSRP and DSFP. That is, the latch unit 32, in response to the first and second synchronous control signals DSRP and DSFP, latches the sequentially input 4-bit data (ie, OR, OF, 1R, and 1F) into two using the latches 321 to 327. Column. The delay unit 340 delays the data latched by the latches 3 22, 326, 323, and 327 (ie, OR, OF, 1R, and 1F) to output the outputs F〇—R, F1_R, F〇_F, and F1_F to the first A cross-domain unit 400. In addition, when the enable signal EN2 is responded to the input of the fourth data (ie 1F) 112587.doc -20- 1307897
; 序而生效時,跨域控制單元240產生與内部時脈訊號ICLK 同步之第一跨域控制訊號DSTROPB2。 第一跨域單元400回應於第一跨域控制訊號 DSTROPB2,鎖存延遲單元340之輸出F0_R、F1_R、F0_F 及F1_F,以將其輸出為輸出D_1R、D_0R、D_1F&D_0F。 - 因此,由第一跨域單元400將順序輸入之4位元資料(即 、 OR、OF、1R及1F)對準為並列之4位元資料。 在順序輸入之8位元資料中之第一 4位元資料鎖存於第一 ® 跨域單元400處的同時,對準單元300之鎖存單元320回應 於第一及第二同步控制訊號DSRP及DSFP,將輸入8位元資 料之其它4位元資料鎖存為兩列。即,鎖存單元320回應於 第一及第二同步控制訊號DSRP及DSFP,使用鎖存器321至 327將順序輸入之4位元資料(即2R、2F、3R及3F)鎖存為兩 列。 延遲單元340延遲被鎖存器322、326、323及327鎖存之 資料(即2R、2F、3R及3F),以將其輸出為輸出F0_R、 • F1_R、FWF1_F。 — 此外,當啟用訊號EN4回應於第八資料(即3F)之輸入時 序而生效時,跨域控制單元240產生與内部時脈訊號ICLK 同步之第二跨域控制訊號DSTROPB4。 第二跨域單元500回應於第二跨域控制訊號 DSTROPB4,鎖存第一跨域單元400之輸出D_1R、D_0R、 0_1?及D_0F,以將其輸出為輸出DI0_1R、DIO_OR、 DI0_1F及DIO_OF,並鎖存延遲單元340之輸出F0_R、 112587.doc -21 - 1307897 FLR、F0_F及F1_F,以將其輸出為輸出DI〇_2F、 OIO—3F、DIO一2R及DIO_3R。因此,由第二跨域單元500 將順序輪入之8位元資料(即OR、〇F、1R、IF、2R、2F、 3R及3F)對準為並列之8位元資料。When the sequence is in effect, the cross-domain control unit 240 generates a first cross-domain control signal DSTROPB2 synchronized with the internal clock signal ICLK. The first cross-domain unit 400, in response to the first cross-domain control signal DSTROPB2, latches the outputs F0_R, F1_R, F0_F, and F1_F of the delay unit 340 to output them as outputs D_1R, D_0R, D_1F&D_0F. - Therefore, the sequentially input 4-bit data (i.e., OR, OF, 1R, and 1F) is aligned by the first cross-domain unit 400 into a parallel 4-bit data. While the first 4-bit data of the sequentially input octet data is latched at the first cross-domain unit 400, the latch unit 320 of the aligning unit 300 responds to the first and second synchronous control signals DSRP. And DSFP, the other 4-bit data of the input 8-bit data is latched into two columns. That is, the latch unit 320 latches the sequentially input 4-bit data (ie, 2R, 2F, 3R, and 3F) into two columns using the latches 321 to 327 in response to the first and second synchronous control signals DSRP and DSFP. . Delay unit 340 delays the data latched by latches 322, 326, 323, and 327 (i.e., 2R, 2F, 3R, and 3F) to output them as outputs F0_R, F1_R, FWF1_F. - In addition, when the enable signal EN4 is valid in response to the input timing of the eighth data (i.e., 3F), the cross-domain control unit 240 generates a second cross-domain control signal DSTROPB4 synchronized with the internal clock signal ICLK. The second cross-domain unit 500, in response to the second cross-domain control signal DSTROPB4, latches the outputs D_1R, D_0R, 0_1?, and D_0F of the first cross-domain unit 400 to output them as outputs DI0_1R, DIO_OR, DI0_1F, and DIO_OF, and The outputs F0_R, 112587.doc -21 - 1307897 FLR, F0_F, and F1_F of the latch delay unit 340 are output as outputs DI〇_2F, OIO-3F, DIO-2R, and DIO_3R. Therefore, the octet data (i.e., OR, 〇F, 1R, IF, 2R, 2F, 3R, and 3F) sequentially rotated by the second cross-domain unit 500 is aligned into the octet data of the parallel.
如以上所述’根據本發明之第二實施例之8位元預提取 貢料輸入電路具有兩個跨域單元4〇〇及5〇〇,且執行兩次跨 域操作。第一跨域單元4〇〇以同步於參考訊號(即,第一跨 域控制訊號DSTROB2)方式,將輸入8位元資料中之第一 4 位70資料對準為經對準之並列4位元資料。第二跨域單元 5〇〇以同步於參考訊號(即,第二跨域控制訊號dstr〇b4) 方式,將輸入8位元中之隨後4位元資料及第一跨域單元 400中之經對準之4位元資料對準為經對準之並列8位元資 料。 、 因為執行兩次跨域操作,所以可減少對準單元300中鎖 存态之數目。詳言之,根據本發明之第一實施例之8位元 預提取資料輸入電路具有十五個鎖存器,以將8位元串列 貝料對準為成兩列之8位元資料。’然,根據本發明之第 时 彳丨之8位元預長1取資料輸入電路僅具有七個鎖存 器’以將4位元串列資料對準為成兩列之4位元資料。對準 單元細用兩次跨域操作,將輸入8位元資料中之僅4位元 串列資料對準為4位开 並歹〗-貝料。因此,不再需要輸入電 路之八個鎖存器。 此外,與第一 操作之情況下, 貫施例之跨域單元相比,在採用兩次跨域 而要第—跨域單元400之四個額外鎖存器 112587.doc •22- 1307897 ' 420、440、460及480。 雖然需要此等四個額外鎖存器,但8位元預提取資料輸 入電路中所需鎖存器之總數目可減少。即,鎖存器之總數 目自第一實施例中之23個鎖存器改變為第二實施例中之19 個鎖存器。 隨著鎖存器總數目減少,8位元預提取資料輸入電路之 . 面積亦可減小。因此,可削減具有8位元預提取輸入電路 之半導體的成本。 ® 雖然在以上所述内容中揭露了關於8位元預提取資料輸 入電路,但可使用各種替代例、修改體及等效物。舉例而 5 ’熟習此項技術者應瞭解’用於4位元預提取、丨6位元 預提取或32位元預提取之資料輸入電路可用於任意類型半 導體C憶裝置之情景中,或其位元數目可經修改以適當劃 分一完整輸入資料,或其可經修改以使得其中控制訊號經 選擇以用於兩次或兩次以上的跨域操作。 • 本申請案含有關於韓國專利申請案第2〇〇5_9〇919號及第 2006-26260號之主旨(分別於2005年9月29日及2〇〇6年3月22 曰申請於韓國專利局),該等專利申請案之全部内容以引 用的方式併入本文中。 雖然已關於特定實施例描述了本發明,但熟習此項技術 者將瞭解,可在不偏離以下申請專利範圍所界定之本發明 之精神與範疇的情況下,做出各種改變及修改。 【圖式簡單說明】 圖1為一半導體記憶裝置之習知2位元預提取資料輸入電 H2587.doc •23· 1307897 路的方塊圖; 圖2為圖1中所示的習知資料輸入電路之-操作的時序 圖; 圖3為-半導體記憶裝置之習知顿元預提取資料輸入電 路的方塊圖; 圖4為圖3中所示的資料輸入電路之一操作的時序圖; -圖5為根據本發明—特定實施例之半導體記憶|置之8位 元預提取資料輸入電路的方塊圖; 圖6為根據本發明另一特定實施例之半導體記憶裝置之8 位元預提取資料輸入電路的方塊圖;及 圖7為圖6所示的資料輸入電路之一操作的時序圖。 【主要元件符號說明】 10、 40、 70 、100 緩 衝單 元 12、 21、 24 、71、 81 > 緩衝器 83 ' 222 · 、242a 14、 11、 94 延 遲單 元 20 > 50、 80 、200 同 步控制單元 12、 25 ' 82 、84、 224、242b 驅 動器 26 > 85 訊 號產 生器 30、 60 > 90 同 步單 元 32 ' 62 ' 92 對 準單 元 33 ' 34、 35 、37、 38 > 鎖 存器 321 、322 、 323、 324、 325 、326 丨·' 327、 420、 112587.doc •24· .1307897 440、 > 460、 • 480、 .510、 520、 530、 • 540、 .550、 560、 570、 • 580 36、 96 跨域單元 66 ' 320 鎖存單元 220 對準控制單 元 240 跨域控制單 元 242 時脈輸入單 元 244 跨域控制訊 號產生單元 244a 第一產生單 元 244b 第二產生單 元 300 對準單元 340 延遲單元 342、 344、 346、 348 延遲器 400 第一跨域單 元 500 第二跨域單 元 112587.doc 25As described above, the 8-bit pre-fetching tribute input circuit according to the second embodiment of the present invention has two inter-domain units 4 and 5, and performs two cross-domain operations. The first cross-domain unit 4 aligns the first 4 bits of the input 8-bit data into aligned 4 bits in synchronization with the reference signal (ie, the first cross-domain control signal DSTROB2). Metadata. The second cross-domain unit 5 同步 is synchronized with the reference signal (ie, the second cross-domain control signal dstr〇b4), and the subsequent 4-bit data in the 8-bit and the first cross-domain unit 400 are input. The aligned 4-bit data is aligned to the aligned parallel 8-bit data. Since the cross-domain operation is performed twice, the number of lock states in the align unit 300 can be reduced. In particular, the 8-bit prefetch data input circuit according to the first embodiment of the present invention has fifteen latches for aligning the 8-bit serial data into two columns of 8-bit data. That is, according to the first aspect of the present invention, the 8-bit pre-length 1 data input circuit has only seven latches' to align the 4-bit serial data into two columns of 4-bit data. The alignment unit uses two cross-domain operations to align only the 4-bit serial data in the input 8-bit data into 4 digits and 歹-bee. Therefore, the eight latches of the input circuit are no longer needed. In addition, in the case of the first operation, the four additional latches of the first-cross-domain unit 400 are used in the cross-domain unit of the embodiment, 112587.doc • 22- 1307897 '420 , 440, 460 and 480. Although these four additional latches are required, the total number of latches required in the 8-bit prefetched data input circuit can be reduced. That is, the total number of latches is changed from the 23 latches in the first embodiment to the 19 latches in the second embodiment. As the total number of latches is reduced, the area of the 8-bit pre-fetch data input circuit can also be reduced. Therefore, the cost of the semiconductor having the 8-bit pre-fetch input circuit can be reduced. ® Although the 8-bit pre-fetch data input circuit is disclosed in the above, various alternatives, modifications, and equivalents may be used. For example, 5' those skilled in the art should understand that the data input circuit for 4-bit pre-fetching, 丨6-bit pre-fetching or 32-bit pre-fetching can be used in any type of semiconductor C memory device, or The number of bits may be modified to properly partition a complete input material, or it may be modified such that the control signal is selected for two or more cross-domain operations. • This application contains the subject matter of Korean Patent Application Nos. 2〇〇5_9〇919 and 2006-26260 (applied to the Korean Patent Office on September 29, 2005 and March 22, 2005, respectively). The entire contents of these patent applications are hereby incorporated by reference. While the invention has been described with respect to the specific embodiments thereof, it will be understood by those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a conventional 2-bit pre-fetch data input device of a semiconductor memory device, H2587.doc • 23·1307897; FIG. 2 is a conventional data input circuit shown in FIG. FIG. 3 is a block diagram of a conventional input device for pre-fetching data of a semiconductor memory device; FIG. 4 is a timing chart of operation of one of the data input circuits shown in FIG. 3; FIG. 6 is a block diagram of an 8-bit pre-fetch data input circuit of a semiconductor memory device according to another embodiment of the present invention; FIG. 6 is a block diagram of an 8-bit pre-fetch data input circuit of a semiconductor memory device according to another embodiment of the present invention; FIG. FIG. 7 is a timing diagram showing the operation of one of the data input circuits shown in FIG. 6. [Main component symbol description] 10, 40, 70, 100 buffer unit 12, 21, 24, 71, 81 > buffer 83 ' 222 · , 242a 14, 11, 94 delay unit 20 > 50, 80, 200 synchronization Control unit 12, 25' 82, 84, 224, 242b driver 26 > 85 signal generator 30, 60 > 90 synchronization unit 32 ' 62 ' 92 alignment unit 33 ' 34, 35, 37, 38 > 321 , 322 , 323 , 324 , 325 , 326 · 327 , 420 , 112587.doc • 24· .1307897 440 , > 460 , • 480 , .510 , 520 , 530 , • 540 , .550 , 560 570, 580 36, 96 cross-domain unit 66 ' 320 latch unit 220 alignment control unit 240 cross-domain control unit 242 clock input unit 244 cross-domain control signal generating unit 244a first generating unit 244b second generating unit 300 Alignment unit 340 delay unit 342, 344, 346, 348 delay 400 first cross-domain unit 500 second cross-domain unit 112587.doc 25
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- 2006-06-30 TW TW095123982A patent/TWI307897B/en active
- 2006-09-13 CN CN2006101518668A patent/CN1941188B/en active Active
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Publication number | Publication date |
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KR100844985B1 (en) | 2008-07-10 |
CN1941188B (en) | 2011-11-30 |
KR20070036591A (en) | 2007-04-03 |
TW200713314A (en) | 2007-04-01 |
CN1941188A (en) | 2007-04-04 |
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