TWI301227B - Lithographic projection apparatus, device manufacturing method, device manufactured thereby and measurement method - Google Patents

Description

1301227 A7 B7 V. INSTRUCTION DESCRIPTION (1) The present invention is directed to the control of a drive mechanism capable of 4 隹 animal ribs in a lithographic projection apparatus. More particularly, the present invention relates to a lithography projection apparatus comprising: a radiation system for providing a radiation projection beam; a first object stage for holding a clamping mechanism, which can be given according to a desired pattern a pattern of the projection light; a second object stage for holding a substrate; and a projection system for mapping the patterned light beam onto the target portion of the substrate; and a driving mechanism for generating a force In order to move the first and second object edges relative to the projection system in each image operation, the term "patterning means" is used herein and should be interpreted broadly to mean: a mechanism that can be used to impart a cross-sectional pattern of the incoming radiation beam, corresponding to a pattern to be fabricated on the target portion of the substrate, the term "light valve" can also be used at this point. . In general, the pattern is equivalent to creating a special functional layer in a device, such as an integrated circuit or other device (see below). Examples of such a mechanism include: - a reticle held by the first article table. The concept of the reticle is well known in the lithography industry, including reticle types such as binary, alternating phase and attenuated phase shifting, as well as various hybrid reticle types. Such a reticle is placed in the projection beam, causing selective transmission (if a transmissive reticle) or reflection (if a reflective reticle) of the radiation impinging on the reticle, according to the reticle Depending on the graphics. The first object table ensures light

1301227

The cover can be attached to a desired position in the incoming projection beam and, if necessary, ensure that the reticle can be moved relative to the beam. - A programmable mirror array, fixed for a structure, referred to as the first object stage. An example of such a device is a matrix-addressable surface having a viscoelastic control layer and a reflective surface. The basic principle behind such a device is, for example, the addressed area of the reflective surface, which reflects incident light as diffracted light, while the unaddressed area reflects incident light as non-diffracted light. By using a suitable filter, the non-circular light can be filtered out of the reflected beam to leave the diffracted light; thus, the beam becomes a pattern having an address pattern according to the matrix-addressable surface. This necessary matrix addressing can be performed using an appropriate electronic mechanism. Further information on the mirror arrays described herein can be found in, for example, U.S. Patent Nos. 5,296,891 and 5,523,193. - A programmable LCD array secured by a structure known as the first object stage. An example of such a construction is found in U.S. Patent No. 5,229,872, the disclosure of which is incorporated herein by reference. For the sake of brevity, the rest of this article will be discussed on some occasions, especially for examples involving masks and object tables; however, the general principles discussed in these examples must be based on the broad aspects of the previously announced mechanism. Look. For the sake of simplicity, the projection system will be referred to as "lens" thereafter; however, this term should be interpreted broadly to include: various types of projection systems including refractive optical lenses, reflective optical lenses, Refraction • 6 - This paper size applies to the gg standard (CNS) Α 4 specification (21G χ tear public love)

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1301227 V. Inventive Note (3 (Catad1〇ptric) system, as an example. The light projecting system may also include components that operate according to any design type for illuminating, shaping, or controlling the light projecting beam' The component may also be used later, collectively or individually, as a lens J ° # 卜 ' 'The lithography mechanism may be a type having more than two substrate stages (and / or more than two reticle stages). In this "multiple" mechanism, the additional item table can be used in parallel, or when one or more object tables have been used for exposure, the preparatory steps are performed on the remaining one or more tables. The lithography mechanism is described in, for example, U.S. Patent No. 5,969,441, the disclosure of which is incorporated herein by reference. a pattern (eg, on a reticle) is imaged onto a substrate that is at least partially covered with a radiation-sensitive material (resist). Prior to this imaging step, the substrate can be subjected to various procedures, such as Primer, resist coating, and soft bake. After exposure, the substrate can be subjected to other procedures such as post-exposure bake (PEB), development, hard bake, and measurement/testing of the imaged Morphology. This series of programs is used as a basis for making a device, such as an IC, with individual layer-human graphics. This has a graphical level and can be processed in various ways, such as etching, ion implantation (doping ), plating metal, oxidation, chemical-mechanical grinding, etc., all done to complete this individual level. If there are several levels, then the entire program, or its variants, will have to be heavy on each new level. Overlay. Finally, an array of devices will be presented on the substrate (wafer). These devices are then separated from each other by slicing or sawing techniques, after which the individual devices can be mounted on a carrier, Connected to this paper scale applicable to China National Standard (CNS) A4 specification (210 X 297 public) 1301227 A7 B7 V. Invention description (4) Pins, etc. Further information about this procedure can be obtained, for example, from Pitt Fan Shande (Peter van Zant), '' Microchip Fabrication: A Practical Guide to Semiconductor Processing,' third edition, McGraw Hill Publishing Company, 1997, ISBN 0-07-067250-4, which is available in the book. The shadow projection device can be used in the manufacture of the integrated circuit (1C). If so, the clamping mechanism can generate a different level of circuit pattern corresponding to the 1C, and the graphic can be mapped to the substrate (矽 wafer). A target portion (including one or more small wafers) is imaged, which has been previously coated with a layer of radiation-sensitive material (resist). In general, a single substrate $ contains a complete network of contiguous target portions that are sequentially illuminated one by one through the projection system. In current equipment, the use of a mask on a reticle stage is a very different approach between two different types of machines. In a type of lithographic projection apparatus, each target portion is exposed to light in a single pass operation by exposing the entire reticle pattern; such a device is commonly referred to as a wafer stepper. In an alternative device, commonly referred to as a step-and-scan device, each target portion is illuminated by a stepwise scan of the reticle pattern in a given reference direction ("scanning" direction) under the projected beam. Simultaneously scanning the substrate table in parallel or anti-parallel direction; because, generally speaking, the projection system has an amplification factor Μ (usually <1), and the substrate table receives the scanning speed V, It will be a factor that doubles the speed at which the reticle stage is scanned. The projection beam, in a scanning type of device, will have a slit shape with a slit width in the scanning direction. Relevant to -8 as described here - This paper scale applies Chinese National Standard (CNS) Α4 specification (210 X 297 mm) 1301227 A7

Further information on the lithographic apparatus is described in U.S. Patent No. 6,466,792, which is incorporated herein by reference. In a scanning lithography projection apparatus, a drive mechanism is used to move an object stage during the image formation. These drives will operate with high precision so that the two object tables will be synchronized during the imaging process (4) without causing image errors, which is very important. The drive mechanism does not operate in accordance with the required precise synchronism, and can introduce the height deviation of the Moving Standard Deviation (MSD) and the moving average (MA) of the two objects. When the two object stations receive a contour of the correct on-time synchronized motion from a set point generator,

What is to be begging is the relative position error between the substrate and the reticle object table: N e = [i] where e(10) is equal to the position error between the substrate table and its set point, and W is equal to the reticle Position error between the station and its set point. Figure 2 shows the acceleration of the substrate stage during a scan in the Y direction for an exposure scan, the substrate stage must be at a distance equal to the length of the target portion 11 plus twice the slit width 13 plus The settling time moves over a distance of 7 in length. This settling time reduces the position error. This acceleration occurs when the acceleration distance 5 travels, and the deceleration occurs when the deceleration distance 15 travels. At the start point of the exposure 17 at the first point on the target portion to be exposed, the illumination slit 13 is reached. After the exposure time Texp, the first exposure point leaves the slit 13. Binding after a period equal to the length of the target portion divided by the speed of the platform

1301227 A7 B7 V. INSTRUCTIONS (6) The actual last point 19 of the target portion leaves the slit. These add up to a total of the scan length 9 described above. The average platform position error at a particular point of the dry mark portion during the illumination slit 13 determines the migration (coverage) of the particular point on the radiation sensitive material on the substrate. For each point of the dry mark part, such a kind of migration can be calculated. It is the so-called moving average (ΜΑ) difference of this point: MA{x)=

Here 'Texp is the exposure time, which is equal to the slit width divided by the scanning speed of the substrate table' e(t) is the relative US plate/mask position error at the level of the substrate as a function of time, and tx The time when the point X is at the center of the lens. In addition to the average position error, this position error can have high frequency variations during exposure, resulting in a matte effect (image unclear or loss of contrast). This effect is represented by the Moving Standard Deviation (MSD), which is equal to the standard deviation of the relative position error during exposure:

Both MA and MSD are calculated for each point in the direction of the scan in the target portion •10·1301227 V. Inventive Note (7). The peaks of the ΜΑ and MSD in the target section are used as performance indicators. In the U.S. Patent No. 6,373, No. 72 m, which is incorporated herein by reference, it is proposed to provide a control system for a substrate stage and a reticle stage in a lithographic projection apparatus in which the substrate stage is in a poor position. The position is included as a feedforward control in the control loop of the reticle stage to obtain compensation. Specifically, the substrate stage error is a low pass filter, the output of the filter is then summed to the set point of the reticle stage, and is further differentiated twice, multiplied by the mass of the substrate stage and applied to the reticle stage. The combined force. This proposal is based on the realization that the absolute position of the reticle stage and the substrate stage is less important than their relative position, and that the position of the control reticle stage is better than the position of the control substrate stage. easily. The latter is due to the absolute error in the positioning of any reticle stage, which is multiplied by the magnification of the lens system before it is added to the image error on the surface of the substrate. The magnification of the lens will be typically 0·25 and 0.2, so any error on the mask will be four to five times smaller than the error on the wafer surface. It is an object of the present invention to provide a lithographic projection apparatus that has improved synchronism and necessarily lower MSD and threshold values. According to the present invention, there is provided a lithographic projection apparatus according to the opening section characterized by the apparatus comprising: a data storage mechanism for reading from a storage mechanism in response to a position signal representative of one of the two object stations Taking a disturbance compensating force; and a processing mechanism for generating a force adjustment signal under the response to the disturbance compensating force for adjusting the -11-book scale applied by the driving mechanism to the edge of the object Guanjia Standard (CNS) Α4 Specifications _χ297 公爱) 13〇1227 A7 B7 V. Invention Description (8) One power. A signal representative of the position of the object table can be generated by a measurement system that measures the position of the object table, or a set point generated by a controller for controlling the movement of the object table. The data storage mechanism will read a disturbance compensation force based on the signal representative of a position, which will be processed in the processing mechanism to generate a force adjustment signal for adjusting the force applied to the object table. The present invention is based on the discovery that certain magnetic materials can exert force on the article table during movement of the article table. The external magnetic perturbation force can be relied upon by the position of the object table, or a combination of position and velocity. Both dependencies can be determined and stored in the data storage mechanism and can be read therefrom to pre-adjust the force response of the drive mechanism to compensate for the external magnetic disturbance power. The amount of external magnetic disturbance power of the position-dependent position is caused, for example, by the attraction between the permanent magnets present in the object table and the magnetic material in the vicinity of the moving path of the object table. In a step-scan type device, each target portion moves the reticle pattern by a reference direction set in a next direction of the projection beam, and simultaneously moves the substrate table in parallel or anti-parallel to the one direction. Receive exposure. In order to achieve that the rim rim and the substrate rib are moving in synchronism, the movement of the first and second object stages must be controlled with high precision. Sensitivity is very high for errors in the movement of the object table, because during the mapping of the object table, the two object tables are moving, and each disturbance force will induce MSD and MA values. The first object stage is particularly sensitive to external magnetic disturbances. •12· The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1301227

In the high moving speed of the object, a disturbing power appears at certain positions within the moving range, which proves that there is a speed dependency due to, for example, an eddy current effect. For these, the adjustment power of the external magnetic disturbance power that is also dependent on the speed is calculated as a function of the stored disturbance power amount; and the stored disturbance power amount is a function of the position and velocity of the object table, so the counting mechanism is used. The speed of the object table is multiplied by the disturbance compensation force to calculate the strength of the adjustment. The drive mechanism may include a long stroke and a short stroke motor; the long stroke motor is used to drive the long distance movement of the object table, and the short stroke motor is used to take care of the fineness of the object table. Positioning. The short-range motor is driven by the long-range motor and may be more sensitive to position- and speed-dependent influences. The adjustment force can be fed to the short-range motor, but because the motor is generally easier to sense the small force than the long-range motor, the long-range motor may only passively follow The short-range motor. a measuring unit for measuring a relative distance between the moving member of the long-range motor and the object table member driven by the short-range motor, indicating a deviation of the two from an equilibrium position, and the length The travel motor must be moved to achieve a balance. According to another aspect of the present invention, there is provided a device manufacturing method comprising the steps of: - providing a substrate for at least partially a layer of radiation-sensitive material to a second object table; preparing a radiation projection beam by using a radiation system; Using a tanning mechanism held by a second object table, the projection light is applied to the Chinese national standard (21〇X --- 1301227. 5. Description of the invention (cross-section of the beam; moving with the drive mechanism) a two object table; and projecting a patterned beam of light onto a dry standard portion of the layer of radiation sensitive material; the method is characterized by the following steps: in response to a signal representative of the position of one of the two object stations, the data The storage mechanism reads a disturbance compensation force; generates a force adjustment signal under the response compensation force; and - adjusts the signal by using the force 1 to adjust the force of the drive mechanism acting on the object table. According to the present invention On the one hand, the 'set-up measurement method, including the following steps, · using the drive mechanism in the lithography projection apparatus, at least one first degree of freedom Pushing at least one object table; controlling the drive mechanism to maintain the movement of the object table at a constant speed in the first degree of freedom, characterized by being applied by the drive mechanism to hold the object The force of the constant velocity movement of the station in the first degree of freedom is stored in the data storage mechanism as a function of the first degree of freedom position. Preferably, this measurement method should be performed for higher and lower speeds, and different Executed in a number of degrees of freedom. The latter can be interpreted as: the measurement is performed while the different degrees of freedom of the object are moving and the disturbing power stem is stored as a function of the different degrees of freedom (4), and 'The measurement is performed while the object table is moving in a degree of freedom: 14- This paper size is suitable for SS material (CNS) Α 4 specifications (210X297^μΓ 11 1301227 V. Invention instructions (but control The position of the object table in multiple degrees of freedom, and the multi-degree of freedom perturbation of the force is stored as a function of the degree of freedom. The measurement can be performed back and forth in a degree of freedom, the result can be averaged and furnace The measurement result can be used to correct the lithography projection apparatus. Although the use of the apparatus according to the present invention is specifically referred to herein, the manufacture of the integrated circuit (1C) is specifically cited. It is obvious that there are many other possible applications for this type of device. For example, it can be used to manufacture: integrated optical systems, magnetic memory guided and detected graphics, liquid crystal display panels, <thin film magnetic heads, etc. Etc. Those skilled in the art will recognize that any of the associated texts that discuss alternative applications use "repticle", "wafer" or "die". The term "should be considered to be replaced by the more common terms "mask", "substrate" and "target area" or "target part". The terms 'illumination radiation' and 'illumination beam' in this document are used to cover all electromagnetic radiation or particle flow patterns, including but not limited to 'ultraviolet radiation (eg 365, 248, 193, 157) , or 126 nanometers of wavelength), EUV (ultraviolet radiation), X-rays, electrons and ions. BRIEF DESCRIPTION OF THE DRAWINGS In the following, the invention will be described with reference to exemplary embodiments and accompanying drawings in which: FIG. 1 shows a lithography apparatus according to a first embodiment of the present invention; Figure 3 shows a detailed flow chart of the first embodiment of the present invention; Figure 4 shows a first object table that moves in the Y direction for γ, χ, and "square 15 paper scales. China National Standard (CNS) A4 Specification (210X 297 mm) - Binding 1301227

Figure 5 shows a detailed flow chart of a second embodiment of the present invention; and Figure 6 shows the dependence speed and position of the first object stage moving in the gamma direction in the gamma direction. The external magnetic disturbance power. DETAILED DESCRIPTION OF THE INVENTION Figure 1 is a schematic representation of a lithographic projection apparatus in accordance with the present invention. The device comprises: a radiation system LA, IL, a projection beam for supplying a radiant energy (for example, uv or EUV radiant energy, X-ray, electron or ion); an object & (mask station) MT' A reticle holder is used to fix a reticle MA (such as a reticle) and is connected to the first driving mechanism ps i so that the reticle precisely moves the object PL; the first object table (substrate table) WT ' A substrate holder is provided for fixing a substrate W (for example, a resist-coated germanium wafer), and is connected to the second driving mechanism PS2 to precisely move the substrate to the object PL; a projection scene system ("lens") PL (eg, a refractive or reflective refractive system, a mirror set, or a field of view mirror array) for mapping an illuminated portion of the mask A to a dry mark of the substrate w Part c. As explained herein, the device is a transmissive type (i.e., has a transmissive mask). However, in general, it can also be one, for example, a reflective type. The radiation system includes a source LA (eg, a mercury lamp, excimer laser light, a discharge plasma, a laser generated plasma source, a undulator disposed around the electron beam path in a storage ring or a synchrotron) ( Undulator), -16 _ This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) ' ------ 1301227

Or an electron or ion beam source) produces a beam of radiation. The beam is passed along various optical components included in the illumination system, such as beam shaping optical instrument Ex, an integrator IN, and a capacitor c, such that the terminated beam P B has a desired shape and intensity distribution. The beam PB then intersects the reticle MA held on the reticle stage MT reticle holder. After passing through the reticle MA, the beam passes through the lens PL, which focuses the beam pB onto a target portion of the wafer w. By means of the measuring system IF2 and the second driving mechanism pS2, the substrate table, «such" can be moved precisely, positioning the different dry marking portions c in the path of the light beam PB. Similarly, the first driving mechanism Psi, for example, 'the mechanical mask can be used to accurately locate the reticle MA relative to the path of the beam PB after it has been retrieved from a reticle database. Generally, the movement of the object table MT and WT can be realized by a long-range module (coarse positioning) and a short-moving module (fine positioning), which is not clearly shown in FIG. It is used in two different modes: 1. In the step mode, the mask table MT is mainly kept still, and the entire mask image is projected in one operation (ie, a single "flash"). On the target part c. The substrate table WT is then transferred in the χ and / or ¥ direction so that a different target portion can be illuminated for the light beam PB; 2. In the scan mode, the same scenario can be applied to the enamel, with the exception of - setting The target portion C is not exposed in a single "flash". However, the reticle stage MT is moving at a speed of _ speed in the set direction (so-called "scanning direction", for example, 丫 direction), thereby causing the projection

1301227 A7

The light beam PB is scanned on a reticle; at the same time, the substrate table WT is synchronously moved in the same or opposite direction at a speed V=M^, where M in the above equation is the magnification of the lens PL (typically , m=1/4 or 1/5). In this way, a larger target portion can be exposed without having to damage the resolution. The device also includes a bottom frame BP (also referred to as a backplane or chassis) for supporting the components of the device to support the projection system PL and sensors, such as a metrology system. As mentioned herein, the two object stages are movable, and the measurement system package interferometers IF 1 and IF 2 will measure the position of the first and second object disturbances. The signal generated by the interferometer IF1 can be used to generate a force signal for the drive mechanism psi, and the signal generated by the interferometer IF2 can be used to generate a force adjustment signal for use by the drive mechanism PS2. The processing mechanism pM includes a data storage mechanism for responding to a measurement signal from the measurement system IF1 (or IF2) to generate a force adjustment signal for adjustment applied by the drive mechanism PS1 (or PS2) The strength of the individual objects on the table. The disturbance compensating force stored in the data storage mechanism may be an array of forces F ,, ready to act on the X, Y*Rz (rotational motion on the X, γ plane) 'as one in the Y direction The function of position measurement, the γ direction is the scanning direction of the device. In addition, we can also store the power FO prepared to act in the Rx, Ry, and Z directions, which is a function of the Y position; we can store these functions as X, Y, and Z positions (and possibly Rx, Ry, and The power of the Rz function) FO. According to World Patent WO 01/18944, it may be advantageous to store the power of the X and γ position functions in a planar motor; this patent is based on reference -18- This paper scale applies to the S National Standard (CNS) A4 specification. (210 X 297 public) ------ A7 B7 1301227 V. Description of invention (I5) is included in this article. In a planar motor, the second article stage will be pushed over a magnetic plate for a long distance in the X and Y directions. In order to achieve high-precision positioning, we may use a two-step positioning system in which the planar motor acts as a long-range motor and the additional Lorentz motor acts as a short-range motor ^ feedforward signal It is then used to compensate for any disturbances in the short-range motor 'the latter is caused by the magnetic plates present in the planar motor. Figure 3 shows a detailed flow chart of a first embodiment of the present invention. The desired object table position is generated by a set point generator 31 and fed into an object table controller 33. The object table controller 33 calculates a force 39 that is intended to act on the object table 43. The position of the object table, and thus the influence of the set point generator, will be measured using the position measurement system 41. The set point of the setpoint generator 31 will be fed to a processing mechanism 37 via connection 47. This set point will be used in the data storage mechanism 35 to obtain the disturbance compensation force, which is then converted into a force adjustment signal 49 in the processing mechanism 37 and added to the total force 39. The line 45 provides an alternative. The way to connect 47. If it is necessary that the disturbance compensation force is independent of the set point generator 31, it is preferable to use the connection 45 and use the actual measurement data to process the force adjustment signal 49. Figure 4 shows the result of moving the first object stage j in the gamma direction of the scan [while measuring the external magnetic force acting on the first object stage. The acquisition of these measurements 'is to borrow a relatively low speed of 0.025 m / s in the Y direction' and simultaneously measure the application by the drive motor to maintain the first object table at a constant speed in the Y direction The power of movement. The constant speed is used in a ____ - 19- paper scale for the g g home standard (CNS) Μ specification ( χ 297 public) 1301227

The measurement mechanism controls that any deviation of the constant velocity will result in an adjusted force applied by the drive mechanism region. This adjusted force f is shown in Figure 4.

in. The measuring mechanism is also used to control the position of the object table in other degrees of freedom (X and Y) and any deviation from the position will also induce an adjustment force output by the driving mechanism, which is shown in FIG. Also expressed. The low speed ensures that the difference between the required and actual position is minimal, and therefore the force exerted by the drive mechanism is an accurate measure of the amount of disturbance. As can be seen, in the γ direction, _〇·〇8 and 0.05 or so, a strong deviation from the straight line phenomenon can be observed. The disturbance correction force, as shown in Figure 4, can be obtained several times, averaged, and then filtered to enhance the disturbance correction force of the vehicle in the data storage mechanism as a function of position in the 丫 direction. DETAILED DESCRIPTION OF THE INVENTION The amount of magnetic disturbance force applied by an object table shows a speed dependency in addition to positional dependence. Therefore, a speed must be calculated from the measurement system 11 or the signal generated by the set point generator to calculate a force adjustment signal that is a function of the disturbance correction force and the speed of the object table. Figure 5 shows a detailed flow chart in accordance with a second embodiment of the present invention. It shares most of the same items with the first embodiment of the present invention, and an additional set point representing the speed of the object table is generated by the set point power generating unit 3 i via the connection 51 is fed to processing mechanism 37, which also includes a computing mechanism for calculating a force adjustment signal as a function of the position and speed of the shoe. The computing mechanism simply multiplies the disturbance compensation force by the speed of the object table. -20- This paper scale applies to China National Standard (CNS) A4 specification (210X297 public)

• Installation 1301227 A7 B7 V. INSTRUCTION DESCRIPTION (17) Fig. 6 shows the speed-dependent magnetic disturbance amount in the γ direction of the first object stage moving in the Y direction. These measurements are made by moving the first head gauge in the Y direction at a relatively high speed of 1 m/s and simultaneously measuring the application by the drive mechanism to maintain the first object at a constant speed. The force that moves in the first direction. This constant speed is controlled by a measurement system, for example, IF1 (and IF2) in Figure 1 or 41 in Figures 3 and 5. The force applied by the drive mechanism to maintain the first article stage moving at a constant speed is stored in the data storage mechanism as a function of position in the gamma direction. In addition, the force applied by the driving mechanism to maintain the first object table moving at other degrees of freedom at a constant speed is also checked by the measuring mechanism, and the applied force is stored in the data storage mechanism. Become a function of the first degree of freedom position. In the graph on top of Fig. 6, the line 卯 shows the force of the first object stage moving forward in the γ direction, and the line print shows the force of the first object stage moving backward in the Υ direction. In the bottom chart, multiply the line FB of the top chart by -1 and draw the line FF in the same chart. The lines FF and FB show a nearly perfect match, with the exception of the +〇 〇 5 meter section. This is in accordance with the segment of the Y-power diagram of Figure 4, where the position-dependent external magnetic force is not zero. The fact that the measurement of force has the opposite sign for the opposite direction of movement proves that the amount of disturbance is mainly speed dependent. The forces listed in Figure 6 can be filtered to obtain a compensation table for the amount of disturbance, including the force to be applied, to compensate for the dependence of the positional function in the gamma direction and the amount of external magnetic disturbance. The value in the table shall be multiplied by the speed of the first object table to obtain the adjustment force F〇 or

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, line A7 B7 1301227 V. Description of invention (18) 49. Table 1 shows the moving average ΜA value and the moving standard deviation]VISD value of the first object table, expressed in units of nanometers in the X and Y directions, and in nanoscale units in terms of Rz. Table. Table 1 MA-X MA-Y MA-Rz MSD-X MSD-Y MSD-Rz [Nano] [Nami] [Nai 3t] [Nami] [Nano] [Nai] Undisturbed power compensation 2.27 4.57 12.92 11.64 10.57 42.29 Position-dependent force compensation 2.28 4.35 11.83 11.68 10.11 42.08 Speed-dependent force compensation 1.77 2.66 8.57 11.37 9.43 37.24 Dependent on position and speed 1.78 1.44 5.96 11.41 9.15 36.03 Compensation

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The table shows both the MA and MSD values, which can be improved by applying the disturbance compensation force according to the present invention. To understand correctly, it is important to keep in mind that the power correction of speed dependence depends on location and speed. Although the specific embodiments of the present invention have been described above, it is possible to obtain the approval, and the present invention can be implemented in other aspects than the above. All of the above descriptions should not be used to limit the invention. Symbol comparison table 5 acceleration length Acceleration length 7 travel length Travel length 9 scan length Scan length __ _ _ -22·_ This paper scale applies to China National Standard (CNS) A4 size (210 X 297 mm) 1301227 A7 B7

11 target portion length dry mark length 13 slit width slit width 15 deceleration distance 17 exposure exposure 19 very last point of the target portion actual point 31 of the dry mark part set point generator set point generator 33 object table controller object table Controller 35 data storage means data storage mechanism 37 processing means processing mechanism 39 force force 41 position measurement system position measuring system 43 object table object table 45 line connection 47 connection connection 49 force adjustment signal force adjustment signal 51 connection connection BP base frame Base plate, base plate or machine frame C target portion CO condenser Capacitor Ex beam shaping optics Beam shaping optics - FB line Line FF line Line FO force Force IF1 measuring system or interferometer Measurement system or interferometer •twenty three·

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, Line · This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) 1301227 A7 B7 V. Invention description (20) IF2 measuring system or interferometer Measurement system or interferometer IN integrator integrator IL radiation system Radiation system or source LA radiation system or source Radiation system or source ΜΑ mask 光 ΜΤ first object table or mask table first object table or mask table projection beam of radiation projection projection beam or projection System or lens PM processing means processing mechanism PS1 first drive means first drive mechanism PS2 second drive means second drive means W substrate WT second object table or substrate table first object edge or substrate edge _________ -24 - This paper size applies China National Standard (CNS) A4 specification (210 X 297 mm)

Claims (1)

(1) No. of special wealth application, Chinese application for patent scope replacement, this June, 7th, 7th) Driving 97, > ΦΊ Application Patent Park, D3 1 · A lithography projection device, including · _ - radiation system, to provide a radiation Projection beam; - a first object table for holding a patterning mechanism capable of giving a pattern to the projection beam according to a desired pattern; - a second object table for holding a substrate; and - a projection system for Mapping the patterned beam onto a target portion of the substrate; and driving a mechanism for generating a s force to move the first and second directions in a direction in an image operation An object table; characterized by: a data storage mechanism for storing a force on a force of one of the object tables, a function of the position of the object table relative to the projection system; a processing mechanism, which responds to a generation The position information storage mechanism of one of the π δ 物 object table reads the data, and controls the drive mechanism to apply a force to one of the object stages on a plane containing the first direction to compensate the disturbance power . 2. According to the scope of patent application No. 1 / /, σ, the equipment also includes an S measuring system for measuring the position of the object table, and generating the position of the object table signal. 3. According to the scope of the patent application ^ ^ ^, Beizhi sighs, wherein the device also includes a system for controlling the movement of the object half of the object table and for generating the position of the object table. signal. 4. According to the scope of the patent application No. 1, the third item of equipment, including the location of 78957-970612.doc ΐ paper scale suitable for household goods (CNS) Μ specifications (21 () χ .1 - 1301227 patent application scope The institution includes a computing mechanism, a piece of equipment, and a hitting force; a force adjustment signal is generated for the compensation force and the function of the object. The cow-speed is 5. According to the scope of the patent application, the compensation force is *3, , wherein the force adjustment signal 6 (four): the product of the force and the speed of the object table. • According to the device of claim 2 or 3, wherein the data is read and the table is read by a signal of the position of the object table. The two compensating forces; the technical supplements are used to generate a first force adjustment signal directly under the response-compensation force, and the younger one compensating power for the rape 4 3 ▲ is used to generate one as the first A compensating force and a speed of 5 liters and one object table - a number of power adjustment signals; two signals I5 are used to adjust the force exerted by the drive mechanism on the pile of the object, 7 according to the scope of the patent application? 2 or 3 The device, wherein the drive mechanism pushes the object table in at least two degrees of freedom, and the data storage branch is read in response to a signal representative of the position of the object table to the two patching forces, the at least two The compensating force is used to generate a force adjustment signal for adjusting the force exerted by the driving mechanism in the at least two degrees of freedom. & device according to claim 2, 2 or 3, wherein the driving The mechanism pushes the object table in at least two degrees of freedom, and the data storage mechanism reads a compensation force in response to a signal representing the position of the object table at the at least two degrees of freedom. The equipment in the range i, 2 or 3, wherein the driver 78957-970612.doc _ 2 1301227 A8 B8 C8 D8 VI. Patent scope 1 ^ The mechanism includes a short-range motor and a poison-traction motor Pushing the object table, and the force is adjusted to L, adjusting the force exerted by the short-range motor. 10. According to the patent application scope, the first system includes a radiation source. U. The first mechanism is a reticle, and the reticle stage. The device of item 2 or 3, wherein the device of the radiant item 2 or 3, wherein the piece of the object piece is a 12 for retaining the reticle. The device manufacturing method comprises the steps of: preparing a substrate covered by at least a portion of a radiation sensitive material layer for a second object table; preparing a radiation projection beam by using a radiation system; and using a second object holder a clamping mechanism that imparts a pattern of the transverse plane of the shadow beam; driving the two object stages with the driving mechanism; and projecting the patterned radiation beam onto the target portion of the radiation sensitive material layer; Feature: storing a quantity of the disturbed power of one of the object stations to a data remaining mechanism as a function of the position of the object relative to the object of the projection system; reading data from the data storage institution to a processing mechanism for controlling the driving mechanism to apply a force of ~ to one of the object stages on a plane containing the first direction to compensate for the amount of disturbance power, the processor 78 957-970612.doc This paper scale is suitable for @@ _ 准 (CNS) M specifications (10) χ 公 (6) 13 〇 1227 The application for the patent Fan Park can respond to the position signal of the representative (four). The measuring method comprises the following steps: using a driving mechanism in the lithography projection device, pushing at least one object table in a degree of freedom; controlling the driving mechanism to keep the object table at a constant speed in the degree The movement is characterized in that the force applied by the drive mechanism to maintain the constant velocity in the object-degree of freedom is stored in the data storage mechanism as a function of the degree position. R according to the measuring method of claim 13, wherein the position of the object table is controlled to at least one second self-holding of the object table at the at least one second = degree 并将 and will be maintained The object table is in the at least one first constant, force applied by the drive mechanism, in the storage. Less than a first free piece in the first free drive of the machine, to the same degree, the position of the material storage machine 78957-970612.doc This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 PCT) -------