TWI286329B - Recoverable over-current protection device and its manufacturing method - Google Patents

Recoverable over-current protection device and its manufacturing method Download PDF

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TWI286329B
TWI286329B TW93133393A TW93133393A TWI286329B TW I286329 B TWI286329 B TW I286329B TW 93133393 A TW93133393 A TW 93133393A TW 93133393 A TW93133393 A TW 93133393A TW I286329 B TWI286329 B TW I286329B
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Taiwan
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layer
overcurrent protection
plating
fabricating
granular
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TW93133393A
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Chinese (zh)
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TW200615980A (en
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Chang-Wei He
Yung-Yi Jang
Shang-Chi Juang
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Sea & Land Integrated Corp
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Abstract

A kind of recoverable over-current protection device and its manufacturing method are disclosed in the present invention. The invention is composed of the followings: providing a lamination layer body that includes at least two conductive polymer layers, in which at least one inner electrode layer is disposed and spaced at intervals inside the conductive polymer layer, and the upper and the lower electrode layers are disposed outside two outmost conductive polymer layers; alternately disposing the isolation grooves formed between two adjacent electrode layers so as to divide and define plural particle-shaped devices; coating the insulation layer on both the upper and the lower electrodes to cover the isolation groove; performing the dicing step to form plural particle-shaped devices such that each particle-shaped device is provided with two curve-shaped end faces symmetrical to each other; and electroplating both left and right electrodes to cover two curve-shaped end faces of the particle-shaped device and have an electrical connection with the upper and the lower electrode layers, respectively, so as to form the reversible over-current protection device.

Description

1286329 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一種可復式過電流保護元件及其製作 方法,尤其是一種利用正溫度係數之導電性高分子聚合物 (Polymer Positive Temperature Coefficient, PPTC) 材料所製作之正溫度係數熱敏電阻元件之製作方法及其裝 【先前技術】 高分子基正溫度係數熱敏電阻元件( 粒子等等)、高分子基材、以及添加鮮所組成,溫度或電 流的增加將同時提高元件之電阻抗值,而#溫度或電流的 狀況解除後,元件電阻抗值恢制縣之低阻抗狀態,是 以,高分子ί正溫度係數熱敏電阻元件亦可稱為“可復式 凡件’即高分子聚合物城開關之4,主要祕小功率 電子設備的短路及過電流賴。該PPTG熱敏電阻之业型應 用包括電腦週邊(如USB埠)、電信設備、二次充電電池 池匡)、電源、汽車電子(如汽車啟動器)及變壓器等領 之電路保護應用。其讀顧請參考第—圖所*,在正常 溫度下,該S分子基材將導電填充材錄㈣束縛於其結 晶狀的結構内,構成一種低阻抗(100歐姆-公分以下 歐姆以下,或丨歐姆_公分以下)鏈鍵,電流藉順利 通過該導電填充材緊密連接之微粒保持電路通路,且不合 改變該高分子基材的晶狀結構;然:而,當電流急劇增曰, 過多的熱量便會魏PPTG滅電_溫度純短時間内 1286329 迅速上升,當溫度高過一預定值時,該高分子基材由結晶 狀變成無定形狀,這時被束缚在該高分子基材上之該導電 填充材微粒便會分離,該PPTC熱敏電阻的阻抗迅速提高, 使通過的電流在極短時間内變小,其電路如同斷開,進而 達到保護目的;待過電流之狀況排除後,該高分子基材由 無定形狀再度轉變回結晶狀,這時導電填充材微粒之間的、 鏈=又域建立,俾使該PPTG熱敏電_阻抗紐低阻抗, 狀L上述之動作原理係基於能量守恒,當電流通過該 P^rc熱敏電阻時,射PTG熱敏電阻所產生的熱會散發至 環境中或提高其熱敏電阻本身的溫度;如第一圖之第】點# ^ 2點所示之溫度,係表示該ppTC熱敏電阻處於電流或 裱境溫度的增加不顯著時所能達到之平衡。當電流或環境 溫度進:步提高時,該PPTC熱敏電阻會達到如第一圖之第 3點之臨界溫度,此階段中很小的溫度變化就會造成阻抗 大幅提高.,一旦溫度超過第3點將導致該PPTC熱敏電阻呈 跳=(Trip)狀態,阻抗迅速增加至第一圖之第4點之作 動/皿度以限制了電流的通過,進而保護相關設備免於損壞。 般衣,PPTC熱敏電阻之步驟,係包括各家廠商獨門_ =方(包3向分子聚合物,導電性填充物與添加劑等)、在 ,當溫度之下將該配方混煉製作呈板狀、利用上下兩金屬 =反(、般為鎳板、鍍鎳銅板或鎳銅合金)夾製該板狀配 運用各種技術令上述之金屬板形成兩上下電極, 完成一正溫度係數熱敏電阻元件。其中,配方掌控材 二ΐ ’其攸關於該PPTC熱敏電阻之阻抗、跳脫能力與回 =:特性,是以配方為各家廠商研發機密;然熱敏 ”之阻抗不僅與面分子聚合物結晶特性、導電性填充物 1286329 J度目關制f與製板厚度以及兩上下電極交疊面積有 山 耘中尚有高分子聚合物與金屬板之間的結合 化與以作方式、成形加卫製程後的内應力、客戶端 應用之^祕射靠性等卫法與問題需要考慮。 /匕外,因應電子器材輕薄短小之訴求,表面黏著式電 子兀件的尺寸以逐漸由12〇6精進為〇6〇3、0402、甚至02(^ 等規格,是以,較高阻抗之PPTC熱敏電阻在尺寸上無法朝 平面尺=(如·長、I)發展’便須以堆疊的方式與變化 7G件的南度,藉雙層或多層的並聯封裝方式來達到多層 ρρ=熱敏電阻的需求;相較於單層ppTC熱敏電阻,具有 更咼的工作電流之能力(較高的跳脫電流餘裕),且多層 PPTC熱敏電阻佔用於電路板上所需的表面積(red此如 surface yea)較單層即亿熱敏電阻更小;惟,當堆疊層數 越來越高時,多層PPTC熱敏電阻兩端電極的熱效應會越來 越明顯,過多的熱聚效應不僅存在觸發該多層ppTC熱敏電 阻跳脫的風險,多餘的熱應力對於元件本身而言可能影響 的疋更長达的可罪度之表現,是以,部分應用於習知單層 結構之製作技術,恐無法應付堆疊所帶來的熱聚效應。 请參閱第二A圖至第二F圖所揭露之美國專利us 6, 348, 852號之第一習知,係揭露至少三鍍鎳電鍍銅箔板 1 a上預先形成有複數個齒梳狀溝槽^ 〇 a,且該三鍍鎳 電鑛銅箔板1 a交錯夾擠至少兩層正溫度係數導電性高分 子材料2 a (以下稱PPTC材料),且該三鍍鎳電鍍銅箱二 1 a上之該齒梳狀溝槽(grooves)丄〇 a方向互相交錯且 呈交疊狀態(如第二A圖);再於夾製完成之板狀基材上切 割(dice)有複數個通道(openings) 1 1 a,盆貫穿兮 1286329 二兩鎳板1 a、且該通道1 1 a與該齒梳狀溝槽1 〇 a兩 兩間雜設置(如第二B圖);然後以網印塗覆一層環氧基修 飾壓克力樹脂保護膠4 a蓋住該齒梳狀溝槽1 〇 a但露出 該齒梳狀溝槽1 〇 a之部分齒部(如第二c圖);塗覆環氧 基修飾壓克力樹脂保護膠4 a之後進行鎳電鑛,該通道1 1 a内與上下鎳板ia之外表面均覆有鎳層(如第二〇 圖);完成鎳電鍍後將板狀基材切割成粒狀基材,始完成單 顆雙層之PPTC熱敏電阻(如第二E圖)。如第二E圖所示 之該PPTC熱敏電阻結構,該通道1 1 a係由切割刀 (dicing blade)加工且呈直線狀;如上所述,ppTC熱敏 電阻之阻抗與上下電極交疊面積有關,其交疊面積越大則 阻抗越小,然第一習知之上下電極交疊面積係由該通道工 1 a與該齒梳狀溝槽1 〇 a互相框圍決定,該通道1 1 a 與該齒梳狀溝槽1 〇 a呈平直線狀則表示在此結構上決定 了較小的交疊面積(因浪費近端電極處的PPTC材料),由 上述可知較小之交疊面積決定較大之元件電阻抗值,則距 離由pptc材料配方所決定的跳脫電流(tripcurrent)的 餘裕減少,進而限縮PPTC熱敏電阻的應用範圍。 請參閱第三A圖至第三g圖所揭露之美國專利us 6, 242, 997號之第二習知,其先進行兩鎳板1 b上下夾擠 PPTC材料2 b呈板狀基材之後,製作出至少兩組織板狀基 材,各板狀基材針對鎳板1 b餘刻出槽道1 〇 b,兩兩板 狀基材之槽道1 0 b係呈交錯設置,且最外部之板狀基材 之外層鎳板1 b係保持平整,即不進行蝕刻(請同時參閱 弟二A圖與弟二B圖)’其中,該鎳板1 b之該槽道1 〇匕 之蝕刻示意圖,請參閱第三B /圖;將該板狀基材壓製成 1286329 一層壓體(如第三c:圖);將板狀基材貫穿有複數溝槽工工 =(slots)(如第三d圖);進行銅電鍍,銅層3 b除鍍在 最外層之兩鎳板1 b外,尚鍍在該溝槽1 1 b内,俾使該 三鎳板1 b藉該銅層3 b呈交錯電性相連(如第三^:圖); 再進行蝕刻將最外層之該兩鎳板i b分別蝕刻出一道分隔 槽1 2 b,形成由該分隔槽丄2 b隔絕之上下電極(如第 二=圖);於最外層之該兩鎳板i b上塗覆一層保護層4 b 覆蓋住該分隔槽1 2 b (如第三G圖);;最後在銅層3b 之外電鍍錫層5 b (如第三η圖);並將板狀基材切割呈粒 狀’始完成單顆多層之PPTC熱敏電阻(如第三1圖)。如 同第一習知之PPTC熱敏電阻結構,兩上下電極交疊面積係 由上下兩該分隔槽1 2 b互相框圍決定,該兩分隔槽工2 b王平直線狀則同樣表示浪費近端電極處的ppTC材料,由 上述可知較小之交疊面積決定較大之元件電阻抗值,則距 離由PPTC材料配方所決定的跳脫電流(廿的 餘t減少,進而限縮PPTC熱敏電阻的應用範圍。此外,第 -習知之PPTC Μ敏電阻之端電極部分係藉由電鍵於該溝 ,1 1 b内之該銅層3 b與該錫層5 b形成,以達成兩相 f上下鎳板1 b之電性連接,然此結構之ppTC熱敏電阻容 ^ f端電極過小而有抓錫力不佳(poor so 1 derab i 1 i ty) 或芙^於進行迴焊過程時亦遭致如不上錫(de—wetting) 。阻iG=p=nllifting)等’再再影響㈣熱 咬▲、、客戶為應用之實用性與可靠性。1286329 IX. Description of the Invention: [Technical Field] The present invention relates to a multiplexable overcurrent protection device and a method for fabricating the same, and more particularly to a polymer positive temperature coefficient (Polymer Positive Temperature Coefficient) PPTC) A method for fabricating a positive temperature coefficient thermistor element made of a material and a device thereof [Prior Art] A polymer-based positive temperature coefficient thermistor element (particles, etc.), a polymer substrate, and a fresh-made composition, The increase of temperature or current will increase the resistance value of the component at the same time, and after the temperature or current condition is removed, the component impedance value will be restored to the low impedance state of the county. Therefore, the polymer ί positive temperature coefficient thermistor component is also It can be called “replicable piece”, that is, polymer polymer city switch 4, the main secret small power electronic equipment short circuit and over current. The PPTG thermistor industry applications include computer peripherals (such as USB port), Circuit protection for telecommunications equipment, secondary rechargeable battery packs, power supplies, automotive electronics (such as automotive starters) and transformers For reference, please refer to the figure--, at normal temperature, the S molecular substrate is bound to the conductive structure (4) in its crystalline structure to form a low impedance (100 ohm-cm or less ohms or less). , or 丨 ohm _ cm or less) chain key, the current maintains the circuit path by the particles closely connected by the conductive filler, and does not change the crystal structure of the polymer substrate; however: when the current sharply increases, Excessive heat will extinguish the PPTG. The temperature rises rapidly in 1286329. When the temperature is higher than a predetermined value, the polymer substrate changes from crystalline to amorphous, and is bound to the polymer substrate. The conductive filler particles are separated, and the impedance of the PPTC thermistor is rapidly increased, so that the passing current becomes smaller in a very short time, and the circuit is disconnected, thereby achieving the protection purpose; After that, the polymer substrate is again transformed into an amorphous shape by an amorphous shape. At this time, the chain between the conductive filler particles and the domain is established, so that the PPTG thermistor _ impedance has a low impedance, and the shape L The action principle is based on energy conservation. When the current passes through the P^rc thermistor, the heat generated by the PTG thermistor will be emitted to the environment or increase the temperature of the thermistor itself; as shown in the first figure. The temperature indicated by the second point is the balance that can be achieved when the ppTC thermistor is not significantly increased in current or ambient temperature. When the current or ambient temperature is increased: the PPTC heat is increased. The varistor will reach the critical temperature as point 3 of the first figure. A small temperature change in this phase will cause a significant increase in impedance. Once the temperature exceeds the third point, the PPTC thermistor will jump = (Trip). State, the impedance is rapidly increased to the 4th point of the first figure of the actuation / dish to limit the passage of current, thereby protecting the relevant equipment from damage. The general clothing, PPTC thermistor steps, including the individual manufacturers _ = square (including 3 molecular polymer, conductive fillers and additives, etc.), at the temperature of the formula is mixed into a board Shape, use the upper and lower metal = reverse (usually nickel plate, nickel-plated copper plate or nickel-copper alloy) to clamp the plate. Use various techniques to form the above-mentioned metal plate to form two upper and lower electrodes to complete a positive temperature coefficient thermistor. element. Among them, the formula palm control material ΐ 'the other about the PPTC thermistor impedance, tripping ability and back =: characteristics, is based on the formula for the research and development of confidentiality; Crystallization characteristics, conductive filler 1286329 J degree and the thickness of the board and the overlap area of the two upper and lower electrodes. There is still a combination of polymer and metal plate in the hawthorn. The internal stress after the process, the security of the client application, and other issues need to be considered. / In addition, in response to the light and short appeal of electronic equipment, the size of the surface-adhesive electronic components is gradually improved by 12〇6. For 〇6〇3, 0402, or even 02 (^ and other specifications, the higher impedance PPTC thermistor can not be developed in the size of the plane ruler = (such as · long, I)' must be stacked Changing the south degree of 7G parts, the double-layer or multi-layer parallel packaging method is used to achieve the requirement of multi-layer ρρ=thermistor; compared with the single-layer ppTC thermistor, it has the ability to work more smoothly (higher jump) De-current margin) and multi-layer PPTC The varistor occupies the required surface area for the board (red such as surface yea) is smaller than the single layer or tens of thermistor; however, when the number of stacked layers is higher and higher, the electrodes at both ends of the multilayer PPTC thermistor The thermal effect will become more and more obvious. Excessive heat accumulation effect not only has the risk of triggering the multi-layer ppTC thermistor tripping, but the excess thermal stress can affect the component itself. In part, it is applied to the fabrication technology of the conventional single-layer structure, and it is impossible to cope with the heat polymerization effect brought by the stack. Please refer to US Patent No. 6, 348, 852 disclosed in Figures 2A to 2F. Firstly, it is disclosed that at least three nickel-plated electroplated copper foil sheets 1 a are pre-formed with a plurality of toothed comb-shaped grooves ,a, and the three nickel-plated electro-ceramic copper foil sheets 1 a are interlaced at least two layers. Positive temperature coefficient conductive polymer material 2 a (hereinafter referred to as PPTC material), and the teeth of the three nickel-plated copper plating tanks 1 a are staggered and overlapped (as shown in Figure A); cutting on the plated substrate Dice) has a plurality of channels (openings) 1 1 a, the basin runs through the 1286329 two nickel plates 1 a, and the channel 1 1 a and the tooth comb groove 1 〇 a two or two miscellaneous settings (such as the second B Then, a layer of epoxy-modified acrylic resin protective adhesive 4a is coated with a screen printing to cover the toothed comb-shaped groove 1 〇a but exposes a portion of the tooth portion of the tooth-shaped groove 1 〇a (eg, 2 c)); coating the epoxy-modified acrylic resin protective adhesive 4 a after the nickel electro- ore, the outer surface of the channel 1 1 a and the upper and lower nickel plate ia are covered with a nickel layer (such as the second map) After completing the nickel plating, the plate-shaped substrate is cut into a granular substrate, and a single double-layer PPTC thermistor (such as the second E diagram) is completed. As shown in the second E diagram, the channel 1 1 a is processed by a dicing blade and is linear; as described above, the impedance of the ppTC thermistor and the overlapping area of the upper and lower electrodes Relatedly, the larger the overlap area is, the smaller the impedance is. However, the first upper electrode overlap area is determined by the channel 1 a and the tooth comb groove 1 〇 a, and the channel 1 1 a A flat line with the comb-like groove 1 〇a indicates that a small overlap area is determined in this structure (by wasting the PPTC material at the proximal electrode), which is determined by the above-mentioned small overlap area. The larger component resistance value reduces the margin of the tripcurrent determined by the pptc material formulation, which in turn limits the application range of the PPTC thermistor. Referring to the second prior art of U.S. Patent No. 6,242,997, the disclosure of which is incorporated herein by reference to the entire disclosure of the entire disclosures of , at least two tissue plate-shaped substrates are prepared, and each of the plate-shaped base materials has a groove 1 〇b for the nickel plate 1 b, and the channels 10 b of the two plate-shaped base materials are staggered and outermost The plate-shaped substrate outer layer nickel plate 1 b is kept flat, that is, it is not etched (please refer to both the second and the second and B) (wherein the etching of the channel of the nickel plate 1 b) For a schematic view, please refer to the third B / diagram; press the plate-shaped substrate into 1286329 a laminate (such as the third c: figure); the plate-shaped substrate is penetrated by a plurality of grooves = (slots) (such as 3d)); performing copper electroplating, the copper layer 3b is plated on the outermost two nickel plates 1b, and is still plated in the groove 1 1 b, so that the three nickel plates 1 b are borrowed from the copper layer 3 b is connected in a staggered manner (such as the third ^: figure); etching is further etched the outermost two nickel plates ib respectively to a separation groove 1 2 b, forming the upper and lower electrodes separated by the separation groove 丄 2 b ( As the second = Applying a protective layer 4 b to the outermost layer of the nickel plate ib to cover the separation groove 1 2 b (as shown in the third G diagram); and finally plating the tin layer 5 b outside the copper layer 3b (as in the first Three η map); and the plate-shaped substrate is cut into a granular shape to complete a single multi-layer PPTC thermistor (as shown in Figure 3). As in the first conventional PPTC thermistor structure, the overlapping areas of the upper and lower electrodes are determined by the upper and lower partitioning grooves 1 2 b, and the two dividing grooves 2b are flat and straight, which means waste of the proximal electrode. At the ppTC material, it is known that the smaller overlap area determines the larger component resistance value, and the trip current determined by the PPTC material formulation is reduced (the remaining t of the 廿 is reduced, thereby limiting the PPTC thermistor) In addition, the terminal electrode portion of the first-known PPTC varistor is formed by the electric bond to the groove, and the copper layer 3 b in the 1 1 b is formed with the tin layer 5 b to achieve two-phase f upper and lower nickel The electrical connection of the board 1 b, but the ppTC thermistor of the structure is too small and has poor holding power (poor so 1 derab i 1 i ty) or Fu ^ is also subjected to the reflow process If it is not tin (de-wetting). Resistance iG = p = nllifting), etc. 'Re-influence (four) hot bite ▲, customer application and reliability.

UiToL閱第四A圖至第圖所揭露之美國專利us , 5 c ^ ^兩PPTC材料2 c形成板狀基材之後(請同時參閱 1286329 第四A圖與第四B圖);將板狀基材貫穿有陣列狀孔軸1 1 c (如第四C圖);進行鎳層電鍍約1〇〜2〇微米厚,再 電鍍約10〜20微米厚的銅層,該通道孔軸1 l c内與最 外層之該兩銅箔板1 c均覆有鎳-銅層4 c (如第四d 圖),俾使最外層之該兩銅箔板1 c藉該鎳—銅層4 c電性 相連,進行姓刻將最外層之該兩銅箔板1 C (連同該錄— 銅層4 c )分別姓刻出一道分隔槽1 2 c (如第四E圖); 於隶外層之該兩銅治板1 b上塗覆一層保護層5 c覆蓋住 該分隔槽12c (如第四F圖);進行鎳電鍍,令該銅層4 c上除保濩層5 c覆盍之面積之外均覆有錄層6 c (如第 四G圖);最後,並將板狀基材切割呈粒狀,始完成單顆多 層之PPTC熱敏電阻(如第四Η圖)。該分隔槽1 2 c係以 曲狀方式蝕刻,可較充分利用到近端電極處的ppTC材料, 解決苐一習知與第二習知所遭遇之問題,然,第三習知之 PPTC熱敏電阻之端電極部分係藉由電鍍於該孔軸1工c 内之該鎳-銅層4 c與該鎳層6 c形成,以達成兩上下簡隔 金屬箔電極板1 c之電性連接,然此結構之pptc熱敏電阻 容易因兩端電極過小而有抓錫力不佳(P〇〇r solderability)的問題,於進行迴焊過程時亦遭致如不上 錫(de-wetting)或墓碑效應(c〇mp〇nent lifting)等, 因為孔轴電鍍有其困難度,該鎳-銅層4 c或鎳層6 c的電 鍍效果無法達其所需之緻密性(fineness),甚至可能造成 更嚴重之該鎳-銅層4 c或該鎳層6 c剝落(cracked jointing)、客戶端應用於迴焊後内應力不均造成本體破裂 (component cracking)等等;此外,該孔軸i i c之表 面積不大,以致當此結構之PPTC熱敏電阻應用於一般電路 1286329 板上時,通過電流容易被表面積較小之孔軸 產生熱量蓄積之情況,致使PPTC熱敏電阻交且+二限制而 過雷、古e N 易在尚未發生 、電々丨l ( 〇ver-current )負載時突破跳脫 · current),再再影響卯咒熱敏電阻後續於 々丨L (^ιρ 用性與可靠性。 、尸舄應用之實 之運Γ&Γ人錢上述缺失,乃潛心研究並配合學理 種設計合理且廣泛且有效改善上述缺失之 【發明内容】 _ 件及==主要目的在於提供一種可復式過電流保護元 件及其製作方法,係可提高熱傳導效應,提高散熱效果, =免外在溫度或設計不良的熱量累積影響產品特性與應 本發明之次一目的在於提供一種可復式過電流保護元 件及其製作方法,係保持上下電極最大之有效(交疊)面 積,當有效面積越大則該元件之阻抗越小,則距離由PPTC 材料配方所決定的跳脫電流(trip⑶厂⑼七)的餘裕較大,鲁 俾使PPTC熱敏電阻的應用範圍更為寬廣。 本發明之再一目的在於提供一種可復式過電流保護元 件及其製作方法,係可避免烊接後在元件内部殘留内應 力,從而避免本體破裂。 〜 本發明之另一目的在於提供一種可復式過電流保護元 件及其製作方法,增加電鍍與焊接表面積,提高鏵錫特性 (good solderability),避免不上錫(de-wetting)或墓 1286329 碑效應(component lifting)等問題產生。 為了達成上述目的,本發明提供一種可復式過電流保 護元件,係包含層壓體(laminated body)、左右端電極、 以及上下絕緣層。該層壓體係包含至$ 一導電性高分子 層、設置於該導電性高分子層之上下側之上下電極層、選 Jf性設置及鄰設於該導電性高分子層之至少一内電極;其 中’該層壓體係具有互相對稱之左右兩曲形端面(curved sidewal 1 );該導電性高分子層係具有正溫度係數 (Positive Temperature Coefficient)特性。該左右端 電極係分別包覆該層壓體之該兩曲形端面,且分別電性連 接至该上下電極層以及該内電極層,該上下電極層以及該 内電極層係呈隔層電性連接。該上下絕緣層係分別覆蓋於 該層壓體之上下表面且填滿於該左右端電極之間;其中, 该上下電極層之左右兩端面係對應至該層壓體之左右曲形 端面而呈互相對稱之曲形。 為了達成上述目的,本發明提供之該層壓體(laminated bod^y),係包含複數導電性高分子層、間隔設置於兩兩導電 性南分子層内之至少—内電極層、以及設置於最外層之導 電性高分子層之外侧之兩上下電極層。 為了達成上述目的,本發明提供一種可復式過電流保 護元件之製作方法,其步驟包κ a)置備兩電極層失擠 -導電性南分子層形成—單體;(b)分別細複數隔絕槽 於該單體之該兩電極層;(e)準備至少兩該單體與至少一 該導電性高分子層互彳目_設置並夾㈣成—層壓板體 (laminated sheet);其中該等電極層均蝕刻有複數隔絕 槽’兩兩相鄰之該電極層成形之該等隔絕槽互相交錯設 12 1286329 置,藉以區隔定義出複數粒狀元件,且該隔絕槽係呈曲形; (d)按預定圖樣設置切割格線於上下兩電極層,該切割 格線係包括複數條連續性縱向曲線以及複數條不連續性橫 向直線,兩兩相鄰之該縱向曲線係互相對稱;(e )塗覆絕 緣層於該上下兩電極並覆蓋住該上下隔絕槽;(f )製作該 層壓板體成複數粒狀元件,每一粒狀元件係具有互相對稱 之左右兩曲形端面(curved sidewal 1);以及(g)電鑛 左右端電極以包覆每一粒狀元件之該兩曲形端面上,且分 別父錯地電性連接至該等電極層;其中該等電極層係呈隔 層電性連接。 為了達成上述目的,本發明提供一種可復式過電流保 護元件之製作方法,其步驟包含a )置備單一電極層夾 擠單二導電性高分子層形成一單體;(b )蝕刻複數隔絕槽 於該單體之該電極層;(c )依序堆疊至少兩該單體與另一 電極層夾擠形成一層壓板體(laminatedsheet);( d )蝕 刻複數隔絕槽於該層壓板體之該等電極層,,兩兩相鄰之 該等隔絕槽互相交錯設置,藉以區隔定義出複數粒狀元 件,且該隔絕槽係呈曲形;(e )按預㈣樣設置切割格線 於上下兩電極層,該切割格線係包括複數條連續性縱向曲 線以及複數條*連續性橫肖錄,1^相鄰线縱向曲線 係互相對稱;(f )塗覆絕緣層於該上下兩電極並覆蓋住該 上下隔絕槽;(g)製作該層壓板體成複數粒狀元件,每一 粒狀元件係具有互相對稱之左右兩曲形端面(咖_ sidewall);以及(h )電鍍左右端電極以包覆每—粒狀元 件之兩端面上,且分別交錯地電性連接至該等電極層。 為了達成上述目的,本發明提供一種可復式過電流保護元 13 1286329 件之製作方s,其步驟包含:(a )置備兩電極層夹擠一導 ,性南分子層形成-單體;(b )分別㈣複數隔絕槽於該 單體之該兩電極層;(C )準備至少兩該單體與至少該導 電性咼分子層互相間隔設置並夾擠形成一層壓板體 ( laminated sheet);其中該等電極層均蝕刻有複數隔絕 槽,兩兩相鄰之該電極層成形之該等隔絕槽互相交錯設 置,藉以區隔定義出複數粒狀元件,且該隔_係呈曲形; (d ) 设置陣列式孔洞貫穿該 層屢板體,其中該層壓板體之上下兩電極層係預切有格 線,該孔洞係落於該格線之交點;(e )塗覆絕緣層於該上 下兩電極並覆蓋住賴f )製作該錢板體成複數 沒狀7G件’每-粒狀it件胁兩端面具有互相對稱之貫穿 孔土,以及(g)電鍍左右端電極以包覆每—粒狀元件之 兩端面上,且分別交錯地電性連接至該等電極層。 ,了達成上述目的’本剌提供—種可復細€流保護元 件之製作方法,其步驟包含:(a)置料—電極層夾擠單 Γ導電性高分子層形成—單體;(b)_複數隔絕槽於該 早體之該電極層;(e)依序堆疊至少兩該單體與另一電極 層夾擠形賴層壓板體;(d )_複數隔_於該層壓板 體之該等電極層;其巾㈣相鄰之該電極層顏之該隔絕 槽互相交錯設置,藉以區隔定義出複數粒狀元件,且該隔 ,係呈曲形;(e )設置陣列式孔洞(drilHng h〇les) 貫穿該層壓板體,.其中該層壓板體之上下兩電極層係預切 有格線,該孔洞係落於該格線之交點;(f )塗覆絕緣層於 ”亥上下兩電極並覆蓋住該隔絕槽;(g)製作該層壓板體成 複數粒狀元件’每-粒狀元件係於兩端面具有互相對稱之 貝牙孔壁,以及(h)電鍍左右端電極以包覆每一粒狀元 件之兩端面上,且分別交錯地電性連接至該等電極層。 護元步提== 麵性高分子層形成之層壓板體 之隔絕槽於該上下電極層,該層屢板體之隔 成 形,耩以區隔定義出複數粒狀元件,其中, 曲形;按預定圖樣設置切割格線於上 係主 ϋ、 性縱向曲線以及複數條不連續性橫 二ΐί下=鄰之該縱向曲線係互相對稱,·塗覆絕緣層 iri 住該_槽;製作該層墨板體成複 狀元件係具有互相對稱之左右兩曲形 而:』:1);以及電鍍左右端電極以包覆每 件之該兩曲形端面上,且分別電性連接至該上下 護元目ί ’本發明提供一種可復式過電流保 抨導電性t八早岛、、步驟包含:製備-由上下電極層夾 t = 層形成之層壓板體(1_ed sheet); 員刀^上下電極層與設置陣列式孔洞(二 holes)貝牙該層壓板體 女 g 分別蝕#、純雜線之交點; 體之二 該上下電極層,該層*板 其中’該隔絕槽係呈曲形, 二 二;該上下兩電極並覆= ’r粒狀元件係於兩端 、牙 土,以及電鑛左右端電極以包覆 15 每一粒狀元件之兩沪 層。 @ ,且分別電性連接至該上下電極 為了使責審杳主。& 技術内容,請=貞能更進—步瞭解本發明之特徵及 載内容僅提供有關本發明切細說明,然而= 者。 考與明用,並相來對本發明加以限制 【實施方式】 如先前技術之第一圖所言,pp 流或過熱狀態發生時,令高分子贿阻可^供過電 A曰丄 7问刀于基材結構由結晶相轉轡成 非日日相’使得該PPTC熱敏電阻之阻抗佶曰、, /P1故ΓΤ · /η 、 夕午間才疋歼並呈跳脫 /開路(Trlp/〇pen)的狀態,達到限制電流的作用,進而 保護電路;當過電流或過熱狀態消除後,其阻抗值又可口 復到低阻抗值狀態,此種特性稱為「可復性」。當吸计不^ (尤其以堆疊製作之多層式熱敏電阻容易發^ ^二外在‘ 定溫度過高時,PPTC熱敏電阻容易蓄積熱量而產生作動 (跳脫狀態),造成原運作分擺,產生無謂之困擾。是以, 本發明提供一種可復式過電流保護元件及其製作方法,係 可提高熱傳導效應,提高散熱效果,避免外在額定溫度或 設計不良的熱量累積影響產品特性與應用。 請參閱第五A圖與第五B圖所示,係為一種可復式過 電流保護元件,其包含具有互相對稱之左右兩曲形端面 (curved sidewall) 1 〇與 1 1 之層壓體(laminated body) 1、分別包覆該層壓體1之該兩曲形端面丄〇與工 1之左右端電極2與3、以及分別覆蓋於該層壓體1之上 下表面之上下絕緣層4與5 ° 其中,該層壓體1係可包含至少一導電性高分子層1 16UiToL reads the US patent us, 5 c ^ ^ two PPTC materials 2 c disclosed in Figure 4A to Figure 2 after forming a plate-like substrate (please refer to 1286329, fourth A and fourth B, respectively); The substrate penetrates through the arrayed hole axis 1 1 c (as shown in FIG. 4C); the nickel layer is plated to a thickness of about 1 〇 2 〇 2 μm, and then a copper layer of about 10 to 20 μm thick is plated, and the channel hole axis 1 lc The inner and outermost two copper foil plates 1 c are covered with a nickel-copper layer 4 c (as shown in the fourth d-figure), so that the outermost two copper foil plates 1 c are electrically charged by the nickel-copper layer 4 c Sexually connected, the last two layers of the two copper foil sheets 1 C (along with the recorded copper layer 4 c ) are respectively named with a dividing groove 1 2 c (as shown in the fourth E diagram); The two copper plate 1 b is coated with a protective layer 5 c covering the separation groove 12c (as shown in the fourth F diagram); nickel plating is performed to make the copper layer 4 c beside the area covered by the protective layer 5 c Each layer is covered with a recording layer 6 c (such as the fourth G picture); finally, the plate-shaped substrate is cut into a granular shape, and a single multi-layer PPTC thermistor (such as the fourth drawing) is completed. The separation groove 1 2 c is etched in a curved manner, and the ppTC material at the proximal electrode can be fully utilized to solve the problems encountered in the conventional and second conventional methods. However, the third conventional PPTC thermal The end electrode portion of the resistor is formed by the nickel-copper layer 4c plated in the hole shaft 1c and the nickel layer 6c to achieve electrical connection between the two upper and lower metal foil electrode plates 1c. However, the pptc thermistor of this structure is prone to the problem of poor solderability due to the excessively small electrodes at both ends, and is also de-wetting or de-wetting during the reflow process. Tombstone effect (c〇mp〇nent lifting), etc., because of the difficulty in plating the hole axis, the plating effect of the nickel-copper layer 4c or the nickel layer 6c cannot achieve the required fineness, and may even The nickel-copper layer 4c or the cracked jointing of the nickel layer 6c is caused to be more serious, the internal stress unevenness of the client after reflow is caused by component cracking, and the like; in addition, the hole axis iic The surface area is not so large that the PPTC thermistor of this structure is applied to the general circuit 1286329 board. When the current is easily generated by the hole axis with a small surface area, the PPTC thermistor is crossed and the +2 limit is over, and the e e is easy to occur, and the 〇ver-current load is not yet generated. Break through the current ·, and then influence the curse thermistor to follow 々丨L (^ιρ usability and reliability. 实 舄 舄 舄 Γ Γ amp amp amp amp 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述The invention is reasonable and widely designed to effectively improve the above-mentioned defects. [Inventive content] The main purpose of the _ piece and == is to provide a multiplexable overcurrent protection component and a manufacturing method thereof, which can improve the heat conduction effect and improve the heat dissipation effect. External temperature or poorly designed heat accumulation affects product characteristics and the second object of the present invention is to provide a reversible overcurrent protection element and a method of fabricating the same, which is to maintain the maximum effective (overlap) area of the upper and lower electrodes, when the effective area The larger the impedance of the component, the greater the margin from the tripping current determined by the PPTC material formulation (trip(3) plant (9)7), and the reckless PPTC thermal The application of the resistor is broader. A further object of the present invention is to provide a multiplexable overcurrent protection component and a method of fabricating the same, which can prevent internal stress from remaining inside the component after splicing, thereby avoiding body rupture. Another object is to provide a multiplexable overcurrent protection component and a method of fabricating the same, which can increase the surface area of plating and soldering, improve the good solderability, and avoid de-wetting or toe 1286329 component lifting. And so on. In order to achieve the above object, the present invention provides a multiplexable overcurrent protection member comprising a laminated body, left and right end electrodes, and upper and lower insulating layers. The lamination system includes at least one conductive polymer layer, a lower electrode layer disposed on the lower side of the conductive polymer layer, and at least one internal electrode disposed adjacent to the conductive polymer layer; Wherein the laminate system has two curved end faces which are symmetrical to each other; the conductive polymer layer has a positive temperature coefficient. The left and right end electrodes respectively cover the two curved end faces of the laminate, and are electrically connected to the upper and lower electrode layers and the inner electrode layer, respectively, and the upper and lower electrode layers and the inner electrode layer are electrically interlayer connection. The upper and lower insulating layers are respectively covered on the upper surface of the upper surface of the laminate and filled between the left and right end electrodes; wherein the left and right end faces of the upper and lower electrode layers correspond to the left and right curved end faces of the laminate Symmetrical curves. In order to achieve the above object, the laminated body provided by the present invention comprises a plurality of conductive polymer layers, at least an inner electrode layer spaced apart from each other in the two conductive south molecular layers, and Two upper and lower electrode layers on the outer side of the outermost conductive polymer layer. In order to achieve the above object, the present invention provides a method for fabricating a replicable overcurrent protection device, the steps of which are: κ a) provisioning a two-electrode layer de-extrusion-conductivity south molecular layer formation-monomer; (b) fine and complex isolation trenches respectively The two electrode layers of the monomer; (e) preparing at least two of the monomers and at least one of the conductive polymer layers are mutually inspected and disposed (four) into a laminated sheet; wherein the electrodes Each of the layers is etched with a plurality of insulating grooves, and the insulating grooves formed by the two adjacent electrodes are alternately arranged 12 1286329, thereby defining a plurality of granular elements, and the insulating grooves are curved; a cutting grid line is disposed on the upper and lower electrode layers according to a predetermined pattern, the cutting grid line includes a plurality of continuous longitudinal curves and a plurality of discontinuous transverse straight lines, and the longitudinal curves adjacent to each other are symmetrical to each other; (e) Applying an insulating layer to the upper and lower electrodes and covering the upper and lower isolation grooves; (f) fabricating the laminate body into a plurality of granular elements, each of the granular elements having mutually symmetrical left and right curved end faces (curved sidewal 1 ); And (g) the left and right end electrodes of the electric ore to cover the two curved end faces of each of the granular elements, and are electrically connected to the electrode layers by a fault, respectively; wherein the electrode layers are electrically conductive connection. In order to achieve the above object, the present invention provides a method for fabricating a replicable overcurrent protection device, the method comprising the steps of: a) providing a single electrode layer to pinch a single two-conductive polymer layer to form a monomer; and (b) etching a plurality of isolation trenches; The electrode layer of the monomer; (c) sequentially stacking at least two of the monomers and another electrode layer to form a laminated sheet; (d) etching the plurality of insulating grooves to the electrodes of the laminate body a layer, the two adjacent insulating grooves are arranged alternately with each other, whereby a plurality of granular elements are defined by the partition, and the insulating groove is curved; (e) the cutting grid is set to the upper and lower electrodes according to the pre (four) sample a layer, the cutting grid line comprises a plurality of continuous longitudinal curves and a plurality of strips of continuous transverse trajectory, wherein the longitudinal curves of adjacent lines are symmetrical to each other; (f) coating an insulating layer on the upper and lower electrodes and covering The upper and lower insulation grooves; (g) the laminate body is formed into a plurality of granular elements, each of the granular elements having mutually symmetrical left and right curved end faces (coffee); and (h) electroplating left and right end electrodes for wrapping Cover each - granular Both end surfaces of the member, and are alternately electrically connected to these electrode layers. In order to achieve the above object, the present invention provides a fabrication method for a multiplexable overcurrent protection element 13 1286329, the steps of which include: (a) arranging a two-electrode layer to pinch a lead, and forming a south molecular layer-monomer; Separating (four) a plurality of isolation holes in the two electrode layers of the monomer; (C) preparing at least two of the monomers and at least the conductive germanium molecular layer are spaced apart from each other and pinched to form a laminated sheet; Each of the equal electrode layers is etched with a plurality of insulating grooves, and the two insulating grooves formed by the adjacent electrode layers are alternately arranged with each other, thereby defining a plurality of granular elements, and the partition is curved; (d) Array holes are arranged through the layer of the plurality of layers, wherein the upper and lower electrode layers of the laminate body are pre-cut with a ruled line, the holes are at the intersection of the grid lines; (e) the insulating layer is coated on the upper and lower sides The electrode is covered with ray f) The body of the money plate is made into a plurality of 7G pieces, each of which has a mutually symmetrical through-hole soil at both ends of the flank, and (g) a plated left and right end electrodes to coat each particle. Both ends of the element are interleaved Such electrically connected to the electrode layer. In order to achieve the above objective, the present invention provides a method for fabricating a reflowable protective element, the steps of which include: (a) a charge-electrode layer pinching a single conductive polymer layer to form a monomer; a plurality of isolation holes in the electrode layer of the precursor; (e) sequentially stacking at least two of the monomers and another electrode layer to form a laminate body; (d) _ a plurality of spacers The electrode layers; the insulating grooves of the electrode layer adjacent to the towel (4) are alternately arranged with each other, thereby defining a plurality of granular elements, and the partitions are curved; (e) arranging the array holes (drilHng h〇les) penetrating the laminate body, wherein the upper and lower electrode layers of the laminate body are pre-cut with a ruled line, the hole is at the intersection of the ruled line; (f) an insulating layer is applied to the layer The upper and lower electrodes are covered and covered by the insulating groove; (g) the laminated body is made into a plurality of granular elements, each of the granular elements is symmetrical to each other on both end faces, and (h) the left and right ends of the plating Electrodes are coated on both end faces of each granular element, and are electrically connected to the same electric power in a staggered manner The protective layer of the laminate body is formed on the upper and lower electrode layers, and the layer is formed by separating the plurality of granular elements, wherein the plurality of granular elements are defined by the partition, wherein Curved shape; set the cutting grid line in the upper pattern, the longitudinal curve and the plurality of discontinuities in the predetermined pattern. The longitudinal curve is symmetrical with each other, and the insulating layer iri is applied to the groove; The composite ink plate body is formed into a complex element having two symmetrical left and right curved shapes: 』: 1); and the left and right end electrodes are plated to cover the two curved end faces of each piece, and are respectively electrically connected to The upper and lower protective elements ί 'the present invention provides a double overcurrent protection conductivity t eight early island, the steps include: preparing - a laminate body (1_ed sheet) formed by the upper and lower electrode layer sandwich t = layer; ^The upper and lower electrode layers are arranged with array holes (two holes), the teeth of the laminate body, the intersection of the purely miscellaneous wires, and the upper and lower electrode layers of the body. Curved shape, two two; the upper and lower electrodes are overlapped = 'r granular element system The two ends, the dentate soil, and the left and right end electrodes of the electric ore are coated with two layers of each of the granular elements of each of the 15 elements. @ , and are electrically connected to the upper and lower electrodes respectively for the purpose of reviewing the ruling. & technical content, please The features and contents of the present invention are only provided to provide a detailed description of the present invention. However, the invention is limited and the invention is limited. As shown in the figure, when the pp flow or overheating occurs, the brittle resistance of the polymer can be supplied to the power supply A曰丄7, and the substrate structure is converted from the crystalline phase to the non-daili phase, making the PPTC thermistor Impedance 佶曰, /P1 ΓΤ · /η, 夕 疋歼 疋歼 呈 呈 呈 呈 呈 呈 Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr Tr After that, the impedance value is deliciously restored to the low impedance state. This characteristic is called "recoverability". When the suction meter is not ^ (especially when the multi-layer thermistor fabricated in a stack is easy to emit ^ ^ two external 'the temperature is too high, the PPTC thermistor easily accumulates heat to generate an action (tripping state), resulting in the original operation The pendulum creates unnecessary troubles. Therefore, the present invention provides a reconfigurable overcurrent protection component and a manufacturing method thereof, which can improve the heat conduction effect, improve the heat dissipation effect, and avoid the external rated temperature or the poorly designed heat accumulation affecting the product characteristics and Referring to FIGS. 5A and 5B, it is a reconfigurable overcurrent protection element comprising a laminate having mutually symmetrical left and right curved sidewalls 1 〇 and 1 1 . Laminated body 1. respectively coating the two curved end faces of the laminate 1 with the left and right end electrodes 2 and 3 of the work 1, and covering the lower insulating layer 4 above the lower surface of the laminate 1, respectively. And 5 °, wherein the laminate 1 can comprise at least one conductive polymer layer 1 16

κ更)正替換頁 2、"ϋ挪電性高分子層12之上下侧之上下電極層 1 3科14、選擇性設置及鄰設於該導電性高分子層1 2 之至^、…内龟極2 〇 ;於一較佳實施例中,該層壓於1勿 含複數導迅性局分子層丄2、_設置於兩兩導電姓高分 子層1f内之至少—内電極層2 Q、以及設置於最外= 導迅性冋刀:層12之外侧之兩上下電極層13與1:; 耸π性層12決定阻抗、跳脫能力與回復性 層:0、ΓΪ導電性高分子層1 2内之-内電極 ‘ i 4 ::違導電性高分子層1 2之外之上下電極 面之上下導電属置該導電性高分子層12之上下表 槽1 7與該上iiff16。該上電極層1 3係以上隔絕 下隔絕槽1 8與=5互相絕緣,該下電極層1 4係與 中,該左端電^ =導電層1 6互相絕緣。於本實施態樣 1 4,該右端電性連接該上導電層1 5與該下電極層 層2 0盥嗲卜=亟3包性連接該下導電層1 6、該内電極 二=層i3,籍此在該導電性高分子層12 1之右曲形端而,之屯極。该上電極層1 3係由該層壓體 該下電極層4 〇向内延伸且逼近至該上導電層1 5 , 下導電層16,、由左曲形端面1 1向内延伸且逼近至該 係對應至該層上下電極層1 3、14之左右兩端面 對稱之曲形,,左右曲形端面1〇、11而呈互相 極層2 0可在该上下電極層1 3、14以及該内電 (overlap)出最^尺寸需求下(如⑽〇3、0201等),交疊 阻抗越小,則卸有效面積,當有效面積越大則元件之 每由導電性高分子層1 2所決定的跳脫電κ更) is replacing page 2, " ϋ 电 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上The inner turtle pole 2 〇; in a preferred embodiment, the laminate 1 does not contain a plurality of conductive molecular layers 丄 2, at least the inner electrode layer 2 disposed in the two conductive polymer layers 1f Q, and set at the outermost = conductive boring tool: two upper and lower electrode layers 13 and 1 on the outer side of layer 12: π layer 12 determines impedance, tripping ability and recovery layer: 0, high conductivity In the molecular layer 12, the internal electrode 'i 4> is inferior to the upper surface of the lower electrode surface except the conductive polymer layer 1 2, and the lower surface of the conductive polymer layer 12 is disposed on the upper surface of the conductive layer 12 and the upper iiff16 . The upper electrode layer 13 is insulated from each other by the isolation trenches 18 and =5, and the lower electrode layer 14 is connected to the middle, and the left end electrode is electrically insulated from each other. In this embodiment, the right end is electrically connected to the upper conductive layer 15 and the lower electrode layer 2 0 盥嗲 = 亟 3 is inductively connected to the lower conductive layer 16 , the inner electrode 2 = layer i3 Thus, the drain is formed on the right curved end of the conductive polymer layer 12 1 . The upper electrode layer 13 extends inwardly from the lower electrode layer 4 且 and approaches the upper conductive layer 15 and the lower conductive layer 16 and extends inwardly from the left curved end face 1 1 and approaches to The system corresponds to a curved shape in which the left and right end faces of the upper and lower electrode layers 13 and 14 of the layer are symmetric, and the left and right curved end faces 1〇 and 11 are formed as mutually polar layers 20 in the upper and lower electrode layers 13 and 14 and The internal power (overlap) is the most suitable size (such as (10) 〇 3, 0201, etc.), the smaller the overlap impedance, the effective area is unloaded, and the larger the effective area, the more the conductive polymer layer 12 Decided jump

流(top current)的餘裕較大,俾使該元件的應用範圍 更為寬廣。該上下絕緣層4、5係分別覆蓋住上下隔絕槽 1 7、1 8並填滿於該左右端電極2、3之間。該上下‘ 極層1 3、1 4、該内電極層2◦與導電層丄5、丄6二 :由,:鋼、鍍鎳銅箔或鎳銅合金所製成,該左右端電極 2、3係包括至少兩電鑛層,最外層之第二電鑛層2 2、 3 2係為·,以職續上板或焊制,最⑽^ 帝 鑛層21、31可視該上下電極層13、"與導電層^ 5 1 6之材質為鎳層或銅層;本實施觸示之該左右 :極2、3係包括三層電鍍層’當第一電鍍層2丄、3丄 展更進一步包括有鎳層2 3、3 3於該銅層2 1、 3 1與錫層2 2、3 2之間。 乙丄 ,參岐六A_^之其他實施例,該左右兩曲形端 1係分別具有至少-凹表面1 〇 2、1丄2 ; 右兩曲形端面10、11係分別如第五A圖所示呈 有連績凹凸表力Λ明不具 11总产丄丄’左右兩曲形端面10、 力接們件於同樣尺寸需求下(如_3、麵等)增 加接觸表面積;於電鍍製程, 該左右端電極2、3的㈣紐表面積有助於改善 辦加焊H 率與緻密性;於焊接製程, :1 γ1γΛΦ 1 5 ^ ^ ^ ( good ;T (de-ett-^ ^面ΤΓ/ 題產生。此外,該左右兩曲形 鈿面1 0、1 ]_必須對稱之原因 端電極2、3所造成的抓錫力相等’、* 左右兩 部殘留内應力,從㈣免本避站接後在元件内 該上下電極層1 1、1」 曰丄d 1 4、该内電極層2 0與導電層 一修(更)正替換】 if丄係可由鎳、銅、鍍鎳銅猪或鎳銅合金所製成, ^工鈿包杈2、3係包括至少兩電鍍層,最外層之二 锡層,以利後續上板或焊;用,; 4“層J1、31可視該上下電極層13 4 μ所示之該左右端電極2、3係僅包括二層 第一電鑛層2r、3r為錄層時,鋼層2曰工电鑛 直接設置於該鎳層2丄-、3丄〃之上。 d1 該上下絕緣層4、5係由液態感光防焊 Ph-_MeSolderMask,圆所製成 層4 j可如弟圖所示,其兩端沿該壓層體1之左右 兩曲形端面1 Q、11構形呈互相對稱之曲形,%力二 A圖所示,該上下絕緣層4、5簡單 ^或二,、 可,因該上下絕緣層4、5之目的係:以呈直線即 槽17、18,避免電鑛時發生該上下 7 互相導通。 丄 如第六B圖,本發明之該可復性過治一 一 -步包括完全塗佈於該層壓體!前後^^兀件係進 6,亦同樣有避免電鍍時產生導通之功外> 之侧絕緣層 6可由液態感光防焊綠漆(LPSM)所=側絕緣層 圖,本發明之該可復性過電流保護元=。然,如第五B 後兩侧面不塗覆任何保護層,可利用带該層壓體1前 密度分佈,俾使除該導電性高分子層1、^^凋边適當電流 緣層4、5之外,僅有該層壓體1之診 以及该上下絕 0、1 1得以鑛上上述之左右端電極2 #兩曲形$而面1 當導通之狀況。 、3,進以排除不 19 (更)正替換ij —明參閱第七HI所示,係為本發明之一、 護元件之至少兩種製作方法,第-f作;ϋ式過電流保 八Α圖至第八!^圖與第八乂圖,其步驟包含二问=閱第 央:導電性高分子層12〃形成之單體,^ 丄d丄4 该早體之該隔絕槽1 7,/孫一奴/ 藉以區隔定義出複數粒狀元件,其令 曰成形, =…,兩端具有至少一凹表面=二: 尺寸二二面i連續凹凸ΐ面之數量係可依據 格線於該上下電極声刀丄,J預定圖樣設置切割 數條連續性㈣• 切割格線係包括複 卞m向曲線y以及複數條不連續性橫向直線x, 兩兩相鄰之該縱向曲線y係互相對稱;其中步驟(b)盘 乂驟(c)係可互相對調;(d)麼板:如第八D圖盘第父 e圖,準備至少兩該單體與至少—該導電性高分子層、工2,, 互相間隔,置並夾擠藉此形成—層μ板體(laminated sheet 1 ’( e )塗覆LPSM :如第八F圖,塗覆絕緣層 \於該上下兩電極層1 3 〃、1 4〃並覆蓋住該隔絕槽1 7、,’( f )切粒:如第八G圖,製作該層壓板體1成複 f粒狀元件’每-粒狀元件係具有互相對稱之左右兩曲形 端面(curvedsidewall) 1 CT、;[ ;^,其製作步驟係包 括按该縱向曲線y與該橫向直線χ將該層壓板體1 〃直接 衝製(punching)成複數粒狀元件;或,如第八X圖按該 縱向曲線y將該層壓板體1〃衝製成複數條狀基材,再將 該條狀基材依該橫向直線X折製成複數粒狀元件;(g )侧 20The margin of the top current is large, which makes the application of the component wider. The upper and lower insulating layers 4, 5 cover the upper and lower isolation grooves 17 and 18, respectively, and are filled between the left and right end electrodes 2, 3. The upper and lower 'pole layers 1 3, 14 , the inner electrode layer 2 ◦ and the conductive layer 丄 5, 丄 6 2: made of: steel, nickel-plated copper foil or nickel-copper alloy, the left and right end electrodes 2 The 3 series includes at least two electric ore layers, and the second outermost layer of the second electric ore layer 2, 3 2 is for the purpose of continuous board or welding, and the most (10)^ ore layer 21, 31 can be regarded as the upper and lower electrode layers 13 , and the conductive layer ^ 5 1 6 material is a nickel layer or a copper layer; the left and right of the implementation of the touch: the pole 2, 3 series includes three layers of plating layer 'When the first plating layer 2 丄, 3 丄 更Further included is a nickel layer 23, 3 3 between the copper layer 2 1 , 3 1 and the tin layer 2 2, 3 2 . In other embodiments, the left and right curved ends 1 have at least a concave surface 1 〇 2, 1 丄 2; the right two curved end faces 10, 11 are respectively as shown in the fifth A diagram. The performance shown in the figure shows that there is no 11 total production 丄丄 'left and right curved end face 10, the force of the parts to increase the contact surface area under the same size requirements (such as _3, surface, etc.); The (four) New surface area of the left and right end electrodes 2, 3 helps to improve the H-rate and compactness of the welding; in the welding process, :1 γ1γΛΦ 1 5 ^ ^ ^ (good ;T (de-ett-^^ΤΓΤΓ/ In addition, the left and right curved surfaces 10, 1]_ must be symmetrical because the end electrodes 2, 3 are equal to the holding force of the ', * left and right residual internal stress, from (four) free of the station After the connection, the upper and lower electrode layers 1 1 , 1 曰丄 1 d 1 4 , the inner electrode layer 20 and the conductive layer are repaired (more) positively replaced by the nickel, copper, nickel-plated copper pig or Made of nickel-copper alloy, 2, 3 series including at least two electroplated layers, the outermost layer of tin, to facilitate subsequent plate or welding; use,; 4" layer J1, 31 visible When the left and right end electrodes 2, 3 of the upper and lower electrode layers 13 4 μ include only two layers of the first electric ore layers 2r and 3r as recording layers, the steel layer 2 is directly disposed on the nickel layer 2丄. -3丄〃上。 d1 The upper and lower insulating layers 4, 5 are made of liquid photosensitive anti-welding Ph-_MeSolderMask, the layer 4 j can be as shown in the figure, the two ends of which are along the laminated body 1 The left and right curved end faces 1 Q, 11 are configured to be symmetrical with each other, as shown by the % force two A diagram, the upper and lower insulating layers 4, 5 are simple or two, and may be due to the upper and lower insulating layers 4, 5 The purpose is to make the upper and lower 7 mutual conduction when the electric ore is avoided in a straight line, that is, the grooves 17. 18, as shown in the sixth B, the reversible treatment of the present invention includes the step of completely coating the layer. Pressing body! Before and after ^^兀件6, also has the function of avoiding the conduction during plating. The side insulating layer 6 can be liquid photosensitive solder resist green paint (LPSM) = side insulating layer diagram, the present invention The reversible overcurrent protection element=. However, if the two sides are not coated with any protective layer after the fifth B, the density distribution before the laminate 1 can be utilized, and the conductive high score is removed. Layer 1, ^ ^ with the appropriate current edge layer 4, 5, only the diagnosis of the laminate 1 and the upper and lower 0, 1 1 can be mineralized on the left and right end electrodes 2 # two curved shape 1 When the conduction is in. 3, to exclude 19 (more) to replace ij - as shown in the seventh HI, is one of the invention, at least two manufacturing methods of the protection element, the -f; Ϋ-type over-current protection eight maps to the eighth! ^ map and the eighth map, the steps include two questions = read the central: conductive polymer layer 12 〃 formed monomer, ^ 丄d丄4 the early body The isolation groove 177, / Sun Yinu / by partition to define a plurality of granular elements, which form 曰, = ..., at least one concave surface at both ends = two: size two two sides i continuous concave surface The number can be based on the grid line on the upper and lower electrodes, and the J predetermined pattern is set to cut several continuityes. (4) • The cut grid line includes the complex m-direction curve y and a plurality of discontinuous transverse lines x, two adjacent The longitudinal curves y are symmetrical to each other; wherein the step (b) of the step (c) can be mutually adjusted; (d) the board: as the eighth D disk, the parent e map, prepare at least The monomer and at least the conductive polymer layer are spaced apart from each other, and are pinched to form a laminated sheet 1 'e coated with LPSM: as shown in FIG. Applying an insulating layer to the upper and lower electrode layers 1 3 〃, 1 4 〃 and covering the insulating groove 17, '(f) pelletizing: as shown in the eighth G diagram, the laminate body 1 is made into a complex f The granular element 'per-grain element has two curved curved walls 1 CT,; [^^, which are symmetrical with each other, and the manufacturing step includes the laminate body according to the longitudinal curve y and the transverse straight line 1 〃 directly punching into a plurality of granular elements; or, as in the eighth X drawing, the laminated body 1 is punched into a plurality of strip-shaped substrates, and then the strip-shaped substrate is The transverse straight line X is folded into a plurality of granular elements; (g) side 20

以及f,沾絕緣漆6"於該粒狀元件之前後兩侧; 極y ^鑛.如第八1圖至第八尺圖,電鑛左右端電 、3以包覆每―粒狀元件之該兩㈣端面1(r、 ^上,且分別電性連接至該上下電極層丄3//、i 4"; 形二:=f少電鍍兩層電鍍層於每-粒狀元件之該兩曲 1 ^ ' 1 1上,該步驟係包括電鍍第一電鑛層2 Q3^ <糸為鎳層或銅層,且最外層之第二電鑛 :2 、3 2夕於該第一電鍍層2工' 3工夕 ?鍍層2 2、3 2 ’’係為錫層;當第一電鍍層2工:、 為銅層時,係更進一步電鍍鎳層 ' ㈣f1'31 〃與繼2〃、32〃之二於ί 驟亦可省略,並_於該(h)電鑛時調整 適虽琶〜逸、度分佈,俾使除該導電性高分子層工2、以及 t下絕緣層4' 5//之外,僅有該兩曲形端面1 o' i t传以社該左右端電極2〃、3〃之上述钱層,進以 排除不當導通之狀況。 日日f同時參閱第七圖、以及第九A至第九G圖係為本發 人之衣作方法於塗覆LPSM之前的另一實施例,其步驟包 3 口:其步驟包含··( a )製板:如第九A圖與第九b圖,置 備^一電極層1 3 ^夾擠單—導電性高分子層1 2夕形成 了單體;(bj第一次韻刻··如第九c圖,餘刻複數隔絕槽 ^ 7於該單體之該電極層工3夕;(c )第一次預切··如 弟九C圖,按預定圖樣設置切割格線於該上下電極層,該 __係包括複數條連續性縱向曲線7以及複數條不連 績性橫向直線X,兩兩相鄰之該縱向曲”係互相對稱,· 21And f, varnish 6" on the front and back sides of the granular element; pole y ^ mine. As shown in the eighth to eighth figure, the left and right ends of the electric ore, 3 to cover each of the granular elements The two (four) end faces 1 (r, ^, and electrically connected to the upper and lower electrode layers 丄 3 / /, i 4 "; shape two: = f less plating two layers of plating on each of the two granular elements On the curve 1 ^ ' 1 1 , the step includes electroplating the first electric ore layer 2 Q3 ^ < the crucible is a nickel layer or a copper layer, and the outermost second electric ore: 2, 3 2 Layer 2 work '3 working eves? Coating 2 2, 3 2 '' is a tin layer; when the first plating layer 2:, when it is a copper layer, the system further electroplating the nickel layer ' (4) f1'31 继 and subsequent 2〃 32 〃 于 于 于 于 于 于 于 于 于 于 亦可 亦可 亦可 亦可 亦可 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电In addition to '5//, only the two curved end faces 1 o' it pass the above-mentioned money layer of the left and right end electrodes 2〃, 3〃, to eliminate the improper conduction. The figure and the ninth to ninth G drawings are the fabrics of the hairdresser. In another embodiment prior to coating the LPSM, the step of the package includes: the steps include: (a) plate making: as shown in the ninth A and ninth b, the electrode layer 1 3 is clamped - the conductive polymer layer 1 2 formed a monomer; (bj first rhyme · · ninth c picture, the remaining number of isolation holes ^ 7 in the electrode of the electrode layer 3; (c The first pre-cutting, such as the ninth C-picture, sets the cutting grid line to the upper and lower electrode layers according to a predetermined pattern, the __ system includes a plurality of continuous longitudinal curves 7 and a plurality of non-continuous horizontal straight lines X, The two longitudinally adjacent longitudinal curves are symmetrical to each other, 21

料更)正替換頁 動 ==第九°圖,依序堆疊至少兩該娜另-如〜曰i 掩形成該層壓板體P;(e)第二次綱. 電㈣17〃於該層壓板體1 i 出複係交錯成形,藉以區隔定義 ::表面,或具有連續凹凸表面,其設計凹表面或: ^凸表面之數1係可鋪尺寸決定;( (=侧)按預定圖樣設置切割格線於該 Μ切傭線係包括複數條連續性縱向 連續性橫向直線厂,兩兩相鄰之該縱向曲線Γ 置m二1交錯設 中朗b)與步驟(。)、以及步驟U)與步驟 dt侧與預切步驟係可互相對調;(g )塗覆LpSM : 如,弟九f圖,塗覆絕緣層4/,於該上下兩電極層丄η 4夕並覆蓋住該隔絕槽丄;後續製程同上。 制請同時參閱第七圖、以及第十八圖至第十κ圖之第二 衣作方法,其步驟包含··( a )製板:如第十a圖與第+ Β =’製備—由上下f極層1 3〃、丨4〃夾擠導電性高分子 ^ 1 2形成之形成一單體;(b )第一次蝕刻:如第十c 圖,分別蝕刻複數隔絕槽2 於該單體之該兩上下電極 層1 3”、1 4",該隔絕槽工7,,係呈具有一凹表面之曲 /、,.(. c )屢板.如弟十D圖,準備至少兩該單體與至少— 该導電性高分子層1 2"互相間隔設置並夾擠形成該層壓 板體1 ” ;( d )穿孔··如第十£圖,預切格線於該上下^ 極層1 3 ”、1 4 "與設置陣列式孔洞1 9(drilling 1es)貝牙#亥層魔板體1 /,該孔洞1 9 ’’係落於該格線 22 =交點;(e )第二次蝕刻:如第十1?圖,分別蝕刻複數不 獻:賣,邑槽1 r於該上下電極層13' 1 4'該層 2板體r之隔絕槽1 71交錯成形,藉以區隔定義出 =數粒狀元件,形成該隔絕槽1 7夕係沿該孔洞丄q//之 $形成形;(f )塗覆LPSM:如第十G圖,塗覆絕緣層4// 4上下兩電極1 3 ”、1 4 ”並覆蓋住該隔絕槽1 7 "; g)切粒:如第十Η圖,直接衝製該層壓板體丄〃成沪 =麵狀元件;或先將該層壓板體i"折製成複數個條狀^ ,再折製成複數粒狀元件;俾使每一粒狀元件係於兩端 具有對應該孔洞1 9 〃之互相對稱之貫穿孔壁;(h)侧 :’如第十I圖,沾絕緣漆6”於該粒狀元件之前後兩侧; r及(i )電鍍:如第十J圖,電鍍左右端電極2,,、3// =包覆每一粒狀元件之兩端面上,且分別電性連接至該上 •電極層1.3〃、1 4〃;且該左右端電極2' 3//同以 氣趣貫施態樣係包括至少兩層電鑛層。此外,亨(^ ), 沾步驟同第一製作方法所述亦可省略。 μ 侧 請同時參閱第七圖、以及第十Η-圖之第二料 之另-實施例,其由步驟U)至步驟(f )均盘相 问,並在步驟(h)由切粒變更為切條:如第十^一 先將該層壓板體1 〃折製成複數個條狀基材,沾 ,, 於該條狀基材之前後兩職,再折製成複練狀以牛' 行電鑛。此外,該側沾步驟同第—製作方法所述亦 1窄略。 是以,由前述可知,本發明具有以下之俨點. i.利用元件^電極呈曲面狀,增加熱^電鑛 表面積,可一舉解決熱量累積影響產口 干接 曰座口口 4寸性與應用、以及 23 電鍍緻密性與銲錫性不良所造成之問題; 2 ·端電極之曲線互相對稱,可避免焊接後在元件内部 殘留内應力,從而避免本體破裂;以及 3 .利用上下電極層沿該端電極形狀被蝕刻呈曲線,其 有效(交疊)面積可在相同尺寸需求下保持最大。 惟以上所述僅為本發明之較彳圭可行實施例,非因此即 拘限本發明之專利範圍,故舉凡應用本發明說明書或圖式 内容所為之等效結構變化,均同理皆包含於本發明之範圍 内,以保障發明者之權益,於此陳明。 【圖式簡單說明】 第一圖,係為PPTC熱敏電阻之特性示意圖; 第二A圖至第二E圖,係為第一習知之PPTC熱敏電阻製作 流程不意圖, 第三A圖至第三I圖,係為第二習知之PPTC熱敏電阻製作 流程不意圖, 第四A圖至第四Η圖,係為第三習知之PPTC熱敏電阻製作 流程不意圖, 第五A圖,係為本發明之可復式過電流保護元件之第一實 施例之結構不意圖; 第五B圖,係為本發明之可復式過電流保護元件之該第一 實施例之上視圖; 第六A圖,係為本發明之可復式過電流保護元件之第二實 施例之結構示意圖; 第六B圖,係為本發明之可復式過電流保護元件之第三實 24 样祕(更)正替換頁 施例之結構示意圖; 第七圖,係為本發明之可復式過電流保護元件之流程圖; 第八A圖至第八K圖、與第八X圖,係為本發明之可復式 過電流保護元件之該第一實施例之製作流程示意 圖; 第九A圖至第九F圖,係為本發明之可復式過電流保護元 件之第四實施例之製作流程示意圖;以及 第十A圖至第十J圖、與第十圖,係為本發明之可復 式過電流保護元件之第五實施例之製作流程示意 圖。 【主要元件符號說明】 第一習知 鍍鎳電鍍銅箔板 齒梳狀溝槽 10a 通道 11a PPTC材料 2 a 環氧基修飾壓克力樹脂保護膠 4 a 第二習知 鎳板 lb 槽道 10b 孔軸 lib 分隔槽 12b PPTC材料 2 b 銅層 3 b 保護層 3 b 錫層 5 b 第三習知 銅箔板 1 c 孔轴 11c 25More material) is replacing the page movement == ninth degree diagram, stacking at least two of the other ones in sequence - such as ~ 曰i masking the formation of the laminate body P; (e) second order. Electric (four) 17 〃 on the laminate The body 1 i is formed by interlacing, whereby the surface is defined as: surface, or has a continuous concave and convex surface, and the designed concave surface or: ^ the number of convex surfaces is determined by the size of the pavement; ((= side) is set according to a predetermined pattern The cutting grid line includes a plurality of continuous longitudinal continuous transverse straight line factories, and the longitudinal curves of the adjacent two pairs are alternately set in the middle b) and the step (.), and the step U And the step dt side and the pre-cutting step can be mutually adjusted; (g) coating the LpSM: for example, the drawing of the insulating layer 4/, covering the upper and lower electrode layers, and covering the isolation Groove; follow-up process is the same as above. Please also refer to the seventh figure, and the second clothing method of the eighteenth to tenth κ drawings, the steps of which include: (a) plate making: as in the tenth a picture and the + Β = 'preparation - by The upper and lower f-pole layers 1 3 〃, 丨 4 〃 pinch the conductive polymer ^ 1 2 to form a single body; (b) the first etching: as shown in the tenth c-figure, etch the plurality of isolation grooves 2 respectively The two upper and lower electrode layers 1 3", 1 4 ", the isolation slot 7 is a curved surface having a concave surface, and (.c) repeatedly. The monomer and at least the conductive polymer layer 1 2 " are spaced apart from each other and are pinched to form the laminate body 1"; (d) a perforation · as shown in the tenth figure, the pre-cut line is on the upper and lower electrodes Layer 1 3 ”, 1 4 " and set array hole 1 9 (drilling 1es) Bayer #海层魔板体 1 /, the hole 1 9 '' is tied to the grid 22 = intersection; (e) The second etching: as shown in the tenth 1st, respectively, etching the plural: selling, the groove 1 r is formed in the upper and lower electrode layers 13' 1 4', and the insulating groove 1 71 of the layer 2 is r-shaped, thereby forming a region Define the number of granular elements, Forming the isolation trench 1 is formed along the hole /q//$; (f) coating LPSM: as shown in the tenth G diagram, coating the insulating layer 4// 4 upper and lower electrodes 1 3 ”, 14 And cover the isolation tank 1 7 "; g) pellet: as in the tenth map, directly punch the laminate into a Shanghai = surface element; or first fold the laminate i" The plurality of strips are formed into a plurality of strips, and then folded into a plurality of granular elements; each of the granular elements is woven at both ends with a mutually symmetrical through-hole wall corresponding to the holes 19; (h) side: ' 10I, varnish 6" on the front and back sides of the granular element; r and (i) electroplating: as shown in the tenth J, electroplating left and right end electrodes 2,,, 3// = coated each grain element On both end faces of the device, and electrically connected to the upper electrode layer 1.3〃, 14〃, respectively; and the left and right end electrodes 2′ 3// include the at least two layers of the electric ore layer . In addition, the heng (^), immersion step may be omitted as described in the first production method. For the μ side, please refer to the seventh figure, and the other embodiment of the second material of the tenth Η-picture, which is from the step U) to the step (f), and is changed by the pelletizing in the step (h). For the stripping: as for the tenth ^1, the laminate body 1 is first folded into a plurality of strip-shaped substrates, dipped, and then the two positions before and after the strip-shaped substrate, and then folded into a rehearsal ' Electric mine. In addition, the side sticking step is also narrower than the first method of making. Therefore, it can be seen from the foregoing that the present invention has the following defects. i. The use of the component electrode is curved, and the surface area of the heat and electric ore is increased, so that the heat accumulation affects the mouth of the mouth of the dry mouth and the mouth of the mouth is 4 inches. Application, and 23 problems caused by poor plating density and poor solderability; 2) The curves of the terminal electrodes are symmetrical to each other to avoid internal stress remaining inside the component after soldering, thereby avoiding body cracking; and 3. Using the upper and lower electrode layers along the The shape of the terminal electrode is etched into a curve whose effective (overlapping) area can be kept to a maximum under the same dimensional requirements. However, the above is only the preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent structural changes of the present specification or the drawings are all included in the same. Within the scope of the present invention, to protect the rights and interests of the inventors, Chen Ming. [Simple diagram of the diagram] The first diagram is a schematic diagram of the characteristics of the PPTC thermistor; the second diagram A to the second diagram E is the first conventional PPTC thermistor production process is not intended, the third diagram A to The third I diagram is a second conventional PPTC thermistor manufacturing process, and the fourth A to fourth diagrams are not intended for the third conventional PPTC thermistor fabrication process, and the fifth A diagram, The structure of the first embodiment of the multiplexable overcurrent protection device of the present invention is not intended; FIG. 5B is a top view of the first embodiment of the multiplexable overcurrent protection device of the present invention; The figure is a schematic structural view of a second embodiment of the multiplexable overcurrent protection component of the present invention; and the sixth diagram is a third real secret of the multiplexable overcurrent protection component of the present invention. The schematic diagram of the page embodiment; the seventh figure is a flow chart of the multiplexable overcurrent protection component of the present invention; the eighth through eighth to eighth K and the eighth X are the multiplexable A schematic diagram of a manufacturing process of the first embodiment of the current protection component; 9A to 9F are schematic diagrams showing a manufacturing process of a fourth embodiment of the multiplexable overcurrent protection device of the present invention; and 10A to 10J and FIG. A schematic diagram of the manufacturing process of the fifth embodiment of the multiplexable overcurrent protection component. [Main component symbol description] The first conventional nickel-plated electroplated copper foil plate tooth comb-like groove 10a channel 11a PPTC material 2 a epoxy-modified acrylic resin protective glue 4 a second conventional nickel plate lb channel 10b Hole axis lib Separation groove 12b PPTC material 2 b Copper layer 3 b Protective layer 3 b Tin layer 5 b Third conventional copper foil plate 1 c Hole axis 11c 25

分隔槽 1 2 C PPTC材料 2 鎳--銅層 4 c 保護層 錄層 6 c 本發明之可復性過電流保護元件 層壓體 1 曲形端面 1 0 凹表面102、112 連續凹凸表面101、 導電性高分子層12 上下電極層 13 導電層 15、 内電極 2 0 第一電鍍層2 1、3 1 鎳層 2 3 ^ 錫層2 2、3 2(^2 絕緣層 4、5 層壓板體 1" 上下電極層 13' 上下隔絕槽 17-、 陣列式孔洞 1 9" 内電極 2 0" 端電極 2^3 第一電鍍層 2 1^ 第二電鍍層 2 2^ 鎳層 2 3,,、 絕緣層 4"、 .6上下隔絕槽 17 端電極 2、 :、2 r、3 r ) 3 3 ^ ,、3 2。 側絕緣層 6 高分子層 12 1 4" 1 8"Separation groove 1 2 C PPTC material 2 nickel-copper layer 4 c protective layer recording layer 6 c Reversible overcurrent protection element laminate 1 of the present invention curved end face 1 0 concave surface 102, 112 continuous concave-convex surface 101, Conductive polymer layer 12 upper and lower electrode layer 13 conductive layer 15, inner electrode 2 0 first plating layer 2 1 , 3 1 nickel layer 2 3 ^ tin layer 2 2, 3 2 (^2 insulating layer 4, 5 laminate body 1" Upper and lower electrode layer 13' Upper and lower isolation groove 17-, Array hole 1 9" Internal electrode 2 0" Terminal electrode 2^3 First plating layer 2 1^ Second plating layer 2 2^ Nickel layer 2 3,, Insulation layer 4", .6 upper and lower isolation grooves 17 terminal electrodes 2, :, 2 r, 3 r ) 3 3 ^ , , 3 2 . Side insulation layer 6 polymer layer 12 1 4" 1 8"

26 更 :·丨換 i 連續性縱向曲線y、y 不連續性橫向直線χ、χ26 more :·丨换 i continuous longitudinal curve y, y discontinuity transverse straight line χ, χ

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Claims (1)

修(更)正本 十、申請專利範圍: - 1、一種可復式過電流保護元件,係包含: - 層壓體(laminated body ),係包含至少一導電性高 分子層、設置於該導電性高分子層之上下側之上下電極 層、選擇性設置及鄰設於該導電性高分子層之至少一内電 極;其中,該層壓體係具有互相對稱之左右兩曲形端面 (curved sidewal 1);該導電性高分子層係具有正溫度係 數(Positive Temperature Coefficient)特性; 左右端電極,係分別包覆該層壓體之該兩曲形端 面,且分別交錯地電性連接至該上下電極層與該内電極, 該上下電極層以及該内電極層係呈間隔電性連接;以及 上下絕緣層,係分別覆蓋於該層壓體之上下表面且 填滿於該左右端電極之間; 其中,該上下電極層之左右兩端面係對應至該層壓 體之左右曲形端面而呈互相對稱之曲形。 2、 如申請專利範圍第.1項之可復式過電流保護元 件,其中: 該層壓體(laminated body ),係包含複數導電性高分子 層、間隔設置於兩兩導電性高分子層内之至少一内電極 層、以及設置於最外層之導電性高分子層之外侧之兩上下 電極層。 3、 如申請專利範圍第2項之可復式過電流保護元 件,其中該曲形端面係具有至少一凹表面。 4、 如申請專利範圍第2項之可復式過電流保護元 件,其中該曲形端面係具有連續凹凸表面。 28 1286329 5、 如申請專利範圍第2項之可復式過電流保護元 件,其中該上下電極以及該内電極層係分別與該左右端電 極間隔形成有互相交錯設置之隔絕槽(separation groove),且該上下絕緣層係分別覆蓋住上下之該隔絕槽。 6、 如申請專利範圍第2項之可復式過電流保護元 件,其中該上下電極層係由錄、銅、鍵錄銅箔或錄銅合金 所製成。 7、 如申請專利範圍第2項之可復式過電流保護元 件,其中該左右端電極係包括至少兩電鍍層,其中,最外 層之電鑛層係為錫層。 8、 如申請專利範圍第7項之可復式過電流保護元 件,其中最内層之電鍍層係為鎳層或銅層。 9、 如申請專利範圍第2項之可復式過電流保護元 件’其中該上下絕緣層係由液態感光防焊綠漆(L i qu i d Photoimagible Solder Mask, LPSM)所製成。 1 0、如申請專利範圍第2項之可復式過電流保護元 件,其中該上下絕緣層係沿該層壓體之兩曲形端面之構形 塗佈,且具互相對稱之曲形側邊。 1 1、如申請專利範圍第2項之可復式過電流保護元 件,係進一步包括完全塗佈於該層壓體前後兩侧面之侧絕 緣層。 1 2、如申請專利範圍第1 1項之可復式過電流保護 元件,其中該兩侧絕緣層係由液態感光防焊綠漆所製成。 1 3、一種可復式過電流保護元件之製作方法,其步 驟包含: 29 1286329 置備兩電極層夾擠一導電性高分子層形成一單體; 分別蝕刻複數隔絕槽於該單體之該兩電極層; 準備至少兩該單體與至少一該導電性高分子層互相 間隔設置並夾擠形成一層壓板體(laminated sheet);其 中該等電極層均蝕刻有複數隔絕槽,兩兩相鄰之該等隔絕 · 槽互相交錯設置,藉以區隔定義出複數粒狀元件,且該隔 . 絕槽係呈曲形; 按預定圖樣設置切割格線於上下兩電極層,該切割 格線係包括複數條連續性縱向曲線以及複數條不連續性橫 籲 向直線,兩兩相鄰之該縱向曲線係互相對稱; 塗覆絕緣層於該上下兩電極並覆蓋住該上下隔絕 槽; 製作該層壓板體成複數粒狀元件,每一粒狀元件係 具有互相對稱之左右兩曲形端面(curved sidewall);以 及 電鍍左右端電極以包覆每一粒狀元件之該兩曲形端 面上,且分別交錯地電性連接至該等電極層。 修 1 4、如申請專利範圍第1 3項之可復式過電流保護 元件之製作方法,其中該曲形端面係具有至少一凹表面。 1 5、如申請專利範圍第1 3項之可復式過電流保護 元件之製作方法,其中該曲形端面係具有具有連續凹凸表 面。 1 6、如申請專利範圍第1 3項之可復式過電流保護 元件之製作方法,其中該製作粒狀元件步驟係包括按該縱 - 向曲線與該橫向直線將該層壓板體直接衝製(punching) . 30 1286329 成複數粒狀元件。 1 7、如申請專利範圍第1 3項之可復式過電流保護 元件之製作方法,其中該製作粒狀元件步驟係包括按該縱 向曲線將該層壓板體衝製成複數條狀基材,再將該條狀基 材依該橫向直線折製成複數粒狀元件。 · 1 8、如申請專利範圍第1 3項之可復式過電流保護 . 元件之製作方法,更進一步於電鍍左右端電極之前包括: 侧沾絕緣漆於該粒狀元件之前後兩侧。 1 9、如申請專利範圍第1 3項之可復式過電流保護 Φ 元件之製作方法,其中係電鍍至少兩層電鍍層於每一粒狀 元件之該兩曲形端面上,該步驟係包括電鑛第一電鍍層於 該兩曲形端面上,該第一電鑛層係為錄層或銅層。 2 0、如申請專利範圍第1 9項之可復式過電流保護 元件之製作方法,其中該步驟係包括電鍍第二電鍍層於該 第一電鍍層上,該第二電鍍層係為錫層。 2 1、如申請專利範圍第2 0項之可復式過電流保護 元件之製作方法,其中當第一電鍍層為銅層時,係更進一 春 步電鍍鎳層於該銅層與錫層之間。 2 2、一種可復式過電流保護元件之製作方法,其步 驟包含: 置備單一電極層夾擠單一導電性高分子層形成一單 體; 蝕刻複數隔絕槽於該單體之該電極層; 依序堆疊至少兩該單體與另一電極層夾擠形成該層 - 壓板體(laininated sheet); - 31 1286329 蝕刻複數隔絕槽於該層壓板體之該等電極層,兩兩 相鄰之該等隔絕槽互相交錯設置,藉以區隔定義出複數粒 狀元件,且該隔絕槽係呈曲形; 按預定圖樣設置切割格線於上下兩電極層,該切割 格線係包括複數條連續性縱向曲線以及複數條不連續性橫 · 向直線,兩兩相鄰之該縱向曲線係互相對稱; 塗覆絕緣層於該上下兩電極並霞蓋住該上下隔絕 槽; 製作該層壓板體成複數粒狀元件,每一粒狀元件係 鲁 具有互相對稱之左右兩曲形端面(curved sidewall);以 鬲上·電鑛左右端電極以包覆每一粒狀元件之該兩曲形端Repair (more) original ten, the scope of the patent application: - 1, a multiplexable overcurrent protection component, comprising: - a laminated body comprising at least one conductive polymer layer disposed at the high conductivity a lower electrode layer on the lower side of the molecular layer, and at least one internal electrode selectively disposed adjacent to the conductive polymer layer; wherein the laminate system has two curved end faces that are symmetrical to each other; The conductive polymer layer has a positive temperature coefficient (Positive Temperature Coefficient) characteristic; the left and right end electrodes respectively cover the two curved end faces of the laminate, and are electrically connected to the upper and lower electrode layers in a staggered manner, respectively. The inner electrode, the upper and lower electrode layers and the inner electrode layer are electrically connected to each other; and the upper and lower insulating layers are respectively covered on the upper surface of the upper surface of the laminate and filled between the left and right end electrodes; wherein The left and right end faces of the upper and lower electrode layers are curved in a symmetrical shape corresponding to the left and right curved end faces of the laminate. 2. The multiplexable overcurrent protection component of claim 1, wherein: the laminated body comprises a plurality of conductive polymer layers disposed at intervals in the two conductive polymer layers. At least one inner electrode layer and two upper and lower electrode layers provided on the outer side of the outermost conductive polymer layer. 3. The reversible overcurrent protection element of claim 2, wherein the curved end face has at least one concave surface. 4. The reversible overcurrent protection element of claim 2, wherein the curved end face has a continuous concave and convex surface. 28 1286329 5. The multiplexable overcurrent protection component of claim 2, wherein the upper and lower electrodes and the inner electrode layer are respectively spaced apart from the left and right end electrodes to form a separation groove which is interlaced with each other, and The upper and lower insulation layers respectively cover the upper and lower isolation grooves. 6. The double-over overcurrent protection element of claim 2, wherein the upper and lower electrode layers are made of copper, copper, or copper alloy. 7. The multiplexable overcurrent protection component of claim 2, wherein the left and right end electrodes comprise at least two electroplated layers, wherein the outermost layer of the electric ore layer is a tin layer. 8. A reversible overcurrent protection element as claimed in claim 7 wherein the innermost plating layer is a nickel layer or a copper layer. 9. The multiplexable overcurrent protection element of claim 2, wherein the upper and lower insulation layers are made of liquid photosensitive green paint (LPM). 10. The multiplexable overcurrent protection element of claim 2, wherein the upper and lower insulating layers are coated along the configuration of the two curved end faces of the laminate, and have mutually symmetrical curved sides. 1 1. The multiplexable overcurrent protection element of claim 2, further comprising a side insulating layer completely coated on both sides of the front and back of the laminate. 1 2. A reversible overcurrent protection component according to claim 1 of the patent scope, wherein the insulating layers on both sides are made of liquid photosensitive anti-welding green paint. 1 . A method for fabricating a multiplexable overcurrent protection device, the method comprising the steps of: 29 1286329 providing a two-electrode layer to sandwich a conductive polymer layer to form a single body; respectively etching a plurality of isolation trenches on the two electrodes of the monomer Forming at least two of the monomers and at least one of the conductive polymer layers are spaced apart from each other and pinched to form a laminated sheet; wherein the electrode layers are etched with a plurality of insulating grooves, adjacent to each other The isolation and the grooves are arranged alternately with each other, whereby a plurality of granular elements are defined by the division, and the separation groove is curved; the cutting grid is set to the upper and lower electrode layers according to a predetermined pattern, and the cutting grid line includes a plurality of strips The continuous longitudinal curve and the plurality of discontinuities traverse the straight line, and the longitudinal curves adjacent to each other are symmetrical to each other; an insulating layer is coated on the upper and lower electrodes and covers the upper and lower insulating grooves; a plurality of granular elements each having left and right curved sidewalls symmetrical to each other; and plating left and right end electrodes to coat each of the particles The two shaped end face of the element, and are alternately electrically connected to these electrode layers. The method of fabricating a replicable overcurrent protection component according to claim 13 wherein the curved end face has at least one concave surface. A method of fabricating a replicable overcurrent protection component according to claim 13 wherein the curved end face has a continuous concave and convex surface. [16] The method of fabricating a replicable overcurrent protection component according to claim 13 wherein the step of fabricating the granular component comprises directly stamping the laminate body according to the longitudinal-direction curve and the transverse straight line ( Punching) . 30 1286329 A plurality of granular elements. The method for fabricating a replicable overcurrent protection component according to claim 13 wherein the step of fabricating the particulate component comprises: pressing the laminate body into a plurality of strip substrates according to the longitudinal curve, and then The strip substrate is folded into a plurality of granular elements according to the transverse straight line. · 1 8. Reversible overcurrent protection as claimed in Article 13 of the patent application. The method of manufacturing the component further includes: before the plating of the left and right end electrodes: the side is varnished with insulating paint on the front and back sides of the granular component. 1 9. A method of fabricating a replicable overcurrent protection Φ component according to claim 13 wherein at least two plating layers are plated on the two curved end faces of each of the granular components, the step comprising: The first electroplated layer of the ore is on the two curved end faces, and the first electric ore layer is a recording layer or a copper layer. A method of fabricating a replicable overcurrent protection device according to claim 19, wherein the step comprises plating a second plating layer on the first plating layer, the second plating layer being a tin layer. 2 1. A method for fabricating a replicable overcurrent protection component according to claim 20, wherein when the first plating layer is a copper layer, the nickel layer is further electroplated between the copper layer and the tin layer. . 2, a method for fabricating a multiplexable overcurrent protection device, the method comprising: providing a single electrode layer to pinch a single conductive polymer layer to form a monomer; etching a plurality of isolation trenches in the electrode layer of the cell; Stacking at least two of the monomers and another electrode layer to form the layer-laininated sheet; - 31 1286329 etching the plurality of isolation trenches on the electrode layers of the laminate body, adjacent to each other The grooves are arranged alternately with each other, whereby a plurality of granular elements are defined by the partition, and the insulating groove is curved; the cutting grid is arranged on the upper and lower electrode layers according to a predetermined pattern, and the cutting grid line comprises a plurality of continuous longitudinal curves and a plurality of discontinuities transverse to a straight line, the longitudinal curves adjacent to each other are symmetrical to each other; an insulating layer is coated on the upper and lower electrodes to cover the upper and lower isolation grooves; and the laminated body is formed into a plurality of granular elements Each of the granular elements has a curved side wall which is symmetrical to each other; the left and right end electrodes of the upper and lower sides of the electric iron are used to coat the two of the granular elements Curved end 啕。 ^ 穴τ砀萌形端面係具有具有迷躓凹凸表 鲁 元件 後麩 、如申請專利範圍第2 H、丄 号列乾圍第2 2項之可復式過電流保護wail. ^ The hole-shaped 端面-shaped end face has a reversible over-current protection with a concavity and convex surface element and a bran, such as the patent application scope 2 H, the 列 column dry circumference 2nd item 1286329 材依:向直線折製成複數粒狀元件。 元件之制#如申請專利範_2 2項之可復式過電流保護 側“漆=以=端電極雜: 元件如申請專利範圍第2 2項之可復或過電流保護 一 # 方去,其中係電鍍至少兩層電鍍層於每一粒狀 St兩曲形端面上,讀步驟係包括電鍍第,電鍍層於 P為面上’該第―電鍍層係為鎳層或銅廣。1286329 Material: It is folded into a plurality of granular elements in a straight line. The system of components #such as the application of patent paratax _2 2 of the reversible overcurrent protection side "paint = with = terminal electrode miscellaneous: components such as the patent scope of the second item of the reusable or overcurrent protection one # go, At least two electroplated layers are plated on each of the two St-shaped curved end faces, the reading step includes electroplating, and the electroplated layer is on the surface of P. The first electroplated layer is a nickel layer or a copper strip. 一 29如申請專利範圍第2 8項之可復式過電流保護 =件^衣作方法,其中該步驟係包括電鍍第二電鍍層於該 弟-電鍍層上,該第二電鍍層係為錫層。 一 3 0、如申請專利範圍第2 8項之可復式過電流保護 元件之製作方法,其中當第一電鍍層為銅層時,係更進一 步電_層於該_鄕層之間。 3 1、一種可復式過電流保護元件之製作方法,其步 驟包含: 置備兩電極層夾擠一導電性高分子層形成一單體; 分別蝕刻複數隔絕槽於該單體之該兩電極層; 準備至少兩該單體與至少一該導電性高分子層互相 間隔設置並夾掩形成一層壓板體(laminated sheet);其 中該等電極層均蝕刻有複數隔絕槽,兩兩相鄰之該電極層 成形之該隔絕槽互相交錯設置,藉以區隔定義出複數粒狀 元件,且等該隔絕槽係呈曲形; s史置陣列式孔洞(dri 11 i ng h〇1 es)貝穿該層壓板 體,其中該層壓板體之上下兩電極層係預切有格線,該孔 33 1286329 洞係落於該格線之交點; 塗覆絕緣層於該上下兩電極並覆蓋住該隔絕槽; 製作j層壓板1成複數粒狀元件,每/粒狀元件係 於兩端面具有互相對稱之貫穿孔壁;以及 電鍵左右纟而電極以包覆每一粒狀元件之兩端面上, 且分別交錯地電性連接至該等電極層。 3 2、如申睛專利範圍第3 1項之可復式過電流保護 兀件之製作方法,其中該層壓板體成粒步驟係包括按該格 線直接衝製成複數粒狀元件。 3 3、如申請專利範圍第3 2項之可復式過電流保護[29] A reversible overcurrent protection method according to claim 28, wherein the step comprises electroplating a second electroplated layer on the electroplated layer, the second electroplated layer being a tin layer . A method for fabricating a replicable overcurrent protection device according to claim 28, wherein when the first plating layer is a copper layer, the layer is further electrically layered between the layers. 3, a method for fabricating a multiplexable overcurrent protection device, the method comprising: providing a two-electrode layer to squeeze a conductive polymer layer to form a single body; respectively etching a plurality of isolation trenches in the two electrode layers of the monomer; Preparing at least two of the monomers and at least one of the conductive polymer layers are spaced apart from each other and sandwiched to form a laminated sheet; wherein the electrode layers are etched with a plurality of insulating grooves, and the electrode layers adjacent to each other Forming the isolation grooves are staggered with each other, thereby defining a plurality of granular elements, and the insulating grooves are curved; s history array holes (dri 11 i ng h〇1 es) are worn by the laminate a body, wherein the upper and lower electrode layers of the laminate body are pre-cut with a ruled line, the hole 33 1286329 is at the intersection of the grid lines; an insulating layer is coated on the upper and lower electrodes and covers the isolation groove; j laminate 1 is a plurality of granular elements, each / granular element has mutually permeable through-hole walls on both end faces; and the electrodes are bent to the left and right sides of the electrode to cover the two end faces of each granular element, and are respectively staggered Connected to these electrode layers. 3 2. The method for manufacturing a reversible overcurrent protection device according to claim 31, wherein the laminating step of the laminate comprises directly punching the plurality of granular elements according to the grid. 3 3. Reversible overcurrent protection as claimed in item 32 of the patent application 兀件之製作方法’更進一步於電鍍左右端電極之前包括: 侧沾絕緣漆於該粒狀元件之前後兩侧。 一 3 4、如申請專利範圍第3 1項之可復式過電流保護 疋=之製作方法,其中該層壓板體成粒步驟係包括先將該 層壓板體折製成複數個條狀基材,再折㈣複餘狀元件。 元 制、如申請專利範圍第3 4項之可復式過電流保護 = '之製作方法,更進一步於折製成複數粒狀元件之前包 •侧沾絕緣漆於該條狀基材之前後兩侧。The method of fabricating the component further includes before the plating of the left and right end electrodes: the side is varnished with insulating paint on the front and rear sides of the granular component. A method for fabricating a reversible overcurrent protection crucible according to claim 31, wherein the laminating step of the laminate comprises first folding the laminate into a plurality of strip substrates. Then fold (4) complex components. The metric system, such as the multiplexable overcurrent protection = 'the manufacturing method of the patent application scope § 4, is further packaged before the folding into a plurality of granular components; the side is varnished with insulating varnish on the sides of the strip substrate before and after . 元件、如申請專利範圍第3 1項之可復式過電流保護 製作方法,更進一步於電鍍左右端電極之前包括: 巴、、、彖漆於該粒狀元件之前後兩侧。 元件、如申請專利範圍第3 1項之可復式過電流保護 元件之^作方法,其中係電鍍至少兩層電鍍層於每一粒狀 曲带亥兩端面上’該步驟係包括電鍍第一電鍍層於該兩 面上,該第一電鍍層係為鎳層或銅層。 34 1286329 3 8、如申請專利範圍第3 7項之可復式過電流保護 元件之製作方法,其中該步驟係包括電鍍第二電鍍層於該 第一電鍍層上,該第二電鍍層係為錫層。 3 9、如申請專利範圍第3 8項之可復式過電流保護 元件之製作方法,其中當第一電鍍層為銅層時,係更進一 · 步電鍍鎳層於該銅層與錫層之間。 _ 4〇、一種可復式過電流保護元件之製作方法,其步 驟包含: 置備單一電極層夾擠單一導電性高分子層形成一單 _ 體; I虫刻複數隔絕槽於該單體之該電極層; 依序堆疊至少兩該單體與另一電極層夾擠形成該層 壓板體; 蝕刻複數隔絕槽於該層壓板體之該等電極層;其中 兩兩相鄰之該電極層成形之該隔絕槽互相交錯設置,藉以 區隔定義出複數粒狀元件,且該隔絕槽係呈曲形; 設置陣列式孔洞(dri 11 ing holes)貫穿該層壓板 _ 體,其中該層壓板體之上下兩電極層係預切有格線,該孔 洞係落於該格線之交點; 塗覆絕緣層於該上下兩電極並覆蓋住該隔絕槽; 製作該層壓板體成複數粒狀元件,每一粒狀元件係 於兩端面具有互相對稱之貫穿孔壁;以及 電鑛左右端電極以包覆每一粒狀元件之兩端面上, 且分別交錯地電性連接至該等電極層。 - 4 1、如申請專利範圍第4 0項之可復式過電流保護 - 35 1286329 元件之製作方法,其中該層壓板體成粒步驟係包括按該格 線直接衝製成複數粒狀元件。 4 2、如申請專利範圍第41項之可復式過電流保護 元件之製作方法,更進一步於電鍍左右端電極之前包括: 侧沾絕緣漆於該粒狀元件之前後兩側。 · 4 3、如申請專利範圍第4 0項之可復式過電流保護 . 元件之製作方法,其中該層壓板體成粒步驟係包括先將該 層壓板體折製成複數個條狀基材,再折製成複數粒狀元件。 4 4、如申請專利範圍第4 3項之可復式過電流保護 _ 元件之製作方法,更進一步於折製成複數粒狀元件之前包 括:側沾絕緣漆於該條狀基材之前後兩侧^ 4 5、如申請專利範圍第4 0項之可復式過電流保護 元件之製作方法,更進一步於電鍍左右端電極之前包括: 側沾絕緣漆於該粒狀元件之前後兩側。 4 6、如申請專利範圍第4 0項之可復式過電流保護 元件之製作方法,其中係電鍍至少兩層電鍍層於每一粒狀 元件之該兩端面上,該步驟係包括電鍍第一電鍍層於該兩 _ 曲形端面上,該第一電鑛層係為錄層或銅層。 4 7、如申請專利範圍第4 6項之可復式過電流保護 元件之製作方法,其中該步驟係包括電鍍第二電鍍層於該 第一電鍍層上,該第二電鍍層係為錫層。 4 8、如申請專利範圍第4 7項之可復式過電流保護 元件之製作方法,其中當第一電鍍層為銅層時,係更進一 步電鍍鎳層於該銅層與錫層之間。 _ 4 9、一種可復式過電流保護元件之製作方法,其步 . 36 1286329 驟包含: ^ 製備一由上下電極層夾擠導電性高分子層形成之層 壓板體; 分別蝕刻複數不連續之隔絕槽於該上下電極層,該 層壓板體之隔絕槽係交錯成形,藉以區隔定義出複數粒狀 · 元件,其中,該隔絕槽係呈曲形; · 按預定圖樣設置切割格線於該上下電極層,該切割 格線係包括複數條連續性縱向曲線以及複數條不連續性橫 向直線,兩兩相鄰之該縱向曲線係互相對稱; 籲 塗覆絕緣層於該上下兩電極並覆蓋住該隔絕槽; 製作該層壓板體成複數粒狀元件,每一粒狀元件係 具有互相對稱之左右兩曲形端面(curved sidewall);以 及 電鍍左右端電極以包覆每一粒狀元件之該兩曲形端 面上,且分別電性連接至該上下電極層。 5 0、如申請專利範圍第4 9項之可復式過電流保護 元件之製作方法,其中該曲形端面係具有至少一凹表面。 鲁 5 1、如申請專利範圍第4 9項之可復式過電流保護 元件之製作方法,其中該曲形端面係具有具有連續凹凸表 面。 5 2、如申請專利範圍第4 9項之可復式過電流保護 元件之製作方法,其中該製作粒狀元件步驟係包括按該縱 向曲線與該橫向直線將該層壓板體直接衝製(punching) 成複數粒狀元件。 5 3、如申請專利範圍第4 9項之可復式過電流保護 37 1286329 元件之製作方法,其中該製作粒狀元件步驟係包括按該縱 向曲線將該層壓板體衝製成複數條狀基材,再將該條狀基 材依該橫向直線折製成複數粒狀元件。 5 4、如申請專利範圍第4 9項之可復式過電流保護 元件之製作方法,更進一步於電鍍左右端電極之前包括: . 側沾絕緣漆於該粒狀元件之前後兩侧。 . 5 5、如申請專利範圍第4 9項之可復式過電流保護 元件之製作方法,其中係電鍍至少兩層電鍍層於每一粒狀 元件之該兩曲形端面上,該步驟係包括電鑛第一電鍍層於 鲁 該兩曲形端面上,該第一電鑛層係為錄層或銅層。 5 6、如申請專利範圍第5 5項之可復式過電流保護 元件之製作方法,其中該步驟係包括電鍍第二電鍍層於該 第一電鍍層上,該第二電鑛層係為錫層。 5 7、如申請專利範圍第5 6項之可復式過電流保護 元件之製作方法,其中當第一電鍍層為銅層時,係更進一 步電鍍鎳層於該銅層與錫層之間。 5 8、一種可復式過電流保護元件之製作方法,其步 _ 驟包含: 製備一由上下電極層夾擠導電性高分子層形成之層 壓板體(laminated sheet); 預切格線於該上下電極層與設置陣列式孔洞 (drilling holes)貫穿該層壓板體,該孔洞係落於該格 線之交點; 分別蚀刻複數不連續之隔絕槽於該上下電極層,該 , 層壓板體之隔絕槽係交錯成形,藉以區隔定義出複數粒狀 _ 38 ^86329 元件,货 一 之播 中,該隔絕槽係呈曲形,且該隔絕槽係沿該孔洞 傅形成形; I復纟巴緣層於該上下兩電極並覆蓋住該隔絕槽; 於 &amp;裏作°亥層壓板體成複數粒狀元件,每/粒狀元件係 〜缒面具有互相對稱之貫穿孔壁;以及 且八氣鍍左右端電極以包覆每一粒狀元件之雨端面上, 刀別電性連接至該上下電極層。 元 5 9、如申请專利範圍第$ 8項之可復式過電流保護 缔*之製作方法,其中該層壓板體成粒步驟係包括按該格 、、求直接衝製成複數粒狀元件。 一 6 〇、如申请專利範圍第5 9項之可復式過電流保護 =件之製作方法’更進—步於電鍍左右端電極之前包括: 則沾絕緣漆於餘狀元叙前後兩侧。 一 6 1、如申請專利範圍第5 8項之可復式過電流保護 元=之製作方法’其中該層壓板體成粒步驟係包括先將該 層壓板體折製成複數個條狀基材,再折製成複數粒狀元件。 一 6 2、如申請專利範圍第6丄項之可復式過電流保護 兀件之製作方法H步於折製成複餘狀元件之前包 括:側沾絕緣漆於該條狀基材之前後兩侧。 6 3、如申請專利範圍第δ 1項之可復式過電流保護 元件之製作方法’更進—步於錢左右端電極之前包括: 側沾絕緣漆於该粒狀元件之前後兩側。 I6二:Γΐ利範圍第5 8項之可復式過電流保護 70件之衣作方法,其巾係錢至少兩層電㈣於每一粒狀 兀件之該兩端面上’該步驟係包括電鍍第1鍍層於該兩 39 1286329 曲形端面上,該第一電鍍層係為鎳層或銅層。 6 5、如申請專利範圍第6 4項之可復式過電流保護 元件之製作方法,其中該步驟係包括電鍍第二電鍍層於該 第一電鍍層上,該第二電鍍層係為錫層。 6 6、如申請專利範圍第6 5項之可復式過電流保護 元件之製作方法,其中當第一電鍍層為銅層時,係更進一 步電鑛錄層於該銅層與錫層之間。The component, such as the multiplexable overcurrent protection manufacturing method of claim 31, further comprises: before, after, plating the left and right end electrodes: the smear, the smear, and the smear on both sides of the granule. An apparatus, such as the method of claim 4, wherein the plating is performed on at least two layers of plating on each of the two sides of the granular band. The layer is on both sides, and the first plating layer is a nickel layer or a copper layer. 34 1286329 3 8. The method for fabricating a replicable overcurrent protection device according to claim 37, wherein the step comprises plating a second plating layer on the first plating layer, the second plating layer being tin Floor. 3. The method for fabricating a replicable overcurrent protection device according to claim 38, wherein when the first plating layer is a copper layer, the nickel layer is further electroplated between the copper layer and the tin layer. . _ 4〇, a method for fabricating a multiplexable overcurrent protection device, the method comprising: providing a single electrode layer to pinch a single conductive polymer layer to form a single body; I insect engraving a plurality of isolation grooves at the electrode of the monomer a layer; at least two of the cells are sequentially stacked to form a laminate body with another electrode layer; and the plurality of insulating layers are etched into the electrode layer of the laminate body; wherein the two adjacent electrode layers are formed The insulating grooves are arranged alternately with each other to define a plurality of granular elements, and the insulating grooves are curved; Array holes are arranged through the laminate, wherein the upper and lower sides of the laminated body The electrode layer is pre-cut with a ruled line, the hole is at the intersection of the ruled line; an insulating layer is coated on the upper and lower electrodes and covers the isolation groove; and the laminate body is made into a plurality of granular elements, each of which The element is formed on the both end faces with mutually symmetrical through-hole walls; and the left and right end electrodes of the electro-mineral are coated on both end faces of each of the granular elements, and are electrically connected to the electrode layers in a staggered manner. - 4 1. A method for fabricating a multiplexable overcurrent protection - 35 1286329 component, wherein the granulation step of the laminate comprises directly pulsing the plurality of granules according to the grid. 4 2. The method for manufacturing the multiplexable overcurrent protection component according to the 41st patent application scope further includes: before the plating of the left and right end electrodes, the side is immersed with the insulating paint on the front and the back sides of the granular component. · 4 3. The method of manufacturing the component according to the method of claim 40, wherein the step of granulating the laminate comprises first folding the laminate into a plurality of strip substrates. It is then folded into a plurality of granular elements. 4 4. The method for manufacturing the multiplexable overcurrent protection _ component according to the patent application scope § 4, further including before the folding into the plurality of granular components: the side is immersed in the varnish on the front side of the strip substrate ^ 4 5. The method for fabricating the multiplexable overcurrent protection component according to claim 40 of the patent scope further includes: before the plating of the left and right end electrodes, the side is varnished with insulating paint on the front and rear sides of the granular component. 4. A method of fabricating a replicable overcurrent protection component according to claim 40, wherein at least two plating layers are plated on the both end faces of each of the granular components, the step comprising electroplating the first plating The layer is on the two curved end faces, and the first electric ore layer is a recording layer or a copper layer. 4. A method of fabricating a replicable overcurrent protection device according to claim 46, wherein the step comprises plating a second plating layer on the first plating layer, the second plating layer being a tin layer. 4. A method of fabricating a replicable overcurrent protection device according to claim 47, wherein when the first plating layer is a copper layer, a nickel layer is further electroplated between the copper layer and the tin layer. _ 4 9. A method for fabricating a multiplexable overcurrent protection element, the step of which is: 36 1286329 comprises: preparing a laminate body formed by sandwiching a conductive polymer layer between the upper and lower electrode layers; respectively etching a plurality of discrete discontinuities The groove is formed on the upper and lower electrode layers, and the insulating grooves of the laminate body are alternately formed, thereby defining a plurality of granular elements according to the partition, wherein the insulating groove is curved; and the cutting grid is arranged on the upper and lower sides according to a predetermined pattern. An electrode layer comprising a plurality of continuous longitudinal curves and a plurality of discontinuous transverse straight lines, wherein the longitudinal curves adjacent to each other are symmetrical to each other; and an insulating layer is applied to the upper and lower electrodes and covers the Separating the groove; forming the laminate body into a plurality of granular elements, each of the granular elements having mutually curved left and right curved sidewalls; and plating the left and right end electrodes to cover the two of the granular elements The curved end faces are electrically connected to the upper and lower electrode layers, respectively. 50. The method of fabricating a replicable overcurrent protection component according to claim 49, wherein the curved end face has at least one concave surface. Lu 5 1. A method of fabricating a replicable overcurrent protection component according to claim 49, wherein the curved end face has a continuous concave and convex surface. 5 . The method of fabricating a multiplexable overcurrent protection component according to claim 49, wherein the step of fabricating the granular component comprises directly punching the laminate body according to the longitudinal curve and the transverse straight line. Into a plurality of granular elements. 5 3. The method for fabricating a detachable overcurrent protection 37 1286329 component according to claim 49, wherein the step of fabricating the granular component comprises punching the laminate body into a plurality of strip substrates according to the longitudinal curve. Then, the strip substrate is folded into a plurality of granular elements according to the transverse straight line. 5 4. The method for fabricating the multiplexable overcurrent protection component of claim 49, further including before plating the left and right end electrodes: . The side is varnished with insulating paint on the front and rear sides of the granular component. 5. The method of fabricating a replicable overcurrent protection component according to claim 49, wherein at least two plating layers are plated on the two curved end faces of each of the granular components, the step comprising electricity The first electroplated layer of the ore is on the two curved end faces, and the first electric ore layer is a recording layer or a copper layer. 5. The method of fabricating a replicable overcurrent protection device according to claim 5, wherein the step comprises plating a second plating layer on the first plating layer, and the second electrode layer is a tin layer . 5. A method of fabricating a replicable overcurrent protection device according to claim 56, wherein when the first plating layer is a copper layer, a nickel layer is further electroplated between the copper layer and the tin layer. 5 8. A method for fabricating a multiplexable overcurrent protection device, the method comprising: preparing a laminated sheet formed by sandwiching a conductive polymer layer between upper and lower electrode layers; and pre-cutting lines on the upper and lower sides The electrode layer and the array of drilling holes are disposed through the laminate body, and the holes are at the intersection of the grid lines; and the plurality of discontinuous isolation grooves are respectively etched on the upper and lower electrode layers, and the isolation plate of the laminate body Interlaced to form a plurality of granular _ 38 ^ 86629 components, in the broadcast of the goods, the isolation groove is curved, and the isolation groove is formed along the hole; I retanning the edge layer And the upper and lower electrodes cover the insulating groove; in the &amp;, the composite layer is made into a plurality of granular elements, each of the granular elements has a mutually symmetrical through-hole wall; and eight gas plating The terminal electrode is coated on the rain end surface of each of the granular elements, and the blade is electrically connected to the upper and lower electrode layers. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; A 6 〇, such as the patentable scope of item 59, the multiplexable overcurrent protection = the manufacturing method of the part </ RTI> further steps before the plating of the left and right end electrodes include: then the varnish is applied to the front and back sides of the remainder. 161. The method for manufacturing a multiplexable overcurrent protection element according to claim 58 of the patent application, wherein the step of granulating the laminate comprises first folding the laminate into a plurality of strip substrates. It is then folded into a plurality of granular elements. A 6 2. The method for manufacturing the multiplexable overcurrent protection element according to the sixth paragraph of the patent application scope is as follows: before the folding into the complex component, the side is covered with the side varnish on the front side of the strip substrate . 6 3. If the application method of the multiplexable overcurrent protection component of the patent application scope δ 1 is further advanced, the method includes: the side is immersed with the insulating paint on the front and the back sides of the granular component. I6 2: The versatile over-current protection of 70 parts of the profit-making range of item 5, the towel is made of at least two layers of electricity (four) on the two end faces of each granular element. The first plating layer is on the curved end faces of the two 39 1286329, and the first plating layer is a nickel layer or a copper layer. 6. The method of fabricating a replicable overcurrent protection device according to claim 64, wherein the step comprises plating a second plating layer on the first plating layer, the second plating layer being a tin layer. 6. A method of fabricating a replicable overcurrent protection device according to claim 65, wherein when the first plating layer is a copper layer, a further electro-mineral layer is interposed between the copper layer and the tin layer. 40 128632940 1286329 第七圖 1286329 七、指定代表圖: (一)本案指定代表圖為··第(五A ) 圖。 (二)本代表圖之元件符號簡單說明: 本發明之可復性過電流保護元件 層壓體 1 導電性高分子層12 上下電極層 1 3、 14 導電層 1 5、1 6隔絕槽 1 7、 18 内電極 2 0 端電極 2 、3 第一電鍍層 2 1、3 1第二電鍍層 2 2、 3 2 端電極 2、3 第一電鍍層 2 1、 3 1 第二電鍍層 2 2、3 2絕緣層 4 、5 側絕緣層 6 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式:Figure 7 1286329 VII. Designated representative map: (1) The representative representative of the case is the picture (5A). (2) Brief description of the components of the present diagram: Resolvable overcurrent protection element laminate 1 of the present invention Conductive polymer layer 12 Upper and lower electrode layers 1 3, 14 Conductive layer 1 5, 16 6 Insulation groove 1 7 18 inner electrode 2 0 end electrode 2 , 3 first plating layer 2 1 , 3 1 second plating layer 2 2, 3 2 end electrode 2, 3 first plating layer 2 1 , 3 1 second plating layer 2 3 2 Insulation layer 4, 5 Side insulation layer VIII. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention:
TW93133393A 2004-11-02 2004-11-02 Recoverable over-current protection device and its manufacturing method TWI286329B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486988B (en) * 2013-01-31 2015-06-01 Polytronics Technology Corp Over-current protection device and circuit board containing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486988B (en) * 2013-01-31 2015-06-01 Polytronics Technology Corp Over-current protection device and circuit board containing the same

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