TWI307404B - - Google Patents
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- Publication number
- TWI307404B TWI307404B TW96106900A TW96106900A TWI307404B TW I307404 B TWI307404 B TW I307404B TW 96106900 A TW96106900 A TW 96106900A TW 96106900 A TW96106900 A TW 96106900A TW I307404 B TWI307404 B TW I307404B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- cover
- seat
- copper
- tube
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
1307404 九、發明說明: 【發明所屬之技術領域】 一種導熱管與座體結合裝置,尤指一種應用於 散熱器,且更便於組配之裝置者。 【先前技術】 按,習用之導熱管B與座體A結合,如第1圖 所示,係先將散熱銅板C與導熱管B先置於模具中, 採一體成型方式製作,此種方式在實際施行後具有 修以下各弊端: 1、 係因散熱銅板C與導熱管B先置於模具中,無法 確實定位散熱銅板C與導熱管B。 2、 係因採一體成型方式製作,若座體A成型不良, 則需整組報廢,無法回收散熱銅板C與導熱管 B,如此,將大大耗費製造成本。 【發明内容】 本發明提供一種「導熱管與座體結合裝置」,希 φ 藉此設計,改善公知一體成型方式製作之導熱管與座 體結合易因座體成型不良而產生整組報廢的問題,乃 提供導熱管置於吸熱銅板上面,再將座體上蓋與座體 下蓋以卡扣方式扣合,達快速結合,為主要之發明目 的。 為達到前述發明目的,本發明所運用的技術手段 為提供一種導熱管與座體結合裝置,其組件包括有導 熱管、吸熱銅板及一具有座體上、下蓋之組合式座 體;其中,該吸熱銅板四周設有段差以增加強度及減 51307404 IX. Description of the invention: [Technical field to which the invention pertains] A heat pipe and a seat body coupling device, in particular, a device that is applied to a heat sink and is more convenient to assemble. [Prior Art] According to the conventional heat pipe B combined with the seat A, as shown in Fig. 1, the heat-dissipating copper plate C and the heat-conducting pipe B are first placed in a mold, and are integrally formed. After the actual implementation, it has the following disadvantages: 1. Because the heat-dissipating copper plate C and the heat-conducting tube B are first placed in the mold, the heat-dissipating copper plate C and the heat-conducting tube B cannot be reliably positioned. 2. It is made by one-piece forming method. If the seat A is badly formed, the whole group needs to be scrapped, and the heat-dissipating copper plate C and the heat-conducting pipe B cannot be recovered. Therefore, the manufacturing cost will be greatly consumed. SUMMARY OF THE INVENTION The present invention provides a "heat-conducting pipe and a seat body bonding device", which is designed to improve the integration of a heat-conducting pipe and a seat body which are produced by a known integrated molding method, which is easy to form a whole group due to poor molding of the seat body. The heat pipe is placed on the heat absorbing copper plate, and then the upper cover of the seat body and the lower cover of the seat body are fastened by snapping, which is the main purpose of the invention. In order to achieve the foregoing object, the technical means for the present invention is to provide a heat pipe and a seat body assembly device, the assembly comprising a heat pipe, a heat absorbing copper plate and a combined body having a seat upper and a lower cover; The endothermic copper plate is surrounded by a step to increase the strength and reduce
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096106900A TW200837324A (en) | 2007-03-01 | 2007-03-01 | Assembly apparatus for heated pipe and seat member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096106900A TW200837324A (en) | 2007-03-01 | 2007-03-01 | Assembly apparatus for heated pipe and seat member |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200837324A TW200837324A (en) | 2008-09-16 |
TWI307404B true TWI307404B (en) | 2009-03-11 |
Family
ID=44820168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096106900A TW200837324A (en) | 2007-03-01 | 2007-03-01 | Assembly apparatus for heated pipe and seat member |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200837324A (en) |
-
2007
- 2007-03-01 TW TW096106900A patent/TW200837324A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200837324A (en) | 2008-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |