1279279 九、發明說明： 【發明所屬之技術領域】 本發明關於一種將貫穿孔以預定位置做到一基質（基 板）（Substrat)中的方法，特別是用於利用雷射製造模板 (Schablon)或光罩（Mask)者，其中該基質在加工時利用一固 定手段〔它做成拉幅機（Spannrahmen英：tenter frame)形 式〕定位。 【先前技術】 • 一種利用此方法製造的基質係呈印刷模板 (Druckschablon)形式，在實用上，舉例而言，已在製造具 用表面裝配電晶體前，將銲錫膏用網版印刷方法通過基質 的貝牙孔印刷到一電路板的端子片（Anschluflpad，英： terminal pad)上 ° 貫施網版印刷方法的前提為要有形狀穩定的印刷模 板’它們今日大多由鋼式鎳製造，較少用聚醯胺製造。該 構成印刷板的基質的材料厚度在作網版印刷時定出所印刷 _的銲錫膏高度。 除了傳統SMT製法外，用印刷模版作網板印刷的方法 也用於製造晶圓’高極性的晶片殼體，陶瓷多層物 (Multilayer)倒製晶片（Flipchip)及有機發光二極體 (OLED)。 仏類杈板或光罩的一重要應用領域係在濺鍍（Sputt^) 或蒸鑛方法的應用。 要有最佳的印刷結果，對於印刷模板，其位的準確性 1279279 及可重現性，以及所要做人的貫、 模板整個面積張力均1八 、、，以及在印刷 頁m刀均勻分佈的要求报高。 刹二！用上’將貫穿孔做到基質中會使材料變弱，使得 〜巾:機固定的基質的張緊狀態整個改變。這種張緊狀 怨的改變造成不想要的位置 ^ 册扣 ]位置偏差，特別是使得先前做入的 貝牙孔相對於拉幅機的相對位置的改變，以及使以後要做 入的貫穿孔的相對位置改變。 因此在實用上，往往先在一第一工作過程上將所有的 所要貫穿做入在預定位置，但最先貫穿孔做得較小。在第 一工作過程再將貫穿孔加大到各標稱尺寸，如此，在第一 工作過程後發生的移位在第二工作過程被抵消。在此，其 缺點為第二工作過程有附加的時間成本。 另外也己有人考慮，將改變的張力狀態利用電腦内部 的模型預先測定由此導出修正值，在做入貫穿孔時改變位 置的測定，但此構想顯示很繁複，且經濟上並不成功。 德專利DE 100 34 6料B 4發表了 一種製造印刷模板的 方法，其中一金屬模板直接與一預張緊的框以不可鬆開的 方式連接，然後，提高框的預應力而張緊。該構成印刷圖 案的貫穿孔在該金屬模板放到框上之前或之後，利用沖壓 或鑽孔做到金屬模板中。此印刷模板可用於在電路板印 刷、構件製造、或晶圓折曲（Wafei>BumPing)時。 為了依DE 101 41 497 A1製造光罩裝置的方法中，將 光罩之凹隙之所要形成的設置標稱設置偏離的系統偏差加 以避免，故在一系列的「部分程序」將光罩基質作構造化 6 1279279 (Stfuktimeren)，其中該部分程序互相配合設定，使得由它 們ie成的偏差能抵消，如此可達成誤差橋正。 此外，美專利US 2003/0041 753 A1也提到一種設有 貫穿孔的模板或光罩。 【發明内容】 本發明的目的在將上述種類的方法改革，使得已做入 的貝穿孔由於隨後加工步驟造成的局部移位的情事能用簡 早的方式避免。1279279 IX. Description of the Invention: [Technical Field] The present invention relates to a method for forming a through-hole in a substrate in a predetermined position, in particular for manufacturing a template using a laser (Schablon) or A mask, wherein the substrate is positioned during processing by a fixing means (which is in the form of a tenter frame). [Prior Art] • A substrate manufactured by this method is in the form of a printing template (Druckschablon). In practical use, for example, a solder paste is screen-printed through a substrate before the surface-mounted transistor is fabricated. The beryllium is printed on the terminal piece of an circuit board (Anschluflpad, terminal pad). The premise of the screen printing method is to have a shape-stable printing template. They are mostly made of steel nickel today, less Made with polyamine. The material thickness of the substrate constituting the printing plate determines the height of the solder paste to be printed when screen printing is performed. In addition to the traditional SMT process, the printing stencil is also used to fabricate wafers 'high-polarity wafer cases, ceramic multilayer (Flipchip) and organic light-emitting diodes (OLED). . An important application area for enamel rafts or reticle is in the application of sputtering (Sputt^) or steaming methods. To have the best printing results, the accuracy of the position of the printing template is 1279279 and reproducibility, as well as the requirements of the person to be made, the entire area tension of the template is 18, and the uniform distribution of the m-knife on the printed page. Report high. Brake two! Using the upper hole to make the through-hole into the matrix weakens the material, so that the tension of the machine-fixed substrate is entirely changed. This change in tension is caused by an undesired position, a positional deviation, in particular a change in the relative position of the previously made berm hole relative to the tenter, and a through hole to be made later. The relative position changes. Therefore, in practice, it is often necessary to first make all the desired penetrations into a predetermined position in a first working process, but the first through hole is made smaller. The through hole is then enlarged to each nominal size during the first working process so that the displacement occurring after the first working process is cancelled during the second working process. The disadvantage here is that the second working process has an additional time cost. In addition, it has been considered that the changed tension state is measured in advance using a model inside the computer to derive a correction value, and the position is changed when the through hole is made. However, this concept is complicated and economically unsuccessful. German Patent DE 100 34 6 Material B 4 discloses a method of manufacturing a printed template in which a metal template is directly attached to a pretensioned frame in a non-releasable manner and then tensioned by increasing the prestressing of the frame. The through-holes constituting the printed pattern are formed into the metal form by stamping or drilling before or after the metal template is placed on the frame. This print template can be used for board printing, component fabrication, or wafer flexing (Wafei > BumPing). In the method for producing a reticle device according to DE 101 41 497 A1, the systematic deviation of the nominal setting of the reticle gap is to be avoided, so that the reticle substrate is used in a series of "partial procedures" Constructing 6 1279279 (Stfuktimeren), in which the part of the program is matched with each other so that the deviations caused by them can be offset, so that the error bridge can be achieved. In addition, a template or reticle with a through hole is also mentioned in the US patent US 2003/0041 753 A1. SUMMARY OF THE INVENTION The object of the present invention is to reform the above-described method so that the local perforation caused by the subsequent processing steps can be avoided in an early manner.
這種目的依本發明利用 成。本發明的其他特點見於 因此依本發明提供的方 (它離固定手段一段距離）的 穿孔此參考點的距離，最後 離的等級順序，其根據一加 序。如此首度可用出奇地簡 的加工序列將基質的張力狀 際上可避免先前做入的貫穿 移位的情事。在此該參考點 遥擇’且舉例而言，可與幾 後要做入的貫穿孔的距離係 射加工外，也可用流體柱切 及切屑方法將貫穿孔做入。 申請專利範圍第1項的特點達 申請專利範圍附屬項。 法中，首先測定在一中心區域 一參考點的坐標，然後求出貫 由此測定貫穿孔距參考點的距 工程式以在做入貫穿孔時的順 單的方式，根據該依距離所定 怨抵消或保持恆定，並因此實 孔由於隨後做入貫穿孔而局部 基本上可在一中心範圍中自由 何中心重合。由此測定之距隨 用向量方式求出。⑨了利用雷 割方法（例如用水柱切割方法w 在此方法的一種特別有利的設計，係依 腦求得的加工性質（根據習知之基：驗或電 荷别疋材料與 1279279 度量尺寸）決定考點。依此，舉例而言，可將基質之與方 向有關的材料性質例入考慮〔例如部分的材料聚積 (Material-aufhSufungen)。特別是如此基本上也可將三度空 間形狀的基質加工。 舉例而言，可測定面積重心成張力狀態的中心當作參 考點。反之如果測定所要做入的貫穿孔的重心當作參考 點’則可達成此方法一種特別實用的實施例。 該貫穿孔實際上具有近乎任意的尺寸與幾何形狀。反 之，特別適當的一種方法的設計中，該貫穿孔係以一致的 面積做入。如此可避免由於尺寸或幾何形狀不同，而對張 力狀態有偏差的影響。只要這種偏差的尺寸或幾何形狀有 其必要，則它們可由個別的一致的貫穿孔組成。 如果該加工程式以做入貫穿孔開始（該貫穿孔距參考 點有最小距離）且一此首先將基質中央區域加工，則可達 成此方法特別有利的形態。在該處做入貫穿孔，依經驗， 所造成之張力狀態的變化為最小。 加工作業可由此參考點出發呈星狀進行。反之，如果 加工作業在—條繞著參考點的運動路徑上呈螺旋狀進行， 俾使加工期間由於加工頭（Bearbeitungskopf，英：㈣吻如 head)的運動路徑最佳化而減短，也是特別有利。 此外，如果該加工程式另外在加工時根據檢 值^作修正值，則顯得特別實用。在此，舉例而言，可 用相關參數將張力狀態檢出（這些參數可與固定手段相關 聯），以藉著修正加工程序而防止不想要的變化。& 1279279 使基質：料1°Γ亥加工程式根據該由於局部累積的貫穿孔 值，俾在j =的情形（這種減弱與方向有關）當作修正 參考點日讀該序列不㈤（該序列根據貫穿孔位置距 變弱的愔宣— 違做入的貝牙孔的不想要的 常的村料二;累積的貫穿孔由於局部貫穿孔的不尋 的貫穿利點的距離變小在加工時基質由於-側做入 加工而不當變弱的情事使基質不當地變動的情事（在This object is utilized in accordance with the present invention. Further features of the invention are found in the distance of the perforation of the reference point, the order of the final separation, in accordance with an order, in accordance with the invention (which is a distance from the fixing means). For the first time, it is possible to use a surprisingly simple processing sequence to avoid the transversal of the previous intrusion. Here, the reference point is remotely selected and, for example, the distance from the through hole to be made later can be scribed, and the through hole can be made by the fluid column cutting and chipping method. The characteristics of the first application of the scope of patent application are up to the scope of the patent application. In the method, first, the coordinates of a reference point in a central region are measured, and then the distance from the reference point to the reference point is determined to determine the order of the through hole, and the grievance according to the distance is determined. It is counteracted or kept constant, and thus the solid holes are partially partially free to coincide in a central extent due to subsequent penetration into the through holes. The distance thus determined is determined by the vector method. 9 The use of the thunder cutting method (for example, the water column cutting method w. A particularly advantageous design of this method, based on the processing properties obtained by the brain (according to the conventional basis: test or charge material and 1279279 metric size) to determine the test site In this way, for example, the direction-dependent material properties of the substrate can be taken into account (for example, partial material accumulation). In particular, it is basically also possible to process a substrate having a three-dimensional shape. In this case, the center of the center of gravity of the area can be measured as a reference point. Conversely, if the center of gravity of the through hole to be measured is used as a reference point, a particularly practical embodiment can be achieved. It has almost any size and geometry. Conversely, in the design of a particularly suitable method, the through-holes are made with a uniform area. This avoids the influence of variations in the tension state due to differences in size or geometry. As long as the dimensions or geometries of such deviations are necessary, they may consist of individual uniform through holes. If the machining program starts with a through hole (the minimum distance from the reference point) and the central region of the substrate is first processed, a particularly advantageous form of the method can be achieved. Experience, the change in the tension state is minimized. The machining operation can be carried out in a star shape from the reference point. Conversely, if the machining operation is spiraled in the path of the movement around the reference point, It is particularly advantageous to optimize the path of the processing head (Bearbeitungskopf, English: (4) kiss like head). In addition, it is particularly useful if the machining program is additionally corrected according to the value of the machining. Thus, for example, the tension state can be detected with relevant parameters (these parameters can be associated with the fixing means) to prevent unwanted changes by modifying the machining program. & 1279279 The substrate: material 1 ° Γ processing According to the value of the through-hole that is locally accumulated, the program reads the sequence as the correction reference point in the case of j = (this attenuation is related to the direction) No (5) (The sequence is weakened according to the position of the through hole; the undesired constant village material 2 of the shell hole that is in violation; the cumulative through hole is the distance from the point of penetration of the local through hole Smaller in the processing of the substrate due to the side-to-side processing and not weakening the situation to cause the substrate to change improperly (in
事:、於—側做人貫穿孔而使基質造成不想要的變弱情 八 *則特別有利’為此’舉例而言，將基質劃 g方形的部分並為此將所做入的貫穿孔的總面積 作分析。 、 本發明可做各種π同的實施例，A 了進一步說明其基 本原理’在圖式中顯示其一實施例並在以下說明。 【實施方式】 一第1圖的原理圖顯示一種結構，它用於利用雷射（圖 未示）將預定位置的個別貫穿孔（1)做入一基質（2)(它做成 印刷模板形式）。為此，該基質（2)利用一固定手段（3)(做成 拉幅機形式）定位。由於在以後的加工步驟使基質（2)的強 力狀態改變，使得貫穿孔（1)局部移位的情事可用以下方式 避免：首先測定一個中心參考點（4)的座標，然後測定貫穿 孔（1)的預定位置距此參考點的距離a，並由上成一個等級 序列（5)。如此該等級系列（5)構成一加工程式（6)的基礎， 利用此加工程式控制雷射頭的執跡並將貫穿孔（1)做入基質 (2)中。 9 1279279 【圖式簡單說明】 第1圖係本發明之一實施之示意圖。 【主要元件符號說明】Things:, on the side of the person through the hole to make the matrix cause unwanted weakening 8 * is particularly advantageous 'for this', for example, the base of the matrix is squared and for this purpose will be made into the through hole The total area is analyzed. The present invention can be implemented in various embodiments, and A further explains its basic principle. An embodiment of the invention is shown in the drawings and described below. [Embodiment] A schematic diagram of Fig. 1 shows a structure for making a predetermined through hole (1) into a substrate (2) by means of a laser (not shown) (which is in the form of a printed template) ). To this end, the substrate (2) is positioned by means of a fixing means (3) (in the form of a tenter). Since the strong state of the substrate (2) is changed in a subsequent processing step, the local displacement of the through hole (1) can be avoided by first determining the coordinates of a central reference point (4) and then measuring the through hole (1). The predetermined position is a distance a from the reference point and is formed into a sequence of ranks (5). Thus, the series (5) forms the basis of a processing program (6) by which the laser head is guided and the through hole (1) is introduced into the substrate (2). 9 1279279 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing one embodiment of the present invention. [Main component symbol description]
⑴ 貫穿孔 (2) 基質 (3) 固定手段 (4) 參考點 (5) 等級系列 (6) 加工程式 10(1) Through hole (2) Substrate (3) Fixing means (4) Reference point (5) Grade series (6) Machining program 10