TWI274919B - Backlight system and method of making the same - Google Patents

Backlight system and method of making the same Download PDF

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Publication number
TWI274919B
TWI274919B TW92129255A TW92129255A TWI274919B TW I274919 B TWI274919 B TW I274919B TW 92129255 A TW92129255 A TW 92129255A TW 92129255 A TW92129255 A TW 92129255A TW I274919 B TWI274919 B TW I274919B
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Taiwan
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light
backlight module
guide plate
frame
light guide
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TW92129255A
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Chinese (zh)
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TW200515016A (en
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Tsung-Wei Chiang
Wen-Feng Cheng
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Hon Hai Prec Ind Co Ltd
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Publication of TWI274919B publication Critical patent/TWI274919B/en

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Abstract

An integrated backlight system includes a frame, a light guide plate, and at least a light source. The frame includes a concave structure and at least a space, the light source is located in the space, wherein using Insert Molding that the light guide plate is located in the concave structure, the light guide plate and the frame are integrated structure.

Description

1274919 五、發明說明(1) 【發明所屬之技術領域】 本發明係關於一種背光模組及其製造方法,尤指一種 用於液晶顯示裝置之一體化背光模組及其製造方法。 【先前技術】 由於液晶顯示裝置具輕、薄、耗電小等優點,廣泛應 用於筆記本電腦、行動電話、個人數位助理等現代化資訊 設備。但因液晶本身不具發光特性,需為其提供背光模組 以實現顯示4寧。 請參閱第一圖,係一種先前技術之背光模組結構 圖,該背光模組1包括導光板4、光源5、光源罩6、反射片 7及框體8,導光板4主要包括二相對之光入射面、一光 出射面4B、一底面4C及複數側面(圖未示),該底面4C設置 複數網點9,該導光板4作用係導引光源5發出的光自光出 射面4 B射出,同時提高液晶面板(圖未示)發光輝度及其發 光輝度之均勻性;光源5係相對導光板4之光入射面4A設置 並將光線發射至導光板4,光源5可以係冷陰極螢光燈 (Cold Cathode Fluorescence Lamp,CCFL)、發光二極體 (Light-emitting Diode,LED)或電激發光燈 (Electroluminescent Lamp,EL);反射片 7 設置於導光板 4之底面4 C與框體8之間,其作用係反射來自光源5或導先 板4之底面4 C之光線’以增強該背光模組1之發光輝度;框 體8 —般為高分子樹脂材料,其主要作用係保護導光板4、 反射片7及光源5等元件。 該背光模組1係由導光板4、光源5、光源罩6、反射片1274919 V. Technical Description of the Invention The present invention relates to a backlight module and a method of fabricating the same, and more particularly to an integrated backlight module for a liquid crystal display device and a method of fabricating the same. [Prior Art] Due to its advantages of lightness, thinness, and low power consumption, the liquid crystal display device is widely used in modern information equipment such as notebook computers, mobile phones, and personal digital assistants. However, since the liquid crystal itself does not have a light-emitting property, it is required to provide a backlight module to realize display. Please refer to the first figure, which is a structural diagram of a backlight module of the prior art. The backlight module 1 includes a light guide plate 4, a light source 5, a light source cover 6, a reflection sheet 7, and a frame 8. The light guide plate 4 mainly includes two opposite sides. a light incident surface, a light exit surface 4B, a bottom surface 4C, and a plurality of side surfaces (not shown). The bottom surface 4C is provided with a plurality of dots 9 which act to guide the light emitted from the light source 5 from the light exit surface 4 B. At the same time, the luminance of the liquid crystal panel (not shown) and the uniformity of the luminance thereof are improved; the light source 5 is disposed opposite to the light incident surface 4A of the light guide plate 4 and emits light to the light guide plate 4, and the light source 5 can be cooled by the cold cathode. a lamp (Cold Cathode Fluorescence Lamp, CCFL), a light-emitting diode (LED) or an electroluminescent lamp (EL); the reflection sheet 7 is disposed on the bottom surface 4 C of the light guide plate 4 and the frame 8 The function is to reflect the light from the bottom surface 4 C of the light source 5 or the guiding plate 4 to enhance the luminance of the backlight module 1; the frame 8 is generally a polymer resin material, and its main function is a protective guide. Components such as light plate 4, reflection sheet 7, and light source 5The backlight module 1 is composed of a light guide plate 4, a light source 5, a light source cover 6, and a reflection sheet.

1274919 五、發明說明(2) 7及框體8配合組裝而成,如美國專利第6,1 63,3 5〇號、第 6, 5 0 2, 945 號、第 6, 5 1 3, 943 號、第6, 59〇, 626 號及第 6, 5 9 3, 98 0號所揭示之背光模組均係導光板、光源、光源 罩、反射片及框體等元件組裝而成。 惟,上述組裝而成之背光模組主要係人工操作組裝, 該組裝過程複雜,因此耗費工時及人力成本,且人工操作 存在不穩定性及熟練程度差異,因此各組裝元件間需有較 大預留公差L亨裝後元件之間存在間隙,產生漏光現象, 造成液晶面板輝度較低,影響產品良率。雖然,實際^ 中私用機械自動化等手段代替人工操作來減少預留公差, 但其始終未徹底解決漏光現象造成的液晶面板輝度較低的 問題。 有鑑於此,提供一種結構簡單、輝度較高且成本低之 背光模組實為必需。 【發明内容】 本發明之目的在於提供一種結構簡單、輝度較高且成 本低之背光模組及其製造方法。 本發明之另一目的在於提供一種結構簡單、輝度較高 且成本低之背光模組之製造方法。 本發明提供之種背光模組,其包括一框體、一導光板 及至少一光源,該框體具有一開口向上之凹區域,至少一 與該凹區域相連之空腔,該光源設置於該空腔,其中該導 光板係利用埋入射出成型技術設置於該凹區域,使導光板 與該框體形成一體化結構。1274919 V. INSTRUCTIONS (2) 7 and frame 8 are assembled and assembled, as in U.S. Patent No. 6,1,63,3,5,6, 5, 2, 945, 6, 5, 3, 943 The backlight modules disclosed in No. 6, No. 6, No. 626 and No. 6, 5 9 3, 98 0 are assembled by components such as a light guide plate, a light source, a light source cover, a reflection sheet, and a frame. However, the assembled backlight module is mainly manually assembled, and the assembly process is complicated, so labor and labor costs are required, and manual operation has instability and proficiency difference, so that each assembly component needs to be larger. There is a gap between the components after the tolerance L is installed, which causes light leakage, which causes the brightness of the liquid crystal panel to be low, which affects the product yield. Although the actual mechanical automation and other means instead of manual operation to reduce the reserved tolerance, it has not completely solved the problem of low brightness of the liquid crystal panel caused by light leakage. In view of this, it is necessary to provide a backlight module having a simple structure, high luminance, and low cost. SUMMARY OF THE INVENTION An object of the present invention is to provide a backlight module having a simple structure, high luminance, and low cost, and a method of manufacturing the same. Another object of the present invention is to provide a method of manufacturing a backlight module which has a simple structure, a high luminance, and a low cost. The backlight module of the present invention comprises a frame body, a light guide plate and at least one light source, the frame body has an open upward concave area, at least one cavity connected to the concave area, the light source is disposed on the a cavity, wherein the light guide plate is disposed in the concave region by a burying and injection molding technique, so that the light guide plate and the frame form an integrated structure.

第5頁 1274919Page 5 1274919

本發明提供之背光模組 供一導光板,將該導光板置 注入該模具中,固化框體材 一體化結構,併使與導光板 腔;取出該框體與該導光板 框體之空腔内,形成一背光 製造方法,包括下列步驟:提 入一模具内;將熔融框體材料 料,使該框體與該導光板形成 相對之框體上形成至少一空 ;以及將至少一光源設置於該 模組。 本發明提供之另一種背光模組,其包括··一底座,包 括一基底及㊉Ja相對之侧壁;一設置於該基底上之 體’該光傳輸體至少具有-側面;至少—設置於該底^ 側壁與該光傳輸體之側面間之發光體;其中該底座盘該 傳輸體通過埋入射出成型技術形成一體化結構。一The backlight module provided by the present invention is provided with a light guide plate, and the light guide plate is injected into the mold to solidify the frame body integrated structure and make the cavity with the light guide plate; and the cavity of the frame body and the light guide plate frame is taken out. Forming a backlight manufacturing method, comprising the steps of: feeding into a mold; melting the frame material to form at least one space on the frame opposite to the light guide plate; and positioning at least one light source The module. Another backlight module provided by the present invention comprises: a base comprising a base and a side wall opposite to the ten Ja; a body disposed on the base 'the light transmission body has at least a side surface; at least - disposed on the An illuminator between the bottom wall and the side of the light transmitting body; wherein the base plate of the base plate forms an integrated structure by a burying and forming technique. One

與先前技術相比,本發明背光模組之優點在於:因框 體與導光板係以埋入射出成型之一體化結構,因此元件之 間無,隙存在,可有效降低或消除漏光現象,液晶面板輝 度提咼;框體採用高反射率材料製作,因此無需使用反射 片及光源罩,結構簡單,成本降低。 【實施方式】 凊一併參考第二圖及第三圖,為本發明之背光模組, 該背光模組2包括導光板21、框體2^及複數光源23。該框 體22呈盒狀,其包括一下表面221、複數與該下表面221相 交之侧表面222及一與該下表面221相對之上表面223,該 上表面223没置一開口向上之凹區域224及複數與該凹區域 224相連之空腔22 5,該框體22之材料為高反射聚碳酸酯 (Polycarbonate,PC)材料,反射率大於95%,如Compared with the prior art, the backlight module of the present invention has the advantages that the frame body and the light guide plate are integrated into the molded structure, so that there is no gap between the components, and the light leakage phenomenon can be effectively reduced or eliminated. The panel brightness is improved; the frame is made of high reflectivity material, so there is no need to use the reflection sheet and the light source cover, and the structure is simple and the cost is reduced. [Embodiment] Referring to the second and third figures, a backlight module of the present invention includes a light guide plate 21, a frame 2^, and a plurality of light sources 23. The frame 22 has a box shape, and includes a lower surface 221, a plurality of side surfaces 222 intersecting the lower surface 221, and an upper surface 223 opposite to the lower surface 221. The upper surface 223 is not provided with an open concave area. 224 and a plurality of cavities 22 5 connected to the concave region 224. The material of the frame 22 is a highly reflective polycarbonate (PC) material, and the reflectivity is greater than 95%, such as

第6頁 1274919 五、發明說明(4)Page 6 1274919 V. Description of invention (4)

Mitsubishi HPR30 0 0、GE BFL2 0 0 0 等;導光板21 設置於凹 區域224並與該框體22形成一體化結構,其包括一光入射 面211、一與該光入射面211相鄰之光出射面212、一與該 光出射面相對之底面2 1 3及複數側面2 1 4,該導光板2 1之底 面213設置複數光擴散網點陣列215 ;光源23為發光二極體 (Light-Emitting Diode,LED),其設置於空腔 225 内且與 導光板21之光入射面211相對。 該導光疼2J與框體22採用埋入射出成型(insert Molding)技術形成一體化結構。 請一併參考第四圖,為本發明背光模組之製造方法。 先使用射出成型工藝形成一導光板21,其包括一光入射面 211、一光出射面212、一底面213及複數侧面214,該底面 2 1 3設置複數光擴散網點陣列2丨5 (步驟丨〇丨);通過 臂將該導光板21置入一模具内,該模具包括一母模/一盥 該母模配合之公模及一位於公模與母模之間之模仁,豆ς 該模仁具有複數凸狀圖案,該凸狀圖案為半圓 ς == 粗之燒/广°.一,其凸狀高度與導光板以 先入射面211之异度一致,置入導光板21時, 入光,211與該半圓柱體之平面部分接觸,向模具 f融咼反射PC材料,Pc材料固化為框,該框俨盥 導光板21形成一體化結構(步驟1〇2) 亥:=2與 連-側形成複數空腔225,於空腔2 25中置入光:匕相 背光模組2 (步驟1〇3)。 原23 ’形成The light guide plate 21 is disposed in the concave region 224 and forms an integrated structure with the frame 22, and includes a light incident surface 211 and a light adjacent to the light incident surface 211. An exit surface 212, a bottom surface 2 1 3 opposite to the light exit surface, and a plurality of side surfaces 2 1 4, a bottom surface 213 of the light guide plate 21 is provided with a plurality of light diffusion dot arrays 215; and the light source 23 is a light emitting diode (Light-Emitting) Diode (LED) is disposed in the cavity 225 and opposite to the light incident surface 211 of the light guide plate 21. The light guide 2J and the frame 22 are formed into an integrated structure by an insert Molding technique. Please refer to the fourth figure together for the manufacturing method of the backlight module of the present invention. First, a light guide plate 21 is formed by using an injection molding process, and includes a light incident surface 211, a light exit surface 212, a bottom surface 213, and a plurality of side surfaces 214. The bottom surface 21 is provided with a plurality of light diffusion dot arrays 2丨5 (step 丨〇丨); the light guide plate 21 is placed into a mold by an arm, the mold comprises a female mold / a male mold matched with the female mold and a mold between the male mold and the female mold, the cardamom The mold core has a plurality of convex patterns, and the convex pattern is a semicircular ς == thick burn/wide °. The convex height is consistent with the difference between the light guide plate and the first incident surface 211, and is placed in the light guide plate 21 when Into the light, 211 is in contact with the planar portion of the semi-cylindrical body, and the PC material is melted and reflected toward the mold f, and the Pc material is solidified into a frame, and the frame light guide plate 21 forms an integrated structure (step 1〇2). A plurality of cavities 225 are formed in the side-to-side, and light is placed in the cavity 225: the 背光 phase backlight module 2 (step 1 〇 3). Original 23' formation

第7頁 1274919Page 7 1274919

第8頁 1274919 圖式簡單說明 【圖式簡要說明】 第一圖係一種先前技術之背光模組結構示意圖。 第二圖係本發明背光模組之立體示意圖。 第三圖係本發明背光模組沿I I I - I I I線之截面示意圖。 第四圖係本發明背光模組製作方法之流程圖。 【主要元件符號說明】Page 8 1274919 Brief description of the schema [Simplified schematic diagram] The first diagram is a schematic diagram of the structure of a backlight module of the prior art. The second figure is a perspective view of the backlight module of the present invention. The third figure is a schematic cross-sectional view of the backlight module of the present invention along the I I I - I I I line. The fourth figure is a flow chart of the manufacturing method of the backlight module of the present invention. [Main component symbol description]

背光模組 2 框體 22 下表面 ___ 221 側表面 222 上表面 223 凹區域.. 224 空腔 225 導光板 21 光入射面 211 光出射面 212 底面 213 側面 214 光擴散網點陣列 215 光源 23Backlight module 2 Frame 22 Lower surface ___ 221 Side surface 222 Upper surface 223 Concave area: 224 Cavity 225 Light guide plate 21 Light incident surface 211 Light exit surface 212 Bottom surface 213 Side 214 Light diffusion dot array 215 Light source 23

第9頁Page 9

Claims (1)

1274919 六、申請專利範圍 1 · 一種背光模組,其包括:一框體、一導光板及至少一光 源,該框體具有一開口向上之凹區域,至少一與該凹區 域相連之空腔,該光源設置於該空腔,其中該導光板係 利用埋入射出成型技術設置於該凹區域,使導光板與該 框體形成一體化結構。 2 ·如申請專利範圍第1項所述之背光模組,其中該框體之 材料為高反射率材料。 3 ·如申請專後ϋ圍第1項所述之背光模組,其中該導光板1274919 VI. Patent application scope 1 · A backlight module comprising: a frame body, a light guide plate and at least one light source, the frame body having an open upward concave area, at least one cavity connected to the concave area, The light source is disposed in the cavity, wherein the light guide plate is disposed in the concave region by using a buried incidence molding technique, so that the light guide plate and the frame form an integrated structure. The backlight module of claim 1, wherein the material of the frame is a high reflectivity material. 3 · If you apply for the backlight module described in item 1, the light guide plate 之底面設置光擴散網點陣列。 4·如申請專利範圍第1項所述之背光模組,其中該光源為 發光二極體。 5 ·如申請專利範圍第1項所述之背光模組,其中該導光板 材料為丙烯酸樹脂、聚碳酸酯、聚乙烯樹脂或透明玻 璃。 6 · 一種背光模組製造方法,包括下列步驟: k供'一導光板’將該導光板置入一权具内;A light diffusion dot array is disposed on the bottom surface. 4. The backlight module of claim 1, wherein the light source is a light emitting diode. The backlight module of claim 1, wherein the light guide plate material is acrylic resin, polycarbonate, polyethylene resin or transparent glass. 6) A method for manufacturing a backlight module, comprising the steps of: k for a 'light guide plate' to place the light guide plate into a device; 將熔融框體材料注入該模具中,固化框體材料,使該框 體與該導光板形成一體化結構,併使與導光板相對之 框體上形成至少一空腔; 取出該框體與該導光板;以及 將至少一光源設置於該框體之空腔内,形成一背光模 組。 7·如申請專利範圍第6項所述之背光模組製造方法,其中. 該框體之材料為高反射率材料。Injecting the molten frame material into the mold, curing the frame material, forming an integrated structure between the frame and the light guide plate, and forming at least one cavity on the frame opposite to the light guide plate; taking out the frame and the guide a light panel; and at least one light source is disposed in the cavity of the frame to form a backlight module. 7. The method of manufacturing a backlight module according to claim 6, wherein the material of the frame is a high reflectivity material. 1274919 六、 申請專利範圍 ---- 8. 如申請專利範圍第6項所述之背光模組製造方法,其中 該導光板之底面設置光擴散網點陣列。 9. 如申請專利範圍第6項所述之背光模組製造方法,其中 該光源為發光二極體。 10. 如=請專利範圍第6項所述之背光模組製造方法,其中 該導光板材料為丙烯酸樹脂、聚碳酸酯、聚乙烯樹脂 或透明玻璃。 11 · 一種背光—模J且,其包括:The invention relates to a method for manufacturing a backlight module according to the sixth aspect of the invention, wherein a light diffusion dot array is arranged on a bottom surface of the light guide plate. 9. The method of manufacturing a backlight module according to claim 6, wherein the light source is a light emitting diode. 10. The method of manufacturing a backlight module according to claim 6, wherein the light guide plate material is acrylic resin, polycarbonate, polyethylene resin or transparent glass. 11 · A backlight-mode J and comprising: 一底座,包括一基底及兩組相對之側壁; 一設置於該基底上之光傳輸體,該光傳輸體至少具有 一側面; 至少一設置於該底座之侧壁與該光傳輸體之側面間之 發光體; 其中該底座與該光傳輸體通過埋入射出成型技術形成 一體化結構。 1 2 ·如申請專利範圍第丨丨項所述之背光模組,其中該底座 之材料為高反射率材料。a base comprising a base and two opposite side walls; a light transmitting body disposed on the base, the light transmitting body having at least one side; at least one disposed between a side wall of the base and a side of the light transmitting body The illuminant; wherein the pedestal and the optical transmission body form an integrated structure by a buried incident molding technique. The backlight module of claim 2, wherein the material of the base is a high reflectivity material. 1 3 ·如申請專利範圍第丨丨項所述之背光模組,其中該光傳 輸體之底面設置光擴散網點陣列。 1 4 ·如申請專利範圍第11項所述之背光模組,其中該發光 體為發光二極體。 1 5 ·如申請專利範圍第11項所述之背光模組,其中該光傳 輸體材料為丙烯酸樹脂、聚碳酸酯、聚乙烯樹脂或透 明玻璃。The backlight module of claim 3, wherein the bottom surface of the light transmitting body is provided with an array of light diffusion dots. The backlight module of claim 11, wherein the illuminant is a light emitting diode. The backlight module of claim 11, wherein the light transmitting material is acrylic resin, polycarbonate, polyethylene resin or transparent glass. 第11頁Page 11
TW92129255A 2003-10-22 2003-10-22 Backlight system and method of making the same TWI274919B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7762709B2 (en) 2008-06-05 2010-07-27 Au Optronics Corporation Backlight module
US7841761B2 (en) 2007-06-27 2010-11-30 Au Optronics Corporation Backlight module and the method for manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130182456A1 (en) * 2010-11-05 2013-07-18 Huei-dung Chin Edge type LED backlight unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7841761B2 (en) 2007-06-27 2010-11-30 Au Optronics Corporation Backlight module and the method for manufacturing the same
US8162527B2 (en) 2007-06-27 2012-04-24 Au Optronics Corporation Backlight module and the method for manufacturing the same
US7762709B2 (en) 2008-06-05 2010-07-27 Au Optronics Corporation Backlight module

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