TWI285630B - Passive thermoacoustic cooling apparatus - Google Patents

Passive thermoacoustic cooling apparatus Download PDF

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Publication number
TWI285630B
TWI285630B TW094114481A TW94114481A TWI285630B TW I285630 B TWI285630 B TW I285630B TW 094114481 A TW094114481 A TW 094114481A TW 94114481 A TW94114481 A TW 94114481A TW I285630 B TWI285630 B TW I285630B
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TW
Taiwan
Prior art keywords
heat
temperature difference
passive
component
thermoacoustic
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TW094114481A
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Chinese (zh)
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TW200639115A (en
Inventor
Pen-Yuan Hsing
Wei-Kang Huang
Tseng-Yu Shu
Ming-Te Wu
Liang-Chao Chang
Original Assignee
Lee Chih Kung
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Priority to TW094114481A priority Critical patent/TWI285630B/en
Priority to US11/418,469 priority patent/US20060266052A1/en
Publication of TW200639115A publication Critical patent/TW200639115A/en
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Publication of TWI285630B publication Critical patent/TWI285630B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F25B9/145—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle pulse-tube cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1403—Pulse-tube cycles with heat input into acoustic driver
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2309/00—Gas cycle refrigeration machines
    • F25B2309/14—Compression machines, plants or systems characterised by the cycle used 
    • F25B2309/1416—Pulse-tube cycles characterised by regenerator stack details

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A passive thermoacoustic cooling apparatus that could be miniaturized for cooling of microelectronics components was proposed. The passive thermoacoustic cooling apparatus is composed of a resonant chamber, a temperature-difference element and a heat conduction element. The temperature-difference element is situated in the resonant chamber and could transfer heat into acoustic power. The heat conducting element connects heat load and the temperature-difference element. The heat conducting element transmits heat from heat load to one end of the temperature-difference component. By forming temperature gradient on the temperature-difference element, acoustic standing wave is formed in the resonant chamber. Therefore, forced air convection is generated to cool the heat load.

Description

1285630 九、發明說明： 【發明所屬之技術領域】 本發明與散熱裝置相關，係為 【先前技術】 八主元件如巾央處-之散熱裝置可 所謂主動式散熱裝置意指需消耗額外能量作風Ί 葉強制线對流達成散熱效果 材質，試_被散熱元件上的熱料衫。風扇的使 = 鎌動與體積很難縮小的缺點，峨熱片的散熱伽到傳導與 輻射，散熱效果較差，因此可微型化並散熱效果佳的散熱裝置 在微型電路、微電子元件上的散熱有需求度。 '' ，謂熱聲效應是指：當氣體被壓縮時，温度會升高，因此 藉由聲波共振產生介f疏㈣躲，即可在共絲上形成溫度 梯度的變化，反之，在共振軸上形成溫度梯度，可產生聲波共 振現象。熱聲裝置中最重要的元件是將熱能與聲能間做交換的 元件，在此稱溫差元件，溫差元件須具備低傳熱係數與大表面 積的特點’低傳熱係數特性使的在溫差元件上容易形稱溫度梯 度’而大表面積的特性方便傳遞聲波的介質與溫差元件產生互 動。熱聲裝置可藉由聲波或熱源啟動熱聲機制，在溫差元件上 形成溫度梯度及產生共振聲波對流現象，故可使用於散熱上。 應用熱聲效應的散熱裝置由於結構簡單，極具微型化的潛 力’應用熱聲效應產生空氣對流達成散熱效果已見於習知技 6 1285630 ί 國專利號碼4, 858, 717、美國專利號碼M59, 020、 置如勢八等啟動鱗效應造成 、、、々IL以、到政熱的目的。且應用熱聲效應不僅僅可達到散熱而 以’甚至可以達到致冷效果，美國專利號碼6, _，967Β2即利 用一壓電致動器產生約4〇〇〇赫茲高頻的聲能在熱聲管產生聲 ，共振駐波，啟動熱聲效應在熱聲管中造成攝氏負4()度的溫 ，，冷编達到攝氏負20度的溫度。以上幾種習知技術均利 用到聲波產生裝置，故需消耗能量是為主動式散熱的模式 美國專利號碼4, 858, 441提出一種以熱驅動之熱聲致冷 裝置，擬利用廢棄熱源啟動熱聲效應達到致冷的目的、雖然所 使用的熱源是廢棄的，並不造成額外的能量消耗，但由於結構 上需結合廢棄熱源，故有應用方面會受到限制，無法模組化。 【發明内容】 本發明提出一種具微型化潛力之被動式熱聲散熱裝置。 本發明所長：被動式熱聲散熱裝置可應用在微型電路、微電 子元件如中央處理器之散熱上。 本發明所提被動式熱聲散熱裝置不需消耗額外能量，直接 利用被散熱元件之熱能動熱聲機制進行散熱。 本發明所提被動式熱聲散熱裝置直接利用被散熱元件之 熱能動熱聲機制，讓共振腔内介質形成共振駐波，讓介質 產生散熱效果。 本發明所提被動式熱聲散熱裝置基本上至少包含有一溫 差元件、一熱傳導元件與共振腔；溫差元件上兩端一端是= 端、一端是冷端，溫差元件是由熱傳導係數差之材質如陶瓷 玻璃纖維、塑膠或木材等組成之多孔性元件，傳熱係數差的目 的是讓溫差元件兩端容易形成溫差啟動熱聲機制，空隙的存在 疋為了讓傳遞聲波的介質與溫差元件做熱交流。 1285630 熱傳導元件由傳熱係數佳之材質如金屬類組成，熱傳導元 件一端連接被散熱元件，一端接溫差元件之熱端，目的在將被 散熱元件之熱能傳遞至溫差元件熱端，以便在溫差元件兩端形 成溫差啟動熱聲機制。 ，1285630 IX. Description of the invention: [Technical field of the invention] The present invention relates to a heat dissipating device, which is a [prior art] eight main components such as a towel-heating device. The so-called active heat dissipating device means that additional energy is required to be used. Ί Leaf forced line convection to achieve heat dissipation material, try _ the hot material on the heat sink. The fan's make = 镰 与 与 体积 体积 体积 体积 体积 体积 峨 峨 峨 峨 峨 峨 峨 缺点 缺点 缺点 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇There is a demand. '', the thermoacoustic effect means that when the gas is compressed, the temperature will rise. Therefore, by the acoustic resonance, the temperature gradient is formed on the collinear, and vice versa. A temperature gradient is formed on the surface to generate acoustic resonance. The most important component in a thermoacoustic device is a component that exchanges thermal energy and acoustic energy. Here, the temperature difference component is required to have a low heat transfer coefficient and a large surface area. The low heat transfer coefficient makes the temperature difference component It is easy to describe the temperature gradient' and the large surface area is convenient for the medium that transmits the sound wave to interact with the temperature difference element. The thermoacoustic device can activate the thermoacoustic mechanism by sound waves or heat sources to form a temperature gradient on the temperature difference element and generate a resonance sound wave convection phenomenon, so that it can be used for heat dissipation. The heat sink with thermoacoustic effect has the potential of miniaturization due to its simple structure. 'The application of thermoacoustic effect to generate air convection to achieve heat dissipation effect has been found in the conventional technology 6 1285630 ί national patent number 4, 858, 717, US patent number M59, 020, set the trend of the eight to start the scale effect caused by,, 々IL, to the political heat. And the application of the thermoacoustic effect can not only achieve heat dissipation, but can even achieve the cooling effect. U.S. Patent No. 6, _, 967 Β 2 uses a piezoelectric actuator to generate about 4 Hz high frequency acoustic energy in heat. The sound tube produces sound, resonance standing wave, and the thermoacoustic effect is caused to cause a temperature of minus 4 (degrees) Celsius in the thermoacoustic tube, and the cold knitting reaches a temperature of minus 20 degrees Celsius. The above-mentioned prior art technologies all utilize the sound wave generating device, so that the energy consumption is a mode for active heat dissipation. U.S. Patent No. 4,858,441 proposes a thermo-acoustic thermoacoustic refrigeration device, which is intended to start heat by using a waste heat source. The acoustic effect achieves the purpose of cooling. Although the heat source used is discarded, it does not cause additional energy consumption. However, since the structure needs to be combined with the waste heat source, the application is limited and cannot be modularized. SUMMARY OF THE INVENTION The present invention provides a passive thermoacoustic heat sink with miniaturization potential. SUMMARY OF THE INVENTION The passive thermoacoustic heat sink can be applied to the heat dissipation of microcircuits, microelectronic components such as a central processing unit. The passive thermoacoustic heat dissipating device of the invention does not need to consume additional energy, and directly uses the thermal energy and thermal mechanism of the heat dissipating component to dissipate heat. The passive thermoacoustic heat dissipating device of the invention directly utilizes the thermal energy and thermal sound mechanism of the heat dissipating component, so that the medium in the resonant cavity forms a resonance standing wave, so that the medium generates a heat dissipating effect. The passive thermoacoustic heat dissipating device of the present invention basically comprises at least one temperature difference component, a heat conduction component and a resonant cavity; the upper end of the temperature difference component has a = end and one end is a cold end, and the temperature difference component is made of a material having a poor thermal conductivity coefficient such as ceramic. Porous components composed of glass fiber, plastic or wood. The purpose of poor heat transfer coefficient is to make the temperature difference between the two ends of the temperature difference element easy to form a thermoacoustic mechanism. The existence of the gap is to allow the medium transmitting the acoustic wave to communicate with the temperature difference element. 1285630 The heat conduction component is made of a material with good heat transfer coefficient, such as metal. The heat conduction component is connected to the heat dissipation component at one end and the hot end of the temperature difference component is connected at one end. The purpose is to transfer the heat energy of the heat dissipation component to the hot end of the temperature difference component, so that the temperature difference component is The end forms a temperature difference to initiate a thermoacoustic mechanism. ,

共振腔為聲波共振產生駐波的範圍，共振腔^長度直接與 產生駐波的共振頻率相關，如共振腔一端閉口一端開口，則共 振腔長度為最谷易產生的基本頻率之波長的四分之一；一般熱 聲裝置共振腔的範圍可以由熱傳導元件與溫差元件規範出 來，又或可以另外設計外殼規範其範圍；由於共振腔的長度與 頻率直接相關，故對於微型化熱聲散熱裝置而言，極短的共振 腔可以讓產生的頻率為超聲波，超出人耳聽覺範圍，而有無嗓 音的好處；一般共振腔尺寸的設計會讓共振轴長度為主，意即 共振轴的長度最長，使共振轴上的共振波最易驅動產生；又， 溫差元件所放置之最佳位置會在離駐波壓力零點約八分之一The resonant cavity is the range of the standing wave generated by the acoustic resonance. The length of the resonant cavity is directly related to the resonant frequency of the standing wave. If one end of the resonant cavity is open at one end, the length of the resonant cavity is the wavelength of the wavelength of the fundamental frequency that is most likely to be generated by the valley. One; the range of the resonant cavity of the general thermoacoustic device can be specified by the heat conducting component and the temperature difference component, or the outer casing can be additionally designed to have its range; since the length of the resonant cavity is directly related to the frequency, the miniaturized thermoacoustic heat sink is In other words, the extremely short resonant cavity can make the generated frequency ultrasonic, which is beyond the hearing range of the human ear, and has the advantage of sound. Generally, the size of the resonant cavity is designed to make the length of the resonant axis dominant, meaning that the length of the resonant axis is the longest. The resonant wave on the resonant axis is most easily driven; in addition, the optimal position of the temperature difference component is about one-eighth of the standing wave pressure zero.

的波長的位置，駐波壓力零點亦是介質移動速度最快的地方， 共振腔開口端就是駐波壓力零點的位置。共振腔的截面可以隨 被散熱物體定義出任何形狀，如圓形、方形。 本發明被動式熱聲散熱裝置實施例之一，共振腔一端閉口 一，開口，溫差元件約放置在共振腔二分之一處，溫差元件熱 端靠近閉口端，被散熱元件置於靠近共振腔閉端，或者直接^ 被散熱元件的-面封振腔，熱傳導元件連接溫差元件敎端 與被散熱元件。 # 又，在本發明被動式熱聲散熱裝置的實施例中，共振腔兩 端可以皆為開口’溫差元件放置位置約在共振腔四分之一處， „70件冷财賴叫較近處，熱料元件連接 端與被散熱元件。 什… 振腔兩端開叫實施财，溫差元件可以有兩個，分 別放置在舰㈣端各約四分之—敝置，_溫差元件冷端 8 !285630 分別朝開口端，被散熱元件置於靠近共振腔中央%的位置，或者 直接以被散熱元件的一面封閉共振腔，熱傳導元件連接兩個溫 差元件熱端與被散熱元件。 本發明被動式熱聲散熱裝置的實施例中，可以設計共振腔 的長度使共振駐波為超聲波的範圍。 4 本發明被動式熱聲散熱裝置的實施例中，可以有多個共振 腔以陣列方式排列，因如要設計共振腔的長度在超聲波^範 圍’共振腔的共振軸上的長度會變的極短，而共振腔裡非共振 軸上的尺度也需相對配合縮小，以使共振軸上的共振是最容易 激發的模態，由於共振腔尺度相對縮小，散熱面積也隨之縮 小，故可以以陣列排列共振腔之方式增加散熱面積。 本發明被動式熱聲散熱裝置可以以微機電製程或其他薄 膜技術製作，以製作微型化被動式熱聲散熱裝置。^ ' 【實施方式】 本發明所提被動式熱聲散熱裝置實施例之一 1〇〇之侧面 剖面圖如第一圖所示，基本上包含有一溫差元件n、一熱傳 導元件12與共振腔13，共振腔13為聲波共振產生駐波的範 圍由外殼16規範出該範圍，共振腔13 一端皆被散執元件14 形成閉d，另-端開口，共振腔長度為最容易產生的基本頻率 之波長的四分之-’絲腔13最容易產生之駐波壓力分布狀 況如15所示；溫差元件上兩端—端是熱端⑴、—端是 112，溫差元件是她傳導絲差之材質如喊、玻璃纖維、 瓣或木材f組成之乡紐祕，放置位置約在共振腔13 ϋ 由傳熱係數佳之材質如金屬類組成，熱 傳導讀可^線_態，—端連接被散熱元件14，一端接 溫差兀件之熱端m，目的在將被散熱元件14之執能傳遞至 溫差元件熱端m ’以便在溫差元件1;1 _形成溫差啟動熱 1285630 聲機制。 一又在本發明實施例中，共振腔可以有複數個，如第二圖所 示為本發明所提被動式熱聲散熱裝置實施例之一 200側面剖 面圖，共振腔23—端由熱傳導元件22形成閉口，一端由外殼 26規範出開口端；共振腔23有複數個並列，一片溫差元件η 貫穿共振腔23約中央處，該些共振腔23並列狀況之截面圖可 以如第三圖之37所示，共振腔23為圓形，整個被動式熱聲散 熱裝置外型為圓形薄片，圓片型之熱傳導元件22上有複數個 未貫穿的圓孔，形成共振腔23自溫差元件熱端hi到共振腔 閉端的範圍，被散熱元件14貼近熱傳導元件22封閉端，熱傳 導元件22將被散熱元件14上的熱傳導至溫差元件熱端in， 以在溫差元件11上形成溫差驅動熱聲效應；溫差_元件U是由 熱傳導係數差之材質組成之多孔性元件，其孔隙奇以規則排列 如第四圖中47或48所示，分別為格狀或片狀堆疊而成；溫差 元件熱端111接收由熱傳導元件22傳來熱，進而在溫差元件 11上形成溫差驅動熱聲效應在共振腔23共振產生駐波π，共 振駐波15造成空氣對流，進而對被散熱元件14進衧散熱。 第五圖顯示本發明被動式熱聲散熱裝置另一實施例300 ^侧面剖面圖，其共振腔53由外殼56規範出，共振腔53兩 端為開口，溫差元件11放在共振腔53内離開口端約四分之一 的位置，溫差元件冷端112離開口端較近，熱傳導元件52 一 面接觸被散熱元件14，將被散熱元件14上的熱傳導至溫差元 件熱端111，以在溫差元件11上形成溫差驅動熱聲效應造成 共振駐波55，使空氣對流進而對被散熱元件進代散熱。 本發明實施例中溫差元件可不只有一個，如第六圖所示， 本發明被動式熱聲散熱裝置另一實施例40〇之侧面剖面圖，其 共振腔53由外殼56規範出，共振腔53兩端為開口，第一溫 差元件610放在共振腔53内離右端開口端約四分之一的位 1285630 置，第二溫差元件620放在共振腔53内離左端開口端約四分 之一的位置，第一溫差元件冷端612與第二溫差元件冷端622 分別朝向共振腔53開口處，熱傳導元件62 —面接觸被散熱元 件14，將被散熱元件14上的熱傳導至第一溫差元件熱端611 • 與第二溫差元件熱端621，以在兩個溫差元件61〇、620上形 成溫差驅動熱聲效應造成共振駐波55，使空氣對流進而對被 散熱元件進行散熱。 第七圖顯示本發明被動式熱聲散熱裝置另一實施例5〇〇 之側面剖面圖，共振腔73有複數個並列，共振腔73兩端為開 φ 口’第一溫差元件610放在離共振腔73内右端開口端約四分 之一的位置，貫穿並列之共振腔73，第二溫差元件620放在 共振腔53内離左端開口端約四分之一的位置，貫穿並列之共 振腔73，第一溫差元件冷端612與第二溫差元件冷端622 ^ ’ 別朝向該些共振腔53開口處，熱傳導元件72構成共振腔73 中間的腔體，一面接觸被散熱元件14，將被散熱元件14上的 熱傳導至第一溫差元件熱端611與第二溫差元件熱端621，以 在兩個溫差元件610、620上形成溫差驅動熱聲效應造成共振 駐波55，使空氣對流進而對被散熱元件進行散熱。 ' 據此，本發明之較佳實施例係已在此充分地詳細描述，以 使熟習此項技藝之人士能夠利用本發明。然應當:了解的是，吾 人係可針對所說明之實施例進行改變、修改、替換而不會背^ 本發明於隨附申請專利範圍所界定之精神與範疇。 【圖式簡單說明】 為令本發明之上述和其他目的、特徵、和優點能更為明顯 而易於暸解，本發明將配合所附圖式於後列說明文字中進行詳 細說明。附圖之中： 第一圖：本發明被動式熱聲散熱裝置實施例之一的侧面剖 @· 11 1285630 第二圖：本發明被動式熱聲散熱裝置多共振腔實施钩之一的側 面剖面圖； ' 第三圖··本發明被動式熱聲散熱裝置多共振腔實施例的截面示 • 意圖， 第四圖：本發明被動式熱聲散熱裝置中多孔性溫差元件截面示 意圖， 第五圖：本發明被動式熱聲散熱裝置實施例之一的侧面剖面 1^1 · 圖， 第六圖··本發明被動式熱聲散熱裝置實施例之一的侧面剖面 1^1 · 圖， 第七圖：本發明被動式熱聲散熱裝置多共振腔實施例之—的側 面剖面圖； 【主要元件符號說明】 11 :溫差元件 12 :熱傳導元件 13 :共振腔 14 :被散熱元件 15 :聲波形成駐波 Φ 16 :外殼 111 :溫差元件熱端 112 :溫差元件冷端 22 :熱傳導元件 23 =共振腔 26 =外殼 37 :多共振腔截面示意圖 47 :多孔性溫差元件截面示意圖 ‘ 48 :多孔性溫差元件截面示意圖 ·· 52 :熱傳導元件 12 1285630 53 :共振腔 55 :共振腔 56 :外殼 62 ··熱傳導元件 610 :第一溫差元件 611 :第一溫差元件熱端 612 :第一溫差元件冷端 620 :第二溫差元件 621 :第二溫差元件熱端 622 ··第二溫差元件冷端 72 :熱傳導元件 73 :共振腔 13The position of the wavelength, the zero point of the standing wave is also the fastest moving speed of the medium, and the open end of the resonant cavity is the position of the standing wave pressure zero. The cross section of the cavity can define any shape, such as a circle or a square, with the object to be dissipated. In one embodiment of the passive thermoacoustic heat sink device of the present invention, one end of the resonant cavity is closed, the opening, the temperature difference component is placed about one-half of the resonant cavity, the hot end of the temperature difference component is close to the closed end, and the heat dissipating component is placed close to the resonant cavity. The end, or directly ^ is the cavity-sealing cavity of the heat dissipating component, and the heat conducting component is connected to the end of the temperature difference component and the heat dissipating component. # Further, in the embodiment of the passive thermoacoustic heat sink of the present invention, both ends of the resonant cavity may be open. The temperature difference component is placed at about one quarter of the resonant cavity, and „70 pieces of cold money are called closer. The hot material component is connected to the heat dissipating component. The two sides of the vibrating cavity are open to implement the financial, and the temperature difference component can have two, respectively, placed on the ship (four) end for about four quarters - the set, the temperature difference component cold end 8! 285630 respectively toward the open end, the heat dissipating component is placed close to the center of the resonant cavity, or directly closes the resonant cavity by one side of the heat dissipating component, and the heat conducting component connects the hot end of the two thermoelectric components and the heat dissipated component. In the embodiment of the heat sink, the length of the resonant cavity can be designed such that the resonant standing wave is in the range of ultrasonic waves. 4 In the embodiment of the passive thermoacoustic heat sink of the present invention, a plurality of resonant cavities can be arranged in an array, as designed The length of the resonant cavity is extremely short in the ultrasonic axis range of the resonant cavity of the resonant cavity, and the dimension on the non-resonant axis of the resonant cavity also needs to be relatively reduced to make a total The resonance on the vibration axis is the most easy to excite mode. Since the size of the cavity is relatively reduced, the heat dissipation area is also reduced. Therefore, the heat dissipation area can be increased by arranging the resonators in an array. The passive thermoacoustic heat sink of the present invention can be micro Electromechanical process or other thin film technology is fabricated to produce a miniaturized passive thermoacoustic heat sink. [Embodiment] One side cross-sectional view of one embodiment of the passive thermoacoustic heat sink device of the present invention is shown in the first figure. Basically, a temperature difference element n, a heat conduction element 12 and a resonant cavity 13 are included. The range in which the resonant cavity 13 generates standing waves for acoustic resonance is specified by the outer casing 16, and one end of the resonant cavity 13 is closed by the loose element 14. The other end opening, the length of the resonant cavity is the quarter of the wavelength of the most easily generated fundamental frequency - 'the standing wave pressure distribution condition most easily generated by the wire cavity 13 is as shown in FIG. 15; the upper end of the temperature difference element is the heat The end (1) and the end are 112. The temperature difference component is the material of the material of her conduction difference such as shouting, fiberglass, flap or wood f. The placement position is about 13 in the resonant cavity. The material with good heat transfer coefficient is composed of metal, the heat conduction can be read, the end is connected to the heat dissipating component 14, and the end is connected to the hot end m of the temperature difference element, and the purpose is to transfer the function of the heat dissipating component 14 to the temperature difference component. The hot end m 'so that the temperature difference element 1; 1 _ forms a temperature difference to start the heat 1285630 sound mechanism. In the embodiment of the invention, the resonant cavity can have a plurality of, as shown in the second figure, the passive thermal sound of the present invention A side cross-sectional view of one of the heat sink embodiments 200, the resonant cavity 23-end is formed by the heat conducting element 22, and the open end is defined by the outer casing 26; the resonant cavity 23 has a plurality of juxtapositions, and a temperature difference element η runs through the center of the resonant cavity 23. The cross-sectional view of the resonant cavity 23 in parallel may be as shown in the third figure 37, the resonant cavity 23 is circular, and the entire passive thermoacoustic heat dissipating device has a circular shape, and the disc-shaped heat conducting element 22 is disposed. There are a plurality of non-penetrating circular holes, forming a range of the resonant cavity 23 from the hot end hi of the temperature difference component to the closed end of the resonant cavity, being close to the closed end of the heat conducting component 22 by the heat dissipating component 14, and the heat conducting component 22 will be dissipated by the heat dissipating component The heat on the 14 is conducted to the hot end of the temperature difference element to form a temperature difference driving thermoacoustic effect on the temperature difference element 11; the temperature difference_component U is a porous element composed of a material having a difference in thermal conductivity coefficient, and the pores are oddly arranged in a regular arrangement as in the fourth 47 or 48, which are stacked in a lattice or a sheet shape, respectively; the hot end 111 of the temperature difference element receives heat from the heat conduction element 22, and further forms a temperature difference on the temperature difference element 11 to drive the thermoacoustic effect to resonate in the resonance cavity 23. A standing wave π is generated, and the resonant standing wave 15 causes air convection, and thus heat is dissipated by the heat dissipating member 14. 5 is a side cross-sectional view showing another embodiment of the passive thermoacoustic heat sink of the present invention. The resonant cavity 53 is defined by the outer casing 56. The two ends of the resonant cavity 53 are open, and the temperature difference element 11 is placed in the resonant cavity 53 to exit the port. At about one quarter of the end, the cold junction 112 of the temperature difference element is closer to the end of the mouth, and the heat conducting element 52 contacts the heat dissipating element 14 on one side, and conducts heat on the heat dissipating element 14 to the hot end 111 of the temperature difference element to the temperature difference element 11 The formation of a temperature difference drives the thermoacoustic effect to cause a resonant standing wave 55, which causes air convection to further dissipate heat from the heat dissipating component. In the embodiment of the present invention, there may be more than one temperature difference component. As shown in FIG. 6 , a side cross-sectional view of another embodiment of the passive thermal acoustic heat dissipation device of the present invention has a resonant cavity 53 defined by the outer casing 56 and two resonant cavity 53 The end is an opening, the first temperature difference element 610 is placed in the resonant cavity 53 about one quarter of the open end of the right end 1285630, and the second temperature difference element 620 is placed in the resonant cavity 53 about one quarter of the open end of the left end. Position, the first temperature difference element cold end 612 and the second temperature difference element cold end 622 respectively open toward the opening of the resonant cavity 53, and the heat conducting element 62 is in surface contact with the heat dissipating element 14, and the heat transferred by the heat dissipating element 14 is transmitted to the first temperature difference element. The end 611 • and the second temperature difference element hot end 621 to form a temperature difference on the two temperature difference elements 61 〇, 620 to drive the thermoacoustic effect to cause the resonance standing wave 55 to convect the air and thereby dissipate heat to the heat dissipating element. 7 is a side cross-sectional view showing another embodiment of the passive thermoacoustic heat sink of the present invention. The resonant cavity 73 has a plurality of juxtapositions, and the ends of the resonant cavity 73 are open φ. The first temperature difference component 610 is placed in resonance. Approximately one quarter of the open end of the right end of the cavity 73 passes through the juxtaposed resonant cavity 73. The second temperature difference component 620 is placed in the resonant cavity 53 at a position about one quarter of the open end of the left end, and the resonant cavity 73 is inserted through the parallel The first temperature difference element cold end 612 and the second temperature difference element cold end 622 ^ ' are directed toward the openings of the resonant cavity 53. The heat conduction element 72 forms a cavity in the middle of the resonant cavity 73, and contacts the heat dissipated component 14 to be dissipated. The heat on the element 14 is conducted to the first temperature difference element hot end 611 and the second temperature difference element hot end 621 to form a temperature difference on the two temperature difference elements 610, 620 to drive the thermoacoustic effect to cause the resonance standing wave 55, so that the air convection is further The heat sink is used to dissipate heat. The preferred embodiments of the present invention have been described in detail herein to enable those skilled in the art to utilize the invention. It is to be understood that the invention may be modified, modified, and substituted for the described embodiments without departing from the spirit and scope of the invention as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will be apparent from the description of the appended claims. 1 is a side cross-sectional view of one of the embodiments of the passive thermoacoustic heat sink of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a cross-sectional view of a multi-resonator embodiment of a passive thermoacoustic heat sink according to the present invention. FIG. 4 is a schematic cross-sectional view of a porous thermoelectric element in a passive thermoacoustic heat sink according to the present invention. Side profile of one of the embodiments of the thermoacoustic heat sink 1 ^1 · Fig. 6 is a side cross section of one embodiment of the passive thermoacoustic heat sink of the present invention. Fig. 1 is a diagram showing the passive heat of the present invention. Side cross-sectional view of the embodiment of the multi-resonator of the acoustic heat sink; [Description of main components] 11: Temperature difference element 12: Thermal conduction element 13: Resonant cavity 14: Heat-dissipating element 15: Acoustic wave forms a standing wave Φ 16 : Housing 111: Thermoelectric element hot end 112: temperature difference element cold end 22: heat conduction element 23 = resonant cavity 26 = outer casing 37: multi-resonator cross-section schematic 47: cross-sectional schematic of porous thermoelectric element '48: porous Schematic diagram of cross section of temperature difference element · 52: heat conduction element 12 1285630 53 : resonance cavity 55 : resonance cavity 56 : outer casing 62 · heat conduction element 610 : first temperature difference element 611 : first temperature difference element hot end 612 : first temperature difference element cold End 620: second temperature difference element 621: second temperature difference element hot end 622 · second temperature difference element cold end 72: heat conduction element 73: resonant cavity 13

Claims (1)

1285630 十、申請專利範園··1285630 X. Applying for a patent garden·· 丨公告 一種被動式熱聲散熱裝置，至少包含有· 咖，爾振腔 =差70件’溫差元件為由熱傳導係數差 、 膠或木材等組成之多孔性元件，溫差元#兩 翊翊為熱端一端為冷端，放在共振腔内，溫差元件可藉 由冷熱端之溫差產生絲效應，鶴共振_介質形成^ 波共振，產生對流對被散熱元件進行散熱； 熱傳導元件，熱傳導元件由傳熱係數佳之材質如金屬類 組成，熱傳導元件一端連接被散熱元件，一端接溫差元件 ^熱端，將被散熱元件上的熱傳導至溫差元件熱端，以在 ZfflL差元件上形成溫差驅動熱聲效應造成對流，進而對被散 熱元件進行散熱’是為被動式散熱模式。 如申請專利範圍第1項中所述之被動式熱聲散熱裝置，其 共振腔一端閉口一端開口。 3·如申請專利範圍第2項中所述之被動式熱聲散熱裝置，溫 差元件所放置之位置約在共振腔中央處。 4·如申請專利範圍第2項中所述之被動式熱聲散熱裝置，其 溫差元件厚度是共振腔長度百分之二十以下。 5·如申睛專利範圍第1項中所述之被動式熱聲散熱装置，其 共振腔的截面可以是圓形。 6·如申請專利範圍第1項中所述之被動式熱聲散熱裝置，其 1285630 共振腔兩端皆為開口。 7· 溫 端四分之一處。 直在轉共振腔開口 項中所述之被動式絲散鱗置，其 1〇.===項中所述之被動式熱聲散熱裝置，- ，、振腔長度在2公分以下，可形成超聲波之共振。- 請專利細第1項中所述之被動式熱聲散熱裝置，可 應用於微電路與微電子元件如中央處理器上之^、^·。 12.如申請專利範圍第1項中所述之被動式熱 以以微機電製程或其他薄膜技術製作。 .、、、瑕置了 13· —種被動式熱聲散熱裝置，至少包含有： 一共振腔，共振腔一端閉口一端開口，共振腔 内部空間範圍，可讓共振腔内介質在共振軸方向上^振^ 生駐波， -溫差元件，溫差元件為由熱傳導係數差之材質如 、 玻璃纖維、塑膠或木材等組成之多孔性元件，放置1 腔内約中央的位置，溫差元件兩端一端為熱端一端 端’溫差元件熱端朝向共振腔閉口端，溫差元件可藉由^ 熱％之^TL差產生熱聲效應，驅動共振腔内空氣形成駐此 振，產生對流對被散熱元件進行散熱； ^ 一熱傳導元件，熱傳導元件由傳熱係數佳之材質如金屬類 組成，熱傳導元件一端連接被散熱元件，一端接溫差元件 之熱端，將被散熱元件上的熱傳導至溫差元件熱端，以在 15 1285630 溫差元件上形成溫差驅動熱聲效應造成對流，進而對被 熱元件進行散熱，是為被動式散熱模式。 ·/ 月 14·如申請專利範圍第13項中所述之被動式熱聲散熱裝置，其 15·如申请專利範圍第13項中所述之被動式熱聲散熱襄置，其 共振腔的截面可以是圓形。 μ " 16·如申請專利範圍第13項中所述之被動式熱聲散埶裝詈f 溫差元件厚度是共振腔長度百分之二十以^ μ其 17·如申請專利範圍第13項中所述之被動式熱聲散熱裝置，其 # 共振腔長度在2公分以下，可形成超聲波之共振。 ^ 18·如申請專利範圍第13項中所述之被動式熱聲散熱裝置，可 應用於微電路與微電子元件如中央處理器上之散熱。 - I9·如申請專利範圍第13項中所述之被動式熱聲散熱裝置，可 以以微機電製程或其他薄膜技術製作。 20· 一種被動式熱聲散熱裝置，至少包含有： 複數個共振腔並列，該些共振腔一端閉口一端開口，共振 腔規範出一個内部空間範圍，可讓共振腔内介質在共 _ 方向上共振產生駐波； ' 一溫差元件，溫差元件為由熱傳導係數差之材質如陶瓷、 玻璃纖維、塑膠或木材等組成之多孔性元件，溫差元件貫 穿該些並列共振腔内約中央的位置，溫差元件兩端一端為 熱端一端為冷端，溫差元件熱端朝向該些共振腔閉口端， 溫差元件可藉由冷熱端之溫差產生熱聲效應，驅動共振腔 内空氣形成駐波共振，產生對流對被散熱元件進行散熱； 一熱傳導元件，熱傳導元件由傳熱係數佳之材質如金屬類 組成，熱傳導元件上有複數個洞形成共振腔自溫差元件熱 端到共振腔閉端的範圍，熱傳導元件在該些共振腔閉端 16 1285630 一面連接被散熱元件，在開口端連接溫差元件之熱端，將 被散熱元件上的熱傳導至溫差元件熱端，以在溫^元件上 形成溫差驅動熱聲效應造成對流，進而對被散熱元件進行 • 散熱，是為被動式散熱模式。 ' 21·如申請專利範圍第19項中所述之被動式熱聲散熱裝置，該 些共振腔的截面可以是圓形，熱傳導元件上的洞為<圓形^ 22·如申請專利範圍第19項中所述之被動式熱聲散熱農置，其 溫差元件厚度是共振腔長度百分之二十以下。 23·如申請專利範圍第19項中所述之被動式熱聲散熱裝置，該 些共振腔長度在2公分以下，可形成超聲波之共振\ 以 24·如申請專利範圍第13項中所述之被動式熱聲散熱裝置，可 應用於微電路與微電子元件如中央處理器上之散''熱二 25·如申請專利範圍第13項中所述之被動式熱聲散熱裝置，可 以以微機電製程或其他薄膜技術製作。 …^ 26· —種被動式熱聲散熱裝置，至少包含有： 複數個共振腔並列，該些共振腔兩端開口，共振腔規範出 一個内部空間範圍，可讓共振腔内介質在共^軸方向上妓 • 振產生駐波； " 兩片溫差元件，溫差元件為由熱傳導係數差之材質如陶 瓷、玻璃纖維、塑膠或木材等組成之多孔性元件，兩片溫 差元件分別貫穿該些並列共振腔内離開口端各約四分之二 的位置，溫差元件一端為熱端一端為冷端，兩片溫差元件 冷端分別朝向該些共振腔開口端，兩片溫差元件可藉由冷 熱端之溫差產生熱聲效應，驅動共振腔内空氣形成駐波乒 振，產生對流對被散熱元件進行散熱； 〃 一熱傳導元件，熱傳導元件由傳熱係數佳之材質如金屬類 組成，熱傳導元件上有複數個洞形成該些共振腔在兩片溫 17 差元件熱端_範圍，熱傳導元件—面接 將被散熱元件上的熱傳導至溫差元件熱端件 行散熱，是為被動式散熱模式。 十被政熱疋件進 27. 如申请專利範圍第26項中所述之被動式熱聲 些共振腔的截面可以是圓形，熱傳導元件上的洞為裝圓1 :亥 28. ^ ? 26項中所述之鶴式熱聲散熱裳置，兮 些共振腔長度在4公分以下，可形成超聲波之共振。夏孩 29·如申請專利範圍第26項中所述之被動式熱聲散熱 應用於微電路與微電子元件如中央處理器上之散熱。Π 30·如申請專利範圍第26項中所述之被動式熱聲散熱妒 以以微機電製程或其他薄膜技術製作。 …、、’可丨 Announce a passive thermoacoustic heat sink, which contains at least a coffee, a vibration chamber = 70 pieces of difference. 'The temperature difference element is a porous element composed of a difference in heat transfer coefficient, glue or wood, and the temperature difference element is the hot end. One end is a cold end and placed in the resonant cavity. The temperature difference component can generate a silk effect by the temperature difference between the cold and hot ends. The crane resonance_medium forms a wave resonance, which generates convection to dissipate heat by the heat dissipating component. The heat conduction component and the heat conduction component are transferred by heat transfer. The material with good coefficient is composed of metal. One end of the heat conduction element is connected to the heat dissipating component, and one end is connected to the hot end of the temperature difference component, and the heat on the heat dissipating component is conducted to the hot end of the thermoelectric element to form a temperature difference driving the thermoacoustic effect on the ZfflL difference component. Convection, and thus heat dissipation by the heat dissipating component, is a passive heat dissipation mode. The passive thermoacoustic heat dissipating device described in claim 1 is characterized in that one end of the resonant cavity is closed at one end. 3. The passive thermoacoustic heat sink as described in claim 2, wherein the temperature difference element is placed approximately at the center of the resonant cavity. 4. The passive thermoacoustic heat dissipating device as described in claim 2, wherein the thickness of the temperature difference element is less than or equal to 20% of the length of the resonant cavity. 5. The passive thermoacoustic heat sink as described in claim 1 of the scope of the patent application, the cross section of the resonant cavity may be circular. 6. The passive thermoacoustic heat sink as described in claim 1 of the patent application has an opening at both ends of the 1285630 resonant cavity. 7. One quarter of the temperature end. The passive type of the sound-dissipating heat sink described in the item 1〇.=== is directly in the opening of the cavity, and the length of the vibration chamber is less than 2 cm, which can form an ultrasonic wave. Resonance. - The passive thermoacoustic heat sink described in the patent item 1 can be applied to microcircuits and microelectronic components such as central processing units. 12. Passive heat as described in claim 1 of the patent application is made by microelectromechanical processes or other thin film techniques. . . , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Vibrating the standing wave, - the temperature difference element, the temperature difference element is a porous element composed of a material having a poor thermal conductivity coefficient such as glass fiber, plastic or wood, placed in a central position in one cavity, and the end of the temperature difference element is hot at both ends The end end of the end end of the 'temperature difference element is toward the closed end of the resonant cavity, and the temperature difference component can generate a thermoacoustic effect by the difference of TL of the heat %, driving the air in the resonant cavity to form the standing vibration, and generating convection to dissipate heat by the heat dissipating component; ^ A heat conduction element, the heat conduction element is composed of a material with good heat transfer coefficient such as metal. One end of the heat conduction element is connected to the heat dissipation element, and one end is connected to the hot end of the temperature difference element, and the heat on the heat dissipation element is transmitted to the hot end of the temperature difference element to be 15 1285630 The temperature difference is formed on the temperature difference element to drive the thermoacoustic effect to cause convection, and then to dissipate heat by the heat element, which is a passive heat dissipation mode. . ·/月14· Passive thermoacoustic heat dissipating device as described in claim 13 of the patent application, wherein the cross section of the resonant cavity of the passive thermoacoustic heat dissipating device described in claim 13 Round. μ " 16· Passive thermoacoustic bulk 詈f as described in claim 13 of the patent scope 温f temperature difference element thickness is 20% of the length of the cavity to ^ μ its 17 · as in the scope of claim 13 The passive thermoacoustic heat dissipating device has a resonance cavity length of 2 cm or less, which can form an ultrasonic resonance. ^18· Passive thermoacoustic heat sink as described in claim 13 of the patent application can be applied to heat dissipation of microcircuits and microelectronic components such as a central processing unit. - I9· Passive thermoacoustic heat sink as described in Clause 13 of the patent application, which can be fabricated by MEMS or other thin film technology. 20· A passive thermoacoustic heat dissipating device comprises at least: a plurality of resonant cavities juxtaposed, the resonant cavities having one end closed at one end, and the resonant cavity defines an internal space range, which allows the medium in the resonant cavity to resonate in a common _ direction Standing wave; 'a temperature difference component, the temperature difference component is a porous component composed of a material having a poor thermal conductivity coefficient such as ceramic, glass fiber, plastic or wood. The temperature difference component penetrates the central position of the parallel resonant cavity, and the temperature difference component has two One end of the end is a cold end and the other end is a cold end. The hot end of the temperature difference component faces the closed end of the resonant cavity. The temperature difference component can generate a thermoacoustic effect by the temperature difference between the cold and the hot end, and drive the air in the resonant cavity to form a standing wave resonance, generating a convection pair. The heat dissipating component performs heat dissipation; a heat conducting component, the heat conducting component is composed of a material having a good heat transfer coefficient such as a metal, and the heat conducting component has a plurality of holes forming a cavity from a hot end of the temperature difference component to a closed end of the resonant cavity, and the heat conducting component is at the resonance The closed end of the cavity 16 1285630 is connected to the heat dissipating component on one side, and the temperature difference component is connected at the open end Hot end, the heat will be conducted to the heat dissipating element element hot end temperature difference, the temperature to form a temperature differential across the element driving ^ thermoacoustic effect caused by convection, heat radiation is further elements of • cooling, for passive cooling mode. [21] The passive thermoacoustic heat dissipating device described in claim 19, wherein the cross section of the resonant cavity may be circular, and the hole in the heat conducting element is <circle ^ 22 · as claimed in claim 19 The passive thermoacoustic heat sink described in the item has a temperature difference component thickness of less than 20% of the length of the resonant cavity. 23· Passive thermoacoustic heat dissipating device as described in claim 19, wherein the resonant cavity length is less than 2 cm, and the resonance of the ultrasonic wave can be formed\24. Passive as described in claim 13 The thermoacoustic heat dissipating device can be applied to the micro-electro-mechanical process or the micro-electro-mechanical process or the micro-electronic component such as the central processor, the passive thermoacoustic heat dissipating device described in claim 13 Other film technology production. ...^ 26·- Passive thermoacoustic heat sink, comprising at least: a plurality of resonant cavities juxtaposed, the resonant cavities are open at both ends, and the resonant cavity defines an internal space range, so that the medium in the resonant cavity is in the common axis direction Upper 妓 • Vibration generates standing wave; " Two temperature difference components, the temperature difference component is a porous component composed of a material having a poor thermal conductivity coefficient such as ceramic, glass fiber, plastic or wood, and two temperature difference components respectively penetrate the parallel resonance The cavity is separated from the mouth by about two-quarters of the position, one end of the temperature difference element is a hot end and the other end is a cold end, and the cold end of the two temperature difference components respectively face the open end of the resonant cavity, and the two temperature difference components can be cooled by the hot end The temperature difference produces a thermoacoustic effect, driving the air in the resonant cavity to form a standing wave ping-pong, generating convection to dissipate heat from the heat dissipating component; 〃 a heat conducting component, the heat conducting component is composed of a material having a good heat transfer coefficient such as a metal, and the heat conducting component has a plurality of The holes form the resonant cavity in the hot end _ range of the two pieces of temperature difference, and the heat conduction element-surface connection will be thermally conducted on the heat dissipating component To the heat sink of the thermoelectric element, the heat dissipation is a passive heat dissipation mode. Ten is subject to political enthusiasm into the 27. The passive thermoacoustic cavity described in the scope of claim 26 can be circular, the hole on the heat conduction element is round 1: Hai 28. ^ ? 26 items The crane-type hot sound cooling device described in the above, the length of these resonant cavities is less than 4 cm, and the resonance of the ultrasonic wave can be formed. Xia Boy 29· Passive thermoacoustic heat dissipation as described in Clause 26 of the patent application is applied to heat dissipation on microcircuits and microelectronic components such as central processing units. Π 30· Passive thermoacoustic heat sinks as described in Section 26 of the patent application are made by microelectromechanical processes or other thin film technologies. …,,'can
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