TWI296574B - Ink jet head structure and method of fabricating ink jet head - Google Patents
Ink jet head structure and method of fabricating ink jet head Download PDFInfo
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1296574 五、發明說明(1) 【發明所屬之技術領域】 本發明應用於列印相關產品,技術領域屬半導體製程技術 (semi conductor process)、微機電技術 (microelectromechanical system)與喷墨列印(inkjet p r i n t i n g )技術 〇 【先前技術】 喷墨印頭為列印技術與系統中最重要的元件之一,列印速 度與列印解析度等,均由喷墨印頭之喷嘴數、喷墨微流結 傷尺寸、結構解析度來決定。一般基本於矽半導體製程所 製造出之熱氣泡式喷墨頭(thermal bubble inkjet),使 用之喷墨驅動器(inkjet actuator)為一熱阻(heater), 其印頭解析度為最高且微流尺寸最為精細,HP (Hewlett Packard,美商惠普)、Cano η與Lexmark之喷墨印表機均使 用熱氣泡式印頭,且目前均已推出結構解析度1 2〇〇 npi1296574 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention is applied to printing related products, and the technical field belongs to a semi-conductor process, a microelectromechanical system, and an inkjet printing (inkjet). Printing technology [previous technology] Inkjet printing head is one of the most important components in printing technology and system, printing speed and printing resolution, etc., all by the number of nozzles of inkjet printing head, inkjet microflow The size of the knot and the resolution of the structure are determined. Generally, it is a thermal bubble inkjet manufactured by a semiconductor process. The inkjet actuator used is a heater with the highest resolution and microflow size. The finest, HP (Hewlett Packard, HP), Cano η and Lexmark inkjet printers all use thermal bubble printheads, and now have a structural resolution of 1 2〇〇npi
(nozzles per inch)、喷孔直徑 10um、墨滴尺寸 2 pL (pi co 1 i ter)之產品 〇 Η P之嘴墨微流結構分兩大類:第一為大部份產品所使用之 毛春影法以感光材料1 2 2製作流道,再貼上電鑄喷孔片之方 法:先在喷墨頭晶圓1 1 〇上以微影法與熱阻Π 2作對位、曝 光、並顯影出流道132,再與以電鑄法(electroforming) 形成之金屬喷孔片124(—般是電鑄鎳再鍍金、鉑或鈀) [1 ],作逐一晶片之對位貼合,製作完成喷墨單元1 〇 〇,此(nozzles per inch), nozzle hole diameter 10um, ink droplet size 2 pL (pi co 1 i ter) products 〇Η P nozzle ink microfluidic structure is divided into two categories: the first is the spring photo method used in most products The flow path is made of the photosensitive material 12 2, and the electroformed orifice sheet is attached: firstly, the lithography method is used to align, expose, and develop the flow on the ink jet wafer 1 1 微 by the lithography method. The film 132 is further bonded to the metal orifice sheet 124 formed by electroforming (usually electroformed nickel and then gold plated, platinum or palladium) [1], and the wafer is aligned one by one to complete the inkjet. Unit 1 〇〇, this
第6頁 1296574 說明(2) "~' ""~ 喷墨單元1 Ο Ο剖面示意如第一圖:先前技術一。此法之優點 為嘴孔片可獨立製作並檢驗,良率易於監控,電鑄喷孔片 材料成本較低,但因贺孔片採逐一印頭對位,對位貼合之 自動化設備價格高且產能受限;且因電鑄為等向性沉積 (is〇tropic deposition),其喷孔13〇呈火山錐狀(如第一 圖示),最大印頭解析度只達60 Onpi。第二類為同以微影 法製作流道,但喷孔片改用雷射或準分子雷射穿孔(laser ablation)之p〇lyimide喷孔片,這類喷孔片採逐顆以雷射 精岔穿孔,故HP之此類喷孔片都結合導電用之tab (tape _r automatic bonding)[2],使之具成本效益。Page 6 1296574 Description (2) "~' ""~ The inkjet unit 1 Ο Ο section is shown as the first figure: prior art one. The advantage of this method is that the orifice sheet can be independently produced and inspected, the yield is easy to monitor, and the cost of the electroformed orifice sheet material is low, but since the Hekong sheet is taken one by one, the price of the matching automatic equipment is high. And the production capacity is limited; and because electroforming is istropical deposition, the orifice 13 is volcanic cone-shaped (as shown in the first figure), and the maximum print head resolution is only 60 Onpi. The second type is to use the lithography method to make the flow channel, but the orifice film is changed to laser or excimer laser aperture p〇lyimide orifice film.岔 Perforation, so HP's such orifices are combined with tab (tape _r automatic bonding) [2], making it cost-effective.
Lexmark為使用雷射鑿孔之喷孔片224,與HP最大不同為流 道2 3 2以雷射熱鑿產生,且與喷孔2 3 0結合以兩次對位後雷 射熱鑿喷孔片22 4而成[3],完成喷墨單元200,此喷墨單 元2 0 0剖面示意如第二圖:先前技術二。因後續喷孔片對位 精度不若微影法之對位曝光設備(a 1 igner),故此法需在 喷墨晶片或晶圓2 1 0上另以一感光材料22 6作微影先定義氣 泡室(firing chamber或 bubble chamber)區域,以避免喷 孔片對位貼合時,貼到加熱熱阻2 1 2 ;故L e X m a r k之雷射熱 孔片微流結構需較HP多一層且多一次對位。Can on之 微流結構分墨滴側射式(s i d e s h ο 〇 t)與正射式(f r ο n t shoot, HP、Lexmark皆為此種)兩大類,側射式只用於3 0 0 np i低階印頭產品,正射式貝,J再分以光學穿孔製作喷孔, 搭配微影法(1 i thography )製作流道[4 ] [ 5 ]。其中微影法Lexmark is a perforated orifice 224 using a laser perforation. The maximum difference from HP is the flow passage 2 3 2 by laser hot chisel, and combined with the injection hole 230 to two post-alignment laser hot chisel holes. The sheet 22 is formed [3], and the ink jet unit 200 is completed. The ink jet unit 200 is schematically illustrated as a second figure: prior art 2. Since the alignment accuracy of the subsequent orifice is not as good as the lithography of the alignment apparatus (a 1 igner), the method needs to define a lithography on the inkjet wafer or wafer 210. The area of the firing chamber or the bubble chamber is to avoid the heating resistance 2 2 2 when the orifice sheet is aligned. Therefore, the laser flow micro-flow structure of the L e X mark needs one layer more than HP. And one more match. The on-flow microfluidic structure is divided into two types: sidesh ο 〇t and orthomorphic (fr ο nt shoot, HP and Lexmark). The side shot type is only used for 3 0 0 np i The low-order head product, ortho-beam, J is divided into optical perforations to make nozzles, and the lithography method (1 i thography) is used to make the flow channel [4] [5]. Lithography
第7頁 1296574 •五、發明說明(3) 製作為先以具感光之第一材料( 孔,再以第二材料塗佈,或以雷彳定義流道與喷 第一材料後形成流道與喷孔。此 =f噴孔,去除前 產量遠較HP、Lexmark之逐一對位八、古、、、吏用晶圓製程, 去膜將影響良率,且第二材料之於、口 但第一材料之 覆蓋良率皆為此法之關鍵。 …構強又、對第一材料之 另有以微影法光阻加上電漿蝕刻 汽社椹之方法「fi 1 「7 Ί i柚 穿喷孔’來製作喷墨頭微 肌釔構之方法[6],[7]。其特徵為同樣先在 .310上以感光材料322製作流道332,再以壓ς頭…p日日 (laminate)在流道層上壓合一固態層材料328,、再在前述 固態層上以微影法塗佈喷孔層光阻3 2 4並微影定義出喷孔 3 3 0,最後以電壓蝕刻(plasma etching)、活性離子蝕刻 (reactive i0n etching,簡稱RIE)或耦合式感應電漿蝕 刻(inductive couple plasma etching,簡稱 ICP),從噴 孔層3 2 4上方餘刻前述固態層3 2 8以洞穿出固態層喷孔3 3 4, 以形成完整之噴孔與微流結構3 0 0,此噴墨單元3 〇 〇剖面示 意如第三圖:先前技術三。因需堆疊三層光阻或高分子材 料,再餘刻穿其中一層固態層,在此簡稱『堆疊蝕刻 農』。此法優點亦為晶圓製程產量高,但另需RIE與ICI^ 半導體級精密真空活性氣體設備,且受限於r丨E或丨CP之蝕 刻均勻性,噴孔直徑易受影響。 發明内容Page 7 1296574 • V. INSTRUCTIONS (3) Manufactured with a first photosensitive material (hole, coated with a second material, or defined by a Thunder and a first material to form a flow path Spray hole. This = f spray hole, the output before removal is much better than the HP, Lexmark one-to-one bit eight, ancient,, and 晶圆 wafer process, the film will affect the yield, and the second material is in the mouth but the first The coverage rate of a material is the key to this method. ...Structural strength, another method of lithographic photoresist and plasma etching of the first material "fi 1 "7 Ί i pomelo wear The method of making the inkjet head micro-muscle structure [6], [7] is characterized in that the flow path 332 is first made on the .310 with the photosensitive material 322, and then the pressure head is used...p day ( Laminating a solid layer material 328 on the flow channel layer, and then coating the nozzle layer photoresist 3 2 4 by lithography on the solid layer and defining the nozzle hole 3 3 0 by lithography, and finally applying voltage Plasma etching, reactive ion etching (RIE) or inductive couple plasma etching (IC) P), the solid layer 3 2 8 is left over the orifice layer 3 2 4 to penetrate the solid layer orifice 3 3 4 to form a complete orifice and microfluidic structure 300, the inkjet unit 3 〇 The cross-section is shown in the third figure: prior art 3. Because three layers of photoresist or polymer materials need to be stacked, and then one of the solid layers is engraved, which is referred to herein as “stack etching.” The advantage of this method is also the wafer process. The output is high, but RIE and ICI^ semiconductor-grade precision vacuum reactive gas equipment are required, and the etching uniformity of r丨E or 丨CP is limited, and the orifice diameter is easily affected.
第8頁 1296574 、發明說明(4) =ι、月將提出_以微影法製作喷墨微流結構之流道與喷孔 料 去^較佳之實施例為分別在喷墨熱阻晶圓上以感光材 之2曝光顯影製作流道,以及在另一基板上亦以感光材料 t =光顯影製作噴孔,再將二者對準貼合,將喷孔與原噴 ^ 土板分離,即得完整之喷墨微流結構。 八丄 馬日日圓製程,產能遠較HP、Lexmark之逐顆對位貼 口向’且對位貼合同樣只使用一般晶圓對位曝光機,不需 喷孔片對位貼合機、R I E或I CP等高價之真空活性氣體設 備’為簡單且低成本之微流結構製作方法。 【實施方式】 首先製作喷孔基板5 〇。為避免厚膜光阻塗佈之邊緣影響, 可選用尺寸較喷墨頭晶圓為大之一基板5 2,或搭配去邊緣 光阻製程(edge beam removed,簡稱EBR),以去除晶圓或 基板邊緣之較厚光阻。經清洗烘烤後,先塗佈一分離層5 4 (released iayer),為搭配喷孔層光阻,此分離層選用 M i c r 〇 C h e m之L 0 R s e r i e s非感光性光阻材。L 0 R塗佈烘烤 後,再塗佈喷孔層光阻2 4,依墨滴尺寸與喷孔孔徑需求, 光阻厚度約2 0〜7 5 u m為佳,在此選用Fuji Durimide 7000-魏 r i e s之 photosensitive polyimide,或 MicroChem SU8 3000-series,塗佈後預烤(soft bake)、曝光 (exposure)、顯影(development)以形成喷孔30,如第四 圖(甲)與(乙)示。Page 8 1 129 574, invention description (4) = 1, month will be proposed _ lithography method to make the inkjet microfluidic structure of the flow channel and the orifice material to the preferred embodiment is on the inkjet thermal resistance wafer The flow path is formed by exposure and development of the photosensitive material 2, and the injection hole is also formed on the other substrate by the photosensitive material t=light development, and then the two are aligned and bonded, and the injection hole is separated from the original sprayed soil plate, that is, A complete inkjet microfluidic structure. The gossip horse Japanese yen process, the production capacity is far more than HP and Lexmark's one-by-one positional paste to the 'and the alignment fits only the general wafer alignment exposure machine, no need for orifice alignment bonding machine, RIE Or a high-priced vacuum reactive gas device such as I CP is a simple and low-cost microfluidic structure fabrication method. [Embodiment] First, an orifice substrate 5 is produced. In order to avoid the edge effect of thick film photoresist coating, a larger substrate than the inkjet wafer may be used, or an edge beam removed (EBR) may be used to remove the wafer or Thicker photoresist at the edge of the substrate. After cleaning and baking, a separation layer 5 4 (released iayer) is applied to match the nozzle layer photoresist, and the separation layer is selected as L i R r s e r i e s non-photosensitive photoresist material of M i c r 〇 C h e m . After L 0 R coating baking, the nozzle layer photoresist is applied, and the thickness of the photoresist is about 20 to 7 5 um, depending on the size of the ink droplets and the aperture diameter of the nozzle. Fuji Durimide 7000- is used here. Wei ries photosensitive polyimide, or MicroChem SU8 3000-series, soft bake, exposure, development to form the orifice 30, as shown in the fourth figure (A) and (B) .
第9頁 1296574Page 9 1296574
另於具喷墨驅動元件或熱阻元件1 2之喷墨頭晶圓1 〇製作成 流道晶圓20。此流道層22可選用TOK PR- 1〇〇-series、 MicroChem SU8固態膜光阻,亦可選用液態感光樹脂材 (resin)或p〇ly i rai de材之光阻,光阻厚度依墨滴尺寸噴孔 直徑需求,10〜35um為佳。經塗佈或壓膜(laminate)、曝 光、顯影後形成流道32,再以喷砂(san(i blaster)、雷射 熱鑿(laser ablation)或蝕刻(etching)之方式蝕穿晶圓 以作出與儲墨匣相連之墨水槽4 〇 ( i n k s丨〇 t ),完成此流道 曰曰圓2 0。第五圖(甲)為流道與熱阻元件之上視圖,沿圖中 _’之剖面如第五圖(乙)示。 在此使用微影製程之對位機(a 1 i g n e r )中對位,將上述之 喷孔基板5 0與流道晶圓2 0,利用對位機之壓力或真空使其 對位並貼合,如第六圖所示。為使喷孔層與流道層在對位 時能黏合,可於對位前於噴孔層或流道層表面塗上膠材或 黏著材料;為再增強喷孔層與流道層在對位後之貼合力, 可將上述已對位貼合之喷孔基板連同噴墨頭流道晶圓,經 加熱加壓以進一步促進貼合。 將噴孔基板連同喷墨頭流道晶圓,浸於TMAH (tetra methyl ammonium hyperoxide)溶液中,以溶解先前之 LOR 分離層54,使喷孔層自基板52分離,而附著於流道層22 上,形成本發明之微流結構7 0,如圖七示。Further, an ink jet head wafer 1 having an ink jet driving element or a thermal resistance element 12 is formed into a flow path wafer 20. The flow channel layer 22 can be selected from TOK PR-1 〇〇-series, MicroChem SU8 solid film photoresist, or liquid photosensitive resin (resin) or p〇ly i rai de material, and the thickness of the photoresist is ink. Drop size orifice diameter requirements, preferably 10~35um. The flow channel 32 is formed by coating or laminating, exposing, developing, and then etched through the wafer by sandblasting, laser ablation or etching. Make an ink tank 4 〇 (inks丨〇t) connected to the ink reservoir, and complete the flow path rounding 20. The fifth figure (A) is the upper view of the flow path and the thermal resistance element, along the figure _' The cross section is shown in Fig. 5(B). Here, the alignment device (a 1 igner ) of the lithography process is used to align the above-mentioned orifice substrate 50 and the runner wafer 20 with the alignment machine. The pressure or vacuum makes it align and fit, as shown in the sixth figure. In order to make the orifice layer and the runner layer adhere when they are aligned, the surface of the orifice layer or the runner layer can be coated before the alignment. The adhesive material or the adhesive material; in order to reinforce the adhesion of the spray hole layer and the flow channel layer after the alignment, the above-mentioned aligned orifice substrate and the inkjet head flow channel wafer may be heated and pressurized To further promote the fit. Immerse the orifice substrate together with the inkjet head flow channel wafer in a TMAH (tetra methyl ammonium hyperoxide) solution to dissolve the previous The LOR separation layer 54 separates the orifice layer from the substrate 52 and adheres to the flow channel layer 22 to form the microfluidic structure 70 of the present invention, as shown in FIG.
第10頁 1296574 五、發明說明(6) 以上所敘述之實施例為可達成本案之方法之一,可達成本 案之步驟、製程參數,分離層、喷孔層與流道層所選用之 材料則不以此為限。 參考文獻: [1 ]US patent 47 9 1 43 6.Page 10 1 129 574 V. INSTRUCTIONS (6) The above-described embodiments are one of the methods for reaching the cost case, the steps up to the cost case, the process parameters, the materials selected for the separation layer, the orifice layer and the runner layer. Not limited to this. References: [1] US patent 47 9 1 43 6.
[2]US patent 5305018..[2]US patent 5305018..
[3 ] James M. Mrvos, e t. a 1.,丨,Measurement of modulus changes of a phenolic adhesive using nano -dentation for an inkjet printhead nozzle plate"C. M. Hong and S Wagner, "Inkjet Printed Copper Source/Dra i n Metallization for Amorphous Silicon Thin-Film Transistors", in Proceeding of IS&T NIP-17, p. 387, 2001.[3] James M. Mrvos, e t. a 1., 丨, Measurement of modulus changes of a phenolic adhesive using nano -dentation for an inkjet printhead nozzle plate"CM Hong and S Wagner, "Inkjet Printed Copper Source/Dra In Metallization for Amorphous Silicon Thin-Film Transistors", in Proceeding of IS&T NIP-17, p. 387, 2001.
[4] US patent 5948290.[4] US patent 5948290.
[5] US patent 6390606· [6] US patent 6773094 [7] US patent 6364455.[5] US patent 6390606. [6] US patent 6773094 [7] US patent 6364455.
第11頁 1296574 «式簡單說明 【圖式簡單說明】 第一圖先前技術一之喷墨微流結構之剖面示意圖。 第二圖先前技術二之喷墨微流結構之剖面示意圖。 第三圖先前技術三之喷墨微流結構之剖面示意圖。 第四圖(甲)本發明之喷孔基板製作步驟一剖面示意圖。 第四圖(乙)本發明之喷孔基板製作步驟二剖面示意圖。 第五圖(甲)本發明之流道晶圓上視示意圖。 第五圖(乙)本發明之流道晶圓剖面示意圖。 第六圖本發明之喷孔基板與流道晶圓對位貼合之剖面示 _圖。 第七圖將喷孔基板分離後之本發明喷墨微流結構之剖面 示意圖。 【主要元件符號說明】 1 〇喷墨驅動元件晶圓 1 2喷墨驅動元件、 2 0本發明之流道晶圓或晶片 2 2流道層 2 4喷孔層 •喷孔 3 2流道 4 0墨水槽 5 0本發明之喷孔基板 5 2用於製作喷孔之基板Page 11 1296574 «Simple description of the description [Simplified description of the drawings] The first figure shows a schematic cross-sectional view of the inkjet microfluidic structure of the prior art. 2 is a schematic cross-sectional view of the inkjet microfluidic structure of the prior art. The third figure is a schematic cross-sectional view of the inkjet microfluidic structure of the prior art III. Figure 4 (a) is a schematic cross-sectional view showing the steps of fabricating the orifice substrate of the present invention. FIG. 4(B) is a schematic cross-sectional view showing the second step of the fabrication of the orifice substrate of the present invention. Figure 5 (a) is a schematic top view of the flow channel wafer of the present invention. Figure 5 (b) Schematic diagram of the flow channel wafer of the present invention. Fig. 6 is a cross-sectional view showing the alignment of the orifice substrate of the present invention and the flow channel wafer. Figure 7 is a schematic cross-sectional view showing the ink jet microfluidic structure of the present invention after the orifice substrate is separated. [Description of main component symbols] 1 〇 inkjet driving device wafer 1 2 inkjet driving device, 20 channel wafer or wafer of the invention 2 2 channel layer 2 4 orifice layer • orifice 3 2 runner 4 0 ink tank 50 0 The orifice substrate 5 2 of the present invention is used to make a substrate for the orifice
第12頁 1296574 爾式簡單說明 5 4分離層 7 0本發明之喷墨微流結構 1 0 0先前技術一之喷墨微流結構 1 1 0先前技術一之喷墨驅動元件晶圓或晶片 1 1 2先前技術一之噴墨驅動元件 1 2 2先前技術一之流道層 1 2 4先前技術一之喷孔層 1 3 0先前技術一之喷孔 1 3 2先前技術一之流道 _ 0先前技術二之喷墨微流結構 2 1 0先前技術二之喷墨驅動元件晶圓或晶片 2 1 2先前技術二之喷墨驅動元件 224先前技術二之喷孔層 2 2 6先前技術二之定義氣泡室之感光材料 2 3 0先前技術二之喷孔 2 3 2先前技術二之流道 3 0 0先前技術三之喷墨微流結構 3 1 0先前技術三之喷墨驅動元件晶圓或晶片 3 1 2先前技術三之喷墨驅動元件 A 2先前技術三之流道層 3 24先前技術三之喷孔層 3 2 8先前技術三之固態層 3 3 0先前技術三之喷孔 3 3 2先前技術三之流道Page 12 1296574 Simple Description 5 4 Separation Layer 7 0 Inkjet Microfluidic Structure of the Invention 1 0 0 Prior Art 1 Inkjet Microfluidic Structure 1 1 0 Prior Art 1 Inkjet Driving Element Wafer or Wafer 1 1 2 prior art inkjet driving element 1 2 2 prior art one channel layer 1 2 4 prior art one orifice layer 1 3 0 prior art one orifice 1 3 2 prior art one channel _ 0 Prior art inkjet microfluidic structure 2 1 0 prior art inkjet driving component wafer or wafer 2 1 2 prior art 2 inkjet driving component 224 prior art 2 orifice layer 2 2 6 prior art 2 Photosensitive material defining a bubble chamber 2 3 0 prior art orifice 2 2 2 prior art 2 flow channel 3 0 prior art three inkjet microfluidic structure 3 1 0 prior art three inkjet drive component wafer or Wafer 3 1 2 Prior Art 3 Inkjet Drive Element A 2 Prior Art 3 Channel Layer 3 24 Prior Art 3 orifice layer 3 2 8 Prior Art 3 Solid Layer 3 3 0 Prior Art 3 orifice 3 3 2 prior art three flow channels
第13頁 1296574 •圖式簡單說明 3 3 4先前技術三之固態層喷孔 3 4 0墨水槽 ΙΙΙΗΗΙ 第14頁Page 13 1296574 • Brief description of the diagram 3 3 4 Solid state orifices of the prior art 3 3 0 0 ink tank ΙΙΙΗΗΙ page 14
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