^274241 九、發明說明： 【發明所屬之技術領域】 本創作係關於一種記憶卡模組，尤指一種利於可攜帶 快閃記憶體裝置縮小體積及提高容量的記憶卡模組。 【先前技術】 由於半導體科技的快速發展及快^己憶體製造技術的 問世:使攜帶式儲存媒體在容量及尺寸上均有突破性的進 展復m命多消費性電子產品的數位化，例如數位相機、 手機、數位攝影機（dv)、數位播放器（MP3)等，激增了數 位資料儲存媒體的需求與市場，使攜帶式快閃記憶‘裝置 的競爭白熱化。 又攜帶式快閃記憶體基於輕便的要求，尺寸必須儘量 2巧，但容量必須儘量加大，即使其尺寸已標準化，要求 提=容量的呼聲並不曾間歇。事實上，除非半導體製程有 革叩性突破’否則加大容量，目前只能從增加快閃記憶體 的數里著手’但增加元件數量，勢必加大電路板尺寸，又 與規格標準化及輕薄短小的基本產品特性相左，故如何在 Γ有空間限制下，增加電路板可以佈線、安裝元件的有效 工間’即有待進一步研究及謀求可行的解決方案。 【發明内容】 由上述可知，消費市場對於記憶卡此種可攜式 辦擴大各1的期待，但受限於規格化的結構型態難^ 274241 IX. Description of the invention: [Technical field of the invention] The present invention relates to a memory card module, and more particularly to a memory card module which is advantageous for a portable flash memory device to reduce the size and increase the capacity. [Prior Art] Due to the rapid development of semiconductor technology and the advent of fast memory technology: the portable storage media has made breakthroughs in capacity and size, such as the digitalization of multi-consumer electronic products, such as Digital cameras, mobile phones, digital cameras (dv), digital players (MP3), etc., have increased the demand and market for digital data storage media, making the competition of portable flash memory devices hot. The portable flash memory is based on the requirements of light weight, and the size must be as small as possible, but the capacity must be increased as much as possible. Even if the size is standardized, the call for the capacity is not intermittent. In fact, unless the semiconductor process has a breakthrough, otherwise it will increase the capacity. At present, it can only start from increasing the number of flash memory. But increasing the number of components is bound to increase the size of the board, and standardize with specifications and light and short. The basic product characteristics are opposite, so how to increase the effective layout of the circuit board to be able to route and install components under the space constraints is a further study and a feasible solution. SUMMARY OF THE INVENTION As can be seen from the above, the consumer market is expected to expand each of the portable cards of the memory card, but it is difficult to be limited by the standardized structure.
(D 3 1274241 以有所突破。 因此，本發明主要目的在提供一種可增加有效佈線面 積與安裝α件數量的記憶卡模组，透過有效佈、線面積的擴 大並今迕i曰加δ己憶體的數量，可以在規格化的既有結構型 怨下達成加大容量或縮小尺寸之目的。 為達成前述目的採取的主要技術手段係令前述記憶卡 模組包括有：(D 3 1274241 has made a breakthrough. Therefore, the main object of the present invention is to provide a memory card module capable of increasing the effective wiring area and the number of installed α pieces, through the effective cloth, the expansion of the line area, and the current The number of memory elements can be increased or reduced in size under the existing structural grievances. The main technical means to achieve the above objectives is that the aforementioned memory card modules include:
一弟一電路板，具有一第 ，該第一電路板在第一表面上設有至少 控制器等； 一表面及一相對的第二表面 一個快閃記憶體及 一寻務",面埠，係由一第二電路板構成，其設於第一 電路板的-端，並與第一電路板上的線路構成電連接；該 第二電路板具有一第一表面及一相對的第二表面’盆第一 有複數的介面接點，第二表面則形成-適當深 厪的鏤空部； 前述記憶卡模組係利用傳輸介 快閃記憶體盥外部連接㈣A〜 板上所設 輸介面埠在…=1::作為傳輸媒介外，該傳 空部，而ΐυ 表面上形成適當面積的鏤 缘及安於該鏤空部的位置即仍為可供佈 他计體70 空間’該空間如用來安裝控制器及其 ==外的元件，，電路板的第一 _ 部相對位置以外將挪出更 释工 量，進而擴大記憶體容量。 可-加安裝記憶體的數 前述第二電路板的第二表面形成有複數的焊塾，各焊 1274241 墊係分別對應位於第一表面上 塾與介面接點係透過一導通^《點，每一相對的焊 為一導通孔。 導通手&相互連接。該導通手段可 【實施方式】 外如第一、二圖所示，本發明之記憶卡模組主要係令— 弟一電路板（1 〇)且有一篦一 楚一生 、有第一表面（11)及一相對的 弟—表面（1 ?)、七云墙 j. 以第一表面（1 1 )上設有至少一個 快閃記憶體、控制器（圖中未 二 、口丁木乃不）及一傳輸介面埠； 遠傳輸介面埠倍由—笛- — 係自¥ -電路板（2 0 )構成，其以 塾南形式設於前述第-電路板（10)的-端，作為第一 。，反（1 0 )與外部連接的傳輸介面；$第二電路板（ 2 ◦)具有一第-表面（2 1 ) &-相對的第二表面（2 '、第表面（2 1 )上形成有複數的介面接點（2 3) ’第二表面（22)之外側端上形成有複數的焊墊( 2 4 )(请參閱第三圖所示），其分別對應於第—表面（ 2 1 )上的介面接.點（2 3 )且相互導通，是用來與第一 電路板（1 〇)上的線路電連接，其一種可行的導通方式 為導通孔，又前述第二電路板（2Q)的第二表面（U 匕，其内側端上形成一規則形狀且具適當面積、深度的鏤 空部（25)，由於鏤空部（25)係局部地鏤空第二電 路板（2〇)的第二表面（22)，並貫通其内側壁，因 此在第電路板（1 〇 )的相對位置原本應該被第二電路 板（2 〇 )元全覆蓋，亦即無法作線路佈局及安裝元件的 ⑧ 5 1274241 區域，而 )局部鏤 而空出更 他記憶體 面（1 1 未利用前 憶體元件 憶體的安 (25) )空出更 制器及其 一電路板 用來增加 量° 利用前述使第二電路板（2〇)第二表面（22 空之設計，即可將前述的覆蓋區域儘量地縮小， 多的有效空間供作為製作線路及安裝控制器及其 以外的元件。由於第一電路板（1〇)的第—^ )上除記憶體外，另安裝控制器及其他元件，^ 述技術以爭取更多的空間時，控制器及其他非記 的安裝亦必須佔去相當的面冑，當然亦限制了記 裝數量，今透過第二電路板（2 Q ) ±的鎮空部 設計，使第一電路板（JL 〇 )的第一表面（工工 多的有效空間，則該挪出的空間即可用來安裝控 他記憶體以外的元件，巾因該等元件挪開後在； (10)第一表面（11)±空出的空間，即可 記憶體的數量，從而可有效擴大記憶卡模組的容 在具體可行的實施例方面，可將前述記憶卡模組的技 〇)内，該表殼 其前端形成有複 一门形截面而具 =用在SDt己憶卡上，如第四圖所示，其係令前述的記 憶卡模組包裝在一種”一次蓋，，的表殼（ (3 0 )係符合SD記憶卡的標準規格 數的槽口（31)，又表殼（3〇)係 備適當的深度，供容置前述記憶卡模組< ::‘时模組係令第一電路板（1〇)的第二表面（ 入方切表喊（3 〇)丨部開口大致保持齊平，並可以膠 =其相f結合。χ第-電路板（1 〇)對應於表殼 上所°又槽口（31 )的一端設有傳輸介面璋，該 l27424l ‘ ^介面蟑的第二電路板（2Q)上所設介面接點（23 適分別位於表殼（30)對應位置所形成的槽口（Η 使該等介面接點（23)露出於各槽口（31)間， 作為外部連接之用。 請配合參閱第五圖所示，由於記憶卡模組的第一電路 反（10)係以第二表面（12)趨近表殼（3〇)底部 ’在此狀況下’將使第一電路板（丄〇 )第一表面（工丄 與表殼（3 0 )内側壁間具有較大的間隙，由於空間較 大故可供安裝厚度較高的記憶體元件。至於設有傳輸介 的第表面（1 1)另端則因其上所設的第二電路板 (2〇)在其相對的第二表面上形成有鏤空部（25)， 故空出一適當高度的空間，供安裝控制器及其他元件，如 此來即可進—步獲得安裝記憶體的最大有效空間，以擴 大其容量。 則述。己隱卡模組亦可運用在可攜帶快閃記憶體裝置（ 亦即一般俗稱的隨身碟TM、大姆哥TM) ·· “凊參閱第六圖所示，運用在可攜帶快閃記憶體裝置的 。己憶，模組基本結構型態相同，其係於第一電路板（丄〇 )的第表面（1 1 ) 一端設有快閃記憶體、控制器等， 表面（1 1 )另端則設置傳輸介面埠，於本實施例中 ，刻專輸介面琿係一 USB接頭，而構成該傳輸介面埠之第 電路板（2 0 )於第-表面（2 1 )形成複數的導電端 子（26)，其第二表面（22)除設有與導電端子（2 6)電連接的焊塾（圖中未示）外，並形成有鏤空部 ^74241 由上述可知，本發明 作為第一#拉把μ °己匕卡軼組係利用傳輸介面埠 作為傳輸：人閃記憶體與外部連接的媒介，除 面上“二 傳輸介面埠在與第-電路板的相對表 因二Γ “積的鏤空部’而第-電路板的第-表面並 择，… “布線及女裝元件的有效空間，使能 k侍女裝§己憶體的最大右柃 p曰 取大有效空間。故以前述記憶卡模組確 :備突出的技術特徵與顯然的進步性，並符合發明專利 要件。 【圖式簡單說明】 第一圖：係本發明一較佳實施例之立體圖。 第二圖··係本發明一較佳實施例之分解圖。 第三圖：係本發明一較佳實施例之剖視圖。 卜圖係本發明一較佳實施例運用於S D記憶卡之 分解圖。 第五圖：係本發明一較佳實施例運用於SD記憶卡之 剖視圖。 第六圖··係本發明又一較佳實施例之立體圖。 【主要元件符號說明】 (1 〇 )第一電路板（11) (21)第一表面 (2〇)第二電路板（12)(22)第二表面 (2 3 )介面接點 （2 4 )焊墊 1274241 (25)鏤空部 （26)導電端子 (30)表殼 （31)槽口 ⑧a first circuit board having a first circuit board having at least a controller on the first surface; a flash memory and a search for a surface and an opposite second surface; The second circuit board is formed at a terminal end of the first circuit board and electrically connected to the circuit on the first circuit board; the second circuit board has a first surface and an opposite second The surface of the basin has a plurality of interface contacts, and the second surface forms a suitably deep hollow portion; the memory card module utilizes a transmission flash memory and an external connection (4) A to the interface provided on the board. In the case of ...=1:: as the transmission medium, the space is formed, and the edge of the 面积 surface forming an appropriate area and the position of the hollow portion are still available for the space of the body 70. To install the controller and its components outside the ==, the board will be moved out of the first position relative to the first position, thus expanding the memory capacity. The second surface of the second circuit board can be formed with a plurality of soldering pads, and the pads of the 1274241 pads are respectively located on the first surface, and the interface contacts are transmitted through a conductive line. A relative weld is a through hole. The passers & are connected to each other. The conduction means can be implemented as follows. As shown in the first and second figures, the memory card module of the present invention is mainly a circuit board (1 〇) and has a first life and a first surface (11). And a relative brother-surface (1?), seven cloud wall j. at least one flash memory, controller (not in the figure, not only) The transmission interface 埠; the far transmission interface 埠 由 — — 系 系 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 , the reverse (10) transmission interface with the external connection; the second circuit board (2 ◦) has a first surface (2 1 ) & - opposite second surface (2 ', the first surface (2 1 ) Forming a plurality of interface contacts (2 3) 'The second surface (22) is formed with a plurality of pads (24) on the outer side ends (see the third figure), which respectively correspond to the first surface ( 2 1) The upper interface is connected to the point (2 3 ) and is electrically connected to each other for electrically connecting to the line on the first circuit board (1 〇). One possible conduction mode is the via hole, and the second circuit is a second surface (U 匕 of the plate (2Q) having a regular shape and a hollow portion (25) having a proper area and depth on the inner end thereof, wherein the second circuit board is partially hollowed out due to the hollow portion (25) The second surface (22) penetrates the inner side wall, so that the relative position of the first circuit board (1 〇) should be completely covered by the second circuit board (2 〇), that is, the line layout and installation cannot be performed. The 8 5 1274241 area of the component, and) is partially vacated and frees his memory surface (1 1 does not utilize the pre-recall element's memory (2) 5)) vacating the controller and a circuit board for increasing the amount. By using the foregoing second substrate (2 〇) second surface (22 empty design, the aforementioned coverage area can be reduced as much as possible, The effective space is used as the production line and the controller and other components. Since the first circuit board (1〇) is in addition to the memory, the controller and other components are installed, and the technology is called for more In the case of a lot of space, the controller and other non-recording installations must also occupy a considerable amount of face. Of course, the number of recordings is limited. Today, through the second circuit board (2 Q ) ± the design of the air section, the first The first surface of the circuit board (JL 〇) (the effective space for the worker, the space that can be removed can be used to install components other than the memory, and the towel is moved after the components are removed; (10) a surface (11) ± vacant space, that is, the number of memory, so that the memory card module can be effectively expanded in a specific feasible embodiment, the technology of the aforementioned memory card module can be The front end of the case is formed with a multi-gate section and is used in the SDt On the memory card, as shown in the fourth figure, the above-mentioned memory card module is packaged in a "one-time cover, the case ((3 0) is a slot that conforms to the standard specification number of the SD memory card (31) ), and the case (3〇) is provided with an appropriate depth for accommodating the aforementioned memory card module <::' module to make the second surface of the first circuit board (1〇) Shout (3 〇) The opening of the crotch is generally flush and can be glued to its phase f. The first circuit board (1 〇) corresponds to the end of the case and the notch (31) is provided with a transmission interface.璋, the interface contacts formed on the second circuit board (2Q) of the l27424l '^ interface ( (23 are respectively located at the corresponding positions formed by the corresponding positions of the case (30) (Η such interface contacts (23) It is exposed between the slots (31) for external connection. Please refer to the fifth figure, because the first circuit of the memory card module is reversed (10) with the second surface (12) approaching the bottom of the case (3〇) 'in this case' will make the first circuit The first surface of the plate (丄〇) has a large gap between the inner side wall of the workpiece and the case (30). Because of the large space, it is possible to install a memory component with a relatively high thickness. The other end of the surface (11) is formed with a hollow portion (25) on the opposite second surface of the second circuit board (2) provided thereon, so that a space of an appropriate height is vacated for installation control. And other components, so that you can get the maximum effective space for installing memory to expand its capacity. The hidden card module can also be used in portable flash memory devices (also known as common The USB Flash DriveTM, Big BrotherTM) ·· “Refer to the figure 6 and use it in the portable flash memory device. The basic structure of the module is the same, and it is attached to the first circuit board. (丄〇) The surface (1 1 ) has flash memory, controller, etc. on one end, surface (1 1 ) In the embodiment, the transmission interface is configured as a USB connector, and the first circuit board (20) constituting the transmission interface 形成 forms a plurality of conductive terminals on the first surface (2 1 ). (26), the second surface (22) is provided with a solder joint (not shown) electrically connected to the conductive terminal (26), and is formed with a hollow portion ^74241. As described above, the present invention is the first #拉把μ°匕匕匕 The system uses the transmission interface埠 as the transmission: the medium connected to the external flash memory and the external interface, except for the “two transmission interface” and the relative surface factor of the first board. The hollow part 'and the first surface of the first board - and ..., "the effective space of the wiring and the women's components, so that the maximum right 柃 曰 己 己 己 的 己 己 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 己 己 己 § § § § § § § The foregoing memory card module is: a prominent technical feature and obvious advancement, and meets the requirements of the invention patent. [Simplified description of the drawings] The first figure is a perspective view of a preferred embodiment of the present invention. An exploded view of a preferred embodiment of the present invention. A cross-sectional view of a preferred embodiment of the present invention is applied to an exploded view of an SD memory card. Fig. 5 is a cross-sectional view of a preferred embodiment of the present invention applied to an SD memory card. A perspective view of another preferred embodiment of the present invention. [Description of main component symbols] (1 〇) First circuit board (11) (21) First surface (2 〇) Second circuit board (12) (22) Second surface (2 3 ) interface contact (2 4 ) pad 1274241 (25) hollow portion (26) conductive terminal (30) case (31) notch 8