^ 1276377 玖、發明說明： 【發明所屬之技術領域】 本發明係關於-種埋入式軟性電路板製程，尤指一禮 晶#埋人式模組化電路板，尤指—種直接將線路形成在載 體上的電路板結構設計。 【先前技術】 ； 、時下使用半導體元件之既有電子產品，其主要係將預 製成顆#狀之晶片丨以構裝成外部具有接點或引腳之半導 #體元件、，再將其烊設於預設有圖案化線路之電路板預定位 置處，並使該半導體元件之接點或引腳連接電路板上之線 路，而構成一具有預定功能之電子產品。 惟，隨著電子產品朝向輕薄短小之尺寸縮小化發展， 以晶片構裝成半導體元件後，再以表面黏著技術焊接電路 板上之設計。而且’此類之電路板於製作時，往往受制於 原物料之高昂價格，以致於整體成品之成本無法降低，當 然的，消費者亦需為此一不必要的高成本支出不必要的金 籲錢。由於原料長期均掌控於國外的公司或是廠，以致於在 電路板之企業為能成功的製造出成功的成品，其均需 向3a司或廠購買原物料，而這也是成品價格一直高居 ' 不下的主要原因。 &月匕有放的降低製造的成本，並推出具同樣功效的電 路板，本幸^^ η日λ θ 、又月人即努力研發，終致研發出一項具革命性 的電路板製程。 U容 内 明發 4 1276377 步驟後，則將銅箱層（i Ο )予以去除，最後，則再將在 電鍍銅（10，）上的防腐蝕層（13) ( etching stop )予以去除，如此則完成了在表層（丄4 )上含有電路（ 1 2 )的成品。 值得注意的是，本發明中所使用的表層（i 4)是一 種軟質的非金屬層’故而可以當作習知傳統製程中的基底 之用；亦即，在傳統的製程中所使用的載體（carrier)在 本發明的結構内即已由表層（丄4)所取代了。 在去除銅箱（1〇)層的步驟時，該mg ( 1 〇)層 亦可以僅去除部份的銅羯（1 〇)，π留下對應於電鍍銅 (1 〇 )的銅Ή 1 ◦)(如第九Β圖所示），如此， 所留下_(10)料作為和其它電元件相連接的電 極接觸點。請參看第十圖所*，利用第九Α圖以及九Β圖 中所不之結構，在將矣品浴 、表面主佈綠漆或再重覆做第七圖動作 後即可70成單面軟性板結構。 本發明可達到減少製程成本，以及步驟的雙重目的， :=成所要求的特定需求。同時，藉由埋入式之電路 =所Γ該項產品達到薄型化、輕量化之需求。 路板 本毛明確可解決習用半導體元件構裝於電 可有效降低製造成且本發明更 明，因此，本發明符合發:專=業利用價值之創新發 請。 月專利要件，爰依法具文提出申 明】 【圖式簡單說 7 1276377 (一）圖式部分 第一圖：係本發明製 # 一 . 中’鋼箔之側視平面圖； 弟一圖·係發明鋼_ —一 ^ / 自加入—光阻層的示意圖； 第二圖，係本發明將Α ^ °卩松光阻層予以去除，以露出飨 路的示意圖； 路線 第四圖：係本發明於綠々 ^ ^ 、、、 上電錢一層抗腐#層，並在 九腐㈣上加入一層銅的結構示意圖； -在^ 1276377 玖, invention description: [Technical field of invention] The present invention relates to a kind of embedded flexible circuit board manufacturing process, especially a ritual crystal embedded circuit board, especially a direct line A circuit board structure design formed on the carrier. [Prior Art]; an electronic product that uses a semiconductor component nowadays, mainly by prefabricating a wafer-shaped wafer to form a semiconductor component having a contact or a pin externally, and then The device is disposed at a predetermined position of the circuit board on which the patterned circuit is preliminarily provided, and the contacts or pins of the semiconductor element are connected to the circuit on the circuit board to constitute an electronic product having a predetermined function. However, as electronic products have been reduced in size toward light, thin, and small, the wafers are fabricated into semiconductor components, and then the surface-bonding technology is used to solder the design on the circuit board. Moreover, 'the circuit boards of this kind are often subject to the high price of the original materials, so that the cost of the whole finished product cannot be reduced. Of course, consumers also need to spend unnecessary gold for this unnecessary high cost. money. Since the raw materials are controlled by foreign companies or factories for a long time, so that the successful production of the finished products in the circuit board enterprises, they need to purchase the original materials from the 3a division or the factory, and this is the price of the finished products. 'The main reason for not being. & Month has reduced the cost of manufacturing, and introduced a board with the same effect, this fortunately ^^ η λ θ, and Yueren is working hard to develop, and finally developed a revolutionary circuit board process . After the process of U Rongfa 4 1276377, the copper box layer (i Ο ) is removed, and finally, the anti-corrosion layer (13) on the electroplated copper (10,) is removed. The finished product containing the circuit (12) on the surface layer (丄4) is completed. It should be noted that the surface layer (i 4) used in the present invention is a soft non-metal layer 'and thus can be used as a substrate in a conventional process; that is, a carrier used in a conventional process. The carrier has been replaced by the surface layer (丄4) within the structure of the present invention. In the step of removing the copper box (1 〇) layer, the mg (1 〇) layer may also remove only part of the copper plaque (1 〇), and π leaves the copper Ή 1 对应 corresponding to the electroplated copper (1 〇). (as shown in Figure IX), as such, the remaining _(10) material acts as an electrode contact point to be connected to other electrical components. Please refer to the tenth figure*, using the structure of the ninth and nine-inch diagrams, you can make 70% single-sided after the bath, the main green paint or the repeating of the seventh figure. Flexible board structure. The present invention achieves the dual purpose of reducing process costs, as well as steps: = becoming the specific requirements required. At the same time, the embedded circuit = the demand for thinner and lighter products. The present invention clearly clarifies that the conventional semiconductor component is electrically mounted, and the invention can be effectively reduced and the present invention is more clear. Therefore, the present invention conforms to the innovation of the use value of the industry. The patent requirements of the month, 爰 具 具 提出 】 【 【 【 【 【 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Schematic diagram of a steel _ - a ^ / self-added - photoresist layer; the second figure is a schematic diagram of the present invention to remove the Α ^ ° 卩 光 光 , , , 飨 飨 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Green 々 ^ ^ , , , Power on the first layer of anti-corrosion # layer, and a layer of copper on the nine rot (four) structure diagram;
第五圖：係將光阻層予以去除後經高溫軟化線路銅的 示意圖； J 第六圖：係-有機覆蓋表層示意圖； '第七圖：係將含膠有機表層覆蓋或塗佈在銅辖層上， 並和電鍍銅加黏合的結構示意圖； 第八圖：係將第七圖中所示之銅猪層予以去除的示意 第九A圖：係再將電鍍銅上的抗腐蝕層予以 . € &的示 第九B圖：係將第八圖中之銅箔層予以部份 太除的示 ;以及 第十圖：係本發明之另種實施例之結構示意圖。 (一）元件代表符號 (1 0 )銅箔 (1 2 )線路 (1 3 )抗腐蝕層 (11)光阻層 (10 ‘）電鍍麵| (14)表層 1276377Figure 5: Schematic diagram of the copper layer removed by high temperature softening after removal of the photoresist layer; J Figure 6: Schematic diagram of the system-organic coating surface; 'Seventh diagram: Covering or coating the organic surface layer containing the rubber in the copper jurisdiction Schematic diagram of the structure of the layer and the bonding of the electroplated copper; Figure 8: Schematic diagram of the removal of the copper pig layer shown in the seventh figure, Figure IX: The corrosion-resistant layer on the electroplated copper is applied. Illustrated in the ninth B diagram of the <RTIgt;</RTI>></RTI>> (1) Component symbol (1 0) Copper foil (1 2 ) Circuit (1 3 ) Corrosion resistant layer (11) Photoresist layer (10 ‘) Plating surface | (14) Surface layer 1276377