*1304887 九、發明說明： 【發明所屬之技術領域】 本發明係有關於被動元件之測試技術，特別係有關於一 種應用於測試被動元件之水平測試轉盤以及使用該轉盤之 測試裝置。 【先前技術】*1304887 IX. Description of the Invention: [Technical Field] The present invention relates to a test technique for a passive component, and more particularly to a horizontal test turntable for testing a passive component and a test apparatus using the same. [Prior Art]
被動元件是一種相當小尺寸且低成本的電子零組件，如 電谷、電感或電阻等等。一個完整的電子產品一般是需要有 數目眾多的被動元件，例如手機會有數百顆被動元件。但當 有個被動元件測試誤判有可能導致整個電子產品無法正 爷啟用’因此’正確的被動元件測試操作相當重要但不能 增加不必要的測試成本。 動兀件30至測試站。在每一測試站中，都會有一次的探 目前常見的被動元件測試方式是將被動&件裝載一傳動 轉盤，該傳動轉盤係斜向地轉動進行多種測試項目，以確認 、動元件的/。如第！圖所示’—種習知應用於測試被動 元件之-測試裝置主要包含—傳動轉盤1G以及複數個探測 機構20。該傳動轉盤1〇係包含複數個元件容置槽11，用以 容納複數個被動元件30。目前常見的被動元件3〇係為晶片 型’其侧邊各形成有至少一墊塊狀電極31，如帽型面或是门 型面。當被動it件3〇轉動至每—測試站，以電性連接對應 測減站之該些探測機構2〇係以探針探觸對應被動元件之 電極31。在習知的被動元件之測試過程中，該傳動轉 係為傾斜向地旋轉，機械式傳動在其元件容 動开.杜r ^的破 觸 6 *1304887 動作，故測試的項目越多，被動元件30之電極3ι表面會留 下越多的探觸痕跡，甚至導致電極31損傷。並且被動元件 3〇之電極31之表面鍍層，如錫膏，會沾附到探測機構μ 之探針，必須要經常性進行清潔工作，造成測試效率的低落。 【發明内容】 本發明之主要目的係在於解決上述問題，提供一種應用 於測試被動元件之水平測試轉盤以Α使用肖㈣之測試裝 0 置，解決以往被針測被動元件之測點過多導致電極損傷之問 題’藉以達到可擴充地連續式多站測試。 本發明的目的及解決其技術問題是採用以下技術方案來 實見的依據本發明，一種應用於測試被動元件之水平測試 轉盤包含-載料盤、—探針組固定座以及複數個模組化探針 組。該載料盤係具有複數個徑向凹槽，用以電性隔絕地容納 複數個被動元件。該探針組固定座係設置於該載料盤上。該 些模組化探針組係可拆卸地組配於該探針組固定座，每一模 • 組化探針組包含有複數個探針與對應電性連接之複數個接 觸墊。其中，該載料盤與該探針組固定座為同步旋轉，部分 之模組化探針組係被下壓，以使其探針係能探觸至下方對應 被動兀件之電極，以供測試。此外，本發明另揭示使用該水 平測试轉盤之一測試裝置。 本發明的目的及解決其技術問題還可採用以下技術措施 進一步實現。 在則述的水平測試轉盤中，另可包含有一固定座分隔 環’其係設置於該探針組固定座上，並具有複數個嵌槽，用 7 1304如 7 以分隔該些模組化探針組。 在前述的水平測試轉盤中，該些模組化探針組係可具有 回復彈力而突起於該些嵌槽之上。 在前述的水平測試轉盤中，每一模組化探針組係更可包 含有一絕緣本體與一設置該些接觸墊之電路板，該些探針係 嵌埋於該絕緣本體内，該些探針之一端係電性接觸該電路 板’該些探針之另一端係可伸縮地突出於該絕緣本體之外。 % 在前述的水平測試轉盤中，每一模組化探針組之對應探 針之可伸縮突出端係可為陣列排列。 在前述的水平測試轉盤中’該些模組化探針組之該些接 觸墊係可為同心圓配置。 【實施方式】 依據本發明之一具體實施例，揭示一種應用於測試被動 元件之水平測試轉盤以及使用該轉盤之相關測試裝置。如第 2及3圖所示’該水平測試轉盤丨〇〇主要包含一載料盤11〇、 _ 一探針組固定座120以及複數個模組化探針組13〇。該水平 測試轉盤100可相對於其它測試裝置之組件，如印刷電路板 21〇與測片固定座220等等，作水平向旋轉動作。 其中，該探針組固定座12〇係設置於該載料盤u〇上。 該些模組化探針組13 0係可拆卸地組配於該探針組固定座 120。更具體而言，該水平測試轉盤丨00另可包含有一固定 座分隔環140，其係設置於該探針組固定座12〇上並具有 複數個嵌槽141，用以分隔該些模組化探針組13〇。 如第4A及4B圖所示，該載料盤110係為電絕緣性圓盤 8 、Ι3.04δ87 體，其係具有複數個徑向凹槽m，用以電性隔絕地容納複 數個被動元件40(如第3圖之放大圖所示）。該些被動元件4〇 係以一輸送裝置（圖未繪出）逐一送入在旋轉中該载料盤ιι〇 之該些徑向凹槽111，並被吸附固定之。 如第5A及5B圖所示，在本實施例中，該探針組固定座 120之邊緣係設有複數個結合孔121及複數個定位孔us， 以供該些模組化探針組13〇之可拆卸地組配。通常該探針組 g 固定座120之材質係可為塑鋼或鐵氟龍。 如第6A、6B及6C圖所示，每一模組化探針組13〇包含 有複數個探針1 3 1與對應電性連接之複數個接觸塾b 2。該 些模組化探針組130之該些接觸墊132係可為細長條狀（如 第6B圖所示），當所有的模組化探針組13〇組配至該探針組 固定座120，其接觸墊132便可為同心圓配置。再如第6八 圖所示，每一模組化探針組13〇係更可包含有一絕緣本體 133與一設置該些接觸墊132之電路板134，該些探針 鲁 係嵌埋於該絕緣本體13 3内，該些探針13 1之一端係電性接 觸該電路板134而電性連接至該些接觸墊132，該些探針i3i 之另一端係可伸縮地突出於該絕緣本體133之外。較佳地， 該些探針131之可伸縮突出端係為陣列排列，以探測各種不 同類型之被動το件。此外，該絕緣本體133之一側係設有複 數個結合孔135，對應於該揲針組固定座12〇之結合孔i2i 與定位孔122，以供固定該些模組化探針組13〇於該探針組 固定座120。 如第7A及7B圖所示，該固定座分隔環14〇係為—尺寸 9 ι Ι3Ό4887 對應該載料盤11〇之電絕緣性圓盤體。該固定座分隔環i4〇 之複數個嵌槽141係可容納對應之模組化探針組13〇，用以 限制該些模組化探針組130之活動方向。 如第3圖所示，在本實施例中，該些模組化探針組 係可具有回復彈力而突起於該些嵌槽141之上。其中，該載 料盤110與該探針組固定座120為同步旋轉，部分之模組化 探針組130係被下壓，以使該些模組化探針組13〇之探針i3i 鲁係能探觸至下方對應被動元件4〇之電極41，以供測試。而 在本實施例中，該水平測試轉盤1〇〇之所有組件，包含該些 模組化探針組130與該固定座分隔環14〇，皆為同步旋轉。 因此，當裝載該水平測試轉盤100内之待測被動元件⑽被 旋轉進入一可擴充地連續式測試站内，與對應探觸之探針 131為同步水平旋轉’不需要探測更換探觸點，直到所有測 試項目完成後，方回復該些模組化探針組13〇之探針i3i， 脫離對應之已測試被動元件4〇,便可進行分類。該水平測試 參 轉盤1〇〇能同步攜帶該些模組化探針組130進行測試之架 構，明顯能解決以往被針測被動元件之測點過多導致電極損 傷之問題。 本發明進一步揭示使用該水平測試轉盤1〇〇之一測 試裝置。又如帛2及3圖所示，一種測試被動元件之裝置 係包含前述之水平測試轉盤1〇〇、一印刷電路板21〇 ' 一測 片固定座220以及複數個彈性測片組23〇。該水平測試轉盤 1〇〇係在測試時可旋轉移動，而該印刷電路板2ι〇、該測片 固定座220與該些彈性測片組23〇則相對地不可移動。 Ι3Ό4887 如第8八及8B圖所示，該測片固定座22〇係具有複數個 固定槽221，該些固定槽221係為圓弧形排列。該測片固定 座220係具有一半環形下壓塊222,帛以下壓該些模組化探 針組130。可同時參照第8A圖與第5A圖’依據所預定最大 可能的連續式測試站的站數設計（可高達5〇個以上測試 站）°玄測片固定座220之涵蓋區域係可包含該水平測試轉 盤1 00之外;^面四分之一至二分之二；而該水平測試轉盤A passive component is a relatively small size and low cost electronic component such as a valley, inductor or resistor. A complete electronic product generally requires a large number of passive components, such as a mobile phone with hundreds of passive components. However, when a passive component test misjudgment may result in the entire electronic product being unable to be activated, the correct passive component test operation is important but does not increase unnecessary test costs. Move the component 30 to the test station. In each test station, there will be a probe. The current passive component test method is to load the passive & part into a drive carousel that is rotated diagonally for various test items to confirm/dynamic components/ . As the first! The test device shown in the figure is applied to test passive components - the test device mainly comprises a drive turntable 1G and a plurality of detecting mechanisms 20. The drive carousel 1 includes a plurality of component receiving slots 11 for receiving a plurality of passive components 30. At present, the passive components 3 are of the wafer type, and at least one pad electrode 31, such as a hat profile or a gate profile, is formed on each side. When the passive element 3 turns to each test station, the detecting mechanism 2 corresponding to the corresponding measuring station is electrically connected to probe the electrode 31 corresponding to the passive component. During the testing of the conventional passive components, the transmission is rotated obliquely to the ground, and the mechanical transmission is driven by its components. The break of the 6*1304887 action, so the more items tested, the passive The more the traces of the electrodes on the surface of the electrode 3 of the component 30, the more the electrode 31 is damaged. Moreover, the surface plating of the electrode 31 of the passive component, such as solder paste, is attached to the probe of the detecting mechanism μ, and cleaning work must be performed frequently, resulting in a low test efficiency. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above problems, and to provide a horizontal test turntable for testing a passive component, and to use the test device of the fourth (4) to solve the problem that the electrode is excessively measured by the passive component of the needle test. The problem of damage 'to achieve scalable continuous multi-station testing. The object of the present invention and solving the technical problem thereof is based on the present invention. The horizontal test turntable for testing passive components includes a loading tray, a probe set fixing seat and a plurality of modularizations. Probe set. The carrier tray has a plurality of radial grooves for electrically accommodating a plurality of passive components. The probe set fixing seat is disposed on the loading tray. The modular probe sets are detachably assembled to the probe set mounts, and each of the modular probe sets includes a plurality of probes and a plurality of contact pads corresponding to the electrical connections. Wherein, the loading tray and the probe set fixing seat rotate synchronously, and part of the modular probe set is pressed, so that the probe system can be probed to the electrode corresponding to the passive element below, for test. Furthermore, the present invention further discloses the use of one of the horizontal test turntable test devices. The object of the present invention and solving the technical problems thereof can be further realized by the following technical measures. In the horizontal test turntable described above, a fixed seat spacer ring may be included, which is disposed on the probe set fixing seat and has a plurality of slots, and the modules are separated by 7 1304, such as 7 Needle set. In the aforementioned horizontal test turntable, the modular probe sets may have a resilient force to project over the recesses. In the above-mentioned horizontal test turntable, each modular probe set may further include an insulative body and a circuit board on which the contact pads are disposed, and the probes are embedded in the insulating body, and the probes are embedded in the insulating body. One end of the pin electrically contacts the circuit board. The other end of the probes telescopically protrudes out of the insulating body. % In the aforementioned horizontal test turntable, the retractable protruding ends of the corresponding probes of each modular probe set may be arranged in an array. In the aforementioned horizontal test carousel, the contact pads of the modular probe sets may be in a concentric arrangement. [Embodiment] According to an embodiment of the present invention, a horizontal test dial for testing a passive component and a related test apparatus using the same are disclosed. As shown in Figures 2 and 3, the horizontal test turntable 丨〇〇 mainly includes a loading tray 11〇, a probe set holder 120, and a plurality of modular probe sets 13〇. The horizontal test turntable 100 can be rotated horizontally relative to components of other test devices, such as the printed circuit board 21A, the test piece mount 220, and the like. The probe set fixing base 12 is disposed on the loading tray u〇. The modular probe sets 130 are detachably assembled to the probe set holder 120. More specifically, the horizontal test turntable 丨00 may further include a fixed seat spacer ring 140 disposed on the probe set fixing base 12 并 and having a plurality of slots 141 for separating the modularizations. Probe set 13〇. As shown in Figures 4A and 4B, the loading tray 110 is an electrically insulating disc 8 and a Ι3.04δ87 body having a plurality of radial grooves m for electrically accommodating a plurality of passive components. 40 (as shown in the enlarged view of Figure 3). The passive components 4 are fed one by one into a plurality of radial grooves 111 of the loading tray ιι in a rotation by a conveying device (not shown) and are adsorbed and fixed. As shown in FIG. 5A and FIG. 5B, in the embodiment, the edge of the probe set fixing base 120 is provided with a plurality of coupling holes 121 and a plurality of positioning holes us for the modular probe sets 13 . It is detachably assembled. Usually, the material of the probe set g fixing seat 120 can be plastic steel or Teflon. As shown in Figures 6A, 6B and 6C, each modular probe set 13A includes a plurality of probes 1 31 and a plurality of contacts 塾b 2 correspondingly electrically connected. The contact pads 132 of the modular probe sets 130 can be elongated strips (as shown in FIG. 6B), and all the modular probe sets 13〇 are assembled to the probe set mounts. 120, the contact pads 132 can be arranged in a concentric circle. As shown in FIG. 68, each of the modular probe sets 13 further includes an insulative housing 133 and a circuit board 134 on which the contact pads 132 are disposed. The probes are embedded in the circuit board. In the insulative housing 13 3 , one end of the probes 13 1 is electrically connected to the circuit board 134 and electrically connected to the contact pads 132 , and the other end of the probes i3 i telescopically protrudes from the insulative body Outside 133. Preferably, the telescopic projections of the probes 131 are arranged in an array to detect various types of passive components. In addition, one side of the insulative housing 133 is provided with a plurality of coupling holes 135 corresponding to the coupling holes i2i and the positioning holes 122 of the pin holder fixing base 12 for fixing the modular probe sets 13〇. The probe set is fixed to the probe holder 120. As shown in Figures 7A and 7B, the mount spacer ring 14 is an electrically insulating disc body having a size of 9 ι Ι 3 Ό 4887 corresponding to the loading tray 11〇. The plurality of slots 141 of the fixed spacer ring i4 可 can accommodate the corresponding modular probe sets 13 〇 to limit the moving direction of the modular probe sets 130. As shown in FIG. 3, in the embodiment, the modular probe sets may have a resilient force to protrude above the recesses 141. Wherein, the loading tray 110 and the probe set fixing base 120 rotate synchronously, and part of the modular probe set 130 is pressed down, so that the modularized probe sets 13 are probed by the i3i Lu The system can detect the electrode 41 corresponding to the passive component 4 below for testing. In this embodiment, all of the components of the horizontal test turntable 1 including the modular probe set 130 and the mount spacer 14 are synchronously rotated. Therefore, when the passive component (10) to be tested in the horizontal test turntable 100 is rotated into an expandable continuous test station, the horizontal rotation of the probe 131 corresponding to the probe is not required to detect the replacement of the probe contact until After all the test items are completed, the probes i3i of the modular probe sets 13 回复 are returned, and the corresponding passive components 4 脱离 are separated, and the classification can be performed. The horizontal test can be used to synchronously carry the modular probe set 130 for testing, which obviously solves the problem of electrode damage caused by too many measuring points of the passive component. The invention further discloses a test device using one of the horizontal test carousels. Further, as shown in Figures 2 and 3, a device for testing a passive component includes the aforementioned horizontal test turntable 1A, a printed circuit board 21'', a test piece holder 220, and a plurality of elastic test piece sets 23''. The horizontal test carousel 1 is rotatably movable during testing, and the printed circuit board 2 〇, the test piece holder 220 and the elastic test piece set 23 are relatively immovable. Ι3Ό4887 As shown in Figs. 8 and 8B, the test piece holder 22 has a plurality of fixing grooves 221 which are arranged in a circular arc shape. The test strip holder 220 has a half annular lower pressing block 222 which is pressed against the modular probe set 130. Referring to Figures 8A and 5A simultaneously, the design of the number of stations of the maximum possible continuous test station (up to more than 5 test stations) can be included. The coverage area of the test piece holder 220 can include this level. Test turntable 1 00; ^ face quarter to two-two; and the horizontal test turntable
100在該測片固定座22G所涵蓋區域之外的部份可作為被動 元件之裝載與分類下卸。 如第9A與9B圖所示，該印刷電路板21〇係具有複數個 插座211，可為模組式連接埠，以供電性連接至測試機台之 操作程式。 每一彈性測片組230係 如第10A、10B與l〇C圖所示 主要包含一絕緣本體231及複數個彈性測片232，可連接至 一被動元件測試站。該些彈性測片組23G之絕緣本體231兩 侧係設有複數個結合孔233,可對應於該些固定槽221之通 孔223(如第8八與把圖所示），以使該些彈性測片組23〇能 Ί至該測片ij定座22()在其内圓弧側之對應固定槽⑶。 該些彈性測片組230之彈性測片 測試旋轉中之水平測試轉盤1 〇〇 232係用以電性接觸上述在 之該些接觸墊13 2，可利用 -壓合板234與對應彈性測片組23〇之固定孔…，夹合固 定該些彈性測片232。當該些彈性測片組咖結合至該此固 定槽加，該些彈性測片組㈣之彈性測片叫係與該印刷 電路板21〇為電性互連。在本實施例中，該絕緣本體231之 1304887 ㈣係可為《、電木、鐵氟龍、陶£以及玻璃纖維等絕緣 之材質：該些彈性測片232之材料係可為鈹銅，而具有相當 優良的彈性與耐磨性。 w 其中，該載料盤110與該探針組固定座12〇係相對於該 測片固定座22G可為同步旋轉，當部分之模組化探針組⑽ 被旋轉進人該測片gj定座22G之涵蓋區域，被涵蓋之部分模 組化探針組m係被該測片固^座22G之半環形下壓塊如The portion outside the area covered by the test piece holder 22G can be unloaded and sorted as a passive component. As shown in Figures 9A and 9B, the printed circuit board 21 has a plurality of sockets 211 which can be modular ports and are electrically connected to the test machine. Each of the elastic test strips 230, as shown in Figs. 10A, 10B, and 10C, mainly includes an insulative housing 231 and a plurality of elastic webs 232 that can be connected to a passive component test station. A plurality of coupling holes 233 are formed on the two sides of the insulative housing 231 of the elastic test strip group 23G, and corresponding to the through holes 223 of the fixing slots 221 (as shown in FIG. 8 and FIG. 8), so as to make the The elastic test piece set 23 can be slid to the corresponding fixing groove (3) of the inner side of the inner side of the test piece ij. The elastic test piece of the elastic test piece set 230 is used to electrically contact the horizontal test turntable 1 〇〇 232 for electrically contacting the contact pads 13 2 , and the plywood 234 and the corresponding elastic test set can be utilized. The fixing holes of 23 inches are used to fix the elastic measuring pieces 232. When the elastic test strips are coupled to the fixed slot, the elastic test strips of the elastic test strips (4) are electrically interconnected with the printed circuit board 21 . In this embodiment, the 1304887 (four) of the insulative housing 231 can be an insulating material such as "Bakelite, Teflon, Tao" and glass fiber: the material of the elastic measuring piece 232 can be beryllium copper, and Has a very good elasticity and wear resistance. w, wherein the loading tray 110 and the probe set fixing base 12 are synchronously rotated with respect to the test piece fixing seat 22G, and when a part of the modular probe set (10) is rotated into the measuring piece gj Covered area of the 22G, part of the modular probe set m is covered by the semi-annular pressing block of the test piece 22G
下壓，以使被涵蓋之部分模組化探針組13〇之探針Η〗係& 探觸至下方對應被動元件40之電極41，直到旋轉超過該:: 片固定座220之涵蓋區域之外。在下麗該些模組化探針组 13〇之過程中，可以進行可擴充地連續式多站測試，不會刮 傷待測被動元件40之電極4卜即是說，電極41之探測Μ 限制在-安全固定值，但對應彈性測片組⑽之測試站數量 可連續擴充。此外’實際所需的測試站數量可以少於該些彈 性測片組2 3 0之數量。 如第Η圖所示，當該水平測試轉盤1〇〇旋轉時該些模 組化探針組13〇與對應電性連接之被動元件4q係為同步移 動。該些彈性測片組2 3 〇之該些彈性測片2 3 2係電性接觸移 動中之該些模組化探針組130之該些接觸塾132，進行被動 元件之測試。在本發明之被動元件測試過程中，實際的磨耗 界面係介於該些彈性測片232與該些接觸塾132，對於該些 被動元件40之電極41損傷可以降低到最低’亦不受測試2 數量擴充之影響。 以上所述 僅是本發明的較佳實施例而 已’並非對本發 12 l3〇4887 明作任何形式上的限制，雖然本發明 上，梦…赞月已以較佳實施例揭露如 =然而並非用以限定本發明，任何熟悉本項技術者，在不 脫離本發明之巾請專利範圍内，所作的任何簡單修改、等效 性變化與修飾，皆涵蓋於本發明的技術範圍内。 【圖式簡單說明】 第1圖：習知應用於測試被動元件之轉#式測試裝置之截面 示意圖。Pressing down so that the probed part of the modularized probe set 13〇 is tapped to the lower electrode 41 corresponding to the passive element 40 until the rotation exceeds the:: the covered area of the sheet holder 220 Outside. In the process of the modular probe set 13下, a scalable continuous multi-station test can be performed without scratching the electrode 4 of the passive component 40 to be tested, that is, the detection of the electrode 41 is limited. The -safe fixed value, but the number of test stations corresponding to the flexible test set (10) can be continuously expanded. In addition, the actual number of test stations required may be less than the number of the elastic test sets 230. As shown in the figure, when the horizontal test turntable 1 is rotated, the modular probe sets 13A and the correspondingly electrically connected passive components 4q are moved synchronously. The elastic test strips 2 3 2 are electrically connected to the contact pockets 132 of the modular probe sets 130 for passive component testing. In the passive component testing process of the present invention, the actual wear interface is interposed between the elastic test strips 232 and the contact bumps 132, and the damage to the electrodes 41 of the passive components 40 can be reduced to a minimum 'also not tested 2 The impact of quantitative expansion. The above description is only a preferred embodiment of the present invention and has not been limited to any form of the present invention. Although the present invention has been disclosed in the preferred embodiment, In order to limit the present invention, any simple modifications, equivalent changes and modifications made by those skilled in the art without departing from the scope of the invention are covered by the technical scope of the present invention. [Simple description of the diagram] Figure 1: Schematic diagram of the cross-section of the test device used in the test of passive components.
第2圖：依據本發明之一具體實施命】，一種水平測試轉盤及 相關測試裝置之立體分解圖。 第3圖：依據本發明之一具體實施例，該水平測試轉盤及相 關測试裝置之截面示意圖。 第4A圖.依據本發明之一具體實施例，該水平測試轉盤之 載料盤之頂面示意圖。 第4B圖：依據本發明之一具體實施例，該載料盤之截面示 意圖。 第5A圖.依據本發明之一具體實施例，該水平測試轉盤之 探針固定座之頂面示意圖。 第5B圖.依據本發明之一具體實施例，該探針固定座之截 面示意圖。 第6A圖.依據本發明之一具體實施例’該水平測試轉盤之 模組化探針組之截面示意圖。 第6B圖’依據本發明之一具體實施例’該模組化探針組之 軸向頂面示意圖。 第6C圖·依據本發明之一具體實施例’該模組化探針組之 13 Ι3Ό4887 徑向側視示意圖。 笫7A圖·依據本發明之—具體實施例，該水平測試轉盤之 固定座分隔環之頂面示意圖。 第7B圖.依據本發明之—具體實施例，該固定座分隔環之 截面示意圖。 第8A ® .依據本發明之一具體實施例，適用於該水平測試 轉盤之測試裝置之測片固定座之頂面示意圖。 第8B圖：依據本發明之一具體實施例，該測片固定座之截 面示意圖。 第 圖依據本發明之一具體實施例，適用於該水平測試 轉盤之測試裝置之印刷電路板之頂面示意圖。 第9B圖.依據本發明之一真體實施例，言亥印刷電路板之截 面示意圖。 第10A圖.依據本發明之一具體實施例，適用於該水平測試 轉盤之測試裝置之彈性測片組之截面示意圖。 第10B圖：依據本發明之一具體實施例，該彈性測片組之軸 向頂面示意圖。 第10C圖：依據本發明之一具體實施例，該彈性測片組之徑 向侧視示意圖。 第11圖.依據本發明之一具體實施例，在測試過程中該彈 性測片組可電性接觸該移動中模組化探針組之側 面示意圖。 【主要元件符號說明】 10傳動轉盤 u元件容置槽 14 1304887 20 探測機構 30 被動元件 31 電極 40 被動元件 41 電極 100 水平測試轉盤 110 載料盤 111 徑向凹槽 120 探針組固定座 121 結合孔 122 定位孔 130 模組化探針組 131 探針 132 接觸墊 133 絕緣本體 134 電路板 135 定位孔 140 固定座分隔環 141 嵌槽 210 印刷電路板 211 插座 220 測片固定座 221 固定槽 222 半環形下壓塊 223 通孔 230 彈性測片組 231 絕緣本體 232 彈性測片 233 結合孔 234 壓合片 235 固定孔Figure 2: An exploded perspective view of a horizontal test turntable and associated test apparatus in accordance with one embodiment of the present invention. Figure 3 is a schematic cross-sectional view of the horizontal test turntable and associated test apparatus in accordance with an embodiment of the present invention. 4A is a top plan view of a loading tray of the horizontal test carousel in accordance with an embodiment of the present invention. Figure 4B is a cross-sectional view of the loading tray in accordance with an embodiment of the present invention. Fig. 5A is a top plan view of the probe holder of the horizontal test dial in accordance with an embodiment of the present invention. Figure 5B is a cross-sectional view of the probe holder in accordance with an embodiment of the present invention. Fig. 6A is a cross-sectional view showing a modular probe set of the horizontal test turntable according to an embodiment of the present invention. Figure 6B is a schematic illustration of an axial top surface of the modular probe set in accordance with an embodiment of the present invention. Figure 6C is a schematic side elevational view of the 13 Ι 3 Ό 4887 of the modular probe set in accordance with an embodiment of the present invention. Figure 7A is a top plan view of the spacer spacer ring of the horizontal test turntable in accordance with an embodiment of the present invention. Figure 7B is a cross-sectional view of the spacer spacer ring in accordance with an embodiment of the present invention. 8A ® . In accordance with an embodiment of the present invention, a top plan view of a test strip mount for a test device of the level test turntable. Figure 8B is a cross-sectional view of the test strip holder in accordance with an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The Figure is a top plan view of a printed circuit board suitable for use in a test apparatus for a horizontal test turntable in accordance with an embodiment of the present invention. Fig. 9B is a cross-sectional view showing a printed circuit board according to an embodiment of the present invention. Fig. 10A is a cross-sectional view showing an elastic test piece group of a test device suitable for the horizontal test turntable according to an embodiment of the present invention. Fig. 10B is a schematic view showing the axial top surface of the elastic test piece according to an embodiment of the present invention. Figure 10C is a schematic side elevational view of the flexible test strip set in accordance with an embodiment of the present invention. Figure 11 is a side elevational view of the resilient test strip set electrically contacting the moving modular probe set during testing during an embodiment of the present invention. [Main component symbol description] 10 drive carousel u component accommodating groove 14 1304887 20 detection mechanism 30 passive component 31 electrode 40 passive component 41 electrode 100 horizontal test carousel 110 carrier disk 111 radial groove 120 probe group mount 121 combined Hole 122 Positioning hole 130 Modular probe set 131 Probe 132 Contact pad 133 Insulating body 134 Circuit board 135 Positioning hole 140 Mounting spacer ring 141 Inserting groove 210 Printed circuit board 211 Socket 220 Measuring piece holder 221 Fixing groove 222 Half Ring lower pressing block 223 through hole 230 elastic measuring piece set 231 insulating body 232 elastic measuring piece 233 coupling hole 234 pressing piece 235 fixing hole
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