1277524 九、發明說明： 【發明所屬之技術領域】 本案係關於一種列印晶片流體供應結構，尤指一種 應用於喷墨印表機之列印晶片流體供應結構。 【先前技術】 • 目前市面上常見的印表機除雷射印表機外，喷墨印 表機是另一種被廣泛使用的機種，其具有價格低廉、操 作容易以及低噪音等優點，且可列印於如紙張、相片紙 等多種喷墨媒體。而喷墨印表機之列印品質主要取決於 墨水匣的設計等因素，尤其以控制列印晶片釋出墨滴至 喷墨媒體之機構設計為墨水匣設計的重要考量因素。 以現有熱汽泡式（thermal bubble)喷墨技術而言，為了 提高墨水匣列印於喷墨媒體上的解析度，多半採用中央 ^ 供墨流道之設計，主要藉由增加喷孔排列數的方式來提 高喷墨時的解析度。請參閱第一圖，其係為習知使用中 央供墨流道之喷墨頭結構示意圖，如圖所示，習知喷墨 頭之列印晶片1之兩相對侧邊具有複數個焊墊11，且列 ，印晶片1的中央設置有一平行於兩侧邊複數個焊墊11之 中央供墨流道12,而該中央供墨流道12之兩相對側邊則 設置有複數個墨水腔13及複數個加熱電阻（未圖示）。此 外另有一喷孔板14，其係具有複數個喷孔141，且喷孔 1277524 141之位置相對於墨水腔13,故當列印晶片1與喷孔板 14組裝，並設置於墨水匣之出墨口（未圖示）時，墨水便 會自中央供墨流道12流至其兩侧之複數個墨水腔13,並 經過加熱電阻（未圖示）加熱後再由喷孔板14上相對應的 喷孔141喷至喷墨媒體上。 雖然使用中央供墨流道12之喷墨頭具有較高的解析 度，但形成列印晶片1在加工製程上需利用喷砂、雷射 _ 切割或蝕刻等加工方式來形成中央供墨流道12，喷砂製 程之潔淨度低，而雷射加工之費用昂貴，蝕刻則會使列 印晶片1之結構較為脆弱，進而增加加工成本及製造成 本。此外，為了要預留中央供墨流道12之空間，不可避 免的需具有相當大尺寸的列印晶片1，這將會提昇列印晶 片1之製造成本。 為了解決上述問題，現有技術乃發展出一種列印晶 片採用侧邊供墨流道之方式，請參閱第二圖，其係為習 φ 知使用侧邊供墨流道之喷墨頭結構示意圖，如圖所示， 喷墨頭之列印晶片2之兩相對侧邊亦設置有複數個焊墊 21，而相異於焊墊21的另外兩侧邊則分別具有侧邊供墨 流道22，侧邊供墨流道22的一侧亦設有複數個墨水腔 23及複數個加熱電阻（未圖示）。此外，喷墨頭亦具有複 數個喷孔241之喷孔板24，喷孔241之位置係相對於墨 水腔23,故當列印晶片2與喷孔板24組裝，並設置於墨 水匣之出墨口（未圖示）上時，墨水便會自列印晶片2之侧 邊供墨流道22流至複數個墨水腔23,並經過加熱電阻加 7 1277524 · 熱後再由喷孔板24上相對應的噴孔241噴至喷墨媒體 上。 然而，使珀侧邊供墨流道22之列印晶片2雖可省略 形成中央供墨旅道之加工步驟，且其結構較使用中央供 墨流道之列印品片為強，尺寸也相對較小，具有降低列 印晶片2之加>成本及物料成本等優點，但是，這種使 用侧邊供墨流遒的設置方式，相對列印晶片2只能利用 _ 兩侧來配置構成喷孔’因此喷墨頭之喷孔的排列數會受 到限制，相對影響到解析度。 因此，如何發展一種同時考量成本、解析度以及列 印品質之列印晶片流體供應結構，實為相關技術領域者 目前所迫切需要解決之問題。 【發明内容】 本案之主要目的為提供一種列印晶片流體供應結 • 構’適用於一墨水匣，其係結合中央供墨流道及側邊供 墨流道，主要藉由侧邊供墨流道來節省列印晶片之整體 面積，以降低製作成本，而結含中央供墨流道之設計則 可增加噴孔排列數，以具有較高解析度及提升列印品質。 為達上述目的，本案之一較廣義實施樣態為提供一 種列印晶片，其係適用於一墨水匣之一喷墨頭結構，該 列印晶片之兩相對侧係設置有旅數個焊墊，其特徵在於： 該列印晶片於垂直複數個焊塾之方向設置有至少一出墨 側邊’用以與墨水匣之一本體構成至少一侧邊供墨流 8 1277524 道，以及於設置複數個焊墊之兩相對侧之間且平行至少 一侧邊供墨流道之方向具有至少一中央供墨流道。 根據本案之構想，其中列印晶片於垂直複數個焊墊 之方向設有兩出墨側邊，用以與該墨水匣之該本體構成 兩侧邊供墨流道。 根據本案之構想，其中列印晶片於設置複數個焊墊 之兩相對侧之間且平行至少一侧邊供墨流道之方向設有 _ 兩中央供墨流道，且兩中央供墨流道係並列。 根據本案之構想，其中列印晶片於設置複數個焊墊 之兩相對侧之間且平行至少一侧邊供墨流道之方向設有 兩中央供墨流道，且兩中央供墨流道係串列。 根據本案之構想，其中列印晶片於設置複數個焊墊 之兩相對侧之間且平行至少一侧邊供墨流道之方向設有 三中央供墨流道，且三中央供墨流道係並列。 根據本案之構想，其中列印晶片於設置複數個焊墊 Φ 之兩相對側之間且平行至少一側邊供墨流道之方向設有 三中央供墨流道，且三中央供墨流道係串列。 根據本案之構想，其中列印晶片於設置複數個焊墊 之兩相對侧之間且平行至少一側邊供墨流道之方向設有 五中央供墨流道，且五中央供墨流道係並列。 根據本案之構想，其中列印晶片於實質上鄰近至少 一侧邊供墨流道之表面設有至少一侧邊墨滴產生器群 組，而實質上鄰近至少一中央供墨流道之表面設有至少 一中央墨滴產生器群組，至少一侧邊墨滴產生器群組及 9 1277524 ? I ' 至夕中央墨滴產生器群組係因加熱作用而產生複數個 墨滴。 根據本案之構想，其中列印晶片於實質上鄰近至少 一側邊供墨流道之表面分別設有兩組侧邊墨滴產生器群 組，而實質上鄰近至少一中央供墨流道之兩侧表面亦分 別各設有一中央墨滴產生器群組。 根據本案之構想，其中列印晶片於實質上鄰近至少 ^ 侧邊供墨流道之表面分別設有兩組侧邊墨滴產生器群 組，而實質上鄰近至少一中央供墨流道之兩侧表面；分 別各設有兩中央墨滴產生器群組。 根據本案之構想，其中列印晶片於實質上鄰近至少 一侧邊供墨流道之表面僅設有一侧邊墨滴產生器群組， :實質上鄰近至少一令央供墨流道之兩侧表面亦僅分別 設有一中央墨滴產生器群組。 根據本案之構想，其中列印晶片於實質上鄰近該等 籲側邊供墨流道之表面僅分別設有一侧邊墨滴產生器群 組，而實質上鄰近該等中央供墨流道之兩侧表面亦；分 別設有一中央墨滴產生器群組。 根據本案之構想，其中列印晶片上係設置一喷孔 板，噴孔板係具有複數個喷孔，複數個喷孔係對應於列 印晶片上之側邊墨滴產生器群組以及中央墨滴產生器群 組，用以將墨滴產生器群組所產生之複數個墨滴分^自 對應於噴孔板上之複數個喷孔喷出至一喷墨媒體上。 為達上述目的，本案亦提供一種噴墨頭·結構，其係 1277524 適用於一墨水匣，用以將複數個墨滴喷至一喷墨媒體 上，該喷墨頭係包含：一列印晶片，大體上呈矩形，其兩 相對侧係設置有複數個焊墊，且於垂直複數個焊墊之方 向設置有至少一出墨侧邊，用以與墨水匣之一本體構成 至少一侧邊供墨流道，以及於設置複數個焊墊之兩相對 側之間且平行至少一側邊供墨流道之方向具有至少一中 央供墨流道；僅有一側邊墨滴產生器群組，設置於列印 晶片之表面且實質上鄰近每一侧邊供墨流道，用以因加 熱作用而產生複數個墨滴；僅有一中央墨滴產生器群 組，設置於列印晶片之表面且實質上鄰近每一中央供墨 流道，用以因加熱作用而產生複數個墨滴；以及一喷孔 板，係具有複數個喷孔相對於侧邊墨滴產生器群組以及 中央墨滴產生器群組，當喷孔板與列印晶片結合時，用 以將側邊墨滴產生器群組及中央墨滴產生器群組所產生 之複數個墨滴自所對應之複數個喷孔喷出至喷墨媒體 上。 為達上述目的，本案亦提供另一種喷墨頭結構，其 係適用於一墨水匣，用以將複數個墨滴喷至一喷墨媒體 上，該喷墨頭係包含：一列印晶片，大體上呈矩形，其兩 相對侧係設置有複數個焊墊，且於垂直複數個焊墊之方 向設置有至少一出墨侧邊，用以與墨水匣之一本體構成 至少一侧邊供墨流道，以及於設置複數個焊墊之兩相對 侧之間且平行至少一侧邊供墨流道之方向具有複數個中 央供墨流道，其中複數個中央供墨流道係串列；至少一 11 1277524 側邊墨滴產生器群組，設置於列印晶片之表面且實質上 鄰近至少一側邊供墨流道，用以因加熱作用而產生複數 個墨滴；複數個中央墨滴產生器群組，設置於列印晶片 之表面且實質上鄰近複數個中央供墨流道，用以因加熱 作用而產生複數個墨滴；以及一喷孔板，係具有複數個 喷孔相對於至少一侧邊墨滴產生器群組以及複數個中央 墨滴產生器群組，當喷孔板與列印晶片結合時，用以將 至少一側邊墨滴產生器群組及複數個中夹墨滴產生器群 組所產生之複數個墨滴自所對應之複數個喷孔喷出至喷 墨媒體上。 【實施方式】 體現本案特徵與優點的一些典型實施例將在後段的 說明中詳細敘述。應理解的是本案能夠在不同的態樣上 • 具有各種的變化，其皆不脫離本案的範圍，且其中的說 明及圖示在本質上係當作說明之用，而非用以限制本案。 請參閱第三圖，其係為本案第一較佳實施例之喷墨 頭結構之示意圖，如圖所示，喷墨頭結構可包含列印晶 片3、墨濟產生器群組331、341以及喷孔板35，且喷墨 頭結構係組裝於一墨水匣之本體上4(如第四圖所示）。如 第三圖所示，列印晶片3大致成矩形形狀，且其中兩相 對侧邊分別設置有複數個焊墊31，主要用來與喷墨印表 機的系統控制電路（未圖示）電性連接用，使列印晶片3根 12 1277524 據喷墨印表機的系統控制電路所傳送之控制信號的觸發 而將墨水匣内部所儲存之墨水加熱喷射至喷墨媒體（未 圖示）上，且該列印晶片3於垂直於複數個焊墊31設置 方向的兩側邊’即平行於贺墨媒體移動之列印方向’分 別設置有一出墨侧邊32，因此當第三圖所示之喷墨頭與 墨水匣組裝在一起時，列印晶片3兩侧邊的出墨侧邊32 將與墨水匣之本體4構成兩個侧邊供墨流道33(如第四圖 所示），於本實施例中，介於複數個焊墊31以及兩個側 邊供墨流道33之間另外設有一中央供墨流道34,中央供 墨流道34係平行於兩側邊供墨流道33。 請再參閱第三圖並請配合第五圖，第五圖係為第三 圖之局部放大圖。如圖所示，列印晶片3的表面上係具 有兩組侧邊墨滴產生器群組331，且其係分別鄰近於該兩 侧邊供墨流道33，而側邊墨滴產生器群組331係由複數 個墨滴產生器所組成，其中每一個墨滴產生器皆包含一 墨水腔36以及一設置於墨水腔36中的加熱電阻37，同 樣的，在列印晶片3的表面且鄰近中央供墨流道34的侧 邊亦設有一組中央墨滴產生器群組341，中央墨滴產生器 群組341同樣由複數個墨滴產生器所組成，且每一個墨 滴產生器皆包含一墨水腔36及加熱電阻37,故當喷墨頭 組裝於墨水匣本體4上時（如第四圖所示），墨水匣内部所 儲存的墨水將經由兩側邊供墨流道33及中央供墨流道 34分別流至對應的侧邊墨滴產生器群組331以及中央墨 滴產生器群組341的每一個墨水腔36中，並經墨水腔36 13 1277524 中的加熱電阻37加熱後將墨水喷射至喷墨媒體上。 請再參閱第三圖並配合第四及五圖，其中第三及第 五圖之圖式係截切部份之喷孔板35以暴露出列印晶片的 結構示意圖，於本實施例中，列印晶片3的上方係設置 有一喷孔板35，而喷孔板35之長度實質上與列印晶片3 之長度相等（如第四圖所示）。喷孔板35設有兩凹口 351， 使其形狀大致上呈“H”字形，喷孔板35之凹口 351的設 φ 置位置係對應於複數個焊墊31，因此當喷孔板35與列印 晶片3組合時將露出焊墊31，使焊墊31能夠與喷墨印表 機的系統控制電路電性連接。而喷孔板35的寬度則實質 上較列印晶片3之寬度為大，故當喷孔板35與列印晶片 3組合成喷墨頭並安裝至墨水匣本體4時，墨水不至於自 側邊供墨流道33滲出（如第四圖所示）。又喷孔板35上設 有複數個喷孔352,而喷孔352所設置的位置係分別對應 於列印晶片3上側邊墨滴產生器群組331或是中央墨滴 • 產生器群組341的墨滴產生器，更細部地說明，則是複 數個喷孔352係分別對應於侧邊墨滴產生器群組331或 是中央墨滴產生器群組341之墨滴產生器之墨水腔36中 的加熱電阻37，是以墨水匣内部所儲存的墨水可由側邊 供墨流道33及中央供墨流道34分別流至侧邊墨滴產生 器群組331及中央墨滴產生器群組341之墨滴產生器的 每一個墨水腔36中，藉由墨水腔36中的加熱電阻37加 熱並經噴孔板35上相對應的喷孔352喷出至喷墨媒體 1277524 上。 請參閱第六圖，其係為第三圖組裝後之透視圖。如 圖所示，列印晶片3與喷孔板35組合後即成為一喷墨頭 結構，且鄰近兩側邊供墨流道33各自設有一侧邊墨滴產 生器群組331，於鄰近中央供墨流道34的附近則設有一 中央墨滴產生器群組341，喷孔板35上的複數個喷孔352 則對應於侧邊墨滴產生器群組331以及中央墨滴產生器 群組341之墨水腔36，使墨水得以經由墨滴產生器的墨 水腔36中之加熱電阻37(如第五圖所示）加熱成墨水氣 泡，透過對應於該加熱電阻37的喷孔352喷出至喷墨媒 體上。 雖然於第六圖中，列印晶片3鄰近兩侧邊供墨流道 33的表面上係分別設置有一組侧邊墨滴產生器群組 331，而列印晶片3鄰近且平行於中央供墨流道34的表 面上僅於中央供墨流道34之一侧邊設置有一中央墨滴產 生器群組341，但墨滴產生器群組的實施態樣並不以此為 限。舉例而言，配合本實施例之侧邊供墨流道33及中央 供墨流道34，亦可於鄰近兩側邊供墨流道分別設置有兩 組侧邊墨滴產生器群組，該兩侧邊墨滴產生器群組係鄰 近兩侧邊供墨流道，且以交錯的方式排列，以便侧邊供 墨流道中的墨水可流至該兩個側邊墨滴產生器群組，亦 或是只在單邊的侧邊供墨流道33設置一組或是兩組交錯 排列的側邊墨滴產生器群組，而中央供墨流道34的兩侧 15 1277524 可分別設置有一組或兩組中央墨滴產生器群組。換言 之，侧邊墨滴產生器群組及中央墨滴產生器群組的數目 與侧邊供墨流道及中央供墨流道並無直接的相關性，可 視需求任意地在側邊供墨流道或中央供墨流道配置一或 多個側邊墨滴產生器群組或中央墨滴產生器群組。 當然，列印晶片3的墨水供應結構並非僅限於上述 兩侧邊供墨流道33及一中央供墨流道34，請參閱第七 圖，其係本案第二較佳實施例之喷墨頭結構之透視圖。 如圖所示，喷墨頭結構同樣包含列印晶片3、墨滴產生器 群組33卜341以及喷孔板35,至於列印晶片3之複數個 焊墊31及供墨流道33、34的設置方向已詳細描述於第 一較佳實施例中，故此處不再贅述。於本較佳實施例中， 列印晶片3的單一侧邊係具有一個侧邊供墨流道33以及 於列印晶片3的表面係具有兩個中央供墨流道34,該兩 中央供墨流道34係並列設置，亦即兩兩併排平行。此外， 列印晶片3鄰近於側邊供墨流道33的表面上係設置有一 側邊墨滴產生器群組331，而列印晶片3鄰近且平行於兩 中央供墨流道34的表面上，則各自設置有一組中央墨滴 產生器群組341於兩中央供墨流道34的一侧邊。當然， 侧邊墨滴產生器群組331及中央墨滴產生器群組341均 由複數個墨滴產生器所組成，且每一個墨滴產生器都由 一個墨水腔及一位於墨水腔中的加熱電阻所構成（請配 合參考第五圖），而喷孔板35上的複數個喷孔352係對 1277524 應於每一墨滴產生器群組中每一墨滴產生器之墨水腔中 的加熱電阻，故墨水得以經加熱電阻加熱，再自喷孔352 喷出至喷墨媒體上。 相同地，於第七圖中僅揭露列印晶片3於鄰近侧邊 供墨流道33的表面上設置有一側邊墨滴產生器群331， 而兩個中央供墨流道34的一側邊各設置有一中央墨滴產 生器群組341，但配合本實施例的流道設計並非只限定於 φ 上述的配置態樣，舉例而言，配合本實施例之單一側邊 供墨流道33及兩中央供墨流道34,亦可於列印晶片3 上鄰近侧邊供墨流道33的侧邊同時設置兩組侧邊墨滴產 生器群組，而兩中央供墨流道34的兩侧分別設置有一組 或兩組中央墨滴產生器群組。當然，亦可於原侧邊供墨 流道33的相對側再增加一侧邊供墨流道，使其為兩側邊 供墨流道加上兩中央供墨流道，而該增加的侧邊供墨流 道其侧邊墨滴產生器群組的配置方式可與原侧邊供墨流 • 道33之侧邊墨滴產生器群組相同。 請參閱第八圖，其係本案第三較佳實施例之喷墨頭 結構之透視圖，如圖所示，喷墨頭結構同樣包含列印晶 片3、墨滴產生器群組331、341以及喷孔板35，至於列 印晶片3之複數個焊墊31及供墨流道的設置方向已詳細 描述於第一較佳實施例中，故此處不再贅述。於本較佳 實施例中，列印晶片3的侧邊具有兩個側邊供墨流道 33，而於兩個側邊供墨流道33之間則設置有三個中央供 墨流道34,且該三個中央供墨流道34係並列設置，列印 17 1277524 晶片3於鄰近兩侧邊供墨流道33的表面上係分別具有侧 邊墨滴產生器群組331，而中央供墨流道34的一侧邊則 分別具有一中央墨滴產生器群組341，其設置之方式皆與 第七圖所示之第二較佳實施例相同，故於此處不再贅述。 由第七圖及第八圖所揭露之實施例可知，列印晶片3 可依據需求設置為一側邊供墨流道配合多個中央供墨流 道，或兩侧邊供墨流道配合多個中央供墨流道，舉例而 φ 言，該多個中央供墨流道的數目可為四個或五個，但不 以此為限，使喷孔板35之喷孔352排列數可配合侧邊供 墨流道及中央供墨流道的數目相對地增加，以提供較佳 的列印品質以及提高列印的解析度。 第三圖至第八圖所揭露之中央供墨流道及侧邊供墨 流道之間均係以並列的方式平行設置，然於本案可施行 的較佳實施例中，中央供墨流道及侧邊供墨流道不僅止 於平行的並列設置，亦可使甩串列的實施態樣。請參閲 • 第九圖，其係本案第四較佳實施例之喷墨頭結構之透視 圖。於本實施例中，喷墨頭結構係包含有三個以串列的 方式排列之喷墨群組gl、g2及g3，亦即喷墨群組gl、 g2及g3係設置於平行列印方向的同一直線上，當然，喷 孔板35的喷孔352配合喷墨群組gl、g2及g3的設置態 樣同樣以串列的方式排列。而每一個喷墨群組gl、g2或 是g3係分別由兩侧邊供墨流道33以及一中央供墨流道 34配合侧邊墨滴產生器群組331以及中央墨滴產生器群 組341所構成，當然，於每一個喷墨群組gl、g2及g3 18 1277524 中的侧邊供墨流道33、中央供墨流道34、侧邊墨滴產生 器群組331、以及中央墨滴產生器群組341的配置數量及 方式並不以此為限，亦可使用第三圖至第八圖的實施方 式，喷墨頭製造廠商可依據實際需求做各種變化，以增 加喷孔的排列數目，當然，串列的喷墨群組之數目亦可 依需求做不同的調整。 由上述說明可知，本案之列印晶片流體供應結構的 φ 主要技術特徵係結合侧邊供墨流道及中央供墨流道來達 到較佳的列印品質、提高列印的解析度以及降低生產成 本之優點，因此侧邊供墨流道及中央供墨流道的配置態 樣並無特別的限制，舉凡有至少一出墨侧邊與墨水匣之 本體定義出至少一侧邊供墨流道，以及至少一中央供墨 流道的列印晶片流體供應結構，皆為本案之保護範圍。 此外，本案之侧邊供墨流道及中央供墨流道之排列亦無 所設限，可為至少一侧邊供墨流道配合一中央供墨流 • 道、一側邊供墨流道配合多個並列中央流道（如第七圖所 示）、兩個侧邊供墨流道配合多個並列中央供墨流道（如第 八圖所示）以及侧邊或中央供墨流道以串列之方式設置 (如第九圖所示）。 又本案雖以一個侧邊供墨流道配合一側邊墨滴產生 器群組為例，但不以此為限，換言之，一個側邊供墨流 道亦可配合兩群或多群交錯設置的墨滴產生器群組，而 中央供墨流道亦然，一個或多個中央墨滴產生器群組可 單設於平行且鄰近一個中央供墨流道的一侧，或分別設 19 1277524 置於中央墨滴產生器群組的兩側邊，可依照實際需求調 整供墨流道及墨滴產生器群組的設置方式，進而提高解 析度與列印品質。 當然，由上述各實施例中所呈現出列印晶片3以侧 邊供墨流道33與中央供墨流道34結合應用之設置方 式，可滿足具有較高解析度、較佳列印品質以及低製作 成本的需求，而在實際應用上，該列印晶片3的各群墨 φ 滴產生器群組可使用不同色的墨水，以完成多色喷墨列 印的工作。 綜上所述，本發明係提供一結合侧邊供墨流道及中 央供墨流道的列印晶片流體結構，其係以侧邊供墨流道 為主並辅以中央供墨流道，侧邊供墨流道可節省列印晶 片之整體面積及降低製造成本，而藉由中央供墨流道則 用來增加喷孔板上喷孔的排列數，以提供一具有較高解 析度及較佳列印品質的列印晶片，換言之，本案之列印 • 晶片流體結構係結合側邊供墨流道及中央供墨流道之優 點，以設置一個更完善且具有競爭力的列印晶片，使墨 水匣之樣用得以更臻完備。因此，本案極具產業之價值， 爰依法提出申請。 縱使本發明已由上述之實施例詳細敘述而可由熟悉 本技藝之人士任施匠思而為諸般修飾，然皆不脫如附申 請專利範圍所欲保護者。 20 1277524 【圖式簡單說明】 第一圖··其係為習知使用中央供墨流道之喷墨頭結構示 意圖。 第二圖：其係為習知使用侧邊供墨流道之喷墨頭結構示 意圖。 第三圖：其係為本案第一較佳實施例之喷墨頭結構之示 意圖。 第四圖：其係為具有本案第一較佳實施例之列印晶片、 喷孔板與墨水匣之組合示意圖。 第五圖：其係為第三圖之局部放大圖。 第六圖：其係為第三圖組裝後之透視圖。 第七圖：其係為本案第二較佳實施例之喷墨頭結構之透視 圖。 第八圖：其係為本案第三較佳實施例之喷墨頭結構之透視 圖。 第九圖：其係為本案第四較佳實施例之喷墨頭結構之透視 圖。 21 1277524 【主要元件符號說明】 1 列印晶片 11 焊墊 12 中央供墨流道 13 墨水腔 14 喷孔板 141 喷孔 2 列印晶片 21 焊墊 22 側邊供墨流道 23 墨水腔 24 喷孔板 241 喷孔 3 列印晶片 31 焊墊 32 出墨侧邊 33 側邊供墨流道 331 側邊墨滴產生器群組 34 中央供墨流道 341 中央墨滴產生器群組 35 喷孔板 351 凹口 352 喷孔 36 墨水腔 37 加熱電阻 4 墨水匣本體1277524 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a print wafer fluid supply structure, and more particularly to a print wafer fluid supply structure applied to an ink jet printer. [Prior Art] • In addition to the laser printers commonly used in the market, inkjet printers are another widely used model, which has the advantages of low price, easy operation and low noise. Printed on a variety of inkjet media such as paper and photo paper. The printing quality of inkjet printers is mainly determined by factors such as the design of the ink cartridges, especially the design of the ink cartridge design to control the discharge of ink droplets to the inkjet media. In the case of the existing thermal bubble inkjet technology, in order to improve the resolution of the ink cartridge printing on the inkjet medium, the design of the central ink supply channel is mostly adopted, mainly by increasing the number of nozzle arrays. The way to improve the resolution when inkjet. Please refer to the first figure, which is a schematic diagram of a conventional ink jet head structure using a central ink supply flow path. As shown in the figure, the opposite side edges of the printing ink chip 1 of the conventional ink jet head have a plurality of pads 11 And the center of the printed wafer 1 is provided with a central ink supply flow path 12 parallel to the plurality of pads 11 on both sides, and the opposite sides of the central ink supply flow path 12 are provided with a plurality of ink chambers 13 And a plurality of heating resistors (not shown). In addition, there is another orifice plate 14 having a plurality of orifices 141, and the orifices 1277524 141 are positioned relative to the ink chamber 13, so that the printing wafer 1 and the orifice plate 14 are assembled and disposed in the ink cartridge. At the ink port (not shown), the ink flows from the central ink supply path 12 to the plurality of ink chambers 13 on both sides thereof, and is heated by a heating resistor (not shown) and then applied to the orifice plate 14 A corresponding orifice 141 is sprayed onto the inkjet medium. Although the ink jet head using the central ink supply path 12 has a high resolution, the formation of the printing wafer 1 requires a process such as sand blasting, laser cutting or etching to form a central ink supply path in the processing process. 12, the blasting process has low cleanliness, and the laser processing is expensive, and the etching makes the structure of the printing chip 1 relatively fragile, thereby increasing processing cost and manufacturing cost. Further, in order to reserve the space of the central ink supply path 12, it is inevitable to have a printing chip 1 of a relatively large size, which will increase the manufacturing cost of the printing chip 1. In order to solve the above problems, the prior art has developed a method in which a print wafer adopts a side ink supply flow path. Referring to the second figure, it is a schematic diagram of an ink jet head structure using a side ink supply flow path. As shown in the figure, the opposite sides of the printing chip 2 of the inkjet head are also provided with a plurality of pads 21, and the other sides of the pads 21 are respectively provided with side ink supply channels 22, A plurality of ink chambers 23 and a plurality of heating resistors (not shown) are also disposed on one side of the side ink supply passage 22. In addition, the inkjet head also has a plurality of orifices 24 of the orifices 241. The orifices 241 are positioned relative to the ink chamber 23, so that the printing wafer 2 and the orifice plate 24 are assembled and disposed in the ink cartridge. On the ink port (not shown), the ink flows from the side ink supply channel 22 of the printing chip 2 to the plurality of ink chambers 23, and is heated by a heating resistor to add 7 1277524. The corresponding nozzle holes 241 are sprayed onto the ink jet medium. However, the printing of the wafer 2 on the side ink supply passage 22 can omit the processing steps for forming the central ink supply road, and the structure is stronger than that of the printed sheet using the central ink supply flow path, and the size is relatively Smaller, it has the advantages of lowering the cost of printing the wafer 2 and the material cost. However, the arrangement of the side ink supply flow can be configured by using only the _ sides to configure the spray. The hole 'Therefore, the number of arrays of the nozzle holes of the ink jet head is limited, and the resolution is relatively affected. Therefore, how to develop a print wafer fluid supply structure that considers cost, resolution and print quality at the same time is an urgent problem to be solved by those skilled in the related art. SUMMARY OF THE INVENTION The main object of the present invention is to provide a print wafer fluid supply structure suitable for an ink cartridge, which is combined with a central ink supply flow path and a side ink supply flow path, mainly by a side ink supply flow. This saves the overall area of the printed wafer to reduce the manufacturing cost, while the design with the central ink supply flow path increases the number of orifice arrays for higher resolution and improved print quality. In order to achieve the above object, one of the more general embodiments of the present invention provides a print wafer which is suitable for an ink jet head structure of an ink cartridge. The opposite sides of the print wafer are provided with a plurality of solder pads. The printing chip is characterized in that: at least one ink emitting side is disposed in a direction of a plurality of vertical soldering dies to form at least one side of the ink supply flow with a body of the ink cartridge 8 1277524, and a plurality of There are at least one central ink supply flow path between the opposite sides of the pads and in parallel with at least one of the sides of the ink supply flow path. According to the concept of the present invention, the printing wafer is provided with two ink discharging sides in the direction of the vertical plurality of pads for forming the ink supply channels on both sides with the body of the ink cartridge. According to the concept of the present invention, the printing wafer is disposed between two opposite sides of the plurality of bonding pads and parallel to at least one side of the ink supply flow path, and two central ink supply flow paths are provided, and the two central ink supply flow paths are provided. The system is juxtaposed. According to the concept of the present invention, the printing wafer is provided with two central ink supply flow paths in the direction of the ink supply flow path between the opposite sides of the plurality of bonding pads and at least one side of the ink supply flow path, and the two central ink supply flow path systems Serial. According to the concept of the present invention, the printing wafer is provided with three central ink supply flow paths in the direction of the ink supply flow path between the opposite sides of the plurality of bonding pads and at least one side of the ink supply flow path, and the three central ink supply flow path systems are juxtaposed. . According to the concept of the present invention, the printing chip is provided with three central ink supply flow paths between the opposite sides of the plurality of pads Φ and parallel to at least one side of the ink supply flow path, and the three central ink supply flow paths are provided. Serial. According to the concept of the present invention, the printing chip is provided with five central ink supply flow paths in the direction of the ink supply flow path between the opposite sides of the plurality of bonding pads and at least one side of the ink supply flow path, and the five central ink supply flow path system Parallel. According to the concept of the present invention, the printing wafer is provided with at least one side ink drop generator group on the surface of the ink supply flow path substantially adjacent to at least one side, and substantially adjacent to the surface of the at least one central ink supply flow path. There are at least one central drop generator group, at least one side drop generator group and 9 1277524 ? I 'to the central ink drop generator group to generate a plurality of ink drops due to heating. According to the concept of the present invention, the printing wafer is respectively provided with two sets of side drop generator groups on the surface of the ink supply flow path substantially adjacent to at least one side, and substantially adjacent to at least one of the central ink supply flow paths. The side surfaces are also each provided with a central drop generator group. According to the concept of the present invention, the printing wafer is respectively provided with two sets of side drop generator groups on the surface adjacent to at least the side ink supply flow path, and substantially adjacent to at least one of the central ink supply flow paths. Side surfaces; each of which is provided with two central drop generator groups. According to the concept of the present invention, the printing wafer is provided with only one side ink drop generator group on the surface of the ink supply flow path substantially adjacent to at least one side: substantially adjacent to both sides of the at least one central ink supply flow path The surface is also only provided with a central drop generator group, respectively. According to the concept of the present invention, wherein the printing wafer is disposed on the surface of the ink supply flow path substantially adjacent to the respective side edges, only one side ink drop generator group is respectively disposed, and substantially adjacent to the two central ink supply flow paths. The side surfaces are also provided; respectively, a central drop generator group is provided. According to the concept of the present invention, a printing orifice plate is disposed on the printing wafer, the orifice plate has a plurality of orifices, and the plurality of orifices correspond to the side droplet generator group and the central ink on the printing wafer. a group of drop generators for dispensing a plurality of ink droplets generated by the group of droplet generators from a plurality of orifices corresponding to the orifice plate onto an inkjet medium. In order to achieve the above object, the present invention also provides an ink jet head structure, which is suitable for an ink cartridge for spraying a plurality of ink droplets onto an inkjet medium, the inkjet head comprising: a printing wafer, The utility model has a substantially rectangular shape, and a plurality of soldering pads are disposed on opposite sides of the plurality of solder pads, and at least one ink discharging side is disposed in a direction of the vertical plurality of soldering pads to form at least one side of the ink supply with one of the ink cartridges. a flow channel, and at least one central ink supply flow path between the opposite sides of the plurality of pads and parallel to at least one side of the ink supply flow path; only one side of the ink drop generator group is disposed on Printing the surface of the wafer and substantially adjacent each side of the ink supply flow path for generating a plurality of ink drops due to heating; only a central group of ink drop generators is disposed on the surface of the printed wafer and substantially Adjacent to each central ink supply flow path for generating a plurality of ink drops due to heating; and a perforated plate having a plurality of injection holes relative to the side drop generator group and the central drop generator group Group when orifice plate and column When wafer bonding, to the side with a group of drop generators and a central drop generators of the plurality of ink droplets generated by ink jet is discharged to the group corresponding to the medium from a plurality of orifices. In order to achieve the above object, the present invention also provides another ink jet head structure, which is suitable for an ink cartridge for spraying a plurality of ink droplets onto an inkjet medium, the inkjet head comprising: a printing wafer, generally The upper side is rectangular, and the opposite sides are provided with a plurality of solder pads, and at least one ink emitting side is disposed in a direction of the vertical plurality of solder pads to form at least one side ink supply flow with one body of the ink cartridge And a plurality of central ink supply channels in a direction between the opposite sides of the plurality of pads and at least one side of the ink supply flow path, wherein the plurality of central ink supply channels are in series; at least one 11 1277524 A group of side drop generators disposed on a surface of the print wafer and substantially adjacent to at least one side of the ink supply flow path for generating a plurality of ink drops by heating; a plurality of central drop generators a group disposed on a surface of the printing wafer and substantially adjacent to the plurality of central ink supply channels for generating a plurality of ink droplets by heating; and an orifice plate having a plurality of orifices relative to at least one Side drop generation a group and a plurality of central drop generator groups for generating at least one side drop generator group and a plurality of middle clip drop generator groups when the orifice plate is combined with the print wafer A plurality of ink droplets are ejected from the corresponding plurality of orifices onto the inkjet medium. [Embodiment] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in various ways and without departing from the scope of the present invention, and the description and illustration thereof are used in the nature of the description and are not intended to limit the present invention. Please refer to the third figure, which is a schematic diagram of the structure of the ink jet head according to the first preferred embodiment of the present invention. As shown, the ink jet head structure may include a print wafer 3, an ink generator group 331, 341, and The orifice plate 35, and the ink jet head structure is assembled on the body of an ink cartridge 4 (as shown in the fourth figure). As shown in the third figure, the print wafer 3 has a substantially rectangular shape, and two opposite sides of the wafer 3 are respectively provided with a plurality of pads 31 for mainly electrically controlling the system control circuit (not shown) of the inkjet printer. For the purpose of connection, the printing chip 3 12 1277524 is heated according to the trigger of the control signal transmitted by the system control circuit of the inkjet printer to eject the ink stored in the ink cartridge onto the inkjet medium (not shown). And the printing chip 3 is provided with an ink-discharging side 32 respectively on both sides of the printing direction of the plurality of pads 31, that is, parallel to the printing direction of the moving ink medium, so that the third figure is shown in the third figure. When the ink jet head is assembled with the ink cartridge, the ink discharge side 32 on both sides of the printing wafer 3 will form two side ink supply channels 33 with the body 4 of the ink cartridge (as shown in the fourth figure). In this embodiment, a central ink supply flow path 34 is additionally disposed between the plurality of pads 31 and the two side ink supply channels 33, and the central ink supply flow path 34 is inked parallel to the two sides. Flow path 33. Please refer to the third figure and please cooperate with the fifth figure. The fifth picture is a partial enlarged view of the third figure. As shown, the surface of the print wafer 3 has two sets of side drop generator groups 331 which are adjacent to the two side ink supply channels 33, respectively, and the side drop generator groups. The group 331 is composed of a plurality of ink drop generators, wherein each of the ink drop generators comprises an ink chamber 36 and a heating resistor 37 disposed in the ink chamber 36, and similarly, on the surface of the wafer 3 and A pair of central drop generator groups 341 are also disposed adjacent the sides of the central ink supply flow path 34. The central drop generator group 341 is also composed of a plurality of drop generators, and each drop generator is Including an ink chamber 36 and a heating resistor 37, so when the ink jet head is assembled on the ink cartridge body 4 (as shown in the fourth figure), the ink stored inside the ink cartridge will pass through the ink supply channels 33 on both sides. The central ink supply flow path 34 flows into each of the corresponding side drop generator group 331 and the central ink drop generator group 341, and is heated by a heating resistor 37 in the ink chamber 36 13 1277524. The ink is then ejected onto the inkjet media. Please refer to the third figure and the fourth and fifth figures. The drawings of the third and fifth figures are cut-away portions of the orifice plate 35 to expose the structure of the printed wafer. In this embodiment, The upper surface of the printing chip 3 is provided with an orifice plate 35, and the length of the orifice plate 35 is substantially equal to the length of the printing wafer 3 (as shown in the fourth drawing). The orifice plate 35 is provided with two recesses 351 which are substantially in the shape of an "H", and the positions of the recesses 351 of the orifice plate 35 correspond to the plurality of pads 31, so that the orifice plate 35 is used. When combined with the print wafer 3, the pads 31 are exposed to enable the pads 31 to be electrically coupled to the system control circuitry of the inkjet printer. The width of the orifice plate 35 is substantially larger than the width of the printing chip 3. Therefore, when the orifice plate 35 and the printing chip 3 are combined into an inkjet head and mounted to the ink cartridge body 4, the ink is not self-side. The side ink supply path 33 seeps out (as shown in the fourth figure). The orifice plate 35 is provided with a plurality of orifices 352, and the orifices 352 are disposed at positions corresponding to the upper ink droplet generator group 331 or the central ink droplet generator group on the printing wafer 3, respectively. The ink drop generator of 341, more specifically illustrated, is a plurality of spray holes 352 corresponding to the ink cells of the side drop generator group 331 or the drop generator of the central drop generator group 341, respectively. The heating resistor 37 in 36 is such that the ink stored inside the ink cartridge can be flowed from the side ink supply flow path 33 and the central ink supply flow path 34 to the side ink drop generator group 331 and the central ink drop generator group, respectively. Each of the ink chambers 36 of the drop generator of group 341 is heated by a heating resistor 37 in the ink chamber 36 and ejected onto the ink jet medium 1277524 via a corresponding orifice 352 in the orifice plate 35. Please refer to the sixth figure, which is a perspective view of the assembled third figure. As shown in the figure, the print wafer 3 and the orifice plate 35 are combined to form an ink jet head structure, and adjacent ink supply passages 33 are provided with a side ink drop generator group 331 adjacent to the center. A central drop generator group 341 is disposed adjacent the ink supply passage 34, and the plurality of spray holes 352 on the orifice plate 35 correspond to the side drop generator group 331 and the central drop generator group. The ink chamber 36 of 341 allows ink to be heated into ink bubbles via a heating resistor 37 (shown in FIG. 5) in the ink chamber 36 of the ink drop generator, and is ejected through the nozzle holes 352 corresponding to the heating resistor 37 to On inkjet media. Although in the sixth figure, the print wafer 3 is provided with a set of side drop generator groups 331 on the surface of the adjacent ink supply flow path 33, and the print wafer 3 is adjacent and parallel to the central ink supply. A central drop generator group 341 is disposed on the surface of the flow path 34 only on one side of the central ink supply flow path 34, but the embodiment of the ink drop generator group is not limited thereto. For example, in combination with the side ink supply flow path 33 and the central ink supply flow path 34 of the embodiment, two sets of side ink drop generator groups may be respectively disposed adjacent to the two side ink supply flow paths. The ink drop generator groups on both sides are adjacent to the ink supply flow paths on both sides, and are arranged in a staggered manner so that the ink in the side ink supply flow paths can flow to the two side drop generator groups. Or, only one side or two sets of side ink drop generator groups are arranged on the side of the single ink supply path 33, and the two sides of the central ink supply flow path 34 15 1777524 may be respectively provided with one Group or two groups of central drop generators. In other words, the number of side drop generator groups and the central drop generator group is not directly related to the side ink supply flow path and the central ink supply flow path, and the ink supply flow can be arbitrarily provided on the side as required. The track or central ink supply flow path is configured with one or more side drop generator groups or a central drop generator group. Of course, the ink supply structure of the printing chip 3 is not limited to the above-mentioned two-side ink supply flow path 33 and a central ink supply flow path 34, please refer to the seventh figure, which is the inkjet head of the second preferred embodiment of the present invention. Perspective view of the structure. As shown, the ink jet head structure also includes a print wafer 3, a drop generator group 33, and an orifice plate 35, and a plurality of pads 31 and ink supply channels 33, 34 for printing the wafer 3. The setting direction has been described in detail in the first preferred embodiment, and therefore will not be described again here. In the preferred embodiment, the single side of the print wafer 3 has a side ink supply flow path 33 and the surface of the print wafer 3 has two central ink supply channels 34. The flow passages 34 are arranged side by side, that is, the two sides are parallel in parallel. Further, the print wafer 3 is provided with a side ink drop generator group 331 adjacent to the surface of the side ink supply flow path 33, and the print wafer 3 is adjacent to and parallel to the surfaces of the two central ink supply flow paths 34. A set of central drop generator groups 341 are disposed on one side of the two central ink supply channels 34, respectively. Of course, the side drop generator group 331 and the central drop generator group 341 are each composed of a plurality of drop generators, and each drop generator is composed of an ink chamber and a liquid chamber. The heating resistor is formed (please refer to the fifth figure), and the plurality of nozzles 352 on the orifice plate 35 are 1277524 in the ink chamber of each ink drop generator in each ink drop generator group. The resistor is heated so that the ink is heated by the heating resistor and ejected from the orifice 352 to the ink jet medium. Similarly, in the seventh drawing, only the print wafer 3 is disposed on the surface of the adjacent side ink supply flow path 33 with one side ink drop generator group 331 and one side of the two central ink supply flow paths 34. Each of the central ink droplet generator groups 341 is provided, but the flow channel design of the present embodiment is not limited to the above-described configuration of φ. For example, the single side ink supply flow path 33 of the embodiment is matched. The two central ink supply channels 34 may also be provided with two sets of side drop generator groups on the side of the print wafer 3 adjacent to the side ink supply channels 33, and two of the two central ink supply channels 34. One or two sets of central drop generator groups are respectively disposed on the sides. Of course, one side of the ink supply flow path may be further added on the opposite side of the original side ink supply flow path 33 to add two central ink supply flow paths to the two side ink supply flow paths, and the increased side The side ink supply flow path can be arranged in the same manner as the side ink drop generator group of the original side ink supply flow path 33. Referring to FIG. 8 , which is a perspective view of a structure of an ink jet head according to a third preferred embodiment of the present invention, as shown, the ink jet head structure also includes a print wafer 3 , a drop generator group 331, 341, and The orifice plate 35, the plurality of pads 31 for printing the wafer 3, and the direction in which the ink supply channels are disposed have been described in detail in the first preferred embodiment, and thus will not be described herein. In the preferred embodiment, the side of the print wafer 3 has two side ink supply channels 33, and three central ink supply channels 34 are disposed between the two side ink supply channels 33. And the three central ink supply channels 34 are arranged side by side, and the printing of the 17 1277524 wafer 3 has a side ink drop generator group 331 on the surface of the adjacent ink supply flow path 33, respectively, and the central ink supply is provided. One side of the flow path 34 has a central ink drop generator group 341, which is disposed in the same manner as the second preferred embodiment shown in the seventh embodiment, and therefore will not be described herein. As can be seen from the embodiments disclosed in FIG. 7 and FIG. 8 , the printing chip 3 can be configured to match one of the ink supply channels to the plurality of central ink supply channels or the ink supply channels on both sides. For example, the number of the plurality of central ink supply channels may be four or five, but not limited thereto, so that the number of the orifices 352 of the orifice plate 35 can be matched. The number of side ink supply channels and central ink supply channels is relatively increased to provide better print quality and improved resolution of the print. The central ink supply flow path and the side ink supply flow path disclosed in the third to eighth embodiments are arranged in parallel in a side-by-side manner. However, in the preferred embodiment of the present invention, the central ink supply flow path And the side ink supply flow paths are not only arranged in parallel parallel arrangement, but also can be implemented in a series arrangement. Please refer to the ninth drawing, which is a perspective view of the ink jet head structure of the fourth preferred embodiment of the present invention. In this embodiment, the ink jet head structure comprises three ink jet groups gl, g2 and g3 arranged in a series, that is, the ink jet groups gl, g2 and g3 are arranged in the parallel printing direction. On the same straight line, of course, the orifice 352 of the orifice plate 35 is arranged in a tandem manner in accordance with the arrangement of the inkjet groups gl, g2 and g3. Each of the inkjet groups gl, g2 or g3 is composed of a side ink supply flow path 33 and a central ink supply flow path 34, respectively, a side ink drop generator group 331 and a central ink drop generator group. 341 is constructed, of course, the side ink supply flow path 33, the central ink supply flow path 34, the side ink drop generator group 331, and the central ink in each of the ink ejection groups gl, g2 and g3 18 1277524 The number and manner of the configuration of the drop generator group 341 are not limited thereto, and the embodiments of the third to eighth embodiments may be used, and the inkjet head manufacturer may make various changes according to actual needs to increase the number of the nozzle holes. The number of arrays, of course, the number of serial inkjet groups can also be adjusted differently according to requirements. It can be seen from the above description that the main technical feature of the print wafer fluid supply structure of the present invention is to combine the side ink supply flow path and the central ink supply flow path to achieve better print quality, improve print resolution and reduce production. The cost advantage is that the arrangement of the side ink supply flow path and the central ink supply flow path is not particularly limited, and at least one ink supply side and the ink cartridge body define at least one side ink supply flow path. And the printing wafer fluid supply structure of at least one central ink supply flow path is the protection scope of the present invention. In addition, the arrangement of the side ink supply flow path and the central ink supply flow path of the present invention is not limited, and at least one side ink supply flow path can be matched with a central ink supply flow path and one side ink supply flow path. Cooperate with multiple parallel central flow channels (as shown in Figure 7), two side ink supply channels with multiple parallel central ink supply channels (as shown in Figure 8) and side or central ink supply channels Set in tandem (as shown in Figure 9). In this case, although a side ink supply flow path is matched with one side ink drop generator group as an example, but not limited thereto, in other words, one side ink supply flow path can also be matched with two or more groups of staggered settings. a group of ink drop generators, as well as a central ink supply flow path, one or more central ink drop generator groups may be disposed on one side of the parallel and adjacent one central ink supply flow path, or respectively, 19 1277524 Placed on both sides of the central drop generator group, the ink supply flow path and the ink drop generator group can be adjusted according to actual needs, thereby improving the resolution and print quality. Of course, the printing chip 3 shown in the above embodiments can be combined with the central ink supply channel 34 and the central ink supply channel 34 to meet the requirements of high resolution, better printing quality, and There is a low production cost requirement, and in practical applications, each group of ink φ drop generator groups of the print wafer 3 can use different colors of ink to complete the work of multi-color inkjet printing. In summary, the present invention provides a print wafer fluid structure combining a side ink supply flow path and a central ink supply flow path, which is mainly composed of a side ink supply flow path and supplemented by a central ink supply flow path. The side ink supply channel can save the overall area of the printed wafer and reduce the manufacturing cost, and the central ink supply flow path is used to increase the number of nozzle holes on the orifice plate to provide a higher resolution and comparison. Good print quality wafers, in other words, the printing of this case • The wafer fluid structure combines the advantages of the side ink supply flow path and the central ink supply flow path to provide a more complete and competitive print wafer. Make the use of ink sputum more complete. Therefore, this case is of great industrial value and is submitted in accordance with the law. The present invention has been described in detail by the above-described embodiments, and may be modified by those skilled in the art, without departing from the scope of the appended claims. 20 1277524 [Simple description of the drawings] The first figure is a schematic view of a conventional ink jet head structure using a central ink supply flow path. Second: It is a schematic view of a conventional ink jet head structure using a side ink supply flow path. Third Fig.: This is an illustration of the structure of the ink jet head of the first preferred embodiment of the present invention. Figure 4 is a schematic view showing the combination of the printing wafer, the orifice plate and the ink cartridge of the first preferred embodiment of the present invention. Fifth picture: It is a partial enlarged view of the third figure. Figure 6: This is a perspective view of the assembled third figure. Figure 7 is a perspective view showing the structure of the ink jet head of the second preferred embodiment of the present invention. Figure 8 is a perspective view showing the structure of the ink jet head of the third preferred embodiment of the present invention. Fig. 9 is a perspective view showing the structure of the ink jet head of the fourth preferred embodiment of the present invention. 21 1277524 [Description of main components] 1 Printed wafer 11 Pad 12 Central ink supply path 13 Ink chamber 14 Injector plate 141 Injector 2 Print wafer 21 Pad 22 Side ink supply path 23 Ink chamber 24 Spray Orifice plate 241 Injector 3 Print wafer 31 Pad 32 Ink side 33 Side ink supply 331 Side drop generator group 34 Central ink supply channel 341 Center drop generator group 35 Plate 351 notch 352 injection hole 36 ink chamber 37 heating resistor 4 ink cartridge body
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