1277357 16的内徑將會減少，因而減少背腔室裡的容積。此外， 在一些情況中，該固定的電極板14可被組裝成嵌入於該 絕緣基座15中。在這種情況下，固定電極板14的尺寸 會減少，結果相對於該固定電極板14的膜片12b的尺寸 5 也會減少，因而使得例如靈敏度與頻率響應之聲音性質變 差。 【發明内容】 發明摘要 因此，本發明係與一實質上排除由於相關技藝的侷 10 限和缺點所導致的一或更多問題之駐極體電容傳聲器有關 〇 本發明之一目的是要提供一種藉著將一絕緣基座與 導電性基座整合，而藉以擴大背腔室裡的容積而形成之 整合基座。 本發明的另一個目的是要提供一駐極體電容傳聲 裔，其使用一獨立的絕緣環以將一固定電極板絕緣而增加 固定電極板之尺寸，藉此改良其之性能。 為了達成這些目的和其他的優點並依據在此所體表 2現且寬義地描述之本發明的㈣，本發明提供一種駐極體 〇 =容傳聲器之整合基座，其包含具有一頂部和一底部之中 、圓筒形絕緣體；以及分別形成於該中空圓筒形絕緣體 2之了頁部和底部之第-和第二金屬㈣，謂一和第二 屬板層之外徑係分別地小於該絕緣體，該等第-和第二 屬板層藉著形成於該絕緣體内部圓周上導體圖案而彼此 1277357 、、、描it都疋乾例’其係要提供所請求之發明的進一步解釋 說明。 圖式簡要說明 该等例示說明發明的具體例之隨附的圖式，以及用 5來解釋本發明的原理之說明，係被包含以提供對發明的進 一步的理解，且係被結合與構成本申請發明之部分。 第1圖是傳統的駐極體電容傳聲器的剖視圖； 第2圖是依據本發明之一第一具體例的駐極體電 谷傳聲器之主要元件的分解透視圖； 1〇 第3圖依據本發明之一第一具體例的駐極體電容 傳聲器之分解透視圖； 第4圖是在第3圖中所描述的駐極體電容傳聲器 的經組裝後之剖視圖； 第5圖是依據本發明之一第二具體例的駐極體電 15容傳聲器之主要元件的分解透視圖；且 第6圖是依據本發明之一第二具體例的駐極體電 容傳聲器之經組裝後的剖視圖； 【實施方式】 較佳具體例的說明 2〇 現在詳細地參照本發明之該等較佳具體例，該等具 體例係被例示於隨附的圖式中。無論在何處，相同的元件 標唬係在所有的該等圖式各處中被用來指示相同的或類似 的元件。 該創新的駐極體電容傳聲器包含有一由電路板製造 1277357 技術所形成的整合基座。該整合基座包含有具有底部和頂 部之中空圓筒形絕緣本體，其上分別地形成有金屬板層。 該等金屬板層的該等外徑係比該絕緣本體更小。該等金屬 板層係被彼此導通。依照該等導通方法，本發明提供了第 5 和第一具體例。那就是，在第一具體例中，金屬板層係 藉由設置在該絕緣本體内部圓周上之導電圖案所導通。在 第二具體例中，金屬板層係藉由在該絕緣本體中所形成的 透孔或通孔所彼此導通。 第一具艘例 10 第2圖顯示依據本發明之一第一具體例的駐極體 電容傳聲器之主要元件。 參照第2圖，其顯示一用於將一固定電極板26〇 與一外殼（210在第3圖中）絕緣之分離的絕緣環25〇, 以及被用來作為一絕緣基座和一導電性基座的整合基座 15 270 〇 該整合基座270係由一電路板製造技術而非藉由 模製所形成。該整合基座27〇包含有具有頂部和底部之中 空圓筒形絕緣本體272,該等頂部和底部係設置了金屬板 曰74 ‘電圖案278係被設置在該絕緣本體272的 内部圓周上，以使得該等金屬板層274之間形成電氣通 導、、、。果，違整合基座270係被用來作為絕緣基座與導電 基座。那是指’該絕緣本體具有272 —絕緣功能，而形成 於在該絕緣本Μ 272的頂部和底部上之該金屬板層27 4,係分別地接觸該固定電極板260和-電路板（在第3 20 1277357 圖中之280) ’且係被具有導電功能之導電圖案278所電 氣地互相連接。 此時，金屬板層274的外徑係比該絕緣本體272 小，因而該金屬板層274不會與外殼210電氣地接觸。 5 在此，該絕緣本體272係為一選自於由以下材料所構成之 群組所形成之絕緣電路板：以玻璃環氧樹脂為基礎之材 料、以樹脂為基礎之材料，以及以PVC為基礎之材料所 組成。 在上方描述的傳聲器中，因為該整合基座270的内 10徑係比習知技藝來得大，所以背腔室裡的容積可以增加， 藉此改良例如靈敏度和頻率回應之聲音特性。 該固定電極板260具有一藉由一分離絕緣環250 而與整合基座270絕緣之駐極體。那是指，因為該絕緣環 250係被個別地形成，固定電極板26〇的面積可以被擴 15大以增加駐極體的強度，且相對於該固定的電極板26〇而 形成之膜片230 (第3圖）的尺寸可被增加藉此改良傳聲 筒的性能。那是指在傳統的技藝中，該固定的電極板係組 裝至相對較厚的絕緣基座中。然而，本發明因為該分離製 備的絕緣環250係比將固定電極板260絕緣之整合基座 20 27〇還要薄，因而可以擴大固定電極板260的尺寸以增 加駐極體的強度。 第3和4圖顯示一依照本發明的具體例之駐極體 電容傳聲器。 首先參照第3圖，該創新的傳聲筒2〇〇係藉由連 10 1277357 續地將極性環220、膜片230、間隔器240、絕緣環250、 固定電極板260、整合基座270與電路板280插入圓筒 形的外设210内’且藉將該圓筒形外殼21〇的一開放端 捲起而形成。 5 如第4圖所示，該圓筒形外殼210具有一密封端 (底端）與該開放端。該極性環220係被設置在該外殼21 0的底端，而該膜片230係被設置在極性環22〇上。該 固疋電極板260係被設置在該膜片230上，而間隔器24 0係被插入在其等之間。該外殼210的底端具有數個聲孔 10 202。該膜片230係經過由導電性材質所形成的極性環2 20而電氣地連接到該外殼21〇。該膜片23〇和該極性環 220可被一體地形成一單一本體。 該固定電極板260係由一塗敷以一其上形成一駐 極體之有機（聚合物）薄膜的金屬板所形成。該固定電極板 15 260係藉著該絕緣環25〇而非該整合基座27〇以與該 外殼210絕緣。此時，因為該絕緣環25〇的内徑係比整 合基座270的内徑更大，該固定的電極板26〇可被設計 成使得該固定電極板260的外徑係比該整合基座27〇的 内徑更大。 20 此外，該固定電極板260係被該整合基座270所 支持，且係藉由金屬板層274而電氣地連接至該印刷電路 板280而該導電圖案278係被形成於該固定電極板270 上。一例如JFET之電路元件282係被埋於該印刷電路 板内，而該外殼210的開放端捲起以向内壓迫電路板。該 11 1277357 者腔室204係藉著該固定電極板、該整合基座27〇與該 電路板280所界定之空間260而形成。因此，因為在本 發中不具導電基座，該背腔室的容積比起傳統之傳聲器將 會增加。 5 該膜片230係經由該極性環220與外殼210而 電氣地連接到電路板，且該固定電極板26〇係經由金屬板 層274而電氣地連接到電路板280與該整合基座27〇 的導電圖案278。 在上述的傳聲器200中，當帶有一聲波的空氣經過 10聲孔202而導入傳聲器200内時，膜片230會聲壓振 動。該帶有聲波的空氣會被進一步經過形成於固定電極板 260上之孔洞260a，而導入該界定於該電路板280和該 固定電極260之間的該背腔室204之内。此時，當膜片 230被經過聲孔2〇2而導入的聲壓所振動的時候，在膜片 15 230和固定電極板260之間的間隙會改變，藉此改變由 膜片230和固定電極板260所產生的靜電電容。結果， 一電壓訊號會依據該聲波而變化。該電電壓訊號被傳送到 一例如埋在電路板280中之JFET的積體電路並放大。該 經放擴大的電壓訊號會經由一連接端子（未顯示）而向外 20 傳輸。 JL二具體也 第5和6圖顯示依照本發明的一第二具體例之駐 極體電容傳聲器。 首先參照到第5圖，其顯示一從外殼210分離之用 12 1277357 於與固定電極板260絕緣的絕緣環25〇,以及一用來作為 一絕緣基座和一導電基座的整合基座27〇。 该整合基座270係由一電路板製造技術而非藉由 模製所形成。該整合基座27〇包含有具有頂部和底部之中 二圓筒形絕緣本體272，該等頂部和底部係設置了金屬製 板層274。一通孔276係被形成通過該絕緣本體272以 在該等金屬板層274之間形成電氣通導。結果，該整合基 座270係被用來作為絕緣基座與導電基座。那是指，該絕 緣本體具有272 —絕緣功能，而形成於在該絕緣本體272 1〇的頂部和底部上之該金屬板層274,係分別地接觸該固定 電極板260和一電路板，且係被具有導電功能之通孔276 所電氣地互相連接。 此時’金屬板層274的外徑係比該絕緣本體272 小，因而该金屬板層274不會與外殼210電氣地接觸。 15在此，該絕緣本體272係為一選自於由以下材料所構成之 群組所形成之絕緣電路板：以玻璃環氧樹脂為基礎之材 料、以樹脂為基礎之材料，以及以PVC為基礎之材料所 組成。 在上方描述的傳聲器中，因為該整合基座270的内 20徑係比習知技藝來得大，所以背腔室裡的容積可以增加， 藉此改良例如靈敏度和頻率回應之聲音特性。 如第6圖所示，該圓筒形外殼21〇具有一密封端 (底端）與一開放端。該極性環220係被設置在該外殼21 0的底端，而該膜片230係被設置在極性環220上。該 13 1277357 固定電極板260係被設置在該膜片mo上，而間隔器24 〇係被插入在其等之間。該外殼21 〇的底端具有數個聲孔 202。該膜片230係經過由導電性材質所形成的極性環2 20而電氣地連接到該外殼21〇。該膜片23〇和該極性環 5 220可被一體地形成一單一本體。 如上所述，該第二具體例除了該等金屬板層274係 經由通孔（透孔）276所導通之外係與第—具體例相同。因 此，在此將省略這個具體例的操作之詳細描述。 依據本發明，傳統的絕緣與導電基座係整合為一單 1〇基座。因此，因為該整合基座的内徑係比習知技藝來得 大，所以該背腔室裡的容積便會增加，藉此可改良例如聲 波靈敏度與頻相應等之聲學特性，㈣時簡化製造過程。 對於習於此藝者而言顯然可知的是，本發明可以進 料種不同的修改和變化。因此，本發明係要將本發明的 15 這些修改和變化涵蓋於隨附的申社蜜# 、丨通丨竹旳甲咕專利範圍以及其等之等 效物裡面。 20 【圖式簡單說明】 第1岐傳統的駐極體電容傳聲器的剖視圖； 第2圖是依據本發明之 谷傳聲器之主要元件的分解透視圖 第3圖依據本發明之一第 傳聲器之分解透視圖； 第一具體例的駐極體電 具體例的駐極體電容 圖中所描述的駐極體電容傳聲器 第4圖是在第3 的經組裝後之剖視圖； 14 1277357 第5圖是依據本發明之一第二具體例的駐極體電 容傳聲器之主要元件的分解透視圖；且 第6圖是依據本發明之一第二具體例的駐極體電容 傳聲器之經組裝後的剖視圖； 5【主要元件符號說明】 200 傳聲筒 260a 孔洞 202 聲孔 270 整合基座 204 背腔室 272 絕緣本體 210 外殼 274 金屬板層 220 極性環 276 通孔 230 膜片 278 導電圖案 240 間隔器 280 電路板 250 絕緣環 282 電路元件 260,280 固定電極板 15The inner diameter of the 1277357 16 will be reduced, thus reducing the volume in the back chamber. Further, in some cases, the fixed electrode plate 14 may be assembled to be embedded in the insulating base 15. In this case, the size of the fixed electrode plate 14 is reduced, and as a result, the size 5 of the diaphragm 12b with respect to the fixed electrode plate 14 is also reduced, thereby making the sound properties such as sensitivity and frequency response deteriorate. SUMMARY OF THE INVENTION Accordingly, the present invention is directed to an electret condenser microphone that substantially obviates one or more problems due to the limitations and disadvantages of the related art. It is an object of the present invention to provide a An integrated pedestal formed by integrating an insulating pedestal with a conductive pedestal to expand the volume in the back chamber. Another object of the present invention is to provide an electret condenser sound source that uses a separate insulating ring to insulate a fixed electrode plate to increase the size of the fixed electrode plate, thereby improving its performance. In order to achieve these and other advantages and in accordance with (4) of the present invention, which is now and broadly described herein, the present invention provides an integrated pedestal of an electret 容=capacitor comprising a top and a bottom middle, a cylindrical insulator; and first and second metal (four) respectively formed on the page portion and the bottom portion of the hollow cylindrical insulator 2, wherein the outer diameters of the first and second partial layer are respectively Less than the insulator, the first and second sub-layers are further illustrated by the conductor pattern formed on the inner circumference of the insulator 1277357, and the description of the invention is provided. . BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in the claims Apply for part of the invention. 1 is a cross-sectional view of a conventional electret condenser microphone; FIG. 2 is an exploded perspective view of main components of an electret electric valley microphone according to a first specific example of the present invention; An exploded perspective view of an electret condenser microphone of a first specific example; FIG. 4 is an assembled cross-sectional view of the electret condenser microphone described in FIG. 3; FIG. 5 is a view of one of the present invention An exploded perspective view of the main components of the electret electric 15 microphone of the second embodiment; and FIG. 6 is a cross-sectional view of the electret condenser microphone according to a second embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) Reference is now made in detail to the preferred embodiments of the present invention, which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used throughout the drawings to refer to the same or similar elements. The innovative electret condenser microphone includes an integrated pedestal formed by the board's 1277357 technology. The integrated base includes a hollow cylindrical insulating body having a bottom portion and a top portion, and a metal plate layer is formed thereon, respectively. The outer diameters of the metal sheet layers are smaller than the insulating body. The metal plate layers are electrically connected to each other. According to these conduction methods, the present invention provides the fifth and first specific examples. That is, in the first specific example, the metal plate layer is electrically connected by a conductive pattern provided on the inner circumference of the insulating body. In the second specific example, the metal plate layers are electrically connected to each other by through holes or through holes formed in the insulating body. First Ship Example 10 Figure 2 shows the main components of an electret condenser microphone according to a first specific example of the present invention. Referring to Fig. 2, there is shown an insulating ring 25A for isolating a fixed electrode plate 26 from an outer casing (210 in Fig. 3), and is used as an insulating base and a conductive The integrated base 15 270 of the base is formed by a circuit board manufacturing technique rather than by molding. The integrated base 27 includes a hollow cylindrical insulating body 272 having a top portion and a bottom portion, and the top and bottom portions are provided with a metal plate 74. The electrical pattern 278 is disposed on the inner circumference of the insulating body 272. In order to form electrical conduction between the metal plate layers 274, . As a result, the integrated pedestal 270 is used as an insulating base and a conductive pedestal. That means that the insulating body has a 272-insulation function, and the metal plate layer 27 4 formed on the top and bottom of the insulating base 272 respectively contacts the fixed electrode plate 260 and the circuit board (at No. 3 20 1277357 280) 'and is electrically connected to each other by a conductive pattern 278 having a conductive function. At this time, the outer diameter of the metal plate layer 274 is smaller than the insulating body 272, and thus the metal plate layer 274 does not electrically contact the outer casing 210. 5 Here, the insulative housing 272 is an insulated circuit board selected from the group consisting of a glass epoxy resin-based material, a resin-based material, and a PVC The basic materials are composed. In the microphone described above, since the inner diameter of the integrated base 270 is larger than that of the prior art, the volume in the back chamber can be increased, thereby improving the sound characteristics such as sensitivity and frequency response. The fixed electrode plate 260 has an electret insulated from the integrated base 270 by a separate insulating ring 250. That is, since the insulating ring 250 is formed separately, the area of the fixed electrode plate 26〇 can be expanded by 15 to increase the strength of the electret, and the diaphragm formed with respect to the fixed electrode plate 26〇 The size of 230 (Fig. 3) can be increased to improve the performance of the megaphone. That means that in conventional techniques, the fixed electrode plates are assembled into a relatively thick insulating base. However, in the present invention, since the insulating ring 250 of the separation preparation is thinner than the integrated base 20 27 which insulates the fixed electrode plate 260, the size of the fixed electrode plate 260 can be enlarged to increase the strength of the electret. Figures 3 and 4 show an electret condenser microphone in accordance with a specific embodiment of the present invention. Referring first to Figure 3, the innovative microphone 2 is continuously connected to the circuit board by a 10 1277357 polarity ring 220, a diaphragm 230, a spacer 240, an insulating ring 250, a fixed electrode plate 260, an integrated base 270, and a circuit board. 280 is inserted into the cylindrical outer casing 210' and formed by rolling up an open end of the cylindrical outer casing 21''. As shown in Fig. 4, the cylindrical outer casing 210 has a sealed end (bottom end) and the open end. The polar ring 220 is disposed at the bottom end of the outer casing 210, and the diaphragm 230 is disposed on the polar ring 22''. The solid electrode plate 260 is disposed on the diaphragm 230, and the spacer 204 is inserted between them. The bottom end of the outer casing 210 has a plurality of sound holes 10 202. The diaphragm 230 is electrically connected to the outer casing 21 through a polar ring 20 formed of a conductive material. The diaphragm 23A and the polar ring 220 can be integrally formed as a single body. The fixed electrode plate 260 is formed of a metal plate coated with an organic (polymer) film on which a gate body is formed. The fixed electrode plate 15 260 is insulated from the outer casing 210 by the insulating ring 25 〇 instead of the integrated base 27 。. At this time, since the inner diameter of the insulating ring 25 is larger than the inner diameter of the integrated base 270, the fixed electrode plate 26 can be designed such that the outer diameter of the fixed electrode plate 260 is larger than the integrated base. The 27 〇 has a larger inner diameter. In addition, the fixed electrode plate 260 is supported by the integrated base 270, and is electrically connected to the printed circuit board 280 by a metal plate layer 274, and the conductive pattern 278 is formed on the fixed electrode plate 270. on. A circuit component 282, such as a JFET, is buried within the printed circuit board, and the open end of the housing 210 is rolled up to urge the board inward. The 11 1277357 chamber 204 is formed by the fixed electrode plate, the integrated base 27, and the space 260 defined by the circuit board 280. Therefore, since there is no conductive base in the present invention, the volume of the back chamber will increase compared to conventional microphones. 5 The diaphragm 230 is electrically connected to the circuit board via the polar ring 220 and the outer casing 210, and the fixed electrode plate 26 is electrically connected to the circuit board 280 and the integrated base 27 via the metal plate layer 274. Conductive pattern 278. In the above microphone 200, when air having an acoustic wave is introduced into the microphone 200 through the 10 sound holes 202, the diaphragm 230 vibrates in sound pressure. The sonic air is further introduced into the aperture 260a formed in the fixed electrode plate 260 and introduced into the back chamber 204 defined between the circuit board 280 and the fixed electrode 260. At this time, when the diaphragm 230 is vibrated by the sound pressure introduced through the sound hole 2〇2, the gap between the diaphragm 15 230 and the fixed electrode plate 260 is changed, thereby changing the diaphragm 230 and fixing. The electrostatic capacitance generated by the electrode plate 260. As a result, a voltage signal will vary depending on the sound wave. The electrical voltage signal is transmitted to an integrated circuit of a JFET, such as buried in circuit board 280, and amplified. The amplified voltage signal is transmitted outward 20 via a connection terminal (not shown). JL II and Figs. 5 and 6 show a capacitor condenser microphone according to a second embodiment of the present invention. Referring first to Fig. 5, there is shown an insulating ring 25A separated from the outer casing 210 by 12 1277357 insulated from the fixed electrode plate 260, and an integrated base 27 for use as an insulating base and a conductive base. Hey. The integrated base 270 is formed by a board manufacturing technique rather than by molding. The integrated base 27 includes two cylindrical insulative bodies 272 having a top and a bottom, the top and bottom being provided with a metal ply 274. A through hole 276 is formed through the insulative housing 272 to form an electrical communication between the metal plate layers 274. As a result, the integrated base 270 is used as an insulating base and a conductive base. That is, the insulating body has a 272-insulation function, and the metal plate layer 274 formed on the top and bottom of the insulating body 272 1 分别 respectively contacts the fixed electrode plate 260 and a circuit board, and They are electrically connected to each other by a through hole 276 having a conductive function. At this time, the outer diameter of the metal plate layer 274 is smaller than that of the insulating body 272, so that the metal plate layer 274 does not electrically contact the outer casing 210. The insulating body 272 is an insulating circuit board formed from a group consisting of a glass epoxy resin-based material, a resin-based material, and a PVC. The basic materials are composed. In the microphone described above, since the inner diameter of the integrated base 270 is larger than that of the prior art, the volume in the back chamber can be increased, thereby improving the sound characteristics such as sensitivity and frequency response. As shown in Fig. 6, the cylindrical outer casing 21 has a sealed end (bottom end) and an open end. The polar ring 220 is disposed at the bottom end of the outer casing 210, and the diaphragm 230 is disposed on the polar ring 220. The 13 1277357 fixed electrode plate 260 is disposed on the diaphragm mo, and the spacer 24 is inserted between it and the like. The bottom end of the casing 21 has a plurality of sound holes 202. The diaphragm 230 is electrically connected to the outer casing 21 through a polar ring 20 formed of a conductive material. The diaphragm 23A and the polar ring 5220 can be integrally formed as a single body. As described above, the second embodiment is the same as the first embodiment except that the metal plate layer 274 is electrically connected via the through hole (through hole) 276. Therefore, a detailed description of the operation of this specific example will be omitted herein. In accordance with the present invention, conventional insulated and conductive pedestals are integrated into a single truss. Therefore, since the inner diameter of the integrated base is larger than the prior art, the volume in the back chamber is increased, whereby acoustic characteristics such as acoustic wave sensitivity and frequency can be improved, and the manufacturing process is simplified (4). . It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention. Therefore, the present invention is intended to cover the modifications and variations of the present invention, which are included in the scope of the patents of Shen Shemi #, 丨通丨, and their equivalents. 20 [Simplified description of the drawings] Section 1 is a cross-sectional view of a conventional electret condenser microphone; FIG. 2 is an exploded perspective view of the main components of the valley microphone according to the present invention. FIG. 3 is an exploded perspective view of the microphone according to the present invention. Figure 4 is a cross-sectional view of the electret condenser microphone described in the electret capacitance diagram of the electret electric specific example of the first specific example. Fig. 4 is a cross-sectional view after the third assembly; 14 1277357 Fig. 5 is based on An exploded perspective view of main components of an electret condenser microphone according to a second specific example of the present invention; and FIG. 6 is an assembled cross-sectional view of an electret condenser microphone according to a second specific example of the present invention; Main component symbol description] 200 megaphone 260a hole 202 sound hole 270 integrated pedestal 204 back chamber 272 insulating body 210 outer casing 274 metal plate layer 220 polarity ring 276 through hole 230 diaphragm 278 conductive pattern 240 spacer 280 circuit board 250 insulation ring 282 circuit components 260, 280 fixed electrode plate 15