TWI274440B - Memory device capable of preventing electrostatic destruction - Google Patents

Memory device capable of preventing electrostatic destruction Download PDF

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Publication number
TWI274440B
TWI274440B TW93139022A TW93139022A TWI274440B TW I274440 B TWI274440 B TW I274440B TW 93139022 A TW93139022 A TW 93139022A TW 93139022 A TW93139022 A TW 93139022A TW I274440 B TWI274440 B TW I274440B
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Taiwan
Prior art keywords
memory module
memory
memory device
interface connector
row
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TW93139022A
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Chinese (zh)
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TW200620756A (en
Inventor
Chung-Liang Lee
Chanson Lin
Ruei-Lung Tsai
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Innodisk Corp
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Priority to TW93139022A priority Critical patent/TWI274440B/en
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Publication of TWI274440B publication Critical patent/TWI274440B/en

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Abstract

Disclosed is a memory device capable of preventing electrostatic destruction, which is mainly to dispose a socket strip at the front end of the memory module. A plurality of jacks are disposed in the socket strip, and a metal point electrically connected with the memory module is disposed in every jack so as to hide the metal point inside the jack without exposure. Hence, not only can it maintain the original electrical interface specifications of the memory module, but also prevent the metal point from generating electrostatic effect to destroy the memory module in contact with an external object.

Description

1274440 五、發明說明(1) 【本發明所屬之技術領域】 广本發明係有關於一種記憶裝置 破壞之記憶裝置,不僅可保有記,^ —種可防止靜電 格,且又可以防止因為外物接觸心:接m氣界面規 憶模組之靜電效應者。 w屬接^而產生破壞記 【先前技術】 隨者時代的進步 已成為曰常生活中不 僅可提供人們對資料 保存之功能。 然而,現今市面 面規格,致使記憶卡 中,為此,使用者需 適應各種不同介面規 方便,且浪費大量金 另外,如第1圖 記憶卡之立體示意圖 1 3,以利於與一應用 極為容易與外物接觸 ,並經由金屬接點1 3 憶卡11之資料存取功 ,電腦周邊產品或消費性電子商品早 可或缺之使用工具,例如記憶卡,不 快速存取之需求外,亦具有資料長久 上所流 僅能使 分別購 格的應 錢。 所示, ’該記 裝置電 ,例如 而傳入 能,甚 通的記憶卡具有各種不同的介 用於特定介面規袼之應用裝置 買多種不同規格的記憶卡,以 用裝置,不僅在使用上非常不 係為習用SD(Secure Digital) 憶卡11之前端設有一金屬接點 性接觸,但外露之金屬接點1 3 灰塵,因此容易產生靜電效應 記憶卡1 1中,不僅容易破壞記 至將損壞該記憶卡11。 發明内容 第5頁 1274440 五、發明說明(2) ____ 為此,如何針對上述習用記憶卡或記憶裝置之 以設計出一種新穎的·記憶裝置,不僅有利於多種介、點’ 頭之更換,且又可防止記憶卡之金屬接點外露,^$連接 少因外物接觸而產生破壞記憶卡之靜電效應者,此S政減 發明之發明重點。爰是, P為本 本發明之主要目的,在於提供一種可防止靜電破广 記憶裝置,其記憶模組之前端設有一排插,以内藏一么之 記憶模組電性連接之金屬接點,因此可預防金屬接點:= 路而與外物接觸所產生靜電效應之弊端,不僅可確保記憒、 裝置之貧料存取可靠性,且又可延長其使用壽命者。思 本發明之次要目的,在於提供一種可防止靜電破壞之 a己憶裝置’藉由排插及排針的插合關係,而可將記憶裝置 ^用於多種不同介面規格的應用裝置中,不僅可增加記憶 裝置之適用範圍,又可因此而節省記憶裝置之購買費用者 為達成上述目的,因此 其主要構造係包括有:一記 排插内設有複數個插孔,插 連接之金屬接點,而記憶模 MMC記憶模組、XD記憶模組 一介面連接器,其前端可選 連接頭之其中之一,而其後 插相互插合之排針。 ,在本發明一較佳實施例中, 憶模組,其前端設有一排插, 孔内设有一可與記憶模組電性 組係可選擇為一SD記憶模組、 及M S §己憶模組之其中之一:及 擇連接有一應用裝置及一介面 端則設有一可與記憶模組之排1274440 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) [Technical Field to Which the Invention Is Applicable] The present invention relates to a memory device for destroying a memory device, which not only keeps a record, but also prevents an electrostatic grid and prevents foreign matter Contact: Connect the m gas interface to the static effect of the module. W is connected to ^ and produces damages [Prior Art] Advancement of the era has become a function of saving people's data in ordinary life. However, the current market specifications, resulting in the memory card, for this, the user needs to adapt to a variety of different interface rules, and waste a lot of gold. In addition, as shown in Figure 1, the three-dimensional schematic of the memory card 1 3, in order to facilitate an application Contact with foreign objects, and access to data via metal contacts 1 3 memory card 11, computer peripheral products or consumer electronic products may be used as early or missing tools, such as memory cards, not fast access requirements, The long-term flow of information can only make money for the purchase of separate purchases. As shown, 'the device is electrically, for example, the incoming energy, the pass-through memory card has a variety of different application devices for a specific interface specification, and a plurality of memory cards of different specifications are used to use the device, not only in use. Very not suitable for the use of SD (Secure Digital) memory card 11 has a metal contact contact at the front end, but the exposed metal contacts 13 3 dust, so it is easy to produce electrostatic effects in the memory card 1 1 not only easy to damage to remember The memory card 11 is damaged. SUMMARY OF THE INVENTION Page 5 1274440 V. INSTRUCTIONS (2) ____ To this end, how to design a novel memory device for the above-mentioned conventional memory card or memory device is not only advantageous for the replacement of a plurality of media, but also It can also prevent the metal contacts of the memory card from being exposed, and the connection of the memory is less than the electrostatic effect of the memory card caused by the contact of foreign objects. That is, P is the main purpose of the present invention, and is to provide a memory device capable of preventing static electricity from being broken. The front end of the memory module is provided with a row of plugs, and the metal contacts of the memory module are electrically connected therein. Prevents metal contacts: = The disadvantage of electrostatic effects caused by contact with foreign objects is not only to ensure the reliability of the memory access of the device, but also to extend its service life. The second object of the invention is to provide a memory device capable of preventing electrostatic damage. The memory device can be used in a plurality of application devices of different interface specifications by the insertion and arrangement of the socket and the pin header. Not only can the application range of the memory device be increased, but also the purchase cost of the memory device can be saved. To achieve the above purpose, the main structure includes: a plurality of jacks in the plug, and the metal connection of the plug connection Point, and memory mode MMC memory module, XD memory module-interface connector, the front end of which can be selected as one of the connector heads, and then inserted into the pin headers. In a preferred embodiment of the present invention, the memory module has a row of plugs at the front end, and an electrical component that can be combined with the memory module can be selected as an SD memory module and an MS § recall mode. One of the groups: one with an application device and one interface with a row with a memory module

第6頁 1274440 五、發明說明(3) ' — 【實施方式】 兹為使貴審查委員對本發明之特徵、結構及所.達成 之功效有進一步之暸解與認識’謹佐以較佳之實施圖例及 配合詳細之說明,說明如後:Page 6 1274440 V. INSTRUCTIONS OF THE INVENTION (3) ' EMBODIMENT(S) In order to provide the reviewer with a better understanding and understanding of the features, structure and effects of the present invention, With the detailed instructions, the explanation is as follows:

首先’請參閱第2圖’係為本發明記憶裝置一較佳實 施例之立體示意圖;如圖所示,本發明記恃裝置或 係包括有-記憶模組21及一介面連接器25:二記U 組21 係可為一SD(Secure Digital)記憶卡、MMC(Multi Media Card)記憶卡、XD(eXtreffle Digital )記憶卡或MS( Memory Stick)記憶卡,其前端設有一排插23,排插23上 設有複數個插孔231,而插孔23内設有一金屬接點235,該 金屬接點235係可直接電性連接該記憶模組21。 又,介面連接器25之前端設有一與記憶模組21不同介 面規格之介面連接頭27,例如USB(Universal Seriai Bus )連j妾頭(么連接裔或母連接器皆適用),而其後端則設有 與Zfe模組21之排插23可相互插合之排針29,當排針29 與排插23相互插合時,排針29將會與插孔231中的金屬接 性連接,進而與記憶模組21 t性連接,如此該記 即可透過其前端之排插23及介面連接器25之排針 以具人有USB介面連接頭27之記憶裝置或記憶卡, 以週用於USB介面應用產品中。 插23 明記憶模組21之金屬接點235係直接設於排 1内,可避免金屬接點235外露而與外界接觸 勺几險口此可預防因外物接觸所可能產生之靜電效應或1 is a perspective view of a preferred embodiment of the memory device of the present invention; as shown, the recording device of the present invention includes a memory module 21 and an interface connector 25: The U group 21 system can be an SD (Secure Digital) memory card, an MMC (Multi Media Card) memory card, an XD (eXtreffle Digital) memory card or an MS (Memory Stick) memory card, and has a row of plugs 23 at the front end thereof. A plurality of jacks 231 are disposed on the plug 23, and a metal contact 235 is disposed in the jack 23, and the metal contacts 235 are directly electrically connected to the memory module 21. Moreover, the interface connector 25 is provided with an interface connector 27 of a different interface specification from the memory module 21, such as a USB (Universal Seriai Bus) connection (for both connection and female connectors), and thereafter The terminal is provided with a pin 29 which can be inserted into the socket 23 of the Zfe module 21, and when the pin 29 and the socket 23 are inserted into each other, the pin 29 will be connected to the metal in the socket 231. And the memory module 21 is connected to the memory module 21 so that the memory can be connected to the memory device or the memory card of the USB interface connector 27 through the front row of the plug 23 and the interface connector 25 for weekly use. For USB interface applications. The metal contacts 235 of the memory module 21 are directly disposed in the row 1, which can prevent the metal contacts 235 from being exposed and contact with the outside. This can prevent electrostatic effects which may occur due to contact with foreign objects or

12744401274440

1274440 五、發明說明(5) ’例如第4 C圖,則係具有一丨EEE丨394介面連接頭475之 介面連接器455。 每一介面連接器45、451、455之後端還是設有一可與 記憶模組2 1之排插2 3相互插合之排針4 9,同樣可藉由此種 方式而將原本只能與SD、MMC、Xd或MS介面相容之記憶模 組2 1 ’擴充成為一種可變換各種介面規格之記憶裴置,以 減少在購買記憶裝置上之成本支出,且又可減少攜帶多種 規格介面記憶裝置的不便。 當然’本實施例中,其介面連接頭亦可設計成為一符 合 MS(Memory Stick)介面規格或 xD(extreme Digital)介 面規格等各種介面規格之介面連接頭,同樣可達成本發明 之發明目的,在此不再贅述。 a最後,4參閱第5圖,係為本發明又一實施例之立體 不2圖:如圖所示,雖然在上述實施例中,記憶模組(2工) 之珂端係為一排插(23)構造,而介面連接器(25)之後端則 匕排針(29)之構造,但在本實施例中,其記憶模組^之 箣而亦可α又汁為一排針5 9構造,而介面連接器η之後端 可=應設計為-排插53構造,藉由排針59與排插^之相 互插=關係,同樣可達成本發明之發明目的。 =:述,當知本發明係有關於一種記憶裝置 一種可防止靜電破壞之纪愔奘番 ^ 右之雷θ X 日μ =置 僅可保有記憶模組原 赴而甚注成广 且又可以防止因為外物接觸到金屬接 j而產生破壞記憶模組之靜電效應者。故 有新顆性、進步性及可供產_用功㈣應符合1274440 V. INSTRUCTION DESCRIPTION (5) ' For example, in Fig. 4C, there is an interface connector 455 having an EEE丨394 interface connector 475. Each of the interface connectors 45, 451, and 455 is further provided with a pin 4 that can be inserted into the interposer 2 3 of the memory module 2 1 , and can also be used only in this way. , MMC, Xd or MS interface compatible memory module 2 1 'expanded into a memory device that can change various interface specifications to reduce the cost of purchasing memory devices, and reduce the carrying of multiple specifications of interface memory devices Inconvenience. Of course, in this embodiment, the interface connector can also be designed as an interface connector conforming to various interface specifications such as an MS (Memory Stick) interface specification or an xD (extreme Digital) interface specification, and can also achieve the purpose of the invention. I will not repeat them here. a final, 4, referring to FIG. 5, is a perspective view of another embodiment of the present invention: as shown in the figure, although in the above embodiment, the end of the memory module (2 work) is a row of plugs. (23) The structure, and the rear end of the interface connector (25) is configured by the pin (29), but in the embodiment, the memory module is abbreviated and the alpha is a row of pins. The configuration, and the rear end of the interface connector η can be designed as a --displacement 53 structure, and the insertion of the pin 59 and the interposer can also achieve the object of the invention. =:Speaking, when you know that the invention is related to a kind of memory device, it can prevent static electricity from being destroyed. ^Right θ X μμ = can only keep the memory module in the original and even into the wide and can Prevent the electrostatic effect of destroying the memory module due to the contact of the foreign object with the metal connection j. Therefore, there is newness, progress and availability of production _ work (four) should be consistent

1274440 五、發明說明(6) 要件無疑,爰依法提請發明專利申請,懇請 貴審查委員 早曰賜予本發明專利,實感德便。 惟以上所述者,僅為本發明之一較佳實施例而已,並 非用來限定本發明實施之範圍,即凡依本發明申請專利範 圍所述之形狀、構造、特徵、精神及方法所為之均等變化 與修飾,均應包括於本發明之申請專利範圍内。1274440 V. Description of invention (6) Undoubtedly, the application for invention patent is filed according to law, and you are requested to give the invention patent as early as possible. However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the shapes, structures, features, spirits, and methods described in the claims of the present invention are Equivalent changes and modifications are intended to be included in the scope of the invention.

第10頁 1274440 圖式簡單說明 第1圖··係為習用SD記憶卡之立體示意圖。 第2圖··係為本發.明可變換介面之記憶裝置之立體示意圖 〇 第3圖··係為本發明如第2圖所示實施例之介面實施示意 圖。 第4 A至4 C圖··係為本發明又一實施例之個別立體示意 圖。 第5圖:係為本發明又一實施例立體示意圖。 【主要元件符號說明】 11 SD 記 憶 卡 13 金 屬 接 點 21 記 憶 模 組 23 排 插 231 插 孔 235 金 屬 接 點 25 介 面 連 接 器 27 介 面 連 接 頭 28 應 用 裝 置 29 排 針 295 框 體 31 保 護 殼 體 45 介 面 連 接 器 451 介 面 連 接 器 455 介 面 連 接 器 47 介 面 連 接 頭 471 介 面 連 接 頭 475 介 面 連 接 頭 51 1己 憶 模 組 53 排 插 55 介 面 連 接 器 59 棑 針Page 10 1274440 Brief description of the diagram Figure 1 is a three-dimensional diagram of a conventional SD memory card. Fig. 2 is a perspective view showing a memory device of the present invention. Fig. 3 is a schematic view of the interface of the embodiment shown in Fig. 2 of the present invention. 4A to 4C are an individual perspective view of still another embodiment of the present invention. Figure 5 is a perspective view showing still another embodiment of the present invention. [Main component symbol description] 11 SD memory card 13 Metal contact 21 Memory module 23 231 socket 235 Jack 235 Metal contact 25 Interface connector 27 Interface connector 28 Application device 29 Pin 295 Frame 31 Protective housing 45 Interface Connector 451 Interface Connector 455 Interface Connector 47 Interface Connector 471 Interface Connector 475 Interface Connector 51 1 Recall Module 53 Socket 55 Interface Connector 59 棑 Pin

第11頁Page 11

Claims (1)

1274440 申5青專利範圍 •一種可防止靜電破壞之記憶裝置,其主要構造係包括 有: 5己憶模組,其前端設有一排插,排插内設有複數個 插孔’插孔内設有一可與記憶模組電性連接之金屬 接點’而記憶模組係可選擇為一SD記憶模組、MMC "己憶模組、XD記憶模組及MS記憶模組之其中之一,· 及 二面連接器,其前端可選擇連接有一應用裝置及一 二:5接碩之其中之-,而其後端則設有-可與該 • 楔組之排插相互插合之排針。 、查垃::專利範圍第1項所述之記憶裝置,其中該介面 IEEFlU Ϊ面連接頭係可選擇為—USB介面連接頭、 M ;1面連接碩、SM介面連接頭、CF介面連接頭 、MS介面連接頭及XD介面連接頭之其中之一者。 利範圍第1項所述之記憶裝置,其中該記憶 杈組外尚可設有一保確M ^ , 邊/V又肢,该保護殼體可用以包覆 該記憶模組。 4 5 •如申請土利範圍第1項所述之記憶裝置,其"亥記憶 模組之前端係没有-排針,而該介面連接器之後端則 相對應設有一排插。 .-種可防止靜裏之記憶裝置’其主要係在一記憶 模組之前端設有二,插’該排插内設有數個插孔,而 該插孔内設有一與該記憶模組電性連接之金屬接點1274440 Shen 5 Green Patent Range • A memory device that can prevent electrostatic damage. Its main structure includes: 5 memory modules, with a row of plugs at the front end and multiple jacks in the sockets. There is a metal contact that can be electrically connected to the memory module, and the memory module can be selected as one of an SD memory module, an MMC " a memory module, an XD memory module, and an MS memory module. · Two-sided connector, the front end of which can be connected to an application device and one of two: 5 to the top of the master - and the rear end is provided with a pin that can be inserted into the row of the wedge group . Chacha: The memory device described in the first item of the patent scope, wherein the interface IEEFlU kneading connector can be selected as a USB interface connector, M; a 1-sided connection, an SM interface connector, and a CF interface connector. One of the MS interface connector and the XD interface connector. The memory device of claim 1, wherein the memory device can be provided with a security M ^ , edge / V limb, and the protective casing can be used to wrap the memory module. 4 5 • If you apply for the memory device described in item 1 of the Tuici range, the front end of the "Hai Memory Module does not have a pin header, and the rear end of the interface connector has a row of plugs. - a memory device that prevents static electricity. It is mainly provided with two at the front end of a memory module. The plug has a plurality of jacks therein, and the jack is provided with a memory module. Sexually connected metal contacts 1274440 六、申請專利範圍 - 6 ·如申請專利範圍第5項所述之記憶裝置,其中該記憶 模組係可選擇為一 S D記憶模組、Μ M C 記憶模組、X D記 憶模組及MS記憶模組之其中之一者。 7 ·如申請專利範圍第5項所述之記憶裝置,其中該記憶 模組外尚可設有一保護殼體,該保護殼體可用以包覆 該記憶模組。 8 ·如申請專利範圍第5項所述之記憶裝置,其中該記憶 模組之前端亦可直接設有一可取代該排插之排針,而 該排針係可與該記憶模組電性連接者。1274440 VI. Scope of Application - 6 · The memory device described in claim 5, wherein the memory module can be selected as an SD memory module, a Μ MC memory module, an XD memory module, and an MS memory. One of the modules. The memory device of claim 5, wherein the memory module is further provided with a protective casing, which can be used to wrap the memory module. 8. The memory device of claim 5, wherein the front end of the memory module is directly provided with a pin that can replace the row, and the pin can be electrically connected to the memory module. By. 第13頁Page 13
TW93139022A 2004-12-15 2004-12-15 Memory device capable of preventing electrostatic destruction TWI274440B (en)

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