TWI282667B - Passive devices and modules for transceiver - Google Patents

Abstract

A passive device for a transceiver includes a semiconductor substrate, at least one capacitor formed on the substrate, a dielectric layer formed on the capacitor and the substrate, at least one inductor formed on the dielectric layer, a metal electrode formed in the dielectric layer for electrically connecting the capacitor and the inductor, a plurality of radio frequency signal lines for transmitting signals of the inductor and the capacitor, and a radio frequency ground formed on the substrate and isolated from the radio frequency signal lines.

Description

1282667 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Field of the Invention The present invention relates to a passive device (passive device) and a module (m 〇du 1 e ) of a transceiver, and a method of manufacturing the same, and more particularly to a transceiver The passive components and modules of the device utilize micro electro mechanical system (MEMS) technology to fabricate capacitors and inductors respectively above and below a dielectric layer, and connect the capacitors and inductors to each other. Form a circuit. Background Description With the advancement of wireless communication technology, technologies for improving the communication quality of mobile phones and reducing the size of mobile phones have also developed. In addition, the transmission and reception methods of the wireless communication system are developed to utilize frequencies of different channels. For example, the Code Division Multiple Access (CDMA) mode utilizes a 90 0 MHz channel, a personal communication system (Personal communication system, The PCS) mode utilizes a 1.8 GHz channel and the like. Therefore, for transceivers using multiple channels, it is necessary to reduce the size of the wireless communication system. Since passive components occupy most of the space in a personal mobile communication system, the most important thing is to reduce the size of passive components in order to reduce the size of the personal communication system. Furthermore, since the passive components in the personal mobile communication system mostly use discrete components and occupy the base.

1282667 V. Description of invention (2) The life of the board is so much space, so it is more difficult to do it. Pull s, 丨曰 ^ ^ ^ = 曰 晶片 的 的 的 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片Inductors occupy a lot of places, which makes communication quality declining. The first object of the invention is to provide a passive component of the transceiver, and/or to use MEMS technology to fabricate the dielectric. Above and below the layer... Sense... Sense... The second purpose is to provide a module, * is to use the top and bottom of the MEMS, and the passive components are connected to each other to form a layer 0. According to the invention A first object of the present invention is to provide a passive device for a transceiver, comprising a semiconductor substrate or a dielectric L: ii, a dielectric layer on the capacitor and the substrate, at least An inductor is disposed on the dielectric layer, a dielectric layer is disposed, a metal electrode is disposed in the contact hole, and the electric grid device and the S-hai inductor are connected, and the plurality of strips are used to transmit the capacitor. The radio frequency signal line of the nickname, and a radio ^ j :=, and the radio frequency grounding system and the

1282667 V. Inventive Description (3) According to a second object of the present invention, an integrated circuit module of a transceiver includes a semiconductor substrate or a dielectric layer substrate, and a plurality of capacitors are disposed on the substrate a dielectric layer is disposed on the capacitor and the substrate, a plurality of inductors are disposed on the dielectric layer, a plurality of contact holes are formed through the dielectric layer, and a plurality of metal electrodes are disposed in the contact holes Internally for electrically connecting the capacitors and the inductors, a plurality of radio frequency signal lines for transmitting signals of the capacitors and the inductors, and a plurality of radio frequency grounds disposed on the substrate, and the The radio frequency grounding is isolated from the radio frequency signal lines. Wherein the capacitors, the inductors, and the radio frequency signal lines form a circuit' and the circuit includes a radio frequency selector, a plurality of duplexers, a plurality of transmission bandpass filters, and a plurality of receiving band pass filters, the radio frequency selector is composed of a high pass filter and a low pass; the '3 Hai duplex duplexer system consisting of a plurality of transmission filters and a transmission filter And a plurality of receiving filters (recepti〇nfi 1 ter ) for transmitting a signal to the radio frequency selector ' and the transmitting filters comprise a plurality of band pass filters, and the An equal receive filter is used to receive a signal from the radio frequency selector, the receive filters including a plurality of band pass filters. In addition, the band pass filters amplify a signal to be transmitted to the transfer filters, and the receive band pass filters are used to receive the receive filters from the receive noise filters via the low noise amplifiers. A signal. 1282667 V. DESCRIPTION OF THE INVENTION (4) Detailed Description of the Invention The embodiments of the passive components and modules of the transceiver of the present invention are described in detail below with reference to the accompanying drawings of the present invention. 1(A) is a schematic cross-sectional view of a high-pass filter according to a first embodiment of the present invention, and the high-pass filter is a passive component of the transceiver of the present invention, and FIG. 1(B) is a first embodiment of the present invention. For example, a perspective view of the high-pass filter, and FIG. 2 is an equivalent circuit diagram of the high-pass filter shown in FIG. 1(A) and FIG. 1(B). As shown in FIG. 2, the high-pass filter and wave filter package are composed of two capacitors C r C and one inductor L, and the capacitor c is connected in series with the capacitor C 2 , and the inductor L is connected in parallel to the capacitor c and the capacitor. C Α. As shown in FIG. 1(A) and FIG. 1(Β), the high-pass filter is stacked on a substrate 1B. The high-pass filter includes a first capacitor 120 and a second capacitor 1300. The substrate 11 is above the top, and the first capacitor 120 is connected in series with the second capacitor 130. In addition, the high pass filter further includes a dielectric layer 160 covering the substrate 110, the first capacitor 12A and the second capacitor 130, and an inductor 140 formed on the dielectric layer i6. The inductor 14 is connected to the first capacitor ι2 经由 and the second capacitor 1300 via the electrode 152. The electrode 1 5 2 is formed in the contact hole 150 in the dielectric layer 16 〇. . In addition, the substrate 110 includes a semiconductor substrate or a dielectric layer substrate.

1282667 V. The invention (5) 122, a second electrode 12 6 and a first dielectric layer 12 4 are disposed between the first electrode 122 and the second electrode 126, wherein the second electrode ι26 is a lower electrode, It is disposed above the substrate 110, and the first electrode 112 is an upper electrode opposite to the second electrode 126. The second capacitor 13 〇 includes an upper electrode 丄 3 2 , a third electrode 136 and a second dielectric layer 13 4 are disposed between the upper electrode 13 2 and the third electrode 136 , wherein the upper electrode 1 3 2 is an extension of the second electrode 1 2 6 , and the third electrode 1 3 6 is used as a lower electrode. Furthermore, one end of the first electrode 1 2 2 is connected to a signal input line 1 1 2 , one end of the third electrode 1 3 6 is connected to a signal output line 1 1 4 , and a ground 11 6 is located at the signal input line 1丄2 and one side of the signal output line 11 4 are used to transmit the radio frequency signals of the signal input line n 2 and the signal output line 11 4 . Further, the ground π 6 is connected to one end of the inductor 14 4 via an electrode 1 5 3 , and the electrode 1 5 3 is disposed in a contact hole 150. In the above high-pass filter, if a signal of a predetermined frequency is input from the signal input line 1 1 2, the signal is transmitted to the signal output line 11 4 via the first and second capacitors 1 2 〇, 1 3 0, Signals below the predetermined frequency are output from the inductor 1404 to the ground 116. Fig. 3 is a cross-sectional view showing another embodiment of the first embodiment of the present invention, and Fig. 3 is the same as that shown in Figs. 1(A) and (?). As shown in FIG. 3, a dielectric film 1 is formed on a substrate n ,

1282667 V. INSTRUCTION DESCRIPTION (6) An inductor 140 is formed on a dielectric film 1 ,, and a dielectric layer 160 is formed on the dielectric film 111 to cover the inductor 140. Moreover, the inductor 140 is connected to the first capacitor 1 220 and the second capacitor 1 3 0 via an electrode 1 52, and the electrode 15 2 is formed in the contact hole 1 5 in the dielectric layer 16 5 〇 within. When the substrate 110 is a semiconductor substrate, the dielectric film 111 can be used to prevent RF signal loss, and the dielectric film 111 can be made of polyimide or BCB (benzylchlobutene) polymer. On the other hand, the operation of the high-pass filter shown in Fig. 3 is the same as that of the high-pass filter shown in Fig. 1 (A), and therefore will not be described again. 4 is a schematic cross-sectional view of a low pass filter according to a second embodiment of the present invention, and the low pass filter is a passive component of the transceiver of the present invention, and FIG. 5 is a low pass filter shown in FIG. Equivalent circuit diagram. As shown in FIG. 5, the low-pass waver is composed of a capacitor C and two inductors L Γ L, and the inductor L is connected in series with the inductor L 2 , and the capacitor L is connected in parallel to the inductor L and the inductor. L 夂. As shown in FIG. 4, the low-pass filter is stacked on a substrate 210, wherein the low-pass filter includes a capacitor 2200 disposed on the substrate 210, a dielectric layer 2600. Formed on the substrate 210 and covering the capacitor 220, and a first inductor 230 and a second inductor 240 are connected in series over the dielectric layer 260. The capacitor 220 is connected to the first inductor 23 0 and the second inductor 240 by an electrode 25 2 , and the electrode 2 5 2 is formed in the contact hole 25 of the dielectric layer 220 . Within 0.

Page 10 1282667 V. Inventive Description (7) Further, the substrate 210 may be a semiconductor substrate or a dielectric layer substrate. On the other hand, one end of the first inductor 203 is connected to a signal input line 2 1 2 on the substrate 2 1 0 via an electrode 252, and one end of the second inductor 240 is via an electrode 2 5 4 Connected to a signal output line 2 1 4 on the substrate 2 10 , and the lower electrode 2 2 6 of the capacitor 2 2 0 is connected to a ground G. The capacitor 220 is fabricated using MEMS technology, and the capacitor 220 includes a lower electrode 2 2 6 on the substrate 210, an upper electrode 2 2 2 with respect to the lower electrode 226, and a dielectric layer. 224 is disposed between the upper electrode 222 and the lower electrode 2 26 . The first inductor 203 and the second inductor 240 are fabricated by using microelectromechanical system technology, and the first and second inductors 2 3 0, 2 4 0 are connected to the capacitor via a contact hole 250 22 0. In the above low-pass filter, if the signal input line 2 1 2 is connected to one end of the first inductor 2 3 0 , and the signal output line 2 1 4 is connected to one end of the second inductor 2 4 0, When the signal of the predetermined frequency is input from the signal input line 21 2, the signal is transmitted to the signal output line 2 1 4 via the first and second inductors 230, 240, and a signal higher than the predetermined frequency will be The capacitor 22 0 is output to the ground G. Figure 6 is a cross-sectional view showing another embodiment of the second embodiment of the present invention, and the numerals shown in Figure 6 and Figure 4 are the same, that is, the same represents

1282667 V. Description of the invention (8) Components. As shown in FIG. 6, a dielectric film 2 11 is formed on a substrate 210, two inductors 230, 240 are formed on the dielectric film 211, and a dielectric layer 260 is formed on the inductor 230. 2 4 0 to cover the dielectric film 2 11 . In addition, the inductors 2 3 0 and 2 4 0 are connected to the lower electrode 226 of the capacitor 2 2 0 via an electrode 2 5 2 , wherein the capacitor 22 0 is disposed on the dielectric layer 26 0 , and the electrode 252 is formed on the electrode 252 The contact hole of the dielectric layer 2 60 is within 2 50. When the substrate 210 is a semiconductor substrate, the dielectric film 2 11 can be used to prevent RF signal loss, and the dielectric film 2 11 can be made of polyamidene or BCB polymer. The operation of the low-pass filter shown in Fig. 6 is the same as that of the low-pass filter shown in Fig. 4, and therefore will not be described again. Figure 7 is an equivalent circuit diagram of a band pass filter according to a third embodiment of the present invention, and the band pass filter is a passive element of the transceiver of the present invention. As shown in Figure 7, 'electric grids C 1 , C 2 , C and C | ί are connected in series with each other , capacitor C and inductor L are connected in parallel between capacitor C and capacitor C , , capacitor C and inductor L are connected in parallel Between the capacitor c and the capacitor CA, the capacitor C and the inductor L are connected in parallel between the capacitor C and the capacitor C. Wherein capacitors C r C 2, C 3, C 4, C 5, C and C are placed on a substrate, and a dielectric layer covers the capacitors C1, C2, C3, C4, C5, C and C, and electricity

Page 12 1282667 V. Description of the invention (9) The sensors L!, L and L are placed on the dielectric layer, and the inductors L i, L and L 3 are connected to the capacitor C, C via an electrode. 2. C 3 , C 4 , C 5 , C and C 7, and the electrode is formed in a contact hole and penetrates the dielectric layer, for example, the electrodes shown in FIG. 1(A) and FIG. 1(B) 152, or the electrode shown in FIG. 5 2 2 2 ° Further, in another embodiment of the third embodiment of the present invention, a dielectric film is formed on a substrate, and inductors L!, L, and L are provided. On the dielectric film, a dielectric layer covers the inductors Lr L2, L and the dielectric film, and capacitors C r C 2, C 3, C 4, C 5, C and C are formed on the dielectric layer. And the capacitors C r C 2 , C 3 , C 4 , C 5 , C and C 7 are connected to the inductors Im, L and L3 via an electrode, and the electrodes are formed in a contact hole and penetrate the Dielectric layer. Inductive Li, L2, L and capacitive Cl, C2, C3, C4, C5, 〇6, C7 are produced using MEMS technology. In the above band pass filter, if a signal of a predetermined frequency is input to one end of the capacitor C!, the signal is filtered through the inductors L r L 2, L and the capacitors Cr C2, C3, C4, C5, C6, C Then the signal will be sent to a signal output line. The signal output line is located at the C-type end of the capacitor. FIG. 8 is an equivalent circuit of an integrated module according to a fourth embodiment of the present invention.

Page 13 1282667 V. Description of the Invention (10) The integrated module is a passive component of the transceiver of the present invention. In addition, the integrated module can be used in two channels: one is the personal communication system mode, its transmission and reception frequency is on the 丨·8 GHz channel, and the other is the code division multiple access mode. 〇· 9GHz channel. As shown in FIG. 8, the integrated module is a passive component of a transceiver, which includes a radio frequency (RF) selector S, a duplexer D* D2, and a conveyor pass. The filter (transmission band-pass is 1 7 61:) 3 and 87, and the receiving band pass wave $ (reception band-pass: ^1 7 61:) 6 and 88. Wherein, the electrical frequency selector S identifies a frequency signal from the transmitting and receiving antennas aNT. In addition, duplexers D and D receive and convert a signal from the transmit and receive lines A N T , and the duplexer ]) and D 2 can receive and convert a signal that is transmitted to and from the receive antenna ANT. On the other hand, the belt pass filter B 3 is used to filter the duplexer Di and a signal, and the receiving wave is used to filter the slave D and the signal from the duplexer. . The radio frequency selector S is composed of a high pass filter and a low pass filter, and the high pass filter and the low pass filter are the same as the first and second embodiments, respectively. The duplexer D includes a transmission filter ftransmissi〇n filter)Bi, and a reception filter (recepti〇n 1 1 t^r) B2, and the duplexer D includes a transmission filter β5, and reception =^ , B 6 'where the transmission filters B 1 , B and the reception filters B 2, B are constructed by the band pass filter of the third embodiment.

Page 14

1282667

When the equivalent lightning strike shown in Figure 8 is described, a plurality of capacitors are disposed on a substrate, as in the previous two Ϊ Ϊ 4 f 4 Ϊ containers, a plurality of inductors are disposed in the The dielectric 曰 is connected to the capacitors via an electrode, and the electrodes are formed in a contact hole and penetrate the dielectric layer, for example, as shown in FIG. 1(Α) and FIG. 1(Β) The electrode 152 or the electrode 252 as shown in FIG. In another embodiment of the fourth embodiment of the present invention, a dielectric film is formed on a substrate, a plurality of inductors are disposed on the dielectric film, and a dielectric layer covers the inductors A plurality of capacitors are formed on the substrate and on the dielectric layer. The capacitors are connected to the inductors via an electrode formed in a contact hole and extending through the dielectric layer. Wherein, the connection of each passive component is completed by using a micro-electromechanical system, and the integrated module having the above structure is used as a radio transceiver for connecting to an external integrated body. a circuit comprising: a converter between an audio signal and an electronic circuit, a modulator for adjusting the low frequency signal to a high frequency signal, An amplifier (amplifier)

Page 15 1282667

The operation of the integrated module shown in =, will be described as a process. Passing the node (transmissi〇n ί 达德达号, then, the conveyor belt wanted, the wave 8 and B care about the ΐί, ί (p〇wer ampHner, pAs) the signal #德_=fDl, D The signal choppers B and B filter the signal, and the 2R wave filter or the low pass filter transmits the signal to the transmitting and receiving antenna ANT, and outputs the signal. Further, receiving one The process of the signal is explained as follows. When a signal comes from the transmitting and receiving antenna ANT, the signal is selected in the radio frequency selector s according to the frequency of the 4 sfl number. Then the duplexer ρ wide d 2 is received. The filters % and Be will filter the signal, and then the low-frequency amplifiers will amplify the signal, and finally receive the f-pass filter, and the filters B and B s will filter the signal. And outputting the signal to the receiving node (recepti ο η η 〇de ) RX. Referring to FIG. 9A, FIG. 9 is a schematic diagram of a fourth embodiment of the present invention, and FIG. 9 shows a radio frequency. The integrated circuit (r FI c ) is set in the south pass wave of Fig. 1 (β) In addition, the fourth embodiment is the same as the first embodiment, that is, the same element is shown. As shown in FIG. 9, the capacitor 1 220 and the capacitor 1 3 0 are connected in series to a substrate 丨i 〇 The upper dielectric layer 160 is disposed on the substrate 110, the capacitor 120 and the capacitor 130. An inductor 140 is formed on the dielectric layer 160. The inductor 14 is connected to the capacitor 1 2 via an electrode 1 52. 0 and capacitor 1 3 〇, and electricity

1282667 V. DESCRIPTION OF THE INVENTION (13) The pole 1 5 2 is formed within the contact hole 150 of the dielectric layer 16 0 . Further, the substrate 110 may be a semiconductor substrate or a dielectric layer substrate. In addition, a plurality of radio frequency integrated circuits (RF i t e g r a t e d c i r c u i t) 1 8 4 are connected to a signal line 1 8 2, and the signal line 1 8 2 is connected between the capacitor 1 220 and the capacitor 1 30 0. Referring to FIG. 10, FIG. 10 is a schematic diagram of another embodiment of the fourth embodiment of the present invention, and FIG. 10 is a diagram showing a plurality of radio frequency integrated circuits disposed on the substrate of the high-pass filter of FIG. Further, the fourth embodiment is identical to the first embodiment in that it denotes the same element. As shown in FIG. 10, a dielectric film 11 1 is formed on a substrate 110, an inductor 140 is formed on the dielectric film 1 1 1 , and a dielectric layer 160 is formed on the dielectric. The film 111 is overlaid to cover the inductor 140. The capacitor 120 and the capacitor 1 30 are formed on the dielectric layer 160, and the plurality of radio frequency integrated circuits 1 8 4 are connected to a signal line 1 8 2, and the signal line 1 8 2 is connected to Between the capacitor 1 220 and the capacitor 1 30 0. The radio frequency integrated circuit 1 8 4 is composed of a resistor, a capacitor and an inductor, and the radio frequency integrated circuit 1 8 4 may be an oscillator (〇sci 1 1 at 〇r ), a mixer (mi X Er), a low noise amplifier, or a driver amplifier. The radio frequency integrated circuit 184 may be a separate component or a circuit, and the discrete component or

Page 17 1282667 V. Description of the Invention (14) The circuit includes at least one capacitor (not shown) disposed on a first surface of the dielectric layer 160, at least one inductor (not shown) disposed on the dielectric layer 1 A second surface of 60, and an electrode disposed in a contact hole for connecting the capacitor to the inductor. As described above, since the present invention can reduce the installation area of the passive component and the module, the present invention can effectively reduce the size of the communication system. In addition, the use of MEMS technology can reduce the insertion loss of the inductor, thereby improving the communication quality of the communication system. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the patent application of the present invention should fall within the scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1(A) is a cross-sectional view of a high-pass filter according to a first embodiment of the present invention, and the high-pass filter is a passive component of the transceiver of the present invention. . Figure 1 (B) is a perspective view of a high-pass filter of the first embodiment of the present invention. Figure 2 is an equivalent circuit diagram of the high-pass filter shown in Figure 1 (A) and Figure 1 (B). Figure 3 is a cross-sectional view showing another embodiment of the first embodiment of the present invention. Figure 4 is a cross-sectional schematic view of a low pass filter of a second embodiment of the present invention, and the low pass filter is a passive component of the transceiver of the present invention. Figure 5 is an equivalent circuit diagram of the low-pass filter shown in Figure 4. Figure 6 is a cross-sectional view showing another embodiment of the second embodiment of the present invention. Figure 7 is an equivalent circuit diagram of a band pass filter of a third embodiment of the present invention, and the band pass filter is a passive element of the transceiver of the present invention. Figure 8 is an equivalent circuit diagram of an integrated module according to a fourth embodiment of the present invention, which is a passive component of the transceiver of the present invention. Figure 9 is a schematic view showing a fourth embodiment of the present invention. Figure 10 is a schematic view of another embodiment of the fourth embodiment of the present invention

Page 19 1282667 Schematic description of the diagram. Symbolic description of the icon

Page 20 110 Substrate 111 Dielectric film 112 Signal fm In line 114 Signal output line 116 Ground 120 First_capacitor 122 First electrode 124 First dielectric layer 126 Second electrode 130 Capacitor 132 Upper electrode 134 Second dielectric layer 136 second electrode 140 inductor 150 contact hole 152 electrode 153 electrode 160 dielectric layer 182 signal line 184 radio frequency integrated circuit 210 substrate 211 dielectric film 212 signal input line 214 signal outlet 220 capacitor 222 upper electrode 224 dielectric layer 226 lower electrode 230 first inductor 240 second inductor 250 contact hole 252 electrode 254 electrode 260 dielectric layer

Claims (1)

1282667 s. Patent Application 1 1. A passive component of a transceiver, comprising: a substrate, and the substrate comprises a semiconductor substrate or a dielectric layer substrate; at least one capacitor disposed on the substrate; a dielectric layer Provided on the capacitor and the substrate; at least one inductor disposed on the dielectric layer; a contact hole through the dielectric layer; a metal electrode formed in the contact hole And the metal electrode is used for electrically connecting the capacitor and the inductor; a plurality of radio frequency signal lines (radi 〇 frequencysigna 1 1 i nes ), and the radio frequency signal lines are used to transmit the signal of the capacitor and the inductor And a radio frequency ground disposed on the substrate, and the radio frequency grounding is isolated from the radio frequency signal lines. 2. The passive component of claim 1 of the patent scope, wherein a high-pass filter is composed of a capacitor and an inductor, and the inductor is connected to the capacitor via the contact hole in parallel. 3. A passive component as claimed in claim 1, wherein a low pass filter (low-pass f 1 1 ) is composed of a capacitor and a two inductor, and the capacitor is connected to the capacitor via the contact hole The inductors are connected in parallel. 1282667 The integrated module of the transceiver, which comprises: a package board; a substrate, and the substrate comprises a semiconductor substrate or a dielectric layer a plurality of capacitors disposed on the substrate; a dielectric layer formed on the capacitors and the substrate; a plurality of inductors disposed on the dielectric layer; 'a plurality of contact holes, and the contact holes Passing through the dielectric layer and a plurality of metal electrodes respectively formed in the contacts, wherein the metal electrodes are used to electrically connect the capacitors and the inductors, and a plurality of radio frequency signal lines, a signal for transmitting the inductive inductors; and the sub-Jade-Jie and the plurality of radio frequency grounds are disposed on the substrate, and the radio frequency grounding is isolated from the radio frequency signal lines; ..., . The capacitors, the inductors, and the radio frequency signal lines form a circuit, and the circuit includes: a radio frequency selector, Page 22 1282667 VI. Patent Application The pole is formed in a contact hole, and the electrode is used to electrically connect the capacitor and the inductor. 8. The integrated module of claim 5, wherein the high pass filter comprises two capacitors and an inductor, and the inductor is connected in parallel with the capacitors via the contact holes. 9. The integrated module of claim 5, wherein the low pass filter comprises a capacitor and a second inductor, and the capacitor is connected in parallel with the inductor via the contact hole. 10. The integrated module of claim 5, wherein the band pass filter comprises a plurality of series connected capacitors, a plurality of parallel connected capacitors are connected between the series connected capacitors, and a plurality of parallel connected An inductor is connected between the series connected capacitors, and the parallel inductors are connected to the series capacitors via the contact holes. 1 1. A passive component of a transceiver, comprising: a substrate, wherein the substrate comprises a semiconductor substrate or a dielectric layer substrate, at least one inductor is disposed on the substrate; a dielectric layer is formed on the substrate An inductor is disposed on the substrate; at least one capacitor is disposed on the dielectric layer; a contact hole is formed through the dielectric layer; Page 24 1282667 VI. Application for patent scope The integrated module of the transceiver comprises: a substrate, and the substrate comprises a semiconductor substrate or a dielectric reed board; the plurality of inductors of the earth are disposed on the substrate; An electric layer is formed on the inductor and the substrate; a plurality of capacitors are disposed on the dielectric layer; and the metal-recovery inductive re-frequency is recovered by the line-reactor filter and the repeating The plurality of strips of electric frequency bandpasses and the plurality of contacts of the plurality of metal-based electrode coefficient strips of the wireless signal are connected to the wireless grounding system and the plurality of wireless radio-filtering filters and the plurality of isoelectrics. - electric frequency frequency; duplex receiving electric frequency wave wave selector; transmitting holes, and the contact holes are through the dielectric layer; electrodes are respectively formed in the contact holes, and are used for electrically connecting the holes a capacitor and the inductor; an electrical frequency signal line for transmitting the capacitor and the current; and a ^μ electrical frequency grounding disposed on the dielectric layer, and the wireless radio frequency signal lines are isolated; .../ , An equal inductor, and the radio frequency path, and the circuit includes: an ° rate selector comprising a high pass filter and a low passer, the duplexer comprising a plurality of transmit filter filters The transmit filters are used to transmit a rate selection, and the transmit filters are complex and the receive filters are used to receive the receive signal from the receive signal. a complex bandpass filter for powering a signal through power Page 26