1302617 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種背光模組及其導光板及導光板製 程。 【先前技術】 产由於液晶顯示器具輕、薄、耗電小等優點，廣泛應用 於筆記本電腦、行動電動、個人數位助理等現代化資訊設 備。因液晶本身不具發光特性’需為其提供背光模組^實 現顯示功能。 眾所周知，背光模組之出光均勻度要達到預定需求， 從而提昇液晶顯示ϋ的色彩對比度、全屏區域亮度效果及 整機的可視角度。背光模組之厚度需儘量減小以適應現代 資訊設備之輕薄化。 〜 習知背光模組包括光源及導光板，光源係相對導光板 之入射面設置，該導光板引導自光源發出光束之傳輸方 向，將線光源或點光源轉換成面光源出射。該導光板之底 面分佈複數網點，用以破壞光束於導光板内部傳輸之全2 射條件，且使其散射以提高導光板出射光束之均勻性= 而提昇背光模組之整體性能。該網點之疏密、大小均可 不同設計以適應不同之背光模組。如網點可設計為方:有 圓形、六角形或菱形等。 ν 先前技術導光板之製程中，網點之製作方法有 礙壓及網印等。如，射出方式之S前技術可參見200、 月21日公告之中華民國專利第53826〇號及2 6 ι千7月1 1302617 J 之中華民國專利第493148號。惟，採用射出成型法 :.產生欠注（樹脂不轉動）及熔融樹脂隨冷卻固化發 -積：縮等缺陷’需藉由保壓力補充，若保壓力不足， 、¥致极【賦型k壞及導光板厚度不均勻、尺寸難於精確。 八主一種採用按壓方式之先前技術可參見2003年7月工曰 〇之中華民國專利第5396()5號。惟，採用按壓方式時， 二而滾子之機械精度要求高，使其加工時間長 咼0 另’受限於先前技術製程，先前技術導光板之網點之 圖案規格僅可為微米級，不胃達到其均自性要求，使得目 視導光板時可發現暗帶或明顯亮紋，影響到導光板、背光 模組乃至液晶顯示器之光學性能。又，切技術背光模組 於鄰近導光板基材-側設置反射板以反射自導光板底面逸 出之光束，使得背光模組之整體厚度難以有效減小。 有鑑於此，提供一種可提昇出光均勻度、整體較為輕 薄之導光板及其製程及採用該導光板之背光模組實為必 要0 【發明内容】 本發明之目的在於提供一種出光均勻度較高之背光模 組。 ' 本發明之另一目的在於提供一種出光均勻度較高之導 光板。 本發明之又一目的在於提供一種出光均勻度較高之導 光板製程。 1302617 本發明背光模組包括導光板及光源，該導光板包括基 材、染料層及反射層，該基材包括人射面、與人射面相連‘ 之出光面及相對出光面之底面，該光源係相對該入射面設-· ^ ’該染料層佈設於基材之底面，導光板内部傳輸之光束： 藉由該染料層破壞全反射條件後自出光面出射，該反射層 係設置於染料層表面。 曰 本發明導光板包括基材、染料層及反射層，該基材包 括入射面、與入射面相連之出光面及相對出光面之底面， 該木料層佈設於基材之底面，導光板内部傳輸之光束藉由 該染料層破壞全反射條件後自出光面出射，該反射層^設 置於染料層表面。 ’ 、，本發明導光板之製程包括提供基材、於基材底面塗佈 染料層、於染料層表面鍍反射層、採用光罩對染料層曝光 使得該染料層可破壞光束全反射條件及切割基材得到導光 板之步驟。 、相較於先前技術，由於本發明導光板之基材底面佈設籲 木料層，該染料層可破壞光束於導光板内部傳輸之全反射 條件，且使其散射以提高導光板出射光束之均勻性。另， 由於利用類似半導體之採用光罩之曝光技術，使得該染料 層具有較先前技術網點更精細之反射率分佈圖案（可達奈 米級），以此增加導光板及背光模組之出光均勻度與輝度； 又，由於在染料層表面鍍反射層以取代先前技術之^射 板，可有效降低背光模組之整體厚度。 【實施方式】 1302617 請參閱第一圖，係本發明背光模組第一實施方式，該 背光模組100包括螢光燈管111、部分包圍該螢光燈管111 之燈罩112及一導光板120。該螢光燈管111係用以發出光 束，該燈罩112防止光束能量損失，該導光板120則引導 螢光燈管111發出及燈罩112反射之光束之傳輸方向，將 其轉換為面光源出射。 該導光板120為平板形導光板，係採用壓克力、玻璃、 聚曱基丙烯酸甲酯或聚碳酸酯等透明材質製成。其包括基 材（未標示）、染料層130與反射層140，該基材包括一入 射面121、與入射面121相連之出光面122及與出光面122 相對之底面123。 該入射面121係用以接收螢光燈管111發出及燈罩112 反射之光束，其上可塗覆抗反射膜。該出光面122可加工 為具一定粗糙度之粗糙面，亦可於出光面122設置複數V 型槽（圖未示）。 請一併參閱第二圖，該基材之底面123設置染料層 130，該染料層130應用之染料係光敏性染料，一般選用醇 類、酯類或花菁素（Cyanine )、苯二曱藍染料 (Phthalocyanine )或金屬化偶氮化合物（AZO-Metal Complex)。該染料層130採用之塗佈方式可為旋轉式、浸 黏式、滾筒式、喷塗式或擠壓式等，包括反應部131及非 反應部132。該反應部131係藉由光罩曝光形成（詳後述）， 與未經曝光之非反應部132具不同之反射率，從而破壞導 光板120内部傳輸之光束之全反射條件，使其由於反射角 1302617 度不同而改變路徑，並引導其由出光面122均勻射出。該 反應部131呈正方體狀，為提高導光板120出射光束之輝 度及均勻性，該反應部131之大小係沿遠離入射面121之 方向遞增。該反應部131亦可為其他合適之形狀。 該反射層140係採用鍍膜製程設置於染料層130之表 面，以防止光束自導光板120之基材底面123逸出，從而 降低光束之能量損耗，提高導光板120及背光模組100之 整體光學性能。 本發明導光板之基材底面塗佈染料層之形狀、大小、 疏密均可有不同設計以適應不同之背光模組。請參閱第三 圖，染料層包括反應部231與非反應部232，其中反應部 231呈圓柱狀，且係均勻分佈。參閱第四圖，染料層包括反 應部331與非反應部332，其中反應部331呈三角柱狀，且 係均勻分佈。 請參閱第五圖，係本發明背光模組第二實施方式。該 背光模組400包括複數點光源411及一導光板420。該導光 板420係楔形導光板，其包括基材（未標示）、染料層430 及反射層440，該基材包括一入射面421、一與入射面421 傾斜相連之底面423、一與底面423相對之出光面422及侧 面 424 〇 該點光源411係對應該入射面421佈設，本實施方式 中，該點光源411可為發光二極體或小燈泡，且可藉由配 置複數不同顏色之發光二極體或小燈泡以調配所需之光源 顏色與輝度。 1302617 該染料層430係塗佈於底面423以改善導光板420及 背光模組400之整體出光均勻度及光學性能。該染料層430 係採用旋轉式、浸黏式、滾筒式、喷塗式或擠壓式等方法 -佈設於底面423，並經光罩曝光製程以獲得超微細設計，其 ： 選用之染料係幾百萬個相同分子連接而成之組織結構。 該反射層440係金屬反射層，其材質可選用銀或鋁。 請參閱第六圖，係本發明背光模組第三實施方式。該 背光模組700包括二螢光燈管711、部分包圍該二螢光燈管 0 711之二燈罩712及一導光板（未標示）。該導光板包括基 材720、染料層730與反射層740，該基材包括二入射面 721、與入射面721相連之出光面722及與出光面722相對 之底面723,該染料層730佈設於底面723以增加背光模組 700之出光均勻度，該反射層740設置於染料層730表面以 增加背光模組700之出光輝度並降低背光模組700之整體 厚度。 該背光模組700還包括鄰近該出光面722之第一擴散 · 板703、稜鏡片702及第二擴散板701。 請參閱第七圖，本發明之導光板製程包括：基材射出 之步驟11、染料層塗佈之步驟12、反射層鍍膜之步驟13、 光罩曝光製程之步驟14及導光板切割之步驟15,下面結合 第八圖至第十二圖進行詳細描述。 基材射出之步驟11請參閱第八圖，藉由射出方式提供 基材520，該基材520包括入射面521、出光面522及底面 523。惟，提供基材之方式並不限於射出成型，亦可為壓出 π 1302617 $裁切等方式。該基材520之材質—般為壓克力、玻璃、 聚甲基丙烯酸曱酯或聚碳酸酯等透明材質。 ’ 染料層塗佈之步驟12請參閱第九圖，於基材52〇之底… 面523塗佈染料層530。該染料層53〇_般選用醇類、酯類： 或花菁素（Cyanine)、苯二甲藍染料（phthal〇cyanine)或 金屬化偶氮化合物（AZO-MetalC〇mplex)有機染料，塗佈 方式為旋轉式、浸黏式、滚筒式、噴塗式或擠壓式等。 反射層鍍膜之步驟可參閱第十圖，於染料層53〇之表 面‘用鍵膜製程設置反射層540,該反射層54〇係銀或銘金_ 屬反射膜。惟，該反射層54〇亦可為Si〇2與Ή〇2交替形 成之多層㈣，使投射於其上之光束反身φ，該反射層54〇 可才木用化學氣相沈積法、電子束蒸鍍法、賤鍵法等方法形 成’其在可見光區之反射率可達98%以上。 光罩曝光製程之步驟可參閱第十一圖，採用光罩曝光 衣矛壬對木料層530曝光，使得該染料層53〇可破壞導光板 内部光束之全反射條件，改變光束之傳輸路徑。其中，光籲 罩600之形狀依不同之背光模組可有複數不同型態。 參閱第十二圖，將經光罩曝光後之基材52〇、染料層 530與反射層540 (圖中省略反射層54〇)之組合依據所需 尺寸進行切割，得到導光板51〇。該染料層53〇包括反應部 531與非反應部532，其中反應部531呈圓柱狀，且係均勻 分佈。該反應部531係藉由光罩曝光形成，與未經曝光之 非反應部532具不同之反射率，從而破壞導光板51〇内部 傳輸之光束之全反射條件，使其由於反射角度不同而改變 12 1302617 路徑，並引導其由出光面522 (參見第八圖）均勻射出。 請參閱第十三圖，本發明導光板製程之另一實施方式 包括：基材射出之步驟21、染料層塗佈之步驟22、反射層 · 鍍膜之步驟23、光罩曝光製程之步驟24及導光板切割之步 ： 驟25。即對換第六圖所示流程之反射層鍍膜與光罩曝光製 程之先後順序。 綜上所述，本發明確已符合發明專利要件，爰依法提 出專利申請。惟，以上所述者僅為發明之較佳實施方式，| 舉凡熟悉本案技藝之人士，在援依本案發明精神所作之等 效修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係本發明背光模組第一實施方式之立體圖。 第二圖係第一圖所示染料層之示意圖。 第三圖係本發明導光板另一實施方式之染料層之示意圖。 第四圖係本發明導光板又一實施方式之染料層之示意圖。 第五圖係本發明背光模組第二實施方式之立體圖。 · 第六圖係本發明背光模組第三實施方式之立體圖。 第七圖係本發明導光板製程之流程圖。 第八圖至第十二圖係本發明導光板製程之步驟示意圖。 第十三圖係本發明導光板製程之另一實施方式之流程圖。 【主要元件符號說明】 背光模組100、400、700 螢光燈管111、711 燈罩 112、712 點光源 411 導光板 120、420、510 基材 520、720 13 1302617 ❿ 入射面 121 、 421 、 521 出光面 122 、 422 、 522 底面 123 、 423 、 523 側面 124 、 424 染料層 130、430、530、 730反應部 131、231、331、 531 非反應部 132、232、332、 532反射層 140 > 440 > 540 > 740 光罩 600 擴散板 701 、 703 稜鏡片 702 141302617 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight module, a light guide plate thereof and a light guide plate process. [Prior Art] Due to its advantages of lightness, thinness, and low power consumption, liquid crystal display devices are widely used in modern information devices such as notebook computers, mobile electric devices, and personal digital assistants. Since the liquid crystal itself does not have a light-emitting property, it is necessary to provide a backlight module to realize the display function. It is well known that the uniformity of the light output of the backlight module is to meet the predetermined requirements, thereby improving the color contrast of the liquid crystal display, the brightness effect of the full screen area, and the viewing angle of the whole machine. The thickness of the backlight module should be minimized to accommodate the lightness and thinness of modern information equipment. ~ The conventional backlight module includes a light source and a light guide plate. The light source is disposed opposite to the incident surface of the light guide plate. The light guide plate guides the transmission direction of the light beam emitted from the light source, and converts the line light source or the point light source into a surface light source. The bottom surface of the light guide plate is distributed with a plurality of dots to destroy the full-beam condition of the light beam transmitted inside the light guide plate, and is scattered to improve the uniformity of the light beam emitted from the light guide plate to improve the overall performance of the backlight module. The density and size of the outlets can be designed differently to accommodate different backlight modules. For example, the dot can be designed as a square: a circle, a hexagon or a diamond. ν In the process of the prior art light guide plate, the manufacturing method of the dot is hindered by pressure and screen printing. For example, the pre-S technology of the injection method can be referred to 200, the 21st of the Republic of China, the Republic of China Patent No. 53826, and the 2,6 thousand July 1 1302617 J Republic of China Patent No. 493148. However, the injection molding method is adopted: the production of under-injection (resin does not rotate) and the melting of the molten resin with cooling and solidification: the shrinkage and other defects need to be supplemented by the pressure, if the pressure is insufficient, the ¥ is extremely Bad and light guide plate thickness is not uniform and the size is difficult to be precise. The prior art of the eight mains adopting the pressing method can be found in the July 2003 issue of the Republic of China Patent No. 5396() No. 5. However, when the pressing method is adopted, the mechanical precision of the roller is high, and the processing time is long 咼0. In addition, it is limited by the prior art process, and the pattern of the dot of the prior art light guide plate can only be micron-sized, not stomach. Reaching its self-sufficiency requirements, the dark light band or the bright light pattern can be found when the light guide plate is visually observed, which affects the optical performance of the light guide plate, the backlight module and even the liquid crystal display. Moreover, the backlighting module is provided with a reflecting plate adjacent to the substrate side of the light guiding plate to reflect the light beam escaping from the bottom surface of the light guiding plate, so that the overall thickness of the backlight module is difficult to be effectively reduced. In view of the above, it is necessary to provide a light guide plate which can improve light uniformity and is light and thin overall, and a process thereof and a backlight module using the same. [Invention] The object of the present invention is to provide a light uniformity with high uniformity. Backlight module. Another object of the present invention is to provide a light guide plate having a high light uniformity. Another object of the present invention is to provide a light guide plate process having a high light uniformity. 1302617 The backlight module of the present invention comprises a light guide plate and a light source, the light guide plate comprises a substrate, a dye layer and a reflective layer, the substrate comprises a human emitting surface, a light emitting surface connected to the human emitting surface and a bottom surface of the opposite light emitting surface. The light source is disposed opposite to the incident surface. The dye layer is disposed on the bottom surface of the substrate, and the light beam transmitted inside the light guide plate is emitted from the light exit surface by destroying the total reflection condition of the dye layer, and the reflective layer is disposed on the dye. Layer surface. The light guide plate of the present invention comprises a substrate, a dye layer and a reflective layer, the substrate comprises an incident surface, a light emitting surface connected to the incident surface and a bottom surface of the opposite light emitting surface, the wood layer is disposed on the bottom surface of the substrate, and the light guide plate is internally transmitted. The light beam is emitted from the light exit surface by destroying the total reflection condition of the dye layer, and the reflective layer is disposed on the surface of the dye layer. The process of the light guide plate of the present invention comprises providing a substrate, coating a dye layer on the bottom surface of the substrate, plating a reflective layer on the surface of the dye layer, exposing the dye layer to the dye layer, and the dye layer can destroy the total reflection condition of the light beam and cutting The step of obtaining a light guide plate from the substrate. Compared with the prior art, since the bottom surface of the substrate of the light guide plate of the present invention is provided with a wood layer, the dye layer can destroy the total reflection condition of the light beam transmitted inside the light guide plate, and scatter it to improve the uniformity of the light beam emitted from the light guide plate. . In addition, due to the use of a semiconductor-like exposure technique using a photomask, the dye layer has a finer reflectance distribution pattern (up to the nanometer level) than the prior art dots, thereby increasing the uniformity of light emission of the light guide plate and the backlight module. Degree and brightness; Moreover, since the reflective layer is plated on the surface of the dye layer to replace the prior art, the overall thickness of the backlight module can be effectively reduced. The first embodiment of the backlight module of the present invention includes a fluorescent tube 111, a lamp cover 112 partially surrounding the fluorescent tube 111, and a light guide plate 120. . The fluorescent tube 111 is for emitting a light beam, and the lamp cover 112 prevents beam energy loss. The light guide plate 120 guides the transmission direction of the light beam emitted from the fluorescent lamp 111 and the lamp cover 112, and converts it into a surface light source. The light guide plate 120 is a flat plate light guide plate made of a transparent material such as acrylic, glass, polymethyl methacrylate or polycarbonate. It comprises a substrate (not shown), a dye layer 130 and a reflective layer 140. The substrate comprises an entrance surface 121, a light exit surface 122 connected to the entrance surface 121 and a bottom surface 123 opposite the light exit surface 122. The incident surface 121 is configured to receive a light beam emitted from the fluorescent tube 111 and reflected by the lamp cover 112, and an anti-reflection film may be coated thereon. The light-emitting surface 122 can be processed into a rough surface having a certain roughness, and a plurality of V-shaped grooves (not shown) can be disposed on the light-emitting surface 122. Referring to the second figure, the bottom surface 123 of the substrate is provided with a dye layer 130, and the dye layer 130 is applied with a dye-based photosensitive dye, generally selected from alcohols, esters or cyanine, and benzodiazepine. A dye (Phthalocyanine) or a metal azo compound (AZO-Metal Complex). The dye layer 130 may be of a rotary type, a dip type, a drum type, a spray type or a squeeze type, and includes a reaction portion 131 and a non-reaction portion 132. The reaction portion 131 is formed by exposure of a photomask (described later), and has a different reflectance from the unexposed non-reaction portion 132, thereby destroying the total reflection condition of the light beam transmitted inside the light guide plate 120, so that the reflection angle is caused by the reflection angle The 1302617 degree changes the path and directs it to be uniformly emitted by the light exit surface 122. The reaction portion 131 has a rectangular parallelepiped shape, and the size of the reaction portion 131 increases in a direction away from the incident surface 121 in order to increase the luminance and uniformity of the light beam emitted from the light guide plate 120. The reaction portion 131 may have other suitable shapes. The reflective layer 140 is disposed on the surface of the dye layer 130 by a coating process to prevent the light beam from escaping from the substrate bottom surface 123 of the light guide plate 120, thereby reducing the energy loss of the light beam and improving the overall optical performance of the light guide plate 120 and the backlight module 100. performance. The shape, size and density of the dye coating on the bottom surface of the substrate of the light guide plate of the present invention can be differently designed to adapt to different backlight modules. Referring to the third drawing, the dye layer includes a reaction portion 231 and a non-reaction portion 232, wherein the reaction portion 231 has a cylindrical shape and is uniformly distributed. Referring to the fourth drawing, the dye layer includes a reaction portion 331 and a non-reaction portion 332, wherein the reaction portion 331 has a triangular column shape and is uniformly distributed. Please refer to the fifth figure, which is a second embodiment of the backlight module of the present invention. The backlight module 400 includes a plurality of point light sources 411 and a light guide plate 420. The light guide plate 420 is a wedge-shaped light guide plate, which comprises a substrate (not shown), a dye layer 430 and a reflective layer 440. The substrate comprises an incident surface 421, a bottom surface 423 obliquely connected to the incident surface 421, and a bottom surface 423. The point light source 411 is disposed on the incident surface 421 opposite to the light-emitting surface 422 and the side surface 424. In the embodiment, the point light source 411 can be a light-emitting diode or a small light bulb, and can be configured to emit light of a plurality of different colors. A diode or small bulb to match the desired color and brightness of the source. 1302617 The dye layer 430 is applied to the bottom surface 423 to improve the overall light uniformity and optical performance of the light guide plate 420 and the backlight module 400. The dye layer 430 is disposed on the bottom surface 423 by a rotary, dip-coating, drum-type, spray-on or extrusion method, and is subjected to a mask exposure process to obtain an ultra-fine design, wherein: The structure of millions of identical molecules connected. The reflective layer 440 is a metal reflective layer, and the material thereof may be silver or aluminum. Please refer to the sixth figure, which is a third embodiment of the backlight module of the present invention. The backlight module 700 includes two fluorescent tubes 711, two lamp covers 712 partially surrounding the two fluorescent tubes 0 711, and a light guide plate (not shown). The light guide plate includes a substrate 720, a dye layer 730 and a reflective layer 740. The substrate includes two incident surfaces 721, a light exit surface 722 connected to the incident surface 721, and a bottom surface 723 opposite to the light exit surface 722. The dye layer 730 is disposed on the light guide layer 730. The bottom surface 723 is used to increase the light uniformity of the backlight module 700. The reflective layer 740 is disposed on the surface of the dye layer 730 to increase the light output of the backlight module 700 and reduce the overall thickness of the backlight module 700. The backlight module 700 further includes a first diffusion plate 703, a cymbal 702 and a second diffusion plate 701 adjacent to the light-emitting surface 722. Referring to FIG. 7 , the light guide plate process of the present invention comprises: a step 11 of emitting a substrate, a step 12 of coating a dye layer, a step 13 of coating a reflective layer, a step 14 of a mask exposure process, and a step 15 of cutting the light guide plate. The following is a detailed description in conjunction with the eighth to twelfth figures. The step 11 of projecting the substrate is as shown in the eighth embodiment, and the substrate 520 is provided by an injection method. The substrate 520 includes an incident surface 521, a light exit surface 522, and a bottom surface 523. However, the manner of providing the substrate is not limited to injection molding, and may be extrusion π 1302617 $ cutting or the like. The material of the substrate 520 is generally a transparent material such as acrylic, glass, polymethyl methacrylate or polycarbonate. Referring to the ninth drawing of the dye layer coating step 12, the dye layer 530 is applied to the surface 52 of the substrate 52. The dye layer 53 is generally selected from alcohols, esters: or Cyanine, phthalphthalein (phthalic acid) or metal azo compound (AZO-Metal C〇mplex) organic dye, coated The method is rotary, dip, drum, spray or squeeze. The step of coating the reflective layer can be referred to the tenth figure, and the reflective layer 540 is disposed on the surface of the dye layer 53 by a bonding film, and the reflective layer 54 is made of silver or a gold-plated reflective film. However, the reflective layer 54 can also be a plurality of layers (4) alternately formed by Si〇2 and Ή〇2, so that the light beam projected thereon is reversed by φ, and the reflective layer 54 can be used for chemical vapor deposition or electron beam. The vapor deposition method, the ruthenium bond method, and the like form a 'reflectance in the visible light region of up to 98% or more. The step of the mask exposure process can be referred to the eleventh figure, and the wood layer 530 is exposed by the reticle exposure, so that the dye layer 53 can destroy the total reflection condition of the light beam inside the light guide plate and change the transmission path of the light beam. The backlight module 600 may have a plurality of different types depending on the shape of the backlight module. Referring to Fig. 12, the combination of the substrate 52A exposed by the reticle, the dye layer 530, and the reflective layer 540 (the reflection layer 54 is omitted) is cut according to the required size to obtain a light guide plate 51A. The dye layer 53A includes a reaction portion 531 and a non-reaction portion 532, wherein the reaction portion 531 has a cylindrical shape and is uniformly distributed. The reaction portion 531 is formed by exposure of the photomask, and has a different reflectance from the unexposed non-reaction portion 532, thereby destroying the total reflection condition of the light beam transmitted inside the light guide plate 51, so that it changes due to the difference in reflection angle. 12 1302617 Path and direct it to be evenly emitted by the light exit surface 522 (see Figure 8). Referring to FIG. 13 , another embodiment of the light guide plate process of the present invention includes: a substrate 21, a step 22 of applying a dye layer, a step 23 of a reflective layer, a coating step, a step 24 of the mask exposure process, and Steps for cutting the light guide: Step 25. That is, the order of the reflective layer coating and the reticle exposure process of the process shown in FIG. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the invention, and any equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a first embodiment of a backlight module of the present invention. The second figure is a schematic view of the dye layer shown in the first figure. The third figure is a schematic view of a dye layer of another embodiment of the light guide plate of the present invention. The fourth figure is a schematic view of a dye layer of still another embodiment of the light guide plate of the present invention. Figure 5 is a perspective view of a second embodiment of the backlight module of the present invention. The sixth drawing is a perspective view of a third embodiment of the backlight module of the present invention. The seventh figure is a flow chart of the process of the light guide plate of the present invention. 8 to 12 are schematic views showing the steps of the process of the light guide plate of the present invention. Figure 13 is a flow chart showing another embodiment of the light guide plate process of the present invention. [Description of main components] backlight module 100, 400, 700 fluorescent tube 111, 711 lamp cover 112, 712 point light source 411 light guide plate 120, 420, 510 substrate 520, 720 13 1302617 入射 incident surfaces 121, 421, 521 Light-emitting surface 122, 422, 522 bottom surface 123, 423, 523 side surface 124, 424 dye layer 130, 430, 530, 730 reaction portion 131, 231, 331, 531 non-reaction portion 132, 232, 332, 532 reflective layer 140 > 440 > 540 > 740 Photomask 600 Diffuser 701, 703 Bake 702 14