1304096 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種釺焊合金的組成成份，且特別是 有關於一種金剛石釺焊合金的組成成份。 【先前技術】 目前習知的金剛石磨削工具大多採用電鍍或高温奸焊 =方式來製造，其中以高温釺焊的製造方式的效果較佳。 鬲温奸焊的方法所製造的金剛石磨削工具具有較高的結合 強度、70〜80%的金剛石磨料裸露高度、鋒利度高、容屑空 間大以及金剛石磨料可充分利用等優點。 目前習知的金剛石磨削工具的釺焊層的組成成份主要 為鉻-鎳合金，其優點是合金本身強度高，因此進行釺焊 後：：焊層對於金剛石磨料的接著較好。但由於金剛石的 熱穩定性差，纟800。。就會發生石墨化的相轉變 録合金的奸焊温度高達⑽代，因此在奸焊過程中容^ 成金剛石的熱損傷而使金剛石的強度降低。 因此，-種具有較低溶點，且對於金剛石磨料具有較 佳接著力的釺焊合金為目前工業界所需。 【發明内容】 本發明的目狀-為提供—種具妹麟點的奸焊人 的：組成成份，使釺焊合金的炫液在金剛石磨削工具製： 、义私中能报好地浸潤金剛石磨料。 本餐明的另-目的為提供一種與金剛石磨料具有較佳 1304096 99.95%。霧化法所製造的奸焊合金的粉末呈現球狀，其粒 徑小於2GG目（Mesh)，此合金的粉末可用於不同的金剛石 磨削工具的奸焊層的製作。在金剛石磨削工具的金剛石磨 料的接著力測試上，主要是利用—機構對所製作的金剛石 磨削工具上的金剛石顆料的根部施加壓力，直到金剛石脫 落為止，由此測得其剪切力。 表一所示為依照本發明的較佳實施例所完成的釺焊合 金的組成成份、熔點、應用此奸焊合金所完成的金剛石磨 削工具的種類以及所測得的剪切刀。$同的合金組成成份 可用於不同的金剛石磨削工具的釺焊層的製作。實施例一 的合金組成成份可用於對釺焊強度要求較高的場合，如金 剛石圓錐修刀，可用於普通陶瓷砂輪的精細修整與成型角 度修整。實施例二的合金組成成份可用於對奸焊強度要求 較低的場合，如單層釺焊磨棒，可用於如塑膠、橡膠等低 耐熱材料的精細加工。實施例三的合金組成成份可用於對 釺焊強度要求較高的場合，例如單層金剛石修整工具，此 仏正工具可用於半導體材料的加工領域、軟質多孔材料的 加工’且可用於腐钱性的加工場合。1304096 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a composition of a brazing alloy, and more particularly to a composition of a diamond brazing alloy. [Prior Art] At present, most of the conventional diamond grinding tools are manufactured by electroplating or high-temperature soldering, in which the effect of the high-temperature soldering method is better. The diamond grinding tool manufactured by the method of heating and welding has the advantages of high bonding strength, 70~80% diamond abrasive bare height, high sharpness, large chip space and full utilization of diamond abrasive. At present, the composition of the soldering layer of the conventional diamond grinding tool is mainly a chromium-nickel alloy, and the advantage is that the alloy itself has high strength, so after the brazing: the soldering layer is better for the diamond abrasive. However, due to the poor thermal stability of diamond, 纟800. . The phase transition of graphitization occurs. The soldering temperature of the alloy is as high as (10) generation, so the thermal damage of the diamond is reduced during the soldering process, and the strength of the diamond is lowered. Therefore, a solder alloy having a lower melting point and having a good adhesion to a diamond abrasive is currently required in the industry. SUMMARY OF THE INVENTION The object of the present invention is to provide a composition of ingredients for the welder: the glaze of the strontium alloy can be infiltrated by the diamond grinding tool: Diamond abrasive. Another purpose of this meal is to provide a preferred 1304096 99.95% with diamond abrasive. The powder of the solder-alloyed alloy produced by the atomization method is spherical, and its particle diameter is less than 2 GG mesh. The powder of this alloy can be used for the production of the solder layer of different diamond grinding tools. In the adhesion test of the diamond abrasive of the diamond grinding tool, the mechanism is used to apply pressure to the root of the diamond material on the diamond grinding tool until the diamond falls off, thereby measuring the shear force. . Table 1 shows the composition, melting point, type of diamond grinding tool used in the application of the solder alloy, and the shearing tool measured in accordance with a preferred embodiment of the present invention. The same alloy composition can be used for the production of brazing layers for different diamond grinding tools. The alloy composition of the first embodiment can be used for the occasions where the strength of the brazing is high, such as a diamond conical knives, which can be used for fine dressing and forming angle trimming of ordinary ceramic grinding wheels. The alloy composition of the second embodiment can be used for the occasions where the welding strength is low, such as a single-layer brazing rod, which can be used for fine processing of low heat resistant materials such as plastics and rubber. The alloy composition of the third embodiment can be used for the occasions with high requirements on the strength of the brazing, such as a single-layer diamond dressing tool, which can be used in the processing of semiconductor materials, the processing of soft porous materials, and can be used for rottenness. Processing occasions.
鈦 銅 鍚 銀 所應用的金 剛石磨削工 剪切力 熔點 (重量％) (Kgf) CC) (重量％) (重量％) (重量％)Titanium Copper 钖 Silver Applied Diamond Grinding Force Shear Strength Melting Point (% by weight) (Kgf) CC) (% by weight) (% by weight) (% by weight)
•1304096 ---—— —-— 實施例二 3 60 3 34 修刀 單層奸焊磨 9.65 800〜880 實施例三 15 18 14 53 棒 單層金剛石 修整工具 12.55 850〜940 在本發明的一較佳實施例中，由於金剛石是由非金屬 的厌所組成，應用本發明的釺焊合金中金屬鈦的存在，可 Γ7 /皿下與;δ反發生化學反應。因此，在金剛石表面會形成 —層碳化鈦’增加了釺焊合金與金剛石磨料的接著。在本 發明的另一實施例中，由於奸焊合金中的鈦含量控制在 15/❻重$以下，因此不會產生過量的碳化鈦而導致金剛石的 石墨化程度增加，可使得用以製造的金剛石磨削工具保有 其原有的強度。 應用本發明中銅、銀、鍚等低熔點的金屬與鈦的組合， 可使得釺焊合金的熔點介於了肋它到94〇t：之間。在此情況 下’奸¥合金的溶液能很好地浸潤金剛石磨料。此外，合 金中的鈦能與金剛石磨料產生化學作用，形成碳化鈦層， 增強了釺焊層與金剛石磨料的接著。除此之外，由於鈦在 奸太干5至中僅佔很少的比例，因此並不會對金剛石磨料產 生明顯的侵蝕作用。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 8• 1304096 --- -- — — — Example 2 3 60 3 34 Repairing single layer soldering mill 9.65 800~880 Example 3 15 18 14 53 Rod single layer diamond dressing tool 12.55 850~940 In the present invention In a preferred embodiment, since the diamond is composed of a non-metallic annoyance, the presence of metallic titanium in the brazing alloy of the present invention can be chemically reacted with δ. Therefore, the formation of a layer of titanium carbide on the diamond surface increases the adhesion of the solder alloy to the diamond abrasive. In another embodiment of the present invention, since the titanium content in the solder alloy is controlled to be less than 15/❻$, an excessive amount of titanium carbide is not generated to cause an increase in the degree of graphitization of the diamond, which can be used for manufacturing. Diamond grinding tools retain their original strength. The combination of a low melting point metal such as copper, silver or ruthenium and titanium in the present invention can make the melting point of the solder alloy between ribs and 94 〇t:. In this case, the solution of the alloy was able to infiltrate the diamond abrasive well. In addition, the titanium in the alloy can chemically interact with the diamond abrasive to form a titanium carbide layer that enhances the adhesion of the solder layer to the diamond abrasive. In addition, since titanium accounts for only a small percentage of the genus, it does not cause significant erosion of the diamond abrasive. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. 8