1273318 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種背光模組，尤指一種具有平面光源 散熱結構之背光模組。 【先前技術】 由於液晶本身並不會發光，因此背光模組可謂為液 晶顯示器（liquid crystal display，LCD)面板的關鍵 零組件，其主要功能便在供應亮度充分及分佈均勻的光 源，以使LCD面板能夠正常顯示影像。而隨著LCD面板 已廣泛應用於眾多具成長潛力的電子產品，如監視器 (monitor)、筆記型電腦、數位相機、投影機等等，背 光模組及其相關零組件的需求也持續成長中。 請參閱圖一，圖一為習知一利用平面燈板之顯示裝 置10剖面示意圖。顯示裝置10包含一顯示面板11， 以及一背光模組12;背光模組12係為一直下式背光模 組，安裝於顯示面板11下方，背光模組12包含一背板 121、一平面燈板122、及一擴散板123，平面燈板122 係置於背板上，其可為一平面光源，具有全平面發光之 特性，一擴散板123係設於平面燈板122上，以將平面 燈板122產生之光源散射至顯示面板11。 然平面燈板122為全平面發光之平面光源，其所產 生之熱量會以整面性地朝顯示面板11與背板121方向 傳遞，且光源係朝上方發光，因此大量的熱量將集中於 面板11上部，當熱量無適當途徑排出時，熱量將朝顯 示面板11方向傳遞，則會影響到價格昂貴之顯示面板 11之使用壽命以及可靠度（reliability)，亦會影響顯 1273318 示面板11之正常運作，造成顯示品質的降低（例如··部 分區域的晝面容易產生晃動或閃爍等現象），更容易大 幅縮減周圍元件的使用壽命。因此要如何改善背光模組 12的散熱能力，以增加顯示品質與延長元件壽命，實 為當前之重要課題。 【發明内容】 本發明之一目的，在於提供一種具有散熱結構之背 光模組，以解決習知背光模組散熱效果不佳之問題。 本發明之另一目的，在於提供一種具有散熱結構之 背光模組，利用設置傳熱片，以將平面燈板之熱量以熱 傳導方式，使用大面積且散熱效果佳之背板或上固定框 來散熱，而提昇平面燈板之散熱效果及壽命。 本發明之又一目的，在於提供一種具有散熱結構之 背光模組，利用散熱鰭片之課置，使平面燈板之熱量可 順利排至背光模組外，而降低熱量對顯示面板之影響。 為達上述目的，本發明之背光模組係設於一顯示面板 下方，該背光模組包含有一背板，一平面燈板，安裝於 該背板之上方，用來提供一平面光源，以及一傳熱板， 連接於該平面燈板與該背板，用來將該平面燈板上方之 熱量傳導至該背板；另傳熱板具有複數個散熱鰭片，背 板上相對應該散熱鰭片開設有開口，藉以將平面燈板之 熱量由散熱鰭片散出該背光模組之外，以提昇平面燈板 之散熱效果。 1273318 【實施方式】 有關本發明為達到上述目的，所採用之技術手段及 其餘功效，茲舉三較佳實施例，並配合圖式加以說明如 下： 第一實施例： 請參閱圖二及第三圖，圖二為本發明顯示裝置之上 視圖，圖三為顯示裝置沿3-3’之剖面圖，顯示裝置34 包含一上固定框40、一顯示面板36以及一背光模組 38，上固定框40用來包覆顯示面板36以及背光模組 38。而背光模組38係為一直下式背光模組，安裝於顯 示面板36下方，其中，背光模組38包含一上蓋50， 一背板52、一平面燈板42及複數個傳熱板39;其中上 蓋50與背板52其可為.金屬材質，背板52與上蓋50 相結合以形成一腔體’以供容納平面燈板4 2等元件； 平面燈板42係設於背板52上，具有全平面發光之特 性，用來提供一面光源：平面燈板42中間部分係為一 有效發光區42a，可發射出光線，而四周部分則為一無 效發光區42b，無法提供光源，平面燈板42可為平面 放電燈、平面螢光燈或LED燈等。而傳熱板39其一端 係連接於平面燈板42之上側面，另一端與背板52相接 觸，而傳熱板39覆蓋平面燈板42之區域可為平面燈板 42四周之無效發光區42b，傳熱板39係以傳熱性佳及 具緩衝性之材質為佳，使可具有傳熱、緩衝、保護平面 燈板42以及限制平面燈板42位移之功能。另背光模組 38更包含複數個燈板支撐件48以用來支撐與保護平面 燈板42,燈板支撐件48 —端連接於平面燈板42底面， 另一端固設於背板52，而使平面燈板42與背板52間 具有一容室，燈板支撐件48 —般係以不導電材質為 1273318 佳，如塑膠等，以避免燈板支撐件48影響平面燈板42 下方之電極作用。而背光模組38另包含複數個傳熱片 57，安裝於背板52與上固定框40之間，可將熱量有效 地由背板52傳遞至上固定框40，再將熱量由上固定框 40散出至外界。另外，可於平面燈板42與傳熱板39 間，及背板52與上固定框40間設置複數個導熱片 (thermal pad)55或佈散熱膏，以增加熱傳導效率。 而背光模組38更包含一擴散板44，安裝於平面燈 板42與顯示面板36之間，用來將平面燈板42產生之 平面光源散射至36顯示面板，以及至少一光學材料層 46，設置於擴散板44與顯示面板36之間，以增加正視 角之亮度。一擴散板支撐件54,安裝於擴散板44與平 面燈板42之間，使平面燈板42與擴散板44間具有一 容室，並用以支撐擴散板44以及限制平面燈板42朝顯 示面板36方向位移。 由於傳熱板39連接於背板52,背板52連接於上固 定框40，因此，平面燈板42上方之熱量可藉由傳熱板 39傳導至背板52，部份熱量利用背板52之大面積與高 導熱性而散熱，而部分熱量則可由背板52傳導至上固 定框40散熱，藉以可迅速將平面燈板42之熱量帶走， 而使平面燈板42可正常運作及減少熱量朝顯示面板36 方向傳遞，而影響顯示面板3 6效能。 另外，由於燈板支撐件48安裝於背板52與平面燈 板42之間，故可使背板52與平面燈板42之間形成一 容室，及擴散板支撐件54安裝於擴散板44與平面燈板 42之間，故亦可使擴散板44與平面燈板42之間形成 1273318 一另一容室，以提供平面燈板42上下具有散熱之空間。 故由上可知，於背光模組38之散熱方面，背光模 組38所產生熱量之來源是來自於平面燈板42，如圖三 所示，平面燈板42所產生之熱量大致上可由熱傳遞途 徑58A、58B、58C散出，而由熱傳遞途徑58A散出之熱 量乃為以整面性地朝顯示面板34散出，且由於擴散板 44與平面燈板42之間以擴散板支撐件54分隔出一容 室，故由熱傳遞途徑58A所散出之熱量之傳遞方式大部 分為熱對流以及熱輻射之方式為主，此乃因熱量於流體 中之傳播方式以對流與輻射之方式為主；而由熱傳遞途 徑58B散出之熱量乃為以整面性地朝背板52散出，且 由於平面燈板42與背板52之間以燈板支撐件48分隔 出一容室，故由.熱傳遞途徑58B所散出之熱量之傳遞方 式大部分亦為熱對流以及熱輻射之方式為主；而由熱傳 遞途徑58C散出之熱量，則為由平面燈板42上方經由 導熱片55熱傳導傳至傳熱板39，再由傳熱板39傳導 至背板52，然後部分熱量由背板52散出至外界，部分 則由背板52經由傳熱片57傳遞至上固定框40，再由 上固定框40散出至外界，故由熱傳遞途徑58C所散出 之熱量之傳遞方式大部分為熱傳導之方式為主。而於熱 量傳遞之三種方式中，熱傳導之傳遞效率會遠大於熱對 流以及熱輻射，故增加熱傳遞途徑58C可加速平面燈板 42熱量的傳遞，而可避免熱量無法快速且有效地散出 平面燈板42之外造成不斷累積，且導致造成平面燈板 42附近的溫度過高；此外，亦可避免熱量以熱傳遞途 徑58A傳遞而朝顯示面板34方向散出，而影響到價格 昂貴之顯示面板34之使用壽命以及可靠度，進而影響 到顯示面板34之正常運作。 1273318 請參閱圖四，圖四為本發明另一實施例顯示裝置 34之平面燈板42與傳熱板39連接之上視圖，而傳熱 板亦可以環繞覆蓋之方式安裝於平面燈板四周之上 方，與上一實施例不同之處為傳熱板39之一端全部覆 蓋於平面燈板42上側面四肩之上方，傳熱板39覆蓋平 面燈板42之區域亦為平面燈板42四周無效之發光區 域，如此一來平面燈板42與傳熱板39之接觸面積會較 前一實施例之接觸面積來的大，故平面燈板42所產生 之熱量沿熱傳遞途徑58C傳遞之散熱面積也會隨之增 大，因此能達到更高之散熱姝率，然而相對地由於傳熱 板39之體積增大，故背面模組38整體之重量亦會隨之 增加，而造成顯示裝置34之重量增加，故於實務上必 須同時考量散熱效率與重量增加之效應，而做一最佳化 之設計.。 相較於習知之背光模組之散熱結構，本發明之散熱 結構之設計乃可妥善地運用平面燈.板四周無效發光區 域來傳導平面燈板所產生之熱量，而藉由傳熱板與平面 燈板四周無效發光區域直接接觸，可讓平面燈板所產生 之熱量以熱傳導之方式有效且快速地傳導至背板以及 上固定框，再排出於背光模組之外。如此一來便可避免 熱量無法快速且有效地散出平面燈板之外造成不斷累 積，且導致造成平面燈板附近的溫度過高；此外，亦可 避免熱量朝顯示面板方向散出，而影響到價格昂責之顯 示面板之使用壽命以及可靠度，進而影響到顯示面板之 正常運作。綜上所述，本發明背光模組之散熱結構可有 效提升顯示裝置整體之散熱能力，以增加顯示品質與延 長元件壽命。 1273318 第二實施例： > 請參閱圖五所示，本實施例與上述第一實施例相同 或相當之元件係標示同一圖號，而本實施例與上述實施 例不同之處在於··係採用一匸形之傳熱板39A，以取代 第一實施例之傳熱板39與燈板支撐件48，傳熱板39 A 具有一凹槽391A及一底面392A，其底面392A係連結 _ 於背板52A上，而平面燈板42A之兩端係容置於凹槽 391A内，且其與凹槽391A内壁面間係設有具有彈性之 導熱片55A，以增加熱傳導效果及使平面燈板42A與凹 槽391A可緊密接觸，平面燈板42A兩端係可為無效發 · 光區421A或封合區；藉由傳熱板39A之凹槽391A可供 支撐平面燈板42A，同時，平面燈板42A產生之熱量可 透過與傳熱板39A相接觸，而快速地利用傳熱板39A 傳導至大面積之背板52A散熱，且由於平面燈板42A 之上下均與傳熱板39A接觸，使得傳導面積增大，故可 更有助於提昇平面燈板42A之散熱效果。另外，本實施 例中，.可於背板52A與上固定.框40之間設置傳熱片 57A，以使部分熱量可由背板52傳遞至上固定框40， 再由上固定框40排出至外界，以增加散熱途徑及效果。 _ 第三實施例： 請參閱圖六、圖七、圖八及圖九所示，本實施例與 上述第一實施例相同或相當之元件係標示同一圖號，而 ' 本實施例與上述實施例不同之處在於：傳熱板39B上設 有複數個散熱鰭片393B，而背板52B上設有複數個開 口 521B，而傳熱板39B之散熱鰭片393B係安裝於相對 應於背板52B開口 521B之位置，故散熱鰭片393B可直 接與外界之空氣接觸，傳熱板39B之一底面392B係安 11 1273318 裝於平面燈板42之上側面上，而傳熱板39B之一側面 ， 394B係用來與背板52B相連接，藉由傳熱板39B上之 散熱鰭片393B以增加散熱表面積，而使散熱效率提 昇，散熱鰭片393B可以平行傳熱板39B之底面392B(或 平行平面燈板42)間隔排列（如圖八所示），或以垂直 於傳熱板39B之底面392B (或垂直平面燈板42)間隔 ， 排列（如圖十所示），其設計係可取決於重量、材料價 格、加工製程之難易度，以及散熱效果等因素，而選用 適合之散熱鰭片。 於背光模組38B之散熱方面，背光模組38B所產生 熱量之來源是來自於平面燈板42，如圖九所示，平面 燈.板42所產生之熱量大致上可由熱傳遞途徑58A、 58.B、58C、58D散出，而由熱傳遞途徑58A散出之熱量 乃為以整面性地朝顯示面板36散出，且由於擴散板44 與平面燈板42之間以擴散板支撐件54分隔出一容室， 故由熱傳遞途徑58A所散出之熱量之#遞方式大部分 為熱對流以及熱輻射之方式為主，此乃因熱量於流體中 之傳播方式以對流與輻射之方式為主；而由熱傳遞途徑 58B散出之熱量乃為以整面性地朝背板52B散出，且由 _ 於平面燈板42與背板52B之間以燈板支撐件48分隔出 一容室，故由熱傳遞途徑58B所散出之熱量之傳遞方式 大部分亦為熱對流以及熱輻射之方式為主；而由熱傳遞 途徑58C散出之熱量，則為由平面燈板42上方經由傳 ' 熱板39B傳導至背板52B，然後熱量再由背板52B散出 · 至外界，故由熱傳遞途徑58C所散出之熱量之傳遞方式 大部分為熱傳導之方式為主；而由熱傳遞途徑58D散出 之熱量，則為由平面燈板42上方傳導至傳熱板39B上， 再由傳熱板39B上之散熱鰭片393B以與外部空氣熱對 ‘ 12 1273318 流之方式將熱量散出至外界，故由熱傳遞途徑58D所散 出之熱量之傳遞方式大部分為熱傳導與熱對流之方式 而本實施例中增加了 一熱傳遞途徑58D ’故加速平 面燈板42熱量的傳遞與對流，而邛避免熱量無法快速 且有效地散出平面燈板42之外造成不斷累積，且導致 造成平面燈板42附近的溫度過高；此外，亦可更有效 地減少熱量以熱傳遞途徑58A傳遞而朝顯示面板36方 向散出，而影響到價格昂貴之顯系面板36之使用壽命 以及可靠度，進而影響到顯示面板36之正常運作，因 此，本實施例可提供平面燈板42更佳之散熱效果。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利 範圍所做之均等變化與修飾，皆應屬本發明專利之涵蓋範圍。 【圖式簡單說明】 圖一為習知顯示裝置之示意圖。 圖亡為本發明第一實施例顯示裝置之上視圖。1273318 IX. Description of the Invention: [Technical Field] The present invention provides a backlight module, and more particularly to a backlight module having a planar light source heat dissipation structure. [Prior Art] Since the liquid crystal itself does not emit light, the backlight module can be said to be a key component of a liquid crystal display (LCD) panel, and its main function is to supply a light source with sufficient brightness and uniform distribution to make the LCD The panel can display images properly. And as LCD panels have been widely used in many electronic products with growth potential, such as monitors, notebook computers, digital cameras, projectors, etc., the demand for backlight modules and related components continues to grow. . Referring to FIG. 1, FIG. 1 is a schematic cross-sectional view of a display device 10 using a flat panel. The display device 10 includes a display panel 11 and a backlight module 12; the backlight module 12 is a direct-type backlight module, which is mounted under the display panel 11. The backlight module 12 includes a back panel 121 and a flat panel. 122, and a diffuser plate 123, the flat light board 122 is placed on the back board, which can be a planar light source, has the characteristics of full-surface light emission, a diffuser plate 123 is attached to the flat light board 122 to planar light The light source generated by the board 122 is scattered to the display panel 11. However, the planar light panel 122 is a planar light source that emits light in a full plane, and the heat generated by the planar light board 122 is transmitted to the display panel 11 and the back panel 121 in a whole direction, and the light source is emitted upward, so that a large amount of heat will be concentrated on the panel. In the upper part of the 11th, when the heat is not discharged through the proper way, the heat will be transmitted toward the display panel 11, which will affect the service life and reliability of the expensive display panel 11, and will also affect the normality of the 1273118 display panel 11. Operation, resulting in reduced display quality (for example, the surface of the area is prone to sway or flicker), it is easier to significantly reduce the life of the surrounding components. Therefore, how to improve the heat dissipation capability of the backlight module 12 to increase the display quality and extend the life of the component is an important issue at present. SUMMARY OF THE INVENTION An object of the present invention is to provide a backlight module having a heat dissipation structure to solve the problem of poor heat dissipation of the conventional backlight module. Another object of the present invention is to provide a backlight module having a heat dissipating structure, which uses a heat transfer sheet to dissipate the heat of the flat panel by using a large-area heat-dissipating backplane or an upper fixing frame. And improve the heat dissipation effect and life of the flat panel. Another object of the present invention is to provide a backlight module having a heat dissipation structure, which utilizes the heat dissipation fins to enable the heat of the planar light panel to be smoothly discharged outside the backlight module, thereby reducing the influence of heat on the display panel. In order to achieve the above objective, the backlight module of the present invention is disposed under a display panel. The backlight module includes a back panel, and a flat panel is mounted above the back panel for providing a planar light source, and a a heat transfer plate connected to the planar light plate and the back plate for conducting heat over the flat light plate to the back plate; the heat transfer plate has a plurality of heat dissipation fins, and the heat dissipation fins on the back plate An opening is opened to dissipate the heat of the flat panel from the heat sink fins to enhance the heat dissipation effect of the flat panel. 1273318 [Embodiment] In order to achieve the above object, the technical means and the remaining functions of the present invention are as follows, and the following description is given with reference to the following: First Embodiment: Please refer to FIG. 2 and FIG. 2 is a top view of the display device of the present invention, and FIG. 3 is a cross-sectional view of the display device along 3-3'. The display device 34 includes an upper fixing frame 40, a display panel 36 and a backlight module 38. The frame 40 is used to cover the display panel 36 and the backlight module 38. The backlight module 38 is a direct-type backlight module, which is mounted under the display panel 36. The backlight module 38 includes an upper cover 50, a back plate 52, a flat light plate 42 and a plurality of heat transfer plates 39; The upper cover 50 and the back plate 52 may be made of metal. The back plate 52 is combined with the upper cover 50 to form a cavity 'for accommodating components such as the flat light plate 4 2; and the flat light plate 42 is disposed on the back plate 52. The utility model has the characteristics of full-plane illumination for providing a light source: the middle portion of the flat panel 42 is an effective illumination region 42a, which can emit light, and the surrounding portion is an ineffective illumination region 42b, which cannot provide a light source, a planar lamp The plate 42 can be a flat discharge lamp, a flat fluorescent lamp or an LED lamp or the like. The heat transfer plate 39 has one end connected to the upper side of the flat light board 42 and the other end being in contact with the back board 52. The area of the heat transfer board 39 covering the flat light board 42 can be an ineffective light emitting area around the flat light board 42. 42b, the heat transfer plate 39 is preferably a material having good heat transfer property and cushioning property, and has a function of transferring heat, buffering, protecting the planar light plate 42 and restricting the displacement of the planar light plate 42. The backlight module 38 further includes a plurality of light board supports 48 for supporting and protecting the flat light board 42. The light board support 48 is connected at the end to the bottom surface of the flat light board 42 and the other end is fixed to the back board 52. There is a chamber between the flat panel 42 and the back panel 52. The panel support 48 is generally made of a non-conductive material of 1273318, such as plastic, to prevent the panel support 48 from affecting the electrode below the panel 42. effect. The backlight module 38 further includes a plurality of heat transfer sheets 57 mounted between the back plate 52 and the upper fixing frame 40 to efficiently transfer heat from the back plate 52 to the upper fixing frame 40, and then heat is applied to the upper fixing frame 40. Dissipated to the outside world. In addition, a plurality of thermal pads 55 or cloth thermal grease may be disposed between the flat panel 42 and the heat transfer plate 39, and between the back plate 52 and the upper fixing frame 40 to increase heat transfer efficiency. The backlight module 38 further includes a diffuser plate 44 mounted between the planar light panel 42 and the display panel 36 for scattering the planar light source generated by the planar light panel 42 to the 36 display panel and the at least one optical material layer 46. It is disposed between the diffusion plate 44 and the display panel 36 to increase the brightness of the positive viewing angle. A diffuser support member 54 is disposed between the diffuser plate 44 and the planar light panel 42 to define a space between the planar light panel 42 and the diffuser panel 44, and to support the diffuser panel 44 and the flat panel light panel 42 toward the display panel. 36 direction displacement. Since the heat transfer plate 39 is connected to the back plate 52, the back plate 52 is connected to the upper fixing frame 40. Therefore, the heat above the flat light plate 42 can be conducted to the back plate 52 by the heat transfer plate 39, and the heat is utilized by the back plate 52. The large area and high thermal conductivity heat dissipation, and part of the heat can be transmitted from the back plate 52 to the upper fixing frame 40, so that the heat of the flat light plate 42 can be quickly taken away, so that the flat light plate 42 can operate normally and reduce heat. Passing in the direction of the display panel 36 affects the performance of the display panel 36. In addition, since the lamp board support member 48 is installed between the back plate 52 and the flat lamp plate 42, a cavity can be formed between the back plate 52 and the flat lamp plate 42, and the diffusion plate support member 54 is mounted on the diffusion plate 44. Between the flat panel 42 and the flat panel 42 , 1273318 can be formed between the diffuser panel 44 and the flat panel 42 to provide a space for the flat panel 42 to dissipate heat. Therefore, it can be seen that, in terms of heat dissipation of the backlight module 38, the heat generated by the backlight module 38 is derived from the planar light panel 42. As shown in FIG. 3, the heat generated by the planar light panel 42 can be substantially transferred by heat. The paths 58A, 58B, 58C are dissipated, and the heat dissipated by the heat transfer path 58A is dissipated to the display panel 34 in a full-face manner, and the diffuser plate support is between the diffuser plate 44 and the flat panel 42 54 separates a chamber, so the heat transfer from the heat transfer path 58A is mostly based on the method of heat convection and heat radiation, which is due to the way the heat propagates in the fluid by convection and radiation. The heat dissipated by the heat transfer path 58B is dissipated to the back plate 52 in a full-face manner, and a space is separated by the lamp support 48 between the flat lamp plate 42 and the back plate 52. Therefore, the heat transfer method by the heat transfer path 58B is mostly mainly the method of heat convection and heat radiation; and the heat radiated by the heat transfer path 58C is passed above the flat light plate 42 The heat conducting sheet 55 is thermally transferred to the heat transfer plate 39, and then The hot plate 39 is transmitted to the back plate 52, and then part of the heat is radiated from the back plate 52 to the outside, and the portion is transferred from the back plate 52 to the upper fixing frame 40 via the heat transfer sheet 57, and then is released from the upper fixing frame 40 to the outside. The heat transfer by the heat transfer path 58C is mostly based on heat transfer. In the three modes of heat transfer, the heat transfer efficiency is much greater than the heat convection and heat radiation. Therefore, increasing the heat transfer path 58C can accelerate the heat transfer of the planar light plate 42 and prevent the heat from being quickly and efficiently dissipated. The accumulation of light outside the light board 42 causes the temperature of the vicinity of the flat light board 42 to be excessively high; in addition, heat can be prevented from being transmitted in the direction of the display panel 34 by the heat transfer path 58A, thereby affecting the expensive display. The useful life and reliability of the panel 34, in turn, affects the proper functioning of the display panel 34. 1273318 Referring to FIG. 4, FIG. 4 is a top view of the planar light panel 42 of the display device 34 connected to the heat transfer plate 39 according to another embodiment of the present invention, and the heat transfer plate may be installed around the flat light panel in a surrounding manner. The upper part is different from the previous embodiment in that one end of the heat transfer plate 39 covers the upper side of the upper side of the flat light board 42. The area of the heat transfer board 39 covering the flat light board 42 is also invalid for the flat light board 42. The light-emitting area, such that the contact area between the flat light board 42 and the heat transfer plate 39 is larger than that of the previous embodiment, so the heat generated by the flat light board 42 is transferred along the heat transfer path 58C. As a result, a higher heat dissipation rate can be achieved. However, due to the increase in the volume of the heat transfer plate 39, the overall weight of the back module 38 is also increased, resulting in the display device 34. As the weight increases, it is necessary to consider the effects of heat dissipation efficiency and weight increase in practice, and to make an optimized design. Compared with the heat dissipation structure of the conventional backlight module, the heat dissipation structure of the present invention can properly utilize the flat lamp. The ineffective light-emitting area around the board is used to conduct the heat generated by the planar light board, and the heat transfer plate and the plane are used. The ineffective light-emitting area around the light board is in direct contact, so that the heat generated by the flat light board can be efficiently and quickly transmitted to the back board and the upper fixing frame by heat conduction, and then discharged outside the backlight module. In this way, it is possible to prevent the heat from being quickly and effectively dissipated outside the flat panel, and the temperature in the vicinity of the panel is too high; in addition, the heat is prevented from being dissipated toward the display panel, and the influence is also prevented. The service life and reliability of the display panel, which is subject to price, affects the normal operation of the display panel. In summary, the heat dissipation structure of the backlight module of the present invention can effectively improve the overall heat dissipation capability of the display device to increase display quality and extend component life. 1273318 Second Embodiment: > Referring to FIG. 5, the same or equivalent elements of the first embodiment are denoted by the same drawing number, and the difference between the present embodiment and the above embodiment is that In place of the heat transfer plate 39 and the lamp support 48 of the first embodiment, the heat transfer plate 39A of the first embodiment has a recess 391A and a bottom surface 392A, and the bottom surface 392A is coupled thereto. The back plate 52A is disposed on the back plate 52A, and the two ends of the flat lamp plate 42A are disposed in the recess 391A, and an elastic conductive sheet 55A is disposed between the inner wall surface of the recess 391A to increase the heat conduction effect and the flat light board. The 42A can be in close contact with the groove 391A, and the two ends of the flat lamp plate 42A can be the ineffective light-emitting region 421A or the sealing region; the groove 391A of the heat transfer plate 39A can be used to support the planar light plate 42A, and at the same time, the plane The heat generated by the lamp plate 42A can be transmitted through the heat transfer plate 39A, and is quickly conducted to the large-area back plate 52A by the heat transfer plate 39A, and since the flat lamp plate 42A is in contact with the heat transfer plate 39A, Increase the conduction area, so it can help to improve the flat panel 42A heat radiation. In addition, in this embodiment, a heat transfer sheet 57A may be disposed between the back plate 52A and the upper fixing frame 40 so that part of the heat may be transmitted from the back plate 52 to the upper fixing frame 40, and then discharged to the outside by the upper fixing frame 40. To increase the heat dissipation path and effect. _ Third Embodiment: Referring to FIG. 6 , FIG. 7 , FIG. 8 and FIG. 9 , components of the present embodiment that are identical or equivalent to those of the above-described first embodiment are denoted by the same drawing number, and 'this embodiment and the above implementation The difference is that the heat transfer plate 39B is provided with a plurality of heat dissipation fins 393B, and the back plate 52B is provided with a plurality of openings 521B, and the heat dissipation fins 393B of the heat transfer plate 39B are installed corresponding to the back plate. The position of the opening 521B of the 52B is such that the heat radiating fin 393B can directly contact the air of the outside, and one bottom surface 392B of the heat transfer plate 39B is mounted on the upper side of the flat light board 42 and one side of the heat transfer board 39B. 394B is used to connect with the back plate 52B. The heat dissipation fins 393B on the heat transfer plate 39B increase the heat dissipation surface area, and the heat dissipation fins 393B can be parallel to the bottom surface 392B of the heat transfer plate 39B (or The parallel plane light plates 42) are arranged at intervals (as shown in FIG. 8), or are arranged at intervals of the bottom surface 392B (or the vertical flat light plate 42) perpendicular to the heat transfer plate 39B (as shown in FIG. 10), and the design thereof is Depending on weight, material price, processing process And a cooling effect and other factors, the choice of suitable heat-dissipating fins. In the heat dissipation of the backlight module 38B, the heat generated by the backlight module 38B is derived from the planar light panel 42. As shown in FIG. 9, the heat generated by the planar light panel 42 can be substantially determined by the heat transfer paths 58A, 58. .B, 58C, 58D are dissipated, and the heat dissipated by the heat transfer path 58A is dissipated to the display panel 36 in a full-face manner, and a diffuser plate support is provided between the diffuser plate 44 and the flat lamp plate 42. 54 separates a chamber, so the heat transfer from the heat transfer path 58A is mostly dominated by heat convection and heat radiation, which is due to the propagation of heat in the fluid by convection and radiation. The mode is mainly; and the heat dissipated by the heat transfer path 58B is dissipated to the back plate 52B in a full-face manner, and is separated by the lamp support 48 between the flat lamp plate 42 and the back plate 52B. In a chamber, the heat transfer from the heat transfer path 58B is mostly dominated by heat convection and heat radiation; and the heat dissipated by the heat transfer path 58C is from the flat light plate 42. The upper part is transmitted to the back plate 52B via the hot plate 39B, and then the heat is again The plate 52B is dissipated to the outside, so the heat transfer from the heat transfer path 58C is mostly the way of heat conduction; and the heat dissipated by the heat transfer path 58D is above the flat light plate 42. Conducted to the heat transfer plate 39B, and the heat radiating fins 393B are radiated to the outside by the heat radiating fins 393B on the heat transfer plate 39B, so that the heat is dissipated by the heat transfer path 58D. The mode of transmission is mostly the way of heat conduction and heat convection. In this embodiment, a heat transfer path 58D is added to accelerate the heat transfer and convection of the planar light board 42, and the heat cannot be quickly and effectively dissipated. The outside of the board 42 causes accumulation and causes the temperature in the vicinity of the flat panel 42 to be excessively high. In addition, heat can be more effectively reduced to be transmitted in the direction of the display panel 36 by the heat transfer path 58A, which affects the price. The service life and reliability of the display panel 36, which in turn affects the normal operation of the display panel 36, therefore, the present embodiment can provide a better heat dissipation effect of the planar light panel 42. The above is only the preferred embodiment of the present invention, and all changes and modifications made to the scope of the patent application of the present invention should be covered by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional display device. Figure 11 is a top view of the display device of the first embodiment of the present invention.
圖三為本發明第一實施例顯示裝置沿3-3，之剖面圖。 圖四土本發明另—實施細示裝置之平面燈板與傳熱板連 接之上視圖。 圖 13 1273318 主要元件符號說明 10 顯示裝置 11 顯示面板 12 背光模組 121 背板 122 平面燈板 123 擴散板 124 支撐件 34 顯示裝置 36 顯示面板 38 、 38B 背光模組 39 、 39A 傳熱板 391A 凹槽 392A> 392B 底面 393B 散熱鰭片 394B 側面 40 上固定框 42 、 42A 平面燈板 421A 無效發光 區 44 擴散板 46 光學材料 層 48 燈板支撐 件. 50 上蓋 52 、 52A 、 52B 背板 521B 開口 54 擴散板支 撐件 55 、 55A 導熱片 57 、 57A 傳熱片 58A 熱傳遞途 徑 58B 熱傳遞途 徑 58C 熱傳遞途 徑 58D 熱傳遞途 徑Figure 3 is a cross-sectional view of the display device taken along line 3-3 of the first embodiment of the present invention. Figure 4 is a top view of the present invention in connection with a flat panel and a heat transfer panel. Figure 13 1273318 Main component symbol description 10 Display device 11 Display panel 12 Backlight module 121 Back plate 122 Flat panel 123 Diffusion plate 124 Support 34 Display device 36 Display panel 38, 38B Backlight module 39, 39A Heat transfer plate 391A Concave Slot 392A> 392B bottom surface 393B heat sink fin 394B side 40 upper fixing frame 42, 42A flat light board 421A ineffective light emitting area 44 diffusing plate 46 optical material layer 48 light board support. 50 upper cover 52, 52A, 52B back plate 521B opening 54 Diffuser support 55, 55A Thermal pad 57, 57A Heat transfer sheet 58A Heat transfer path 58B Heat transfer path 58C Heat transfer path 58D Heat transfer path