1273717 17461twf.doc/006 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種封裝體陣列結構（package matrix)與封裝製程，且特別是有關於—種電子裝置的封 裝體陣列結構與封裝製程。 【先前技術】 在現今資訊世代的社會下，電子裝置在日常生活中已 佔有舉足輕重的地位，而電子裝置的核心便是晶片，晶片 了透過承載為而與其他晶片或被動元件相電性 例而言，上述電子裝置可以是互補式金氧連半接導體 (complementary metal-oxide semiconductor，CMOS )感測 态、電荷耦合元件（charge couple device，CCD)攝影機、 矽基液晶（liquid crystal on silicon，LCOS)顯示裝置或數 位光學處理（digital light processing，DLP)投影機等等。 一般而言，上述電子裝置之晶片封裝製程是針對一封 裝體陣列、_進行切割以得到多個封賴（package)。圖 不習知之一種封裝製程的流程圖，圖2A至圖2F則繪 不白知之-種封裝製程的示意圖。在此必須說明的是，為 了方便“述以下製程’圖2A、圖2B、圖2D與圖2F為侧 視示意圖，而與圖2E為俯視示意圖，而習知封裝製 程的步驟如下所述。 首先，請參考圖1與圖Μ，進行步驟S110，提供一 習知封裝體_結構刚。f知封裝體_結構⑽包括 !273717 ]7461twf.doc/006 一晶圓（wafer) 110 與一透光基板（transmissive substrate) 120。晶圓lio具有一正面112與一背面，且晶圓il〇 具有多個以陣列方式排列於正面112上之晶片116。此外， 透光基板120與晶圓11〇之正面112接合，以覆蓋住這些 晶片116。 • 接著，請參考圖1與圖2B，進行步驟sl2〇，黏附一 ^ 膠膜（tape) 130於透光基板12〇上，以防止在進行後續切 • 害1J步驟時，透光基板120之表面受到刮損（scratch)。接 著，請參考圖1與圖兀，進行步驟sl3〇，對於晶圓11〇 之背面114進行切割，以形成多條第一切割道（firstcut) FC ’並於晶圓n〇的邊緣形成兩條相互垂直的參考切割道 (reference cut) RC。 “再來，請參考圖1與圖2D，進行步驟sl4〇，移除膠 膜丨3〇 (見圖2C)，且黏附一膠膜13〇,於晶圓n〇的背面 114上。再來，請爹考圖1與圖2E，進行步驟μ刈，以上 述兩條參考切割道RC (見圖2C)為基準，對於透光美板 120，行切割，以形成多條與第一切割道Fc (見圖 相對背且與參考切割道RC才目平行之第2切割道％。然 後，請參考圖j與圖2F，進行步驟sl6〇，移除膠膜 (見圖2E)且進行機台（未會示）裂片的單體化製程以形 成多個獨立之封裝體100,。 然而，習知封裝製程中必須先於晶圓上完成兩條相互 垂直的參考切割道，因此習知封裝製程步驟上較為繁瑣。 此外，在切割透光基板時，所必須平移的特定距離若產生 1273717 17461twf.doc/006 些許誤差，將造成這些 道對齊。由上述可知， 第二切割道無法與對應之第-切割 白知封裝製程實有改進之必要。 【發明内容】 本發明的目的是提供-種封裝體陣列結構，以解 切割道與第二切割道之間無法完全對應的問題。 本發明的又-目的是提供一種封裝製程，以解決製程1273717 17461twf.doc/006 IX. Description of the Invention: [Technical Field] The present invention relates to a package matrix and a package process, and more particularly to a package array structure of an electronic device And packaging process. [Prior Art] In today's information society, electronic devices have occupied a pivotal position in daily life, and the core of electronic devices is wafers, which are electrically connected to other wafers or passive components. In other words, the electronic device may be a complementary metal-oxide semiconductor (CMOS) sensing state, a charge couple device (CCD) camera, or a liquid crystal on silicon (LCOS). A display device or a digital light processing (DLP) projector or the like. In general, the chip packaging process of the above electronic device is performed for a package array, _ to obtain a plurality of packages. A flow chart of a packaging process that is not conventional, and FIG. 2A to FIG. 2F are schematic diagrams of a packaging process. It should be noted that, in order to facilitate the description of the following processes, FIGS. 2A, 2B, 2D, and 2F are schematic side views, and FIG. 2E is a schematic top view, and the steps of the conventional packaging process are as follows. Referring to FIG. 1 and FIG. 1 , step S110 is performed to provide a conventional package _ structure. The package _ structure (10) includes! 273717] 7461 twf. doc / 006 a wafer 110 and a light transmission A substrate lio has a front surface 112 and a back surface, and the wafer il has a plurality of wafers 116 arranged in an array on the front surface 112. Further, the transparent substrate 120 and the wafer 11 are The front side 112 is joined to cover the wafers 116. • Next, referring to FIG. 1 and FIG. 2B, step s1 is performed, and a tape 130 is adhered to the transparent substrate 12 to prevent subsequent cutting. • In the case of the 1J step, the surface of the transparent substrate 120 is scratched. Next, referring to FIG. 1 and FIG. 进行, the step s13 is performed, and the back surface 114 of the wafer 11 is cut to form a plurality of strips. A cut (firstcut) FC 'and on the wafer n The edges form two mutually perpendicular reference cuts RC. "Follow, please refer to Figure 1 and Figure 2D, proceed to step sl4, remove the film 丨3〇 (see Figure 2C), and attach one The film 13 is on the back side 114 of the wafer. Referring again to FIG. 1 and FIG. 2E, the steps μ刈 are performed, and the two reference cutting RCs (see FIG. 2C) are used as reference. For the light-transmissive plate 120, the lines are cut to form a plurality of lines and the first Cutting lane Fc (see the second cutting lane % opposite to the back and parallel to the reference cutting lane RC. Then, referring to Fig. j and Fig. 2F, performing step s16, removing the film (see Fig. 2E) and performing The singulation process of the splicing of the machine (not shown) to form a plurality of independent packages 100. However, in the conventional packaging process, two mutually perpendicular reference dicing streets must be completed on the wafer, so that it is known The packaging process is cumbersome. In addition, when cutting a transparent substrate, the specific distance that must be translated will produce 1273717 17461twf.doc/006 slight error, which will cause these alignments. As can be seen from the above, the second cutting channel cannot correspond. The present invention is directed to providing a package array structure to solve the problem that the scribe line and the second scribe line cannot completely correspond to each other. Again - the purpose is to mention A packaging process, in order to solve the process
步驟較為繁瑣的問題 基於上述目的，本發明提出一種封裝體陣列結構，包 括-晶圓、-透光基板與-透光環狀體。巧，晶圓具有 -正面以及-背面，且晶圓具有多個陣列排列於^面^之 晶片。此外，透光基板與晶圓之正面接合，以覆蓋住這些 晶片。另外，透光環狀體與晶圓的外緣連接。 依照本發明的一實施例，上述之封裝體陣列結構更包 括多個膠框（sealant)，配置於晶圓與透光基板之間，以More cumbersome steps Based on the above objects, the present invention provides a package array structure comprising a wafer, a light transmissive substrate and a light transmissive annular body. Coincidentally, the wafer has a front side and a back side, and the wafer has a plurality of arrays arranged on the surface of the wafer. In addition, the light transmissive substrate is bonded to the front side of the wafer to cover the wafers. Further, the light-transmitting annular body is connected to the outer edge of the wafer. According to an embodiment of the invention, the package array structure further includes a plurality of sealants disposed between the wafer and the transparent substrate to
使晶圓與透光基板接合，其中每一膠框環繞於對應之晶片 外圍。 依照本發明的一實施例，上述之封裝體陣列結構更包 括一膠膜，配置於晶圓之背面。 依照本發明的一實施例’上述之透光基板可具有多條 第一切割道，而透光環狀體可具有多對位於對應之第一切 割道兩端，且與對應之第一切割道平行之輔助切割道 (auxiliary scribe line )。此外，上述具有多條第一切割道 之透光基板的實施例中，晶圓之背面可具有多條第二切割 7 l2^3717 17461twf.doc/006 道。另外，這些第二切割道與這些第一切割道對齊，或者 這些第二切割道與這些第一切割道維持一偏移量（〇ffset)。 依照本發明的一實施例，上述之透光基板包括矩形基 板’且矩形基板之長度與寬度係大於或等於晶圓之直徑。 依照本發明的一實施例，上述之透光基板包括玻璃基 板或塑膠基板。The wafer is bonded to the light transmissive substrate, with each frame surrounding the corresponding wafer periphery. According to an embodiment of the invention, the package array structure further includes a film disposed on the back surface of the wafer. According to an embodiment of the present invention, the light-transmissive substrate may have a plurality of first dicing streets, and the light-transmissive annular body may have a plurality of pairs located at opposite ends of the corresponding first scribe line and corresponding to the first scribe line. Parallel auxiliary scribe line. In addition, in the above embodiment of the transparent substrate having a plurality of first dicing streets, the back side of the wafer may have a plurality of second cuts 7 l2^3717 17461 twf.doc/006. Additionally, the second scribe lines are aligned with the first scribe lines, or the second scribe lines are maintained at an offset (〇ffset) from the first scribe lines. In accordance with an embodiment of the invention, the light transmissive substrate comprises a rectangular substrate and the length and width of the rectangular substrate are greater than or equal to the diameter of the wafer. According to an embodiment of the invention, the light transmissive substrate comprises a glass substrate or a plastic substrate.
依照本發明的一實施例，上述之透光環狀體之材質包 括透明膠體。 ' 基於上述目的，本發明提出一種封裝製程，包括下列 步驟。首先，提供一封裝體陣列結構，其包括一晶圓、一 ，光基板與一透光環狀體。其中，晶圓具有一正面以及一 为面，且晶圓具有多個陣列排列於正面上之晶片。此外， 透光基板與晶圓之正面接合，以覆蓋住這些晶片。另外， 透光環狀體與晶圓的外緣連接。 接著，切割透光基板以及透光環狀體，以於透光基板 上形成多條第-_道，並且同時於透紐狀體上形成多 ，位於對應之第—切割道兩端，且與對應之第—切割道平 =之辅助_道。再來，參考這些輔助切割道的位置來切 ^晶圓的背面，以於晶_背面上形成多條第二切割道。 ’、、、、後，進行單體化製程，以形成多個獨立之封裝體。 ，照本發明的1關，上述之透光雜體例如藉由 的方式形成於晶圓的外緣。 依照本發明的-實施例，上述之參考這些輔助切割道 、立置來切割晶圓之背面的方法包括：於晶圓的背面上形 8 1273717 1746 ltwf.doc 層 6 成與這些弟 切割道對齊之這些第二切割道。 成與割，偏移量之這些以 土； ^與習知相較，本發明之封梦制劣口少Μ羽According to an embodiment of the invention, the material of the light-transmitting annular body comprises a transparent colloid. Based on the above object, the present invention proposes a packaging process comprising the following steps. First, a package array structure is provided, which comprises a wafer, a light substrate and a light-transmissive annular body. Wherein, the wafer has a front side and a side surface, and the wafer has a plurality of wafers arranged in an array on the front side. In addition, the light transmissive substrate is bonded to the front side of the wafer to cover the wafers. In addition, the light-transmissive annular body is connected to the outer edge of the wafer. Then, the light-transmissive substrate and the light-transmissive annular body are cut to form a plurality of first-channels on the transparent substrate, and at the same time, formed on the through-shaped body, at the opposite ends of the corresponding first cutting channel, and Corresponding to the first - cutting road level = the auxiliary _ road. Then, the back surface of the wafer is cut by referring to the positions of the auxiliary dicing streets to form a plurality of second dicing streets on the crystal back surface. After the ', , , and then, a singulation process is performed to form a plurality of independent packages. According to the first aspect of the present invention, the above-mentioned light-transmitting body is formed on the outer edge of the wafer, for example. In accordance with an embodiment of the present invention, the method of cutting the back side of the wafer with reference to the auxiliary scribe lines and the stand-up includes: forming a layer of 8 1273717 1746 ltwf.doc on the back side of the wafer to align with the dicing lines These second cutting lanes. Formation and cutting, the offset of these to the soil; ^ compared with the conventional, the invention of the dream of the inferior mouth less feathers
从為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉較佳實補，並§〔合所_式，作詳細說 明如下。 ν σ 3製程中^切割參考切割道的步驟，因 ί製程可以提升_步驟巾岐率。料，本發 j在對於晶圓之背面進行第二切割道之切割步驟時^ t考形成於透光環狀體上的辅助切割道，因此可避 乐二切割道與相對應之第—切割道之間誤差的產生。 【實施方式】 圖3繪示本發明一實施例之封裝製程的流程圖，圖4Α 至圖4F則繪示本發明一實施例之封裝製程的示意圖。在 此必須說明的是，為了方便描述以下製程，圖4Α、圖、 圖4Ε與圖4F為侧視示意圖，而圖4Β與圖4D為俯視示 意圖。 本實施例之封裝製程的步驟如下所述。首先，請參考 圖3與圖4Α，進行步驟S210,提供一封裝體陣列結構2〇〇。 封I體陣列結構200包括一晶圓210、一透光基板220與 一透光環狀體230。其中，晶圓210具有一正面212以及 9 1273717 17461twf.doc/006 一背面214,且晶圓210具有多個以陣列方式排列於正面 212上之晶片216。透光基板220與晶圓210之正面212 接合，以覆蓋住這些晶片216。透光環狀體230與晶圓21〇 的外緣連接，且透光環狀體230例如藉由點膠的方式形成 於晶圓210的外緣。必須說明的是，在本實施例中，封裝 體陣列結構更包括-膠膜240，其例如為紫外線膠膜且^ 置於晶圓210之背面214上，以防止在進行後續切割步驟 時’晶圓210之背面214受到刮損。 就外型而a，透光基板220包括矩形基板，且其長度 與寬度大於或等於晶圓210之直徑。就材料而言，透光基 板220包括玻璃基板或塑膠基板，且透光環狀體23〇之材 質包括透明膠體。必須進一步說明的是，上述透光基板22〇 泛指任何能夠由其一侧看到其另一侧之物體或影像的基 板例如透明恶色的基板或有顏色但仍能看到對侧之物體 或影像的基板。透光環狀體230泛指任何能夠由其一侧看 到其另一侧之物體或影像的環狀體，例如如透明無色的環 狀體或有顏色但仍能看到對侧之物體或影像的環狀體。 請再參考圖4A，在本實施例中，封裝體陣列結構200 更包括多個膠框250。這些膠框250配置於晶圓210與透 光基板220之間，以使得晶圓210與透光基板220接合， 其中每一膠框250環繞於對應之晶片216的外圍。此外， 膠框250之材質通常採用熱固化（heat curing)樹脂或紫 外線固化（ultraviolet curing)樹脂，其分別藉由加熱或紫 外線照射的方式固化。 10 1273717 17461twf.doc/〇〇6 接著，請參考圖3與圖4B，進行步驟S22〇，切割透 光基板220以及透光環狀體230，以於透光基板220上形 成多條第一切割道FC’，並且同時於透光環狀體23〇上形 成夕對位於對應之第一切割道FC’兩端，且與對應之第一 切軎彳道FC’平行之輔助切割道AS。在本實施例中，這些第 一切割道FC，的深度接近透光基板22〇的厚度，換言^， 這些第一切割道FC，不足以讓透明基板22〇分離成多個單 元。 接著，請參考圖3與圖4C，本實施例可進行步驟 S230，將紫外線照射於膠膜24〇 (見圖4B)上，以使得膠 膜240與晶圓210之背面214分離而移除膠膜240，並且 黏附一膠膜240,於透光基板220之表面上。 再來，請參考圖3與圖4D，進行步驟S240，參考這 些辅助切割道AS的位置來切割晶圓210的背面21扣以^ 晶圓210的背面214上形成多條第二切割道sc，。在本實 施例中，這些第二切割道sc，是對齊於這些第一切割道 (見圖4B)。此外，這些第二切割道sc，的深度接近晶圓 210的厚度，換言之，這些第二切割道sc，不足以讓^圓 210分離成多個單元。另外，先後進行上述步驟與 S230時，切割透光基板22〇與晶圓21〇之背面214的刀^ 通常不同。在此必須說明的是，請參考圖5，其繪示本發 明另一實施例之封裝體陣列結構的侧視示意圖，另―實^ 例兵上述貝知例之不同處在於，另一實施例可於封裝體陣 列結構300之晶圓31〇的背面314上形成與這些第—切判 1273717 17461twf.doc/〇〇6 ^FC維持一偏移量d之第二切割道SC，，。 « S24° ^ 4Β)，而、具有多條第一切割道FC’（見圖 FC，兩# ^狀體’財多對位於對應之第—切割道 AS。此^ T對應之第1割道FC’平行之辅助切割道 有多條 維持-偏移i疒一则逼sc，，與這些第—切割道fc，，可 外線44ed; I進行步驟咖，將紫 透光基板现之表面分__ 環狀體230 (見圖4D)。 卫且私除透先 然後，請參考圖3與圖4F，進行步驟 製程，以形成多個獨立之封裝體,。本實施二早：： 化製程例如是以機台（切裂片的方式’早脰 具有本發明之㈣體陣舰構細裝製程至少 (一） 與習知相較，本發明之封裴 製程中進行切割參考切贿的步驟，因 程可以提升切割步驟中的效率； &之封裝製 (二） 本發明之封裝製程在對於晶圓之背 — 切割道之_步斜，可參考形成於透光環狀體上 12 1273717 17461twf.doc/006 應之第一切割 切割迢，因此可避免每一第二切割道與相對 道之間誤差的產生。 雖然本發明已哺佳實_賊如上， =明，習此技藝者，在不脫離本發明之: ^耗圍内’ *可作些許之更動與_，因此本發明申 粑圍當視後附之申請專利範圍所界定者為準。 ”禮 圖式簡單說明】 圖1緣示料之-觀錢_流程圖。 至知之—種封錄程的示意圖。 =，不本發明一實施例之封裝製程的流程圖。 意圖 不 圖从至圖仲騎示本發明—實施例之封震製程的 圖示意圖 5繪示本發明另一實 施例之封裝體_結構的側視 【主要元件符號說明】 100、200 :封裝體陣列結構 100，、200’ ：獨立之封裝體 110、210 :晶圓 112、212·晶圓之正面 114、214 :晶圓之背面 116、216·晶片 120、220 :透光基板 130、130’、240、240, ··膠膜 13 1273717 17461twf.doc/006 230 :透光環狀體 250 :膠框 AS :輔助切割道 FC、FC’、FC” ：第一切割道 RC :參考切割道 SC、SC’、SC” ：第二切割道 d :偏移量The above and other objects, features and advantages of the present invention will become more apparent from the <RTIgt; In the ν σ 3 process, the step of cutting the reference scribe line can improve the 岐 step rate. In the case of the cutting step of the second cutting pass on the back side of the wafer, the test j is formed on the auxiliary cutting track formed on the light-transmissive annular body, so that the second cutting path and the corresponding first cutting can be avoided. The generation of errors between the tracks. 3 is a flow chart of a packaging process according to an embodiment of the present invention, and FIGS. 4A to 4F are schematic views showing a packaging process according to an embodiment of the present invention. It is to be noted that, in order to facilitate the description of the following processes, FIG. 4A, FIG. 4A and FIG. 4F are side views, and FIGS. 4A and 4D are top views. The steps of the packaging process of this embodiment are as follows. First, referring to FIG. 3 and FIG. 4, step S210 is performed to provide a package array structure 2A. The package body array structure 200 includes a wafer 210, a light transmissive substrate 220 and a light transmissive annular body 230. The wafer 210 has a front surface 212 and a back surface 214 of 9 1273717 17461 twf.doc/006, and the wafer 210 has a plurality of wafers 216 arranged in an array on the front surface 212. The light transmissive substrate 220 is bonded to the front side 212 of the wafer 210 to cover the wafers 216. The light-transmissive annular body 230 is connected to the outer edge of the wafer 21A, and the light-transmitting annular body 230 is formed on the outer edge of the wafer 210 by, for example, dispensing. It should be noted that, in this embodiment, the package array structure further includes a film 240, which is, for example, an ultraviolet film and is disposed on the back surface 214 of the wafer 210 to prevent the crystal from being cut during the subsequent cutting step. The back side 214 of the circle 210 is scratched. In terms of the outer shape, a, the light-transmitting substrate 220 includes a rectangular substrate and has a length and a width greater than or equal to the diameter of the wafer 210. In terms of materials, the light-transmitting substrate 220 includes a glass substrate or a plastic substrate, and the material of the light-transmitting annular body 23 includes a transparent colloid. It should be further noted that the above-mentioned transparent substrate 22 generally refers to any substrate which can see an object or image on the other side of one side thereof, such as a transparent opaque substrate or an object that is colored but still can see the opposite side. Or the substrate of the image. The light-transmissive annular body 230 generally refers to any annular body that can see an object or image on the other side of one side thereof, such as a transparent colorless annular body or a colored but still visible opposite object or The annular body of the image. Referring to FIG. 4A again, in the embodiment, the package array structure 200 further includes a plurality of plastic frames 250. The plastic frame 250 is disposed between the wafer 210 and the light transmissive substrate 220 such that the wafer 210 is bonded to the transparent substrate 220, wherein each of the plastic frames 250 surrounds the periphery of the corresponding wafer 216. Further, the material of the frame 250 is usually a heat curing resin or an ultraviolet curing resin which is cured by heating or ultraviolet rays, respectively. 10 1273717 17461twf.doc/〇〇6 Next, referring to FIG. 3 and FIG. 4B, step S22 is performed to cut the transparent substrate 220 and the transparent annular body 230 to form a plurality of first cuts on the transparent substrate 220. The track FC', and simultaneously formed on the light-transmissive annular body 23〇, is located at the opposite ends of the corresponding first cutting track FC' and parallel to the corresponding first cutting channel FC'. In the present embodiment, the depth of these first dicing streets FC is close to the thickness of the transparent substrate 22, in other words, these first dicing streets FC are insufficient to separate the transparent substrate 22 into a plurality of cells. Next, referring to FIG. 3 and FIG. 4C, in this embodiment, step S230 may be performed to irradiate ultraviolet rays on the adhesive film 24 (see FIG. 4B), so that the adhesive film 240 is separated from the back surface 214 of the wafer 210 to remove the glue. The film 240 is adhered to a film 240 on the surface of the light-transmitting substrate 220. Referring to FIG. 3 and FIG. 4D, step S240 is performed to cut the back surface 21 of the wafer 210 with reference to the positions of the auxiliary dicing streets AS to form a plurality of second dicing streets sc on the back surface 214 of the wafer 210. . In the present embodiment, these second scribe lines sc are aligned with these first scribe lines (see Figure 4B). Further, the depth of these second dicing streets sc is close to the thickness of the wafer 210, in other words, these second dicing streets sc are insufficient to separate the ^ 210 into a plurality of cells. Further, when the above steps and S230 are successively performed, the knives for cutting the transparent substrate 22 and the back surface 214 of the wafer 21 are generally different. It should be noted that, please refer to FIG. 5, which is a side view of a package array structure according to another embodiment of the present invention, and another difference is that the above-described example is different in another embodiment. A second scribe line SC, which is maintained at an offset d from the first step 11173717 17461 twf.doc/〇〇6 ^FC, may be formed on the back surface 314 of the wafer 31 of the package array structure 300. « S24° ^ 4Β), and with multiple first cutting lanes FC' (see Figure FC, two #^形体's pairs are located in the corresponding first-cutting lane AS. This ^ T corresponds to the first cutting lane The FC' parallel auxiliary cutting track has a plurality of sustain-offsets, ie, one is forced to sc, and with these first-cutting streets fc, the outer line 44ed; I perform the step coffee, and the surface of the purple transparent substrate is divided _ _ Annular body 230 (see Figure 4D). Guard and privately pass through then, please refer to Figure 3 and Figure 4F, step process to form a plurality of independent packages, this implementation of the second early:: process such as It is a machine (the method of cutting the lobes), which has the (4) body array frigate process of the present invention at least (1). Compared with the prior art, the step of cutting and referring to bribery in the sealing process of the present invention is The process can improve the efficiency in the cutting step; & packaging (2) The packaging process of the present invention is on the back of the wafer - the slanting of the scribe line can be referred to on the transparent ring body 12 1273717 17461twf. Doc/006 should be the first to cut the cut 迢 so that the error between each second scribe and the opposite track can be avoided. Although the present invention has been accustomed to _ thief as above, = Ming, learn this skill, without departing from the invention: ^ within the cost of '* can make some changes and _, so the invention The definition of the patent application scope is subject to the definition of the scope of the patent application. "Study of the ceremonial style" Figure 1 shows the material - the money _ flow chart. To know the schematic diagram of the record. =, not an embodiment of the invention FIG. 5 is a side view of a package body _ structure according to another embodiment of the present invention. [Main component symbol description 100, 200: package array structure 100, 200': independent package 110, 210: wafer 112, 212 · wafer front side 114, 214: wafer back side 116, 216 · wafer 120, 220: Transmissive substrate 130, 130', 240, 240, · film 13 1373717 17461twf.doc / 006 230: light-transmissive annular body 250: plastic frame AS: auxiliary cutting channel FC, FC', FC": first cutting Track RC: reference cut track SC, SC', SC": second cut track d: offset
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