1274522 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種由多數層陶瓷板複合而成且具有 正、負極導電迴路的壓電陶瓷複合體；本發明也包含使用 該複合體以製成一壓電激發器、壓電喇^八或壓電蜂鳴器的 技術。 【先前技術】 傳統所見的壓電激發器（Piez〇electric Exciter)、壓電 味J。八（Piezoelectric Loudspeaker)以及壓電蜂鳴器 (Piezoelectric Buzzer)，均是利用一只壓電式激發片 (Exciter Plate)將正、負極的訊號加以激發(Stimulate)而釋 放出聲音的裝置。 且知’傳統的激發片是在一金屬板端面上貼附單層陶 瓷板(Ceramic sheet of single layer)所製成，且各陶兗板裸 露的雙側端面上分別披覆有導電材料作為電極層，用以焊 連訊號供應端的正極訊號導線，並利用金屬板焊連訊號供 應端的負極訊號導線，賴以產生激發共震效應，而成為可 釋放聲音的壓電激發器、壓電味卜八以及壓電蜂鳴器。' 惟，因上述金屬板雙端面所貼附的陶瓷板僅具單層， 因此需要較高的驅動電壓才能產生較佳的輸出音效，若曰訊 號供應端輸入之訊號電壓過於微弱時，單層陶瓷板與金屬 板之間將難以激發出較佳的共震音效，為其問題所在。 ' 1274522 然而，本發明將足以改善上述問題，陳如以下之 【發明内容】 以較低驅動電壓 本發明之首要目的旨在提供一種能 驅動的壓電陶瓷複合體。 為達上述目的，本發明之複合體係由一頂層、— 及至V—中層的陶瓷板相互堆疊，經熱水均壓和高、、四蟲二 而成；其中·· ’嚴"°、、，口 各陶瓷板之接合面間分別披覆銀鈀，以作為正' 的導電層，該銀㈣ϋ比例之銀（Ag)與絶（Pdf1274522 IX. Description of the Invention: [Technical Field] The present invention relates to a piezoelectric ceramic composite body which is composed of a plurality of layers of ceramic plates and has a positive and negative conductive circuit; the present invention also includes the use of the composite body. A technique of a piezoelectric actuator, a piezoelectric actuator, or a piezoelectric buzzer. [Prior Art] A piezoelectric actuator (Piez〇electric Exciter) and a piezoelectric flavor J conventionally seen. The Piezoelectric Loudspeaker and the Piezoelectric Buzzer are devices that use a piezoelectric actuator (Exciter Plate) to stimulate the positive and negative signals to release sound. It is also known that the conventional excitation sheet is made by attaching a ceramic sheet of single layer to the end surface of a metal plate, and the exposed end faces of the ceramic plates are respectively coated with a conductive material as an electrode. The layer is used for soldering the positive signal wire of the signal supply end, and the metal signal plate is used to solder the negative signal wire of the signal supply end, thereby generating an exciting resonance effect, and becomes a piezoelectric actuator capable of releasing sound, and the piezoelectric taste is eight. And a piezoelectric buzzer. However, because the ceramic plates attached to the double end faces of the above metal plates have only a single layer, a higher driving voltage is required to produce a better output sound effect. If the signal voltage input to the signal supply terminal is too weak, the single layer It is difficult to inspire better resonance sound between the ceramic plate and the metal plate, which is the problem. However, the present invention will be sufficient to improve the above problems, and the following is a lower driving voltage. The primary object of the present invention is to provide a piezoelectric ceramic composite which can be driven. In order to achieve the above object, the composite system of the present invention is composed of a top layer, and a V-middle layer of ceramic plates stacked on each other, and is formed by hot water pressure equalization and high, and four insects; wherein · · 'strictly " °, The joint faces of the ceramic plates are covered with silver and palladium, respectively, to serve as a positive conductive layer, and the silver (four) ϋ ratio of silver (Ag) and absolute (Pdf)
的口金所製成；其中銀的導電性佳，但溶點僅為961V 故必須與導電性佳，且溶點& 155代的飽—同乂 金；，，於1150。。高溫燒結各陶瓷板時，因銀：：： /、備耐巧’盈的特性，H吏各層陶究板間得以順利 4 陶瓷複合體；且 凡、、、口成 各層陶瓷板間分別開設有相連通之正、負極通 頂、底層__外端碰覆有銀膏，能各自填埋於2 的正或負極通孔内，且各層銀纪及銀膏上設有絕緣孔，圖 、ν〇於所屬層位的正或負極通孔外圍，藉以建構出複合 ::複數:此’可供連結正、負極訊號_，並 間之間^導電迴路作用，以達到降低驅動電壓之目的。 本發明之另—目的旨在取用上述複合體製成能以較 1274522 低驅動電壓鶴且利於模組生產及可避免導線外露造成 牽絆的-種壓電激發器。為達此目的，本發明係將至少一 只複合體的底層銀膏貼附於—金屬板的端面上，以製成一 壓電式激發片，同時，並與—内載有正、負極導電元件的 絕緣座體模組成該壓電激發器。 本發明之再一目的旨在取用上述激發片製成能以較 低驅動電壓驅動且利於模組生產及可避免導線外露造成 牽絆的一種壓電喇队。為達此目的，本發明藉由一阻尼墊 將激發片黏貼於内載有驅動電路晶片的絕緣座體上，以製 成該壓電制队。 本發明之又一目的旨在取用上述激發片製成能以較 低驅動電壓驅動且利於模組生產的一種壓電蜂鳴器。為達 此目的，本發明係將至少一激發片嵌組於一設有嵌槽的殼 體内，再以矽膠將嵌組處相黏固，以製成該壓電蜂鳴器； 亦能將激發片組設於一設有環肋的殼體内，再以矽膠將組 合處相黏固。 為能更加充分揭示本發明之構造、特性及效能，請配 合圖示並詳加說明於后： 【實施方式】 首觀如圖一所示，揭示出本發明第一款實施例之壓電 陶瓷複合體11及其製成之激發片1的立體分解圖，包含 將呈現矩形的一頂層陶瓷板ill、一底層陶瓷板113及至 1274522 少一中層陶究板112相互堆疊，經熱水均壓和高溫燒結而 成；其中： ^ 〃該頂層陶瓷板111與中層陶瓷板112之接合面間披覆 _ 有第一銀1巴層3U如圖一所示），該中層陶瓷板112與底層 陶竟板113之接合面間披覆有第二銀鈀層32 ;該等銀鈀 層fl及32係由銀銥合金披覆而成，能使各個陶瓷板在經 過高溫燒結的過程中緊密結合成陶瓷複合體，並使各銀鈀 • 層之間均被陶瓷板間隔成相絕緣的形態(如圖二所示）； 上述各銀鈀層上至少設有一絕緣孔；在本實施例中， 係於第一銀把層31上形成有第一絕緣孔311，並於第二 銀鈀層32上形成有第二絕緣孔321 ;且各陶瓷板之間開 設有相連通之正極通孔13及另一負極通孔14(如圖二所 不）， 該正極通孔13係於頂層陶瓷板111的頂面形成一正 極頂孔131 ’依序連通頂層陶瓷板in、中層陶瓷板1丨2、 φ 第二銀鈀層32及底層陶瓷板113,並於該底層陶瓷板in 的底面形成一正極底孔132，其間正極通孔13可穿探第 一絕緣孔311而與第一銀把層31絕緣；該負極通孔14 亦於頂層陶瓷板111的頂面開設一負極頂孔141，依序連 通頂層陶瓷板111、第一銀把層31、中層陶瓷板η:及底 層陶瓷板113，並於該底層陶瓷板113的底面形成一負極 底孔142，其間負極通孔14可穿探第二絕緣孔321而與 第二銀鈀層32絕緣； 〃 於上述複合體的半成品lla製成後，可將頂層陶瓷板 d： 8 1274522 示），及將底層 此頂、底層 陶瓷f in的底面披覆上另一底層銀膏22，此頂: 的銀f 21及22在披覆時能久自殖拽你$The gold is made of gold; the silver has good conductivity, but the melting point is only 961V, so it must be good with conductivity, and the melting point & 155 generation of full-same gold; 1, at 1150. . When the ceramic plates are sintered at high temperature, due to the characteristics of silver::: /, and the resistance is good, the ceramic layers of the layers of the H吏 layer can be smoothly completed; and the ceramic plates of each layer are opened separately. The positive and negative poles connected to each other and the bottom layer of the bottom layer __ are covered with silver paste, which can be buried in the positive or negative through holes of 2, and the layers of silver and silver paste are provided with insulating holes. 〇 外围 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Another object of the present invention is to provide a piezoelectric actuator which can be used to produce a lower driving voltage than 1274522 and which is advantageous for module production and avoids wire exposure. In order to achieve the object, the present invention attaches the underlying silver paste of at least one composite to the end surface of the metal plate to form a piezoelectric excitation piece, and simultaneously carries the positive and negative conductive materials. The insulating housing mold of the component constitutes the piezoelectric actuator. A further object of the present invention is to provide a piezoelectric racquet which can be driven by a lower driving voltage and which is advantageous for module production and which avoids the exposure of the wires. To this end, the present invention is formed by adhering an excitation piece to an insulating holder on which a driver circuit wafer is mounted by a damping pad to form the piezoelectric system. Still another object of the present invention is to provide a piezoelectric buzzer which can be driven by a lower driving voltage and which is advantageous for module production by using the above-mentioned exciting sheet. In order to achieve the object, the present invention embeds at least one excitation piece in a casing provided with a groove, and then fixes the embedded portion with a silicone rubber to form the piezoelectric buzzer; The excitation sheet set is disposed in a casing provided with a ring rib, and the combination portion is adhered by silicone rubber. In order to more fully disclose the structure, characteristics and performance of the present invention, please refer to the drawings and detailed descriptions below: [Embodiment] As shown in Figure 1, the piezoelectric ceramic of the first embodiment of the present invention is disclosed. An exploded perspective view of the composite 11 and the activated sheet 1 thereof, comprising a top ceramic plate ill, a bottom ceramic plate 113, and a 1272452, and a middle layer ceramic plate 112, which are rectangular in shape, are stacked on each other by hot water. Sintered at high temperature; wherein: ^ 〃 the top surface of the ceramic plate 111 and the intermediate ceramic plate 112 overlap _ there is a first silver 1 bar layer 3U as shown in Figure 1, the middle ceramic plate 112 and the bottom ceramic The joint faces of the plates 113 are covered with a second silver palladium layer 32; the silver palladium layers fl and 32 are covered by a silver-antimony alloy, which enables the ceramic plates to be tightly bonded into ceramics during high-temperature sintering. a composite body, wherein each of the silver palladium layers is separated by a ceramic plate to form a phase insulating structure (as shown in FIG. 2); each of the silver palladium layers is provided with at least one insulating hole; in this embodiment, a first insulating hole 311 is formed on the first silver layer 31, and A second insulating hole 321 is formed on the two silver palladium layer 32; and a positive electrode through hole 13 and another negative electrode through hole 14 (not shown in FIG. 2) are connected between the ceramic plates, and the positive through hole 13 is Forming a positive electrode top hole 131' on the top surface of the top ceramic plate 111. The top ceramic plate in, the intermediate ceramic plate 1, 2, the second silver palladium layer 32 and the bottom ceramic plate 113 are sequentially connected, and the bottom ceramic plate is in A bottom surface of the positive electrode is formed in the bottom surface of the top surface of the top ceramic plate 111 The hole 141 sequentially connects the top ceramic plate 111, the first silver layer 31, the intermediate ceramic plate η: and the bottom ceramic plate 113, and forms a negative bottom hole 142 on the bottom surface of the bottom ceramic plate 113, and the negative through hole 14 therebetween The second insulating hole 321 can be penetrated to be insulated from the second silver palladium layer 32; after the semi-finished product 11a of the composite body is formed, the top ceramic plate d: 8 1274522 can be shown, and the top and bottom ceramics are The bottom surface of f in is covered with another underlying silver paste 22, and the top: silver f 21 and 22 are overlaid I can grow up for a long time.
111的頂面披覆上一頂層銀膏21(如圖三所示）， 士 丨〜…曰外、β ^月匕兴貝極頂孔141 内的銀嘗相絕緣，同時底層銀膏22能於正極底孔132 圍裸露出-底層絕緣孔22卜使底層銀膏22能與正極底 孔132内的銀貧相絕緣；據此，使該頂層銀膏21與第二 銀把層32之間，藉由已埋填有銀金屬的正極通孔13而相 導通形成一士極迴路130 ;亦使底層銀膏22與第一銀鈀 層31之間’藉由已埋填有銀金屬的負極通孔14而相導通 形成另一負極迴路140;據以製成一壓電陶瓷複合體η， 並能以f層銀膏21作為正極迴路13〇的外露接觸端使 用且此以底層銀貧22作為負極迴路140的外露接觸端 ^發明另包含取用一或二只上述複合體u，將其底 • 層銀貧22貼附於一矩型金屬板12的一侧或雙侧端面上 圖一及圖四所示），此金屬板12上至少具有一外露的 端部121 ^作為負極連接端使用，且以二只上述複合體11 的頂層銀貧21作為正極連接端使用，進而構築成至少一 侧端面上具有複合體11的壓電式激發片j。 21上焊連一 上焊連另一 在使用上述激發片1時，係可在二端外露的頂層銀膏 正極訊號電源，並在金屬板12外露的端部121 一負極訊號電源(如圖四所示广即可經由正極迴 1274522 〇而使頂層銀貧21及第二銀鈀層32同時傳導正極訊 ，並經由負極迴路14〇而使金屬板12、底層銀膏 ^第一銀鈀層31同時傳導負極訊號電壓，進而於各層 二板與該金屬板12之間形成具有相鄰正、負極訊號電 的導電迴路，以達到降低驅動電壓的目的，以利取得較 佳的音效輸出品質。 本發明第二款實施例，揭示出取用上述至少一只壓電 激發片1以製成一壓電激發器的技術（如圖五所示）。主 要係在一絕緣座體4内封裝一正極導電元件41及另一負 極導電元件42,並將至少一只激發片丨嵌組於該座體4 上（配合圖六、七所示）；其中： 一該正極導電元件41延製有三只壓觸端411 (如圖六 所示），係分別與各只激發片丨上的頂層銀膏21相互嵌 接’且該正極導電元件41亦延製有三只外露於絕緣座體 4之頂部、底部及一侧的外接端413、414、412 ; 該負極導電元件42開設有二只夾口 421 (如圖七所 示），係分別與上述二只激發片丨之金屬板12上的外露端 4 121相互嵌接，且該負極導電元件42亦延製有三只外 露於絕緣座體4之頂部、底部及一側端侧的外接端423、 424 、 422 ; 據此，可利用一連接器5與壓電激發器一侧的外接端 412、422相接（如圖五所示），以接收連接器5供應訊號 電壓；也能利用外接端414、424插入基板6之相對應的 插槽61内（如圖八所示），以接收基板6的電路62供應 -1274522 訊號電壓，進而驅動壓電激發器產生共振以播放聲音。 另外，亦能將壓電激發器用的驅動電路作成晶片 7(Dice)形式，而與壓電激發器模組成一體(如圖九所示）； 該驅動電路是由一個直流交換器（DC converter)與放 大器（AMP)組合而成的一個整合電路(ic)，且該晶片7 的輸入埠具有一音源正極端(V+)71、音源負極端(v_)72、 信號輸入端（Signal Input，SI)73與待觸發端（Standby mode，SM)74等導線外接；該晶片7的輸出埠是直接鑲 嵌(mount)在座體4頂部的外接端413、423上，用以傳送 訊號電壓至壓電激發器。 本發明也包含第三款實施例以揭示出一種壓電制队 (如圖十所示）的製作技術。主要係將上述至少一只激發片 10製成圓片形，激發片10上具有與上述複合技術相同的 複合體110及金屬板120，且該金屬板120上至少具有一 外露的端部122，並於該端部122上設置一阻尼墊8，用 以改善低頻音效品質’該阻尼塾8係由一高阻尼且具黏貼 性質的膠材製成’據以製成該壓電制队；且該壓電制u八所 使用的圓片形激發片10上，亦能僅在金屬板120之單侧 端面上貼附一只複合體110。 另外’該壓電剩u八亦能夠模組一與上述具有相同音源 正極端、音源負極端、信號輸入端及待觸發端的驅動電路 晶片70(如圖十一所不）’為曰曰片7〇的輸出璋延設有一軟 性基板60 (FpC)，其具有正、負極輸出端601及602， 11 1274522 該正極輸^端601分別與二只多層壓電陶瓷複合體110 的頂層銀貧210相連接，該負極輸出端6〇2則與金屬板 120相連接，據以將驅動電路晶片7〇與壓電喇^模組成 —' 體。 、 或者，能夠將上述模組有一驅動電路晶片7〇的壓電 喇=，黏固在一絕緣座體4〇的容置孔4〇1内（如圖十二、 十二所示）’其於構造等同於上述實施例。 口抑本發明更加包含第四款實施例以揭示出一種壓電蜂 鳴器（如圖十四所示）的製作技術。主要係將一只圓片形 壓電陶瓷複合體110的底層銀膏220,貼附於一只圓片形 金屬板120的端面上以形成一壓電式激發片1〇a，且該^ f板120上至少具有一外露的端部122，並藉由該端部/122 能夠將激發片l〇a嵌組於一具有嵌槽911的殼體9内，再 以矽膠94將該端部122與嵌槽911相黏固；該殼體9一 端側形成有一音孔92,使該激發片10a發出的聲響可經 由音孔92傳出，且該殼體9另一端側嵌組一基板6\;該 基板6a具有一與複合體110之頂層銀膏21〇相連的正極 輸出端603，及另一與金屬板120之外露端部122相連接 的負極輸出端604，且該基板6a具有一正極輸入端931 及另一負極輸入端932,用以外接正、負極訊號電源，以 驅動壓電蜂鳴器產生共振並發出聲音。 此外，該基板6a的正、負極輸出端603及604(如圖 十五所示）與正、負極輸入端931及932之間，模組一具 有音源正極端及音源負極端的驅動電路晶片7〇a，該晶片 ⑧ 12 -1274522 70a之音源正極端與基板6a的正極輸入端931相連接， 且該晶片70a之音源負極端與基板6a的負極輸入端932 相連接’同時該晶片70a之輸出埠分別與基板6a的正極 輸出端604及負極輸出端6〇4相連接。另外，亦能藉由該 . 鈿部122能夠將壓電激發片l〇a組設於一具有環肋912 的设體90内（如圖十五所示），再以矽膠94將該端部122 與環肋912相黏固，其於等同於上述實施例。 • 是以，本發明上述之壓電激發器、壓電喇队以及壓電 =鳴器，均可達到簡化各訊號端間的連接以及避免導線外 露的目的，並能以較低驅動電壓激發共振出悅耳音效。 綜合上述實施例之說明，相信已詳加揭示本發明的具 體内谷’但本發明之技術並不局限於此，舉凡依據上述以 及后述申請專利範圍等内容而作出簡略修飾的等效技術 均應隸屬於本發明之應用範疇，並予陳明。 【圖式簡單說明】 圖一：揭示出本發明第一款實施例的立體分解圖，說 明該壓電陶瓷複合體成品的組成。 圖二··揭示出本發明壓電陶瓷複合體半成品的剖示 圖’說明各陶瓷板之接合面間分別披覆有銀纪，且各陶瓷 板間開設有相連通之正、負極通孔。 圖三··揭示出本發明壓電陶瓷複合體的剖示圖，說明 該頂層銀膏填埋正極通孔而形成内含銀的正極迴路，且該 ' 底層銀貧填埋負極通孔而形成内含銀的負極迴路。 ⑧ 13 .1274522 圖四：揭示出本發明圖一之激發片的剖子闇μ 不_，說明激 發片能由二只壓電陶瓷複合體及一金屬板複合而成。 圖五·揭不出本發明弟一款貫施例的立體圖，▲兒日月在^ 一絕緣座體内封裝一只正極導電元件、一只負極導電元件 及至少一只激發片以組成一壓電激發器。 圖六··揭示出圖五之一剖示圖，說明正極導電元件 具有三只壓觸端及三只外露的外接端。The top surface of the 111 is covered with a top layer of silver paste 21 (as shown in Figure 3), and the silver in the top hole 141 of the girth 曰 曰 曰 β β β β β β , , , , , , , , , , , , The bottom electrode hole 132 is barely exposed - the bottom insulating hole 22 enables the underlying silver paste 22 to be insulated from the silver poor in the positive electrode bottom hole 132; accordingly, between the top silver paste 21 and the second silver silver layer 32, A positive electrode via hole 13 filled with silver metal is turned on to form a gate circuit 130; also between the underlying silver paste 22 and the first silver palladium layer 31 by a negative via having a silver metal buried therein 14 is turned on to form another negative electrode circuit 140; a piezoelectric ceramic composite body η is formed, and the f-layer silver paste 21 can be used as the exposed contact end of the positive electrode circuit 13〇 and the bottom layer is made of silver lean 22 as the negative electrode. The exposed contact end of the circuit 140 further comprises the use of one or two of the above-mentioned composites u, and the bottom layer of the silver layer 22 is attached to one side or both end faces of a rectangular metal plate 12. As shown in FIG. 4, the metal plate 12 has at least one exposed end portion 121 as a negative electrode connection end, and two of the above composite bodies 11 are used. The top layer of silver-depleted 21 is used as a positive electrode connection end, and is further constructed as a piezoelectric excitation piece j having a composite body 11 on at least one side end face. 21 welding on the first welding and the other in the use of the above-mentioned excitation sheet 1, the top-side silver paste positive signal power supply exposed at the two ends, and the exposed end of the metal plate 12 121 a negative signal power supply (Figure 4 As shown, the top layer of silver-depleted 21 and the second silver-palladium layer 32 are simultaneously conducted through the positive electrode back to 1272422, and the positive electrode is simultaneously conducted, and the metal plate 12, the underlying silver paste, and the first silver-palladium layer 31 are passed through the negative electrode circuit 14 At the same time, the negative signal voltage is transmitted, and a conductive loop having adjacent positive and negative signal signals is formed between the two layers of the two layers and the metal plate 12 to achieve the purpose of reducing the driving voltage, so as to obtain better sound output quality. In the second embodiment of the invention, the technique of taking the at least one piezoelectric excitation piece 1 to form a piezoelectric actuator is shown (as shown in Fig. 5), mainly by encapsulating a positive electrode in an insulating base 4. a conductive element 41 and another negative conductive element 42, and at least one excitation piece is embedded on the base 4 (shown in Figures 6 and 7); wherein: the positive conductive element 41 is extended by three pressures Contact 411 (shown in Figure 6) The top layer silver paste 21 on each of the excitation sheets is not in contact with each other', and the positive electrode conductive member 41 is also extended with three external ends 413, 414, 412 exposed on the top, bottom and one side of the insulating base 4; The negative conductive member 42 is provided with two clamping holes 421 (shown in FIG. 7 ), which are respectively engaged with the exposed ends 4 121 of the metal plates 12 of the two excitation pieces, and the negative conductive element 42 is also There are three external ends 423, 424, and 422 which are exposed on the top, bottom and one side end sides of the insulating base 4; accordingly, a connector 5 and the external terminals 412, 422 on the side of the piezoelectric actuator can be utilized. Connected (as shown in FIG. 5), the receiving connector 5 supplies the signal voltage; and the external terminals 414, 424 can also be inserted into the corresponding slots 61 of the substrate 6 (as shown in FIG. 8) to receive the substrate 6 The circuit 62 supplies the -1274522 signal voltage, which in turn drives the piezoelectric actuator to generate resonance to play the sound. In addition, the driving circuit for the piezoelectric actuator can be formed into a wafer 7 (Dice) form and a piezoelectric actuator module. One body (as shown in Figure 9); the drive circuit is made up of one An integrated circuit (ic) in which a DC converter and an amplifier (AMP) are combined, and the input port of the chip 7 has a positive terminal (V+) 71, a negative terminal (v_) 72, and a signal input. The signal input (SI) 73 is externally connected to the lead-in mode (SM) 74; the output 埠 of the wafer 7 is directly mounted on the external ends 413 and 423 at the top of the base 4 for transmission. The signal voltage is applied to the piezoelectric actuator. The present invention also encompasses the third embodiment to reveal a fabrication technique for a piezoelectric system (shown in Figure 10). The at least one excitation piece 10 is mainly formed into a disk shape, and the excitation piece 10 has the same composite body 110 and metal plate 120 as the above composite technology, and the metal plate 120 has at least one exposed end portion 122. And a damping pad 8 is disposed on the end portion 122 for improving the low-frequency sound quality. The damping 塾8 is made of a highly damped and adhesive-like glue material to form the piezoelectric system; On the wafer-shaped excitation sheet 10 used in the piezoelectric system, a composite body 110 can be attached only to one end surface of the metal plate 120. In addition, the piezoelectric residual U can also be a module 7 with the same sound source positive terminal, the sound source negative terminal, the signal input terminal and the driving circuit chip 70 to be triggered (as shown in FIG. 11). The output of the crucible is provided with a flexible substrate 60 (FpC) having positive and negative output terminals 601 and 602, 11 1274522. The positive electrode terminal 601 is respectively opposite to the top layer of the two multilayer piezoelectric ceramic composites 110. Connected, the negative output terminal 6〇2 is connected to the metal plate 120, so that the driving circuit chip 7〇 and the piezoelectric film are formed into a body. Or, the module can have a piezoelectric puller of the driving circuit chip 7〇, and is adhered to the receiving hole 4〇1 of the insulating base 4〇 (as shown in FIG. 12 and FIG. 12). The construction is equivalent to the above embodiment. The present invention further encompasses the fourth embodiment to reveal the fabrication technique of a piezoelectric buzzer (shown in Figure 14). The bottom layer silver paste 220 of a wafer-shaped piezoelectric ceramic composite 110 is attached to the end surface of a wafer-shaped metal plate 120 to form a piezoelectric excitation piece 1〇a, and the ^f The plate 120 has at least one exposed end portion 122, and the end piece / 122 can be used to embed the excitation piece 10a in a housing 9 having a recess 911, and the end portion 122 is further formed by the silicone 94. The housing 9 is adhered to the slot 911. The sound is generated on one end of the housing 9. The sound emitted by the excitation piece 10a can be transmitted through the sound hole 92, and the substrate 9 is embedded on the other end side. The substrate 6a has a positive output terminal 603 connected to the top layer silver paste 21 of the composite body 110, and another negative output terminal 604 connected to the exposed end portion 122 of the metal plate 120, and the substrate 6a has a positive electrode. The input terminal 931 and the other negative input terminal 932 are connected to the positive and negative signal power sources to drive the piezoelectric buzzer to generate resonance and emit sound. In addition, between the positive and negative output terminals 603 and 604 of the substrate 6a (shown in FIG. 15) and the positive and negative input terminals 931 and 932, the module has a driver circuit chip 7 having a positive end of the sound source and a negative end of the sound source. 〇a, the positive terminal of the sound source of the wafer 8 12 -1274522 70a is connected to the positive input terminal 931 of the substrate 6a, and the negative end of the sound source of the wafer 70a is connected to the negative input terminal 932 of the substrate 6a while the output of the wafer 70a is output. The crucible is connected to the positive output terminal 604 and the negative output terminal 6〇4 of the substrate 6a, respectively. In addition, the piezoelectric excitation piece 10a can also be assembled in a body 90 having a ring rib 912 (as shown in FIG. 15), and the end portion can be made of silicone 94. 122 is bonded to the ring rib 912, which is equivalent to the above embodiment. In the above, the piezoelectric actuator, the piezoelectric squad and the piezoelectric squeal of the present invention can achieve the purpose of simplifying the connection between the signal terminals and avoiding the exposure of the wires, and can excite the resonance with a lower driving voltage. A pleasant sound. In view of the above description of the embodiments, it is believed that the specific inner valley of the present invention has been disclosed in detail, but the technology of the present invention is not limited thereto, and equivalent techniques which are simply modified according to the above-mentioned and the scope of the patent application described later are all It should be subject to the application of the invention and be given to Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1: An exploded perspective view showing the first embodiment of the present invention, illustrating the composition of the finished piezoelectric ceramic composite. Fig. 2 is a cross-sectional view showing the semi-finished product of the piezoelectric ceramic composite of the present invention. The joint faces of the ceramic plates are respectively covered with silver, and the positive and negative through holes are connected between the ceramic plates. FIG. 3 is a cross-sectional view showing the piezoelectric ceramic composite of the present invention, illustrating that the top silver paste fills the positive electrode through hole to form a positive electrode containing silver, and the 'bottom silver is poorly buried in the negative through hole. A negative electrode circuit containing silver. 8 13 .1274522 Fig. 4: revealing the cross-section of the excitation piece of Fig. 1 of the present invention, indicating that the excitation piece can be composed of two piezoelectric ceramic composites and a metal plate. Figure 5 is a perspective view of a coherent embodiment of the present invention. ▲ 儿日月 encapsulates a positive conductive element, a negative conductive element and at least one excitation piece to form a pressure in an insulating body. Electric trigger. Figure 6························································
圖七：揭示出圖五的另一剖示圖，說明負極邕 上具有一夾口及三只外露的外接端。 、 ^ 圖八：揭示出本發明第二款實施例之—組配剖示圖 說明利用外接端插入基板的插槽内以供應訊號電壓。 圖九··揭示出本發明第二款實施例之另一組配剖示 圖，說明壓電激發器與一驅動電路晶片相模組的形熊。τ 圖十 揭不出本發明第三款實施例的立體圖，說明將 激發片製成圓片形，並結合一阻尼墊及與導線相焊連 成的壓電味I 。 & 圖十一：揭示出本發明壓電喇叭之另一附加實施形態 的立體圖’說明壓電喇^八能與一驅動電路晶片及其軟性基 板一同模組成一體。 圖十二··揭示出本發明壓電喇α八之又一附加實施形態 的立體圖’說明壓㈣錢與-驅動電路晶片及其軟性i -1274522 板一同模組於一絕緣座體上。 圖十三··揭示出圖十二的局剖示意圖，附加說明該軟 性基板的輸出埠係連接至激發片的頂層銀膏與金屬板上。 圖十四··揭示出本發明第四款實施例的剖示圖，說明 將激發片製成圓片形，並嵌組於一具有嵌槽的殼體内所製 成的壓電蜂鳴器。 圖十五：揭示出本發明壓蜂鳴器之另一附加實施形態 的剖示圖，說明將激發片製成圓片形，並組設於一具有環 肋的殼體内嵌所製成的壓電蜂鳴器。 【主要元件符號說明】 ⑧ 1、10、10a-------- 1 1 ---------------- 丄丄〇 11 ^ 110----------- 111 . - 複合體半成品 - 複合體 112 . 頂層陶瓷板 113 . - 中層陶瓷板 12 〜120 - 底層陶瓷板 121 > 122---------- 13 . 金屬板 130 - 正極通孔 1 Q1 正極迴路 止極頂孔 15 -1274522 132----------------------正極底孔 14-----------------------負極通孔 140 ----------------------負極迴路 141 ----------------------負極頂孔 142 ----------------------負極底孔 21、210------------------頂層銀膏Figure 7: Another cross-sectional view of Figure 5 is shown, showing that the negative electrode has a pinch and three exposed external ends. FIG. 8 is a cross-sectional view showing the second embodiment of the present invention. The external terminal is inserted into the slot of the substrate to supply the signal voltage. Fig. 9 is a cross-sectional view showing another embodiment of the second embodiment of the present invention, illustrating a shaped bear of a piezoelectric actuator and a driver circuit wafer phase module. τ Figure 10 is a perspective view of a third embodiment of the present invention, illustrating the formation of a disc shape in combination with a damper pad and a piezoelectric odor I bonded to the wire. Fig. 11 is a perspective view showing another embodiment of the piezoelectric horn of the present invention. The piezoelectric rib can be integrated with a driver circuit chip and a flexible substrate thereof. Fig. 12 is a perspective view showing another embodiment of the piezoelectric la à octagon of the present invention. The embossed (four) money and drive circuit chip and its soft i -1274522 board are assembled together on an insulating base. Fig. 13 is a cross-sectional view showing the structure of Fig. 12, and the output of the flexible substrate is connected to the top silver paste and the metal plate of the excitation sheet. Figure 14 is a cross-sectional view showing a fourth embodiment of the present invention, illustrating a piezoelectric buzzer formed by forming an exciting piece into a disk shape and embedding in a housing having a recessed groove. . Figure 15 is a cross-sectional view showing another embodiment of the pressure buzzer of the present invention, illustrating that the excitation piece is formed into a disk shape and assembled in a housing having a ring rib. Piezoelectric buzzer. [Main component symbol description] 8 1,10,10a-------- 1 1 ---------------- 丄丄〇11 ^ 110------ ----- 111 . - Composite semi-finished product - Composite 112 . Top ceramic plate 113 . - Intermediate ceramic plate 12 ~ 120 - Bottom ceramic plate 121 > 122---------- 13 . 130 - positive through hole 1 Q1 positive circuit stop top hole 15 -1274522 132---------------------- positive bottom hole 14-------- ---------------Negative through hole 140 ----------------------Negative circuit 141 ------ ----------------Negative top hole 142 ----------------------Negative bottom hole 21,210-- ---------------- Top silver paste
211----------------------頂層絕緣孔 22 λ 220------------------底層銀膏 221----------------------底層絕緣孔 31 -----------------------第一銀把層 311----------------------第一絕緣孔 32 -----------------------第二銀鈀層 321----------------------第二絕緣孔 4 > 40--------------------絕緣座體211---------------------- Top Insulation Hole 22 λ 220------------------ Underlying Silver Paste 221---------------------- bottom insulation hole 31 ----------------------- First silver layer 311---------------------- first insulating hole 32 ----------------- ------Second silver palladium layer 321---------------------- second insulating hole 4 > 40-------- ------------Insulation body
401----------------------容置孔 41 -----------------------正極導電元件 411----------------------壓觸端 412、413、414、422、423、424-----外接端 42 -----------------------負極導電元件 421----------------------夾口 5 ------------------------連接器 ⑧ 16 •1274522 6、6a--------------------基板 60 -----------------------軟性基板 - 601 ' 603-----------------正極輸出端 602 λ 604-----------------負極輸出端 61 -----------------------插槽 62 -----------------------電路 • 7、70、70a---------------晶片 71-----------------------音源正極端 72—---------------------音源負極端 73 -----------------------信號輸入端 74 -----------------------待觸發端 8------------------------阻尼墊 9、90--------------------殼體 911----------------------嵌槽 • 912----------------------環肋 92-----------------------音孔 931 ----------------------正極輸入端 932 ----------------------負極輸入端 94-----------------------矽膠 ⑧ 17401---------------------- accommodating hole 41 ----------------------- Positive Conductive Element 411---------------------- Pressure Contact Ends 412, 413, 414, 422, 423, 424-----External End 42- --------------------- Negative Conductive Element 421----------------------Pinch 5 ------------------------ Connector 8 16 •1274522 6,6a----------------- ---Substrate 60 -----------------------Soft Substrate - 601 ' 603---------------- - Positive output 602 λ 604----------------- Negative output 61 ---------------------- -Slot 62 ----------------------- Circuitry • 7, 70, 70a--------------- Wafer 71----------------------- Sound source positive end 72—--------------------- Source negative terminal 73 ----------------------- Signal input 74 ------------------- ----To be triggered 8------------------------ Damping pad 9, 90------------- -------Shell 911----------------------Inlay slot 912-------------- -------- Ring rib 92----------------------- Sound hole 931 ------------- --------- Positive input 932 ---------------------- Negative input 94----------- ------------ Plastic ⑧ 17