1280683 九、發明說明： 【發明所屬之技術領域】 特別是有關於一 本發明係有關於一種射頻模組封裝， 種整合天線與散熱金屬盒之射_組_ 【先前技術】 I1通者無線通訊產業的蓬勃么，夕 品也逐年增加，相關站觉工，展夕樣化的行動通訊產 關的電子電路系統與元件設計以及產。 :卜觀的縮小化，已成為重要的研發課題。因為系统單晶： ystem°naehip)的技術成熟，多晶片模組封裝已成為i曰要 :::趨勢。目前射頻前端模組(rf——)已將許 曰 干如應波态、切換電路、功率放大器 =片“在單-模組封裳之中。隨著前端模組的整合 性增加’天線單元勢必也將與其他電子電路元件—起整合 在同一模組封裝之中。 ^知的天線與電子電路元件整合的方式，天線單元通 “女置在散熱金屬片或屏蔽金屬片上方，即電子電路元 、、、 門 口而大巾田地增加射頻模組封裝的整體高度 。美國發明翻專利號第6,867,746B2號，，應用在行動產品 之電磁干擾屏蔽金屬與天線結合，，，其揭示一種雙天線單 電子電路元件屏蔽金屬盒之整合設計，該雙天線單元 j衣在特殊介質之上，且該天線的高度亦大幅地增加電子 電路元件本身封裝的整體高度。另外，美國發明專利專利 唬第6,686,649B1號”具有屏蔽金屬與天線之多晶片半導體 1280683 封裝”，其揭示-種整合天線單元與屏蔽金屬盒之多晶片 封裝’其中該天線單元印製在一介質之上與側面，並同樣 安置，屏蔽金屬盒上方，增加封裳整體的高度。為解決這 個問題’我們提出-種創新的射頻模組封裝設計，利用一 散熱金屬盒之相鄰兩侧牆狹小空間處’置人—狹 屬片天線，來達到不增加電子電路元件本身封料的田整體 j。同時’該散熱金屬盒更具有複數個金屬側牆，亦可 作為良好的屏蔽金屬盒，有效地降低天線與元件之間 =擾效應。另外，該天線亦可提供在5舰頻帶之益線 ^ ^ ^ ^ WLAN (wireless local area network, 5150 ~ 5825 MHz) ^ ^ 球微波存取㈣ access，5250 〜5850 MHz)的寬頻操作。 【發明内容】1280683 IX. Description of the invention: [Technical field of the invention] In particular, the invention relates to a radio frequency module package, an integrated antenna and a heat-dissipating metal box. [Prior Art] I1 communication wireless communication The industry is booming, and the evening products are also increasing year by year. The relevant stations are aware of the work, and the electronic circuit system and component design and production of the mobile communication production. : The shrinking of Buguan has become an important research topic. Because of the maturity of the system single crystal: ystem°naehip, multi-chip module packaging has become a ::: trend. At present, the RF front-end module (rf-) has already applied the wave state, switching circuit, and power amplifier=chip in the single-module package. With the integration of the front-end module, the antenna unit It is bound to be integrated with other electronic circuit components in the same module package. ^The way the antenna and electronic circuit components are integrated, the antenna unit is connected to the heat-dissipating metal piece or the shielding metal piece, that is, the electronic circuit. Yuan,, and the doorway and the large towel field increase the overall height of the RF module package. U.S. Patent No. 6,867,746 B2, the disclosure of which is incorporated herein by reference in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety in Above the medium, and the height of the antenna also substantially increases the overall height of the package of the electronic circuit component itself. In addition, U.S. Patent No. 6,686,649 B1, "Multi-wafer Semiconductor 1280683 Package Shielding Metal and Antenna", discloses a multi-chip package incorporating an antenna unit and a shielded metal case, wherein the antenna unit is printed on a medium Above and side, and placed the same, shield the top of the metal box, increase the overall height of the skirt. In order to solve this problem, 'we propose an innovative RF module package design, which uses a heat-dissipating metal box in the narrow space of the adjacent two walls to set up a human-narrow-chip antenna to achieve no increase in the electronic circuit components themselves. The whole field of j. At the same time, the heat-dissipating metal box has a plurality of metal side walls, and can also be used as a good shielding metal box, effectively reducing the interference effect between the antenna and the component. In addition, the antenna can also provide broadband operation in the 5-ship band ^ ^ ^ ^ WLAN (wireless local area network, 5150 ~ 5825 MHz) ^ ^ ball microwave access (four) access, 5250 ~ 5850 MHz). [Summary of the Invention]
本發明之目的為提供一種創新的射頻模組封裝設叶， 不僅將天線與散熱金屬盒整合—起，並再封裝形成單二元 同時整體結構簡單、製作容易，非常適合應用在各類 31:丁動通5fC裝置端上，作為包含天線與天線前端模組之單 一射頻模組元件。 本發明射頻模組封裝之—實施例ι，包含··一系統接 地面、-模組基板、—散熱金屬盒、—天線、—短路金屬 二金屬片以及一封裝殼。該模組基板電氣連接於 接地面之上，且該模組基板之相㈣側邊與該系統 接也面之相鄰兩側邊大致切齊。該散熱金屬盒電氣連接於 7 1280683 X模、、且基板之上且5亥政熱金屬盒之相鄰兩側牆與該模組 基板之相鄰兩側邊大致切齊。該天線至少具有一彎折並位 於該散熱金屬盒之該兩側牆處，且面向該兩侧牆。該短路 金屬片之一端連接於該散熱金屬盒，另一端連接至該天線 “。該饋入金屬片之-端電氣連接於該模組基板上之一天線 訊號源，另-端連接至該天線。該封裝殼大致包覆該散敎 金屬盒、該天線、該短路金屬片與該饋入金屬片。由實驗 結果顯示，本發明之—實施例i可提供頻帶範圍涵蓋在5 Γζ頻帶之寬頻操作。另外’散熱金屬盒除了排除射頻電 人或多晶片#作時帶來的熱能，亦可作為良好的屏蔽金屬 真，達成天線與系統接地面上相關射頻電路整合更容易。 本發明最大的特色，是利用一散熱金屬盒之相鄰兩側 回狹小空間處’置入一狹長輕射金屬片天線’並藉由一短 路金屬片來連接並整合該散熱金屬盒，有別於傳統的天線 /、電子電路元件整合結構，天線通常都安片 二蔽金屬片上方，因而大幅地增加了射頻模㈣= 體问度。而射頻模組封裝通常會包含相關電子電路元件， t慮波器、切換電路、功率放大器等多晶片整合，因此本 "中的散熱金屬盒更具有複數個金屬 低内ί式天線與電子電路元件之間的電磁干擾效應。 炫配合下列圖示、實施例之詳細說明與申請專利範圍 述與本發明之其他目的與優點詳述於後。 【實施方式】 1280683 第1A圖為本發明射頻模組封震之一實施結構圖 ’包含：-系統接地面11、-模組基板12、—散熱金屬盒The object of the present invention is to provide an innovative RF module package with leaves, which not only integrates the antenna and the heat-dissipating metal box, but also re-packages to form a single binary while the overall structure is simple and easy to manufacture, and is very suitable for application in various types 31: On the 5fC device end of the Dingtongtong, it is used as a single RF module component including the antenna and antenna front-end module. The embodiment of the radio frequency module package of the present invention includes a system ground connection, a module substrate, a heat dissipation metal case, an antenna, a short-circuit metal metal piece, and a package case. The module substrate is electrically connected to the ground plane, and the side of the phase (4) of the module substrate is substantially aligned with the adjacent sides of the system. The heat-dissipating metal case is electrically connected to the 7 1280683 X-mode, and the adjacent side walls of the 5-Huizhen hot metal box are substantially aligned with the adjacent side edges of the module substrate. The antenna has at least one bend and is located at the two side walls of the heat dissipation metal case and faces the two side walls. One end of the short-circuited metal piece is connected to the heat-dissipating metal case, and the other end is connected to the antenna. The end of the feed metal piece is electrically connected to one antenna signal source on the module substrate, and the other end is connected to the antenna. The package substantially envelops the bulk metal case, the antenna, the shorted metal piece and the feed metal piece. The experimental results show that the present invention - the wide range of frequency bands covering the 5 Γζ band In addition, the heat-dissipating metal box can be used as a good shielding metal in addition to eliminating the heat energy generated by the RF or multi-chip. It is easier to integrate the RF circuit with the grounding surface of the system. The feature is to use a heat-dissipating metal box to close the narrow space to 'place a narrow and light metal piece antenna' and connect and integrate the heat-dissipating metal case by a short-circuit metal piece, which is different from the traditional antenna. /, electronic circuit components integrated structure, the antenna is usually placed on top of the metal sheet, thus greatly increasing the RF mode (4) = body temperature. The RF module package usually contains Related electronic circuit components, t-wave filters, switching circuits, power amplifiers and other multi-chip integration, so the heat-dissipating metal box in this " has a plurality of metal low-internal ί-type antenna and electronic circuit components between the electromagnetic interference effect. The following drawings and the detailed description of the embodiments and the scope of the claims are described in detail with reference to the accompanying claims. FIG. 1A. FIG. 1A is a structural diagram of one embodiment of the RF module sealing of the present invention. 'Includes: - system ground plane 11, - module substrate 12, - heat sink metal box
13、 -天線14、一短路金屬# 141、一饋入金屬μ 142以 及一封裝殼15。該模組基板12電氣連接於㈣統接地㈣ 之上，且該模組基板12之相鄰兩側邊與該系統接地面丨丨之 :鄰兩側邊111大致切齊。該散熱金屬盒13電氣連接於該 核^基板12之上’且該散熱金屬盒13之相鄰兩側牆⑶與 该核組基板12之相鄰兩侧邊大致切齊。豸天線至少具有一 弯折並位於該散熱金屬盒13之該兩㈣處131，且面向該 兩側牆131，如第1Β圖所示。該短路金屬$⑷之一端連 接於該散熱金屬盒13 ’另-端連接至該天線14。該饋入金 屬片142之一端經由位於該散熱金屬盒13之一貫孔132電 乳連接於該模組基板12上之—天線訊號源，另__端連接至 該天線14。該封裝殼15大致包覆該散熱金屬盒。、該天線 14、 該短路金屬片丨41與該饋入金屬片142。 該天線14、該短路金屬片141、該饋人金屬片142為 金屬材質，可由輻射金屬片切割製作形成在單—金屬平板 ^。而該天線14也可由單—輻射金屬線彎折形成。藉由調 正該天線14的尺寸大小’可以決定該天線的+讀作頻率 。並適當選擇該天線14與該散熱金屬盒13的㈣與選擇 當短路金屬片⑷的短路位置，可得到良好的阻抗匹配。 第2圖為本發明射頻模組封裝一實施例i之天線返回 損失（retumbss)實驗量測結果圖，其中縱轴代表返回損失 (早位為犯）’橫軸代表操作頻率（單位為MHz)。本實施 9 1280683 例1選擇T列尺寸進行實驗量測：該“接地面U長度為 100mm、寬度為7〇咖；該模組基板12長度與寬度都為 麵、厚度約為〇.4咖；該散熱金屬盒13長度與寬度都 為15mm、高度為3mm;該天線14長度為25咖、寬13. An antenna 14, a shorted metal #141, a feed metal 142, and a package 15. The module substrate 12 is electrically connected to the (four) grounding (4), and adjacent side edges of the module substrate 12 and the grounding surface of the system are: the adjacent side edges 111 are substantially aligned. The heat dissipating metal case 13 is electrically connected to the core substrate 12 and the adjacent side walls (3) of the heat dissipating metal case 13 are substantially aligned with the adjacent side edges of the core group substrate 12. The 豸 antenna has at least one bend and is located at the two (four) portions 131 of the heat dissipating metal case 13, and faces the side wall 131 as shown in Fig. 1. One end of the short-circuit metal $(4) is connected to the heat-dissipating metal case 13' and is connected to the antenna 14 at the other end. One end of the feed metal piece 142 is electrically connected to the antenna signal source on the module substrate 12 via a constant hole 132 of the heat dissipation metal case 13, and the other end is connected to the antenna 14. The encapsulating case 15 substantially covers the heat dissipating metal case. The antenna 14, the short-circuited metal piece 41 and the feed metal piece 142. The antenna 14, the short-circuiting metal piece 141, and the feeding metal piece 142 are made of a metal material, and can be formed by cutting a radiation metal piece to form a single-metal plate. The antenna 14 can also be formed by bending a single-radiation metal wire. The + read frequency of the antenna can be determined by adjusting the size of the antenna 14. A good impedance matching can be obtained by appropriately selecting the (four) of the antenna 14 and the heat dissipating metal case 13 and selecting the short-circuit position of the short-circuited metal piece (4). 2 is a diagram showing experimental results of antenna return loss (retumbss) of an embodiment of the radio frequency module package of the present invention, wherein the vertical axis represents return loss (early position is committed) and the horizontal axis represents operating frequency (unit: MHz). . This embodiment 9 1280683 Example 1 selects the T column size for experimental measurement: the "grounding surface U has a length of 100 mm and a width of 7 〇 coffee; the module substrate 12 has a length and a width of a face and a thickness of about 4. 4 coffee; The heat dissipation metal case 13 has a length and a width of 15 mm and a height of 3 mm; the antenna 14 has a length of 25 coffee and a width.
a5mm ’與該散熱金屬盒13之間隔為2醜；該短路金^ H1長度為2mm、寬度為15mm ;該饋入路金屬片⑷長 度約為6醜、寬度為〇.5酿。如第2圖所示，由所得的量 測結果，在10dB $回損失的定義下’其天線操作頻寬可 ，足無線區域網路WLAN與全球微波存取相㈣職的頻 帶需求。 第3圖為本發明射頻模組封裝一實施例ι操作在侧 MHz之輻射場型量測結果圖。由所得的結果可看出，在各 個t面的騎場型，其極化方向的場量大致接近， 可提升系統在複雜的傳播環境之通訊品質。The distance between the a5mm ′ and the heat dissipating metal case 13 is 2 ug; the short circuit gold H 1 is 2 mm in length and 15 mm in width; the feeding metal piece (4) has a length of about 6 ug and a width of 〇.5. As shown in Figure 2, the resulting measurement results, under the definition of 10dB $ return loss, can be used for the bandwidth of the wireless local area network WLAN and the global microwave access phase (four). FIG. 3 is a diagram showing the measurement results of the radiation field type measured by the side of the RF module package of the present invention. It can be seen from the obtained results that in the riding type of each t-plane, the field of the polarization direction is substantially close, which can improve the communication quality of the system in a complicated propagation environment.
田第4圖4本發明射頻模組封裝一實施⑴之天線增益 量測結果圖，其中縱軸代表天線增益（單位為卿 代表操作頻率。由所得的結果可看出，天線增益約為W 伽，可滿足無線區域網路规颜與全球微波存取相容 WiMAX在5 GHz的頻帶天線增益需求。 第5圖為本發明射頻模組封裝之天線其他實施例結構 f。其中該短路金屬片與該饋人金屬片都位於該散熱金屬 盒=同-侧牆處’ _£連接至該天線末端附近。其他結構則 與第一圖中的第一實施例相同，不再重述。 第6圖為本發明射頻模組封裝<天線其他實施例結構 •1280683 圖。其中該天線具有複數個彎折，且該天線在該饋入金屬 片兩侧具有長短不同的輻射金屬片，可提供雙頻帶操作。 其他結構則與第一圖中的第一實施例相同，不再重述。 綜合上述的說明，本發明射頻模組封裝具有結構簡 ’天線與散熱金屬盒整合容易，製作成本低，功能明確， 因此本發明射頻模組封裝甚具高度產業應用價值， 合發明之範疇。 付 淮以上所述者，僅為本發明之較佳實施例而已，當 不能以此限定本發明實施之範圍。即大凡依本發明申 利範圍所作之均㈣化與修飾，皆應仍屬本發 ^ 之範圍内。 沟益 【圖式簡單說明】 第1A圖為本發明整合天線與散熱金屬盒之射頻模組封震 之一實施例立體示意圖。 ^ 第1B圖為本發明整合天線與散熱金屬盒之射頻模組封裝 之一實施例之射頻模組封裝平面結構示意圖。" 第2圖為本發明射頻模組封裝一實施例之天線返 驗量測結果圖。 、失貫 第3圖為本發明射頻模組封裝一實施例操作在测舰之 幸畜射場型量測結果圖。 第4圖為本發明射頻模組封裝一實施例之天線增益量測結 果圖。 第5圖為本發明射頻模組封《之天線其他實施例結構圖。 11 .1280683 第6圖為本發明射頻模組封裝之天 線其他實施例結構圖 0 【主要元件符號說明】 I 本發明整合天線與散熱金屬 之一實施例 II 糸統接地面Tian 4th Figure 4 shows the antenna gain measurement result of the implementation (1) of the RF module package of the present invention, wherein the vertical axis represents the antenna gain (the unit represents the operating frequency of Qing. From the obtained results, the antenna gain is about W gamma. It can meet the requirements of wireless local area network and global microwave access compatible WiMAX antenna band gain in 5 GHz. Figure 5 is a structure f of another embodiment of the antenna of the radio frequency module package of the present invention, wherein the short circuit metal piece and The feeding metal piece is located at the heat dissipating metal box=the same side wall and is connected to the end of the antenna. Other structures are the same as the first embodiment in the first figure, and will not be repeated. The antenna module of the present invention is a structure of another embodiment of the antenna. 1280683. The antenna has a plurality of bends, and the antenna has different lengths of radiation metal strips on both sides of the feed metal sheet to provide dual frequency bands. The other structures are the same as the first embodiment in the first figure, and will not be repeated. In summary, the radio frequency module package of the present invention has a simple structure, and the antenna and the heat dissipating metal case are easily integrated. The cost of the invention is low and the function is clear. Therefore, the RF module package of the present invention has a high industrial application value and is in the scope of the invention. The above description is only a preferred embodiment of the present invention, and cannot be limited thereto. The scope of the invention is that the average (four)ization and modification of the scope of the invention according to the invention should still be within the scope of the present invention. 沟益 [Simple description of the diagram] Figure 1A shows the integrated antenna and heat dissipation of the present invention. A schematic diagram of one embodiment of a radio frequency module sealing of a metal box. ^B is a schematic diagram of a planar structure of an RF module package according to an embodiment of an RF module package for integrating an antenna and a heat dissipating metal box according to the present invention. The figure shows the result of the antenna return measurement of the embodiment of the radio frequency module package of the present invention. The instalment 3 is the result of the measurement of the field type of the fortunate animal in the embodiment of the radio frequency module package of the present invention. 4 is a diagram showing an antenna gain measurement result of an embodiment of a radio frequency module package according to the present invention. FIG. 5 is a structural diagram of another embodiment of an antenna of the radio frequency module package of the present invention. 11.12280683 FIG. Structure of other embodiments of the radio frequency module package 0 [Description of main components] I. One embodiment of the integrated antenna and heat dissipating metal of the present invention II
盒之射—級封裝 111系統基地面之相鄰兩侧邊 模組基板 13散熱金屬盒 131放熱金屬盒之相鄰兩侧牆 132貫孔 14天線 141 短路金屬片 142 饋入金屬片 15封裝殼Box-in-stage package 111 system-based ground adjacent sides of the module substrate 13 heat-dissipating metal box 131 adjacent metal wall of the heat-dissipating metal box 132 through-hole 14 antenna 141 short-circuit metal sheet 142 feed metal sheet 15 package shell
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