TWI267864B - Method and device for programming control information - Google Patents
Method and device for programming control information Download PDFInfo
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- TWI267864B TWI267864B TW94112519A TW94112519A TWI267864B TW I267864 B TWI267864 B TW I267864B TW 94112519 A TW94112519 A TW 94112519A TW 94112519 A TW94112519 A TW 94112519A TW I267864 B TWI267864 B TW I267864B
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5628—Programming or writing circuits; Data input circuits
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3468—Prevention of overerasure or overprogramming, e.g. by verifying whilst erasing or writing
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1267864 16693pif.doc 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種將控制資訊進行程式化的方法與 裝置。 ^ 【先前技術】 近來在5己憶體各項應用的許多發展上,諸如大量儲存 (MASS STORAGE)、碼記憶體(CODE MEMORY)、以及其 他多媒體(MULTIMEDIA)各項應用都越來越需要具有較 ® 高密度的記憶體裝置。大量儲存的應用可包括記憶卡 (MEMORY CARD)(例如:行動電腦(MOBILE COMPUTER) " 所用的)、固態記憶體(SOLID-STATE MEMORY)(例如··堅 固與/或可信賴的儲存磁碟(STORAGE DISK))、數位照相機 (DIGITAL CAMERA)(例如:用來記錄靜止的或移動的影 像與聲音)、以及用來記錄近似光碟(CD)品質聲音的聲音 (VOICE)或音頻(AUDIO)記錄器(RECORDER)。1267864 16693pif.doc IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method and apparatus for programming control information. ^ [Prior Art] Recently, many applications of various applications, such as MASS STORAGE, CODE MEMORY, and other multimedia (MULTIMEDIA) applications, are increasingly needed. More than a high density memory device. Applications that can be stored in large quantities can include MEMORY CARD (eg, used by MOBILE COMPUTER ", solid state memory (SOLID-STATE MEMORY) (eg · robust and / or reliable storage disk) (STORAGE DISK)), digital camera (DIGITAL CAMERA) (for example, for recording still or moving images and sounds), and sound (VOICE) or audio (AUDIO) recording for recording approximate CD (CD) quality sound. (RECORDER).
碼記憶體應用可包括基本輸入/輸出系統(BASICCode memory applications can include basic input/output systems (BASIC
# INPUT/0UTpUT SYSTEMS)(BIOS)或是網路(NETWORK) 應用(例如··在個人電腦(PERSONAL COMPUTER)、其他 終端機(TERMINAL)、路由器(ROUTER)、或集線器(HUB) 中的記憶體)、行動電話(MOBILE PHONE)應用(例如··碼 (CODE)與/或資料(DATA))、或是其他電子手持式資訊裝置 (ELECTRONIC HANDHELD INFORMATION DEVICE)應 用(例如:個人數位助理(personal digital ASSISTANT)(PDA)、掌上型工作系統(PALM OPERATING 1267864 16693pif.doc SYSYTEM)(POS)、或個人通訊助理(PERSONAL COMMUNICATIONS ASSISTANT) (PCA))。 通常,大量儲存的各種應用都使用成本較低、密度較 高、與/或具有較佳程式化/抹除(PR〇GRAM/ERASE)(P/E) 循環持續力(CYCLING ENDURANCE)的記憶體,而碼記憶 體的應用則使用具有較快的隨機存取(RANDOM ACCESS) 與/或可定位執行(EXECUTABLE IN PLACE)(XIP)。 先前技術的記憶體可包括動態隨機存取記憶體 藝 (DYNAMIC RANDOM ACCESS MEMORY) (DRAM)、靜 態隨機存取記憶體(STAIC RANDOM ACCESS MEMORY)# INPUT/0UTpUT SYSTEMS) (BIOS) or network (NETWORK) applications (such as memory in a personal computer (PERSONAL COMPUTER), other terminal (TERMINAL), router (ROUTER), or hub (HUB) ), MOBILE PHONE applications (such as CODE and / or DATA), or other ELECTRONIC HANDHELD INFORMATION DEVICE applications (eg personal digital assistant (personal digital) ASSISTANT) (PDA), Palm Work System (PALM OPERATING 1267864 16693pif.doc SYSYTEM) (POS), or PERSONAL COMMUNICATIONS ASSISTANT (PCA)). Typically, a variety of applications for mass storage use lower cost, higher density, and/or better programmed/erased (PR/G) (P/E) CYCLING ENDURANCE memory. The code memory application uses faster random access (RANDOM ACCESS) and/or EXECUTABLE IN PLACE (XIP). Prior art memories may include DYNAMIC RANDOM ACCESS MEMORY (DRAM), STANA RANDOM ACCESS MEMORY
- (SRAM)、以及非依電性記憶體(NON-VOLATILE MEMORY)(NVM)。非依電性記憶體可包括遮罩唯讀記憶 體(MASK READ ONLY MEMORY)(ROM)、可抹除可程式 唯讀記憶體(ERASABLE PROGRAMMABLE READ ONLY MEMORY)(EPROM)、電子可抹除可程式唯讀記憶體 (ELECTRICALLY ERASABLE PROGRAMMABLE READ- (SRAM) and NON-VOLATILE MEMORY (NVM). Non-electrical memory can include MASK READ ONLY MEMORY (ROM), ERASABLE PROGRAMMABLE READ ONLY MEMORY (EPROM), and electronic erasable program Read-only memory (ELECTRICALLY ERASABLE PROGRAMMABLE READ
• 〇NLY memory)(eeprom)、快閃記憶體(FLASH MEMORY)(例如:快閃抹除記憶體(FLASh ERASE MEMORY) (EEPROM)、以及駐電記憶體 (FERRO-ELECTRIC MEMORY)。非依電性記憶體在電力 消失時仍不會遺失資料,但通常不允許隨機存取並且通常 會比依電性記憶體(VOLATILE MEMORY)還慢。 吾人可藉由合併可抹除可程式唯讀記憶體(epr〇m) 與電子可抹除可程式唯讀記憶體(eepr〇m)來構成快閃 1267864 16693pif.doc 圮憶體。快閃記憶體可為NANd或NOR快閃記憶體。在 快閃記憶體中,可藉由施加不同電壓給每一快閃記憶體胞 來執行抹除與程式化工作。 NAND快閃記憶體可包括胞串聯而成的字串(STRING) (如:16個胞可形成一字串)。此字串可包括一或多個字串 選擇電晶體(STRING SELECT TRANSISTOR)。NAND 快 閃記憶體可具有相當小的“開,,(“0N,,)胞電流(cell CURRENT),並因而相當慢的感應時間(sensing , TIME)(例如:10_25ms)。NAND快閃記憶體可藉由感應一 頁單兀(PAGE UNIT)(例如:512位元組(BYTE)),並同時 將此頁單元鎖存至一頁緩衝器(PAGE BUFFER),來執行一 項取工作。NAND快閃記憶體可以以相當高的速度(例如: 50ns)自一頁緩衝器鎖存(pAGE bUFFEr LATCH)中讀取 資料。 NAND快閃記憶體可利用穿隧(TUNNELING)(例如: 福勒諾德亥門(F〇WLER_N〇RDHEIM)(F-N)穿隧)來執行• 〇NLY memory) (eeprom), flash memory (FLASH MEMORY) (for example: FLASh ERASE MEMORY (EEPROM), and FERRO-ELECTRIC MEMORY). Sexual memory still does not lose data when power disappears, but usually does not allow random access and is usually slower than VOLATILE MEMORY. We can erase programmable programmable read-only memory by merging (epr〇m) and electronic erasable programmable read-only memory (eepr〇m) to form a flash 1268864 16693pif.doc memory. Flash memory can be NANd or NOR flash memory. In memory, erasing and stylization can be performed by applying different voltages to each flash memory cell. NAND flash memory can include strings (STRING) connected in series (eg, 16 cells). A string can be formed. This string can include one or more string select transistors (STRING SELECT TRANSISTOR). NAND flash memory can have a relatively small "on," ("0N,") cell current ( Cell CURRENT), and thus a relatively slow sensing time (sensing, TIME) ( For example: 10_25ms). NAND flash memory can be sensed by a single page (PAGE UNIT) (for example: 512 bytes (BYTE)), and simultaneously latch this page unit to a page buffer (PAGE BUFFER) ), to perform a job. NAND flash memory can read data from a page buffer latch (pAGE bUFFEr LATCH) at a fairly high speed (for example: 50ns). NAND flash memory can be worn Tunnel (TUNNELING) (for example: F〇Wold_N〇RDHEIM (FN) tunneling) to perform
# 程式化與/或抹除工作(PROGRAM AND/OR ERASE operation)。程式化工作可包括相當快的將一連串資料 載入頁緩衝器中(例如:50ns),這裡,各個胞(例如:512# PROGRAM AND/OR ERASE operation. Stylized work can include loading a series of data into the page buffer quite quickly (for example: 50ns), where each cell (for example: 512)
位元組)都同時被程式化。抹除工作可能為塊單元(BLOCK UNIT)抹除,在這裡若干頁(例如·· 16K位元組胞的32頁) 會同時被抹除。The bytes are all stylized at the same time. The erase job may be erased for the block unit (BLOCK UNIT), where several pages (for example, 32 pages of 16K bytes) are erased at the same time.
吾人可以以約l〇mV/cm來執行可信賴的福勒諾德亥 門(F-N)穿隧,其結果可降低電力消耗(p〇WER 1267864 16693pif.doc CONSUMPTION)、降低溫度相依(TEMPERATUR DEPENDENCE)、更一致的程式化/抹除工作、與/或更容易 對裝置/電壓定標(DEVICE/VOLTAGE SCALING)。 NAND快閃記憶體程式化工作可利用一閘極(GATE) 與通道(CHANNEL)間的耦合。例如:欲程式化的胞在閘極 與通道間可能具有比不欲被程式化的胞有較大的電壓差 (VOLTAGE DIFFERENCE)。NAND快閃記憶體程式化工 作亦可利用一臨限電壓分佈(THRESHOLD VOLTAGE DISTRIBUTION) ’其一範例就顯示於圖1之中。圖1繪示 為字元線電壓(WORD LINE VOLTAGE) VW0RDLINE(例 如:0¥)、讀取電壓(仙八1)¥〇1^^^)¥隱〇、以及未程 式化(UNPROGRAMMED)(或抹除的)胞與程式化We can perform reliable Fowluo DeHai (FN) tunneling at about l〇mV/cm, which results in reduced power consumption (p〇WER 1267864 16693pif.doc CONSUMPTION) and reduced temperature dependence (TEMPERATUR DEPENDENCE) More consistent stylization/erase work, and/or easier device/voltage calibration (DEVICE/VOLTAGE SCALING). NAND flash memory staging can utilize the coupling between a gate (GATE) and a channel (CHANNEL). For example, a cell to be programmed may have a larger voltage difference (VOLTAGE DIFFERENCE) between the gate and the channel than the cell that is not intended to be programmed. The NAND flash memory program can also utilize a threshold voltage distribution (THRESHOLD VOLTAGE DISTRIBUTION), an example of which is shown in Figure 1. Figure 1 shows the word line voltage (WORD LINE VOLTAGE) VW0RDLINE (for example: 0 ¥), the read voltage (Sin 8) ¥ 〇 1 ^ ^ ^) ¥ concealed, and unprogrammed (UNPROGRAMMED) (or Erased cell and stylization
(PROGRAMMED)胞的胞電壓分佈(CEll VOLTAGE DISTRIBUTION)Vth等之間的關係示意圖。圖i中,χ軸 方向代表儲存胞(STORAGE CELL)的臨限電壓,而γ軸方 向代表處於一明確臨限電壓的胞數量。 傳統上,胞電壓分佈Vth由一增量步進脈衝程式 (^NCREMENT STEP PULSE PR〇GRAM)(ISPP)所控制。增 里步進脈衝程式ISPP的各種範例就顯示於圖2A與圖2B 中。圖2A顯示一先前技術增量步進脈衝程式ispp之範 例,這裡,脈衝寬度(PULSE WIDTH)與振幅(amputude) 都維持相同。如所示的’電壓Vq(例如:18V)施於程式化 週期(programPERI0D)期間内(例如:3〇叫)而另一電壓 Vi(例如· 1.2V)則施於驗證週期(VERIFY pERI〇D)期間内 1267864 16693pif.doc (例如:5ps)。圖2B顯示一先前技術增量步進脈衝程式ispp 之範例,這裡,脈衝寬度仍維持相同,但振幅已改^。如 所示的,電M V〇(例如:15V)施於第一程式化週期期間内(例 如:30网)’並且對每一連續的程式化週期增量(例如:以 0.5V)直到到達最終電壓(FINAL v0LTAGE)Vn(例如:19V) 為止。另一電壓VK例如:1.2V)施於每一驗證週期期間内 (例如:5μδ)。在圖2A與圖2B二者中,總歷時(1〇丁^ DURATION)約為250ps。圖2Β的胞電壓vth變動與週期 •數均小於圖2A的胞電壓Vth變動與週期數是較有為利的。 圖3繪示為一先前技術之過度程式化 - (OVER-pR〇GRAMMING)之問題。如果胞臨限電壓Vth高 於Vread的話,則可能無法適當執行NAND胞字串的正常 e貝取工作。先别技術程序的存在是為了避免增量步進脈衝 程式ISPP期間内的過度程式化情形。 先前技術程序亦使用旗標(FLAG)或其他標誌(MARK) 來表示標準胞程式化工作(NORMAL CELL PROGRAM φ operation)已適當的完成。旗標或其他標誌的使用是由 於NAND快閃記憶體的程式化時間相當長(約為上述的 250μ8)。在這麼長的程式化時間内,可能發生電力中斷 (POWER-OFF)或其他類似的中斷。旗標或其他標誌是用來 確認程式化工作已完成。圖4A繪示為已完成旗標或其他 標誌(例如··確認標誌(CONFIRM MARK))之範例,而圖4B 繪示為未完成標準程式化工作與/或旗標或其他標誌之範 例0 1267864 16693pif.doc 在先前技術程序中,當執行標準胞程式化工作或各種 工作時,會依照工作是否完成來作一決定,並且如果是的 話,則會寫入旗標或是其它標誌。此旗標或是其它標誌可 寫入記憶體一預留胞區域(SPARE CELL REGION)中。 圖5A繪示為一先前技術之標準胞程式化與確認胞程 式化(CONFIRM CELL PROGRAM),以及一先前技術之標 準胞程式化時間(NORMAL CELL PROGRAM TIME)與石^ 認胞程式化時間(CONFIRM CELL PROGRAM TIME)之示 意圖。如所示的,先前技術之標準胞程式化時間與確認月包 矛王式化日守間一者都包括一程式化週期與一驗證週期之循環 (LOOP)。圖5B纟會示為先前技術之標準胞程式化與確認跑 程式化寫入記憶體位置(MEMORY LOCATION)的範例示 意圖。如圖5B中所示,對胞程式化寫入而言: 1頁/ 1程式化時間=512位元組/ 1程式化時間==4k 位元/250ps (200ps-300ps) = 16·4 位元/lps。 對於確認標誌寫入而言: 1位元/ 1程式化時間=1位元/ 250ps = 0·004位元 / lps 〇 從上面所述可了解,確認標誌寫入比胞程式化寫入較 無效率。 【發明内容】 本發明的實施例均是針對具有降低的程式化時間 (REDUCED PROGRAM TIME)的半導體裝置 (SEMICONDUCTOR DEVICE),諸如半導體記憶體裝置 1267864 16693pif.doc (SEMICONDUCTOR MEMORY DEVICE),包括:例如快 閃記憶體。 本發明的實施例均是針對具有降低的程式化時間的程 式化方法(PROGRAMMING METHOD)。 本發明的實施例均是針對具有降低的程式化時間的記 憶體胞陣列(MEMORY CELL ARRAY),諸如非依電性記 憶體胞陣列。 本發明的實施例均是針對具有降低的程式化時間的控 _ 制電路(C0NTR0L CIRCUIT),諸如程式化控制電路 (PROGRAM CONTROL CIRCUIT)。 • 在各實施例中,本發明是針對一種程式化方法,方法 包括··執行記憶體陣列(MEMORY ARRAY)第一區域中賦 予的胞型式(CELL TYPE)較低速率(LOWER-SPEED)之程 式化、確認記憶體陣列第一區域中賦予的胞型式此較低速 率之私式化結果、並且在確認此較低速率之程式化之後, 執行記憶體陣列第二區域中賦予的胞型式較高速 • (HIGHER_SPEED)程式化,這裡,此較高速程式化之初始 程式化電壓(INITIAL PROGRAMMING VOLT AGE)不同於 較低速程式化之初始程式化電壓。 、 、在各實施例中,本發明是針對一種程式化的方法,方 法包括·利用第-程式化方法執行記憶體第一區域中 的胞型式第-程式化、確認此記憶體第一區域中賦予 型式第-程式化之結果、以及當第―程式化結果為正確 時,利用與第-程式化方法不同之第二程式化方法執行此Schematic diagram of the relationship between the cell voltage distribution (CEll VOLTAGE DISTRIBUTION) Vth and the like of (PROGRAMMED) cells. In Figure i, the x-axis direction represents the threshold voltage of the STORAGE CELL, and the γ-axis direction represents the number of cells at a definite threshold voltage. Traditionally, the cell voltage distribution Vth is controlled by an incremental step pulse program (ISPREMENT STEP PULSE PR 〇 GRAM) (ISPP). Various examples of the incremental stepping program ISPP are shown in Figures 2A and 2B. Figure 2A shows an example of a prior art incremental stepping pulse program ispp where the pulse width (PULSE WIDTH) and the amplitude (amputude) remain the same. As shown, 'voltage Vq (for example: 18V) is applied during the programization period (programPERI0D) (for example, 3 squeaking) and another voltage Vi (for example, 1.2V) is applied to the verification period (VERIFY pERI〇D) During the period, 1668864 16693pif.doc (for example: 5ps). Figure 2B shows an example of a prior art incremental stepping pulse program ispp where the pulse width remains the same, but the amplitude has been changed. As shown, the electrical MV〇 (eg, 15V) is applied during the first stylized period (eg, 30 nets)' and increments for each successive stylized period (eg, at 0.5V) until the final The voltage (FINAL v0LTAGE) Vn (for example, 19V). Another voltage VK (e.g., 1.2 V) is applied during each verification period (e.g., 5 μδ). In both Figures 2A and 2B, the total duration (1 DURATION) is about 250 ps. The variation of the cell voltage vth and the period of the graph of Fig. 2 are less than the variation of the cell voltage Vth of Fig. 2A and the number of cycles. Figure 3 illustrates the problem of over-provisioning - (OVER-pR 〇 GRAMMING) of a prior art. If the cell threshold voltage Vth is higher than Vread, the normal e-beat operation of the NAND cell string may not be properly performed. The prior art program exists to avoid excessive stylization during the incremental stepping program ISPP. The prior art program also uses a flag (FLAG) or other flag (MARK) to indicate that the NORMAL CELL PROGRAM φ operation has been properly completed. The use of flags or other flags is due to the relatively long programming time of the NAND flash memory (approximately 250μ8 as described above). During such a long stylized time, a power interruption (POWER-OFF) or other similar interruption may occur. A flag or other flag is used to confirm that the stylization has been completed. 4A is an example of a completed flag or other flag (eg, CONFIRM MARK), and FIG. 4B is an example of an unfinished standard stylized work and/or flag or other flag 0 1267864 16693pif.doc In prior art procedures, when performing standard cell stylization or various tasks, a decision is made based on whether the work is completed, and if so, a flag or other flag is written. This flag or other flag can be written to the memory area (SPARE CELL REGION). FIG. 5A illustrates a prior art standard cell stylization and confirmation cell programming (CONFIRM CELL PROGRAM), and a prior art standard cell programming time (NORMAL CELL PROGRAM TIME) and stone ^ cell programming time (CONFIRM) Schematic of CELL PROGRAM TIME). As shown, the standard cell programming time of the prior art and the validation of the monthly package spears are both a stylized cycle and a cycle of verification cycles (LOOP). Figure 5B is a schematic illustration of a prior art standard cell stylization and validation stylized write memory location (MEMORY LOCATION). As shown in Figure 5B, for programmatic writes: 1 page / 1 programmed time = 512 bytes / 1 programmed time == 4k bits / 250ps (200ps - 300ps) = 16·4 bits Yuan / lps. For the confirmation flag write: 1 bit / 1 stylized time = 1 bit / 250ps = 0 · 004 bits / lps 〇 As can be seen from the above, the confirmation flag is written less than the programmed write effectiveness. SUMMARY OF THE INVENTION Embodiments of the present invention are directed to a semiconductor device (SEMICONDUCTOR DEVICE) having a reduced programming time (REDUCED PROGRAM TIME), such as a semiconductor memory device 1268864 16693 pif. doc (SEMICONDUCTOR MEMORY DEVICE), including: Flash memory. Embodiments of the present invention are directed to a PROGRAMMING METHOD with reduced stylized time. Embodiments of the present invention are directed to a memory cell array (MEMORY CELL ARRAY) having reduced stylized time, such as a non-electrical memory cell array. Embodiments of the present invention are directed to a control circuit (C0NTR0L CIRCUIT) having a reduced program time, such as a PROGRAM CONTROL CIRCUIT. In various embodiments, the present invention is directed to a stylized method comprising: executing a program of a lower rate (LOWER-SPEED) of a cell type (CELL TYPE) assigned in a first region of a memory array (MEMORY ARRAY) And confirming the lower rate privateization result of the cell type given in the first region of the memory array, and after confirming the stylization of the lower rate, performing the cell type given in the second region of the memory array is faster • (HIGHER_SPEED) is stylized, where the higher speed stylized initial programmed voltage (INITIAL PROGRAMMING VOLT AGE) is different from the lower stylized initial programmed voltage. In various embodiments, the present invention is directed to a stylized method comprising: performing a first-stylization of a cell type in a first region of a memory using a first stylized method, and confirming that the first region of the memory is in the first region Give the result of the pattern-stylization, and when the first-stylized result is correct, perform this by using a second stylized method different from the first-stylization method.
12 1267864 16693pif.doc 賦予的胞型式第二程式化,這裡,較高速程式化之初始程 式化電壓不同於較低速程式化之初始程式化電壓。 行此非依電性記憶體胞陣列一第一區域中賦予的胞型式一 較低速度之程式化,確認此第一區域中賦予的胞型式此較 低速度之程式化之結果,並且當此較低速度之程式化之結 果為正確時,執行此非依電性記憶體胞陣列一第二區域中 在各實施例中,本發明是針對一種包含非依電性記憶 體胞陣狀半導體記憶難置,其巾,此非依電性記憶體 胞陣列包含-第-區域與—第二區域與_控制器,用以執12 1267864 16693pif.doc The second programming of the cell type given, where the higher-speed stylized initialized voltage is different from the lower stylized initial programmed voltage. Performing a lower-rate stylization of the cell type given in the first region of the non-electric memory cell array, confirming the stylized result of the lower rate of the cell type given in the first region, and when When the result of the lower speed stylization is correct, the non-electric memory cell array is executed in a second region. In each of the embodiments, the present invention is directed to a non-electric memory cell array semiconductor memory. Difficult to set, the towel, the non-electric memory cell array contains - the first region and the second region with the controller
賦予的胞型式一較高速程式化,在這裡,此較高速程式化 之初始程式化電壓不同於較低速率之程式化之初始程式化 電壓。 在各實施例中,本發明是針對一種包含一非依電性記 憶體胞陣列之半導體記憶體裝置,其中,此非依電性記憶 體胞陣列包含一第一區域與一第二區域,此第一區域包括 多數個記憶體胞字串(MEMORY CELL STRING),這裡, 一字串包括若干個記憶體胞,並且字串中欲程式化的胞數 量小於字串中所有的記憶體胞,並且一程式化胞的臨限電 壓與一 Vread電壓準位無關;以及一第二區域,其包括多 數個記憶體胞字串,這裡字串中所有的記憶體胞均可程式 化0 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉較佳實施例,並配合所附圖式,作詳細說 明如下。 13 1267864 16693pif.doc 【實施方式】 在實施例中,本發明是針對一種以程式化方法寫入旗 標(FLAG)、控制旗標(CONTROL FLAG)、標諸(MARK)、 控制標遠(CONTROL MARK)、或其他控制資訊 (CONTROL INFORMATION)之方法與裝置,其中,此程式 化方法與用來寫入胞資料(CELL DATA)之程式化方法不 同。 在實施例中,本發明是針對一種以程式化方法寫入旗 標、控制旗標、標誌、控制標誌、或其他控制資訊之方法 與裝置,其中,此程式化方法對此旗標、控制旗標、標誌、 控制標諸、、或其他控制資訊而言是更有效率的;以及一種 以程式化方法寫入胞資料之方法與裝置,其中,此程式化 方法對胞資料而言是更有效率的。 在貫施例中,本發明是針對一種以程式化方法寫入旗 標、控制旗標、標誌、控制標誌、或其他控制資訊之方法 與裝置,其中,對於此旗標、控制旗標、標誌、控制標誌、 鲁或其他控制資訊而言,此程式化方法是較快的;以及一種 以程式化方法寫入胞資料之方法與裝置,其中,對胞資料 而言,此程式化方法是較慢的。 、 在貫施例中,本發明是針對一種以程式化方法寫入旗 標、控制旗標、標該、、控制標諸、或其他控制資訊之方法 與裝置,其中,此程式化方法比寫入胞資料之程式化方法 具有更少的程式化電壓脈衝(PROGRAMMING VOLTAC}£ PULSE)。在實施例中,本發明是針對一種以程式化方法寫 14 1267864 16693pif.docThe assigned cell type is a higher speed stylized, where the higher stylized initial stylized voltage is different from the lower rate stylized initial stylized voltage. In various embodiments, the present invention is directed to a semiconductor memory device including a non-electric memory cell array, wherein the non-electric memory cell array includes a first region and a second region. The first area includes a plurality of memory cell strings (MEMORY CELL STRING), where a string includes a plurality of memory cells, and the number of cells to be programmed in the string is smaller than all memory cells in the string, and The threshold voltage of a programmed cell is independent of a Vread voltage level; and a second region includes a plurality of memory cell strings, where all memory cells in the string can be programmed to zero for the present invention. The above and other objects, features and advantages will be apparent from the following description. 13 1267864 16693pif.doc [Embodiment] In the embodiment, the present invention is directed to a programmatic method for writing a flag (FLAG), a control flag (CONTROL FLAG), a flag (MARK), and a control target (CONTROL). MARK), or other methods and apparatus for controlling information (CONTROL INFORMATION), wherein the stylized method is different from the stylized method for writing cell data (CELL DATA). In an embodiment, the present invention is directed to a method and apparatus for writing a flag, a control flag, a flag, a control flag, or other control information in a stylized manner, wherein the stylized method has a flag and a control flag. a more efficient method for marking, marking, controlling, or other control information; and a method and apparatus for writing cellular data in a stylized manner, wherein the stylized method is more efficient. In one embodiment, the present invention is directed to a method and apparatus for writing a flag, control flag, flag, control flag, or other control information in a stylized manner, wherein for this flag, control flag, flag , the control flag, Lu or other control information, the stylization method is faster; and a method and device for writing the cell data in a programmatic manner, wherein the programmatic method is slow. In one embodiment, the present invention is directed to a method and apparatus for writing a flag, a control flag, a flag, a control flag, or other control information in a stylized manner, wherein the stylized method is written The stylized method of incoming data has fewer stylized voltage pulses (PROGRAMMING VOLTAC} £ PULSE). In an embodiment, the invention is directed to a programmatic method of writing 14 1267864 16693pif.doc
入旗標、控制旗標、標誌、控制標誌、或其他控制資訊之 方法與裝置’其中,此程式化方法具有比寫入胞資料之程 式化方法之初始程式化電壓脈衝(INITIAL PROGRAMMING VOLTAGE PULSE)還要高的初始程式 化電壓脈衝。Method and apparatus for flagging, controlling flags, flags, control flags, or other control information 'where the stylized method has an initial programmed voltage pulse (INITIAL PROGRAMMING VOLTAGE PULSE) than a stylized method of writing cell data There is also a high initial stylized voltage pulse.
在實施例中,本發明是針對一種以程式化方法寫入旗 標、控制旗標、標誌、控制標誌、或其他控制資訊之方法 與裝置,其中,此程式化方法具有比寫入胞資料之程式化 方法較高的初始程式化電壓脈衝,以及較少的程式化電壓 脈衝。 '在實施例中,本發明是針對一種在胞陣列之不同區 域,以不同的程式化方法寫入的方法與裝置。 —在實施例中,本發明是針對一種方法與裝置,這裡, 每-程式化方法對儲存於其中的資料的形式而言是更有效 率的。 在實施例中,本發明是針對一種方法與裝置, 胞陣列的某些輯均哺_程式化方法寫心 的其他區域則以較慢的程式化方法寫入。 在實施例中,本發明是針對一種方法與 CYCLE TIME)。在貫施例中,本發日肢針對— 置k裡’胞陣列的某些區域具有較長的程/門 而胞記憶體其他的區域則具有較短的程式週期日寸間 在實施例中,本發明是針對一種方法與裝=間這裡, 1267864 16693pif.doc 在胞陣列的某些區域中’過度程式化是被允許的,而在胞 記憶體其他的區域中則不被允許。 圖6A、圖6B、圖6C繪示為依本發明之實施例,對 旗標、控制旗標、標諸、控制標誌'、或其他控制資訊以及 胞資料,使用不同的程式化方法之示意。如圖6A中所示, 此將胞陣列進行程式化的方法可㈣―相當低的初始電壓 來開始,例如:Vpgml,並且可包含若干增量步進脈衝 (INCREMENT STEP PULSE),例如:如圖6A巾所示的四 增量。 相對的,如圖6B與圖6C中所示,將旗標、控制旗標、 標誌、控制標誌、或其他控制資訊進行程式化的方法,可 以以一相當高的初始電壓作為開始,例如:如圖6β中所 示的Vpgm4,或如圖6C中所示的Vpgm5,並可包括較少 的增量步進脈衝,例如:如圖6B中所示的一增量,或如 囷6C所示中的猴增置。將胞資料進行程式化的方法可被 視為一標準的(normal)(或較慢的(slower))程式化方 气而將旗標、控制旗標、標誌、控制標誌、或其他控制 資Λ進行程式化的方法可被視為一較快(faster)的程式 化方法這疋因為如圖6A到圖6C中所示的,將胞資料進 行程式化的方法具有較長的程式化時間,而將旗標、控制 旗標、標誌、控制標誌、或其他控制資訊進行程式化的方 法則具有較短的程式化時間。 入在一實施例中,圖6A中繪示的程式化方法可視為完 全增量步進脈衝程式(FULL ISPP),而圖6B中繪示的程式 16 1267864 16693pif.doc 化方法可視為部分增量步進脈衝程式(PARTIA]LISPP),而 圖6C中繪示的程式化方法可視為一單擊(〇NE-SH〇T)的 程式化方法。完全增量步進脈衝程式(ISPP)可增長程式化 時間,將胞Vth分散(DISPERSION)予以減少或減至最少, 與/或減少或避免過度程式化。部分增量步進脈衝程式 (ISPP)與單擊程式化方法可縮短程式化時間,增加胞Vth 分散,減少儲存效能,與/或增加可能的過度程式化。在另 一實施例中,部分增量步進脈衝程式(ISPP)與/或單擊程式 ® 化方法可施於胞資料。 圖7A與圖7B繪示為本發明與先前技術之實施例之比 -較圖,這裡,實施例實現一單擊程式化方法。依繪示内容 可很明瞭’如果二者所實現的一樣都為完全增量步進脈衝 程式(ISPP)的話,則標準胞程式化時間可能相同。然而, ,本發1一實施例中,此確認胞程式化時間,並因而整個 程式化、時間。’可能會因使用範例之單擊程式化方法而縮 短’攻裡’單擊之電屢等於在完全增量步進脈衝程式卿 _ 中所施之隶後電壓之電壓。 、六圖8Α與圖8Β %示為依本發明—實施例之—種方法之 二私圖。圖8Α繪示為依本發明一實施例,將胞資料進行 私式化之方法之流裎圖。目8Β繪示為依本發明一實施例, 將旗標、控制旗#、標諸、、控制標諸、、或其他控制資訊進 行程式化之方法之流程圖。 、如圖8Α中所示種將胞資料進行程式化之範例方 法,可包括·於步驟,接收命令(COMMAND),諸如In an embodiment, the present invention is directed to a method and apparatus for writing a flag, control flag, flag, control flag, or other control information in a stylized manner, wherein the stylized method has a higher than written data. The stylized method has a higher initial stylized voltage pulse and fewer stylized voltage pulses. In the embodiment, the present invention is directed to a method and apparatus for writing in different stylized ways in different regions of a cell array. - In an embodiment, the invention is directed to a method and apparatus, where each stylized method is more efficient in terms of the form of the material stored therein. In an embodiment, the present invention is directed to a method and apparatus in which other regions of the cell array are written in a slower stylized manner. In an embodiment, the invention is directed to a method and CYCLE TIME). In the embodiment, the present invention has a longer path/gate for certain regions of the cell array and a shorter program period for the other regions of the cell memory in the embodiment. The present invention is directed to a method and apparatus. Here, 1267864 16693pif.doc is 'over-stylized in certain areas of the cell array, and is not allowed in other areas of the cell memory. 6A, 6B, and 6C are diagrams showing the use of different stylized methods for flags, control flags, targets, control flags, or other control information and cell data, in accordance with an embodiment of the present invention. As shown in FIG. 6A, the method of programming the cell array can start with (4) a relatively low initial voltage, for example: Vpgml, and can include several incremental steps (INCREMENT STEP PULSE), for example: The four increments shown in the 6A towel. In contrast, as shown in Figures 6B and 6C, the method of stylizing flags, control flags, flags, control flags, or other control information can begin with a relatively high initial voltage, such as: Vpgm4 shown in Figure 6β, or Vpgm5 as shown in Figure 6C, and may include fewer incremental stepping pulses, such as an increment as shown in Figure 6B, or as shown in Figure 6C The monkey is added. The method of stylizing cellular data can be viewed as a normal (or slower) stylized party with flags, control flags, flags, control flags, or other control assets. The stylized method can be considered as a faster stylized method. Because the method of staging the cell data has a longer stylized time, as shown in FIGS. 6A to 6C. The method of stylizing flags, control flags, flags, control flags, or other control information has a shorter stylized time. In an embodiment, the stylized method illustrated in FIG. 6A can be regarded as a full incremental step pulse program (FULL ISPP), and the program 16 1267864 16693pif.doc method illustrated in FIG. 6B can be regarded as a partial increment. The stepping pulse program (PARTIA) LISPP), and the stylized method illustrated in Figure 6C can be considered as a one-click (〇NE-SH〇T) stylized method. The Full Incremental Stepping Pulse Program (ISPP) increases the stylized time, reduces or minimizes the Vth dispersion (DISPERSION), and/or reduces or avoids over-staging. Partial incremental stepping (ISPP) and click-to-stylization methods can reduce stylization time, increase cell Vth dispersion, reduce storage performance, and/or increase possible over-programming. In another embodiment, a partial incremental step pulse program (ISPP) and/or a click program can be applied to the cell data. FIG. 7A and FIG. 7B are diagrams showing a comparison between the present invention and the prior art embodiment. Here, the embodiment implements a one-click stylization method. According to the content shown, it can be clear that if the two are implemented as a full incremental step pulse program (ISPP), the standard cell programming time may be the same. However, in the first embodiment of the present invention, this confirms the programmed time of the cell, and thus the entire stylization and time. 'It may be shortened by the use of the example click-to-stylization method. The 'attack' click is equal to the voltage applied to the post-voltage in the fully incremental stepping pulse program _. 6, FIG. 8A and FIG. 8Β are shown as two private diagrams of the method according to the present invention. Figure 8A is a flow diagram of a method of privateizing cell data in accordance with an embodiment of the present invention. The figure 8 is a flow chart of a method for entering a flag, a control flag #, a standard, a control flag, or other control information according to an embodiment of the present invention. An exemplary method of programming cell data as shown in FIG. 8A may include, in steps, receiving a command (COMMAND), such as
17 1267864 16693pif.doc17 1267864 16693pif.doc
順序資料輸入命令(SEQUENTIAL DATA ΙΝί>υτ COMMAND),以及於步驟220,接收位址(ADDRESS) 〇於 步驟230,可載入欲程式化之資料,並且於步驟240,可接 收程式化命令(RPOGRAM COMMAND)。於步驟250,本 方法可以以Vpgml之字元線電壓(WORLD LINE VOLTAGE)執行程式化工作。於步驟260,本方法可執行 驗證工作。於步驟270,若成功的話,則將終止本方法。 若非的話,則流程將進行步驟280,這裡,字元線電壓將 以一 Δν增加,然後到步驟250,以此新的字元線電壓執 行程式化工作。 如圖8Β中所示,將旗標、控制旗標、標誌、控制標 誌、或其他控制資訊進行程式化之範例方法可包括:於步 驟610 ’接收命令’諸如順序資料輪入命令,以及於步驟 620 ’接收位址。於步驟63〇,可載入欲程式化之資料, 且於步驟64G ’可接收程式命令。於步驟㈣,本方法可以 如士Vpgm4之字70線電壓’執行程式化工作。於步驟 辑f可執行驗證工作。於㈣⑽,若成功的話, j將ΐ止^法。料的話,騎程將進行步驟_,這 Δν增加,然後到步請,二 新的子7L線電壓執行程式化工作。 圖9Α到圖9ΕΜ會示為依本發明 更多)不同程式化方法之示意圖。圖再9α= 吏用:(; 圖6Β的組合。圖 α从基本上疋圖6Α與 9A與圖9B二者皆基本上疋圖6A與圖6C的組合。圖 矛王式化步進(PROGRAMMING STEP) 18 1267864 16693pif.doc 來增置。相對的,圖9C與圖9D二者皆以初始電壓(INITIAL VOLTAGE)為基礎來增量。如圖9c中所示,第二程式的 初始電壓可能與來自第一程式的最後電壓相同,並且維持 一常數。在圖9D中,第二程式的初始電壓可能與來自第 一程式的最後電壓不同,並可以以士a或士α表示的範例總 量變動’ ±a或士α可為固定電壓或是以前面的電壓為基礎 的電壓’例如:第一程式的鄰接最後或最後的電壓。 圖10Α到圖1〇d緣示為依本發明一實施例,胞陣列之 示意圖。圖10Α繪示為依本發明一實施例,整個胞陣列之 示意圖,而圖10Β到圖i〇d繪示為依本發明之實施例,在 範例胞陣列區域(EXAMPLE CELL ARRAY REGION)的主 要區域(MAIN REGION)與/或預留區域(SPARE REGION) 中’寫入旗標、控制旗標、標誌、控制標誌、或其他控制 資訊之三範例。 如圖10A中所示,胞陣列可由控制電路(CONTROL CIRCUIT)、讀取/寫入電路(READ/WRITE CIRCUIT)、與/ φ 或X-解碼器(X-DECODER)所控制。此硬體已廣泛的為習 知技藝者所了解。胞陣列可具有二或更多陣列區域 (ARRAY REGION)。圖10A繪示為胞陣列之示意圖,其包 括較低速寫入區域(LOWER SPEED WRITE REGION) 110A與較高速寫入區域(HIGHER SPEED WRITE REGION) 11 OB。 在一實施例中,較低速寫入區域110A可為主要胞儲 存區域(MAIN CELL STORAGE FIELD),並且可以以標準 19 1267864 16693pif.doc ^低速程式化寫人於其巾,可㈣完全增量步進脈衝程 式(ISPP)^^其中,與/或不允許過度程式化。在一實施 例中’車乂冋速寫入區域l1〇B可為預留胞儲存區域(SPARE CELL STORAGE FIELD),並且可以以較快速程式化寫入 於其中,可以以降低的增量步進脈衝程式(聊)寫入於呈 中,可以以單擊程式化寫入其中,與/或允許過度程式化、。 如圖10B中所*,在一實施例中,可將旗標、控制旗 標、標誌、控制標誌、或其他控制資訊(由圖1〇B之陰影部 鼸分來辨認)完全寫入此較低速寫入區域u〇A之中。如圖 10C中所示,在另一實施例中,可將旗標、控制旗標、標 •誌、控制標誌、或其他控制資訊(由圖l〇c之陰影部分來辨 認)完全寫入此較高速寫入區域11〇B之中。如圖l〇D中所 示,在另一實施例中,可將旗標、控制旗標、標誌、控制 標誌、或其他控制資訊(由圖10D之陰影部分來辨認)寫入 連續的較低速寫入區域110A之中。要知道亦可能有其他 的選擇’包括將旗標、控制旗標、標誌、控制標諸、^其 • 他控制資訊寫入連續的較高速寫入區域11(^之中\〆“ 圖11A繪示為依本發明之實施例,一範例NAND快 閃胞陣列(NAND FLASH CELL ARRAY)的主要範圍 (MAIN FIELD)與預留範圍(SPARE FIELD)更加詳細之示 意圖。圖11A繪示為類似於圖i〇A到圖log中所示的主 要範圍區域(MAIN FIELD REGION)與預留範圍區域 (SPARE FIELD REGION)的示意圖。如戶斤示的,圖11 a白勺 NAND快閃胞陣列可由幾個方塊所組成。每_方塊可以容 20 1267864 16693pif.doc 易地以列選擇器(ROW SELECTOR)與行選擇器 (COLLUMN SELECTOR)來獲得。列選擇器可透過字元線 (WORD LINE)(WL),而行選擇器可透過位元線(BIT LINE)(BL)。每一方塊可分成二或更多群組(GROUP),主 要胞區域(MAIN CELL AREA)可供主要儲存(MAIN STORAGE),而預留胞方塊(SPARE CELL BLOCK)則供控 制旗標與或冗餘(REDUNDANCY)之用。程式工作可利用 頁單元來執行,其可為通常與共同字元線(COMMAN 鲁 WORD LINE)連接的胞的單元。 圖11B繪示為依本發明一實施例,寫入一範例NAND ' 快閃胞陣列之流程圖。如步驟10所示,本方法可包括接收 資料與位址;並於步驟30,將字元線(WL)致能。於步驟 50,本方法可包括利用較低速程式,將接收到的資料在主 方塊胞(MAIN BLOCK CELL)中進行程式化,並於步驟 70,利用較高速程式,將位於藉由致能字元線(WL)所選的 胞之處的旗標、控制旗標、標誌、控制標誌、或其他控制 • 資訊進行程式化。於步驟90,字元線(WL)可能改變,並且 流程將字元線(WL)返回步驟30來致能下一字元線。 圖12A與圖12B繪示為依本發明其他實施例,圖 與圖8B更普遍的方法之流程圖。圖12A繪示為一種執行 較低速程式化,然後在已經確認此較低速程式化業已正確 地發明一實施例執行之後,執行較高速程式化之方法 =流,圖。圖12B繪示為一種方法之流程圖,此方法利用 第一程式化方法接收第一資料,並將此資料寫入第_記憶 21 1267864 16693pif.doc 體區域 亚且在弟一程式化方法已經被確認 -實施例正確地執行之後,利用第二程式=本發明 資料,並將此資料寫入第二記憶體區域:;匕方法接收第二 低逹巾解,歸驟12G,財的包括執行較 。於步驟140,此方法可包括檢查此較低速呈 果,例如:蚊此較低速程式化是否正確地 =王執行。於步驟16G,#步驟14G已經確定此較低速 ίΐ化正確地與/或完全執行時,此方法可包括執行較高速 如圖12β中所示,於步驟13〇,在另一 方法可包括接收欲寫人第—記憶體區域中的“例^此 150,此古、土 …〜版匕啄甲的貝枓。於步驟 人第—記情舌1 列如利用第一矛呈式化方法,將此資料寫 定寫入裳二“Μ。於步驟17G,#於步驟15G已經確 法可向;^^憶體區域業已正顧與/或完全執行時,此方 此方ΐ收欲寫人第二記憶體區域之資料。於步驟 第二記細胸:姉⑽,卿寫入 準資圖12Β關叙敘述,第—喊化方法可為標 程式化方標4、控制雜、或其他控财訊之較快 或第―士 / ’第一記憶體區域可為胞陣列之主要方塊,與/ 〆^ ^己、體區域可為胞陣列之預留方塊。 刚^ 示為依本發明—實施例,半導體記憶體裝置 不思圖。如圖13中所示,半導體記憶體裝置1〇〇可 22 1267864 16693pif.doc ,括胞陣列記憶體m與記憶體驅動The sequence data input command (SEQUENTIAL DATA ΙΝ ί gt υ τ COMMAND), and in step 220, the receive address (ADDRESS) 〇 in step 230, the programmatic data can be loaded, and in step 240, the programmatic command can be received (RPOGRAM) COMMAND). In step 250, the method can perform stylization work with a Vpgml word line voltage (WORLD LINE VOLTAGE). At step 260, the method can perform the verification work. At step 270, if successful, the method will be terminated. If not, the flow proceeds to step 280 where the word line voltage will increase by a Δν and then to step 250 to perform the stroke operation with the new word line voltage. As shown in FIG. 8A, an example method of stylizing a flag, a control flag, a flag, a control flag, or other control information may include: receiving a command, such as a sequential data rounding command, in step 610, and in steps 620 'Receive address. In step 63, the data to be programmed can be loaded, and the program command can be received in step 64G'. In step (4), the method can perform stylized work such as the voltage of 70 Vpgm4. In the step series f can perform verification work. In (4) (10), if successful, j will stop the law. If necessary, the ride will proceed to step _, which increases Δν, then proceeds to step, and the new sub 7L line voltage performs stylized work. Figures 9A through 9B are diagrams showing more different stylized methods in accordance with the present invention. Fig. 9α= 吏: (; Figure 6Β combination. Fig. α is basically from Fig. 6Α and 9A and Fig. 9B are basically the combination of Fig. 6A and Fig. 6C. Figurine stepping (PROGRAMMING STEP) 18 1267864 16693pif.doc to add. In contrast, both Figure 9C and Figure 9D are incremented based on the initial voltage (INITIAL VOLTAGE). As shown in Figure 9c, the initial voltage of the second program may be from The final voltage of a program is the same and maintains a constant. In Figure 9D, the initial voltage of the second program may be different from the final voltage from the first program, and may vary by the total amount of the sample represented by ±a or ±. a or ± α may be a fixed voltage or a voltage based on the previous voltage 'eg, the first or last voltage of the first program. FIG. 10A to FIG. FIG. 10A is a schematic diagram of an entire cell array according to an embodiment of the present invention, and FIGS. 10A to 12B are diagrams showing an exemplary cell array region (EXAMPLE CELL ARRAY REGION) according to an embodiment of the present invention. Main area (MAIN REGION) and / or reserved Example of 'writing flags, control flags, flags, control flags, or other control information in the area (SPARE REGION). As shown in Figure 10A, the cell array can be read/written by the control circuit (CONTROL CIRCUIT) Controlled by READ/WRITE CIRCUIT, with /φ or X-DECODER, this hardware is widely known to those skilled in the art. Cell arrays can have two or more array regions ( ARRAY REGION. Figure 10A is a schematic diagram of a cell array including a LOWER SPEED WRITE REGION 110A and a HIGH SPEED WRITE REGION 11 OB. In an embodiment, The lower speed writing area 110A may be a MAIN CELL STORAGE FIELD, and may be programmed in a low-speed stylized version of the standard 19 1267864 16693pif.doc ^, and (4) a fully incremental stepping pulse program (ISPP) In the embodiment, the 'vehicle speed writing area l1〇B can be a SPARE CELL STORAGE FIELD, and can be a faster program. Write in it, can be reduced Incremental stepping pulses (talking) are written in the presentation, can be written into it by click programming, and/or allowed to be over-programmed. As shown in Figure 10B, in one embodiment, the flag can be flagged. The target, control flag, flag, control flag, or other control information (identified by the shadow portion of Figure 1B) is completely written into this lower speed write area u〇A. As shown in FIG. 10C, in another embodiment, the flag, control flag, flag, control flag, or other control information (identified by the shaded portion of FIG. The higher speed is written in the area 11〇B. As shown in FIG. 10D, in another embodiment, flags, control flags, flags, control flags, or other control information (identified by the shaded portion of FIG. 10D) may be written consecutively lower. The speed is written in the area 110A. Be aware that there may be other options as well as including flags, control flags, flags, control flags, and their control information written into successive higher speed write areas 11 (^^\"" Figure 11A A more detailed schematic diagram of a main range (MAIN FIELD) and a reserved range (SPARE FIELD) of an exemplary NAND flash celella array according to an embodiment of the present invention. FIG. 11A is similar to the diagram. i〇A to the main range area (MAIN FIELD REGION) and the reserved area area (SPARE FIELD REGION) shown in the log. As shown in Figure 1, a NAND flash cell array can be several Each block can hold 20 1267864 16693pif.doc Easily obtained by column selector (ROW SELECTOR) and row selector (COLLUMN SELECTOR). Column selector can pass word line (WORD LINE) (WL) The row selector can pass through the BIT LINE (BL). Each square can be divided into two or more groups (GROUP), and the main cell area (MAIN CELL AREA) can be used for main storage (MAIN STORAGE). The SPARE CELL BLOCK is used for control flags and or redundancy. The program operation can be performed by a page unit, which can be a unit of a cell that is usually connected to a common word line (COMMAN WORD LINE). FIG. 11B illustrates an embodiment of the present invention, written A flowchart of an exemplary NAND 'flash cell array. As shown in step 10, the method can include receiving data and an address; and in step 30, enabling the word line (WL). In step 50, the method This may include using a lower speed program to program the received data in the MAIN BLOCK CELL, and in step 70, using a higher speed program, will be located by the enable word line (WL). The selected cell's flag, control flag, flag, control flag, or other control information is programmed. At step 90, the word line (WL) may change and the process returns the word line (WL). Step 30 is to enable the next word line.Figure 12A and Figure 12B are flow diagrams of a more general method of Figure 8B in accordance with other embodiments of the present invention. Figure 12A illustrates a lower speed stylization And then confirmed that this lower speed stylization industry has correctly invented an implementation After the execution of the example, the method of executing the higher speed programming = flow, Fig. 12B is a flow chart of a method for receiving the first data by using the first stylized method, and writing the data to the first memory 21 1267864 16693pif.doc body region and after the stylized method has been confirmed - after the embodiment is correctly executed, the second program = the data of the present invention is used, and the data is written into the second memory region: The second low 逹 解 solution, return to 12G, including the implementation of the financial. In step 140, the method can include checking for the lower speed result, for example, if the mosquito is slower stylized correctly. In step 16G, #Step 14G has determined that this lower speed is correctly and/or fully executed, the method may include performing a higher speed as shown in Figure 12β, in step 13〇, and in another method may include receiving To write in the first-memory area of the "example ^ this 150, this ancient, soil ... ~ version of the armor of the shellfish. In the step of the first - remember tongue 1 column using the first spear presentation method, Write this information into the skirt two "Μ. In step 17G, # in step 15G, it has been determined that the ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ In the second step of the step: 姊 (10), Qing wrote the quasi-capital chart 12 Β narration narrative, the first - shouting method can be the standard stylized standard 4, control miscellaneous, or other financial control faster or the first ― / / The first memory area can be the main block of the cell array, and / / ^ ^ ^, body area can be reserved for the cell array. Just as shown in the present invention - the semiconductor memory device is not considered. As shown in FIG. 13, the semiconductor memory device 1 22 1267864 16693pif.doc, the cell array memory m and the memory drive
如圖1GA到圖1GD中所示胞陣列記憶體 可低速寫人區域11GA與較高速寫入區域 I:。如上所述,幸交低速寫入區域u〇A可為主要胞儲存 靶圍,可以以標準與/或較低速程式化寫入其中、可以以^ 全增量步進脈衝程式(ISPP)寫人其中,與/或不允許過度= 式化三也-如上述的’較高速寫人區域Ugb可為預留胞 儲存範圍’可以以較快速程式化寫人其中,可以以一降低 的增量步進脈衝程式(ISPP)寫入其中,可以以單擊程式化 寫入其中,與/或允許過度程式化。 在一實施例中’記憶體驅動器140可包括作為列控制 用之X-解碼器或列解碼器14卜以及包括作為行控制之用 的Y-解碼器-或行解碼器,其中,此γ_解碼器或行解碼器 包括頁緩衝器(PAGE BUFFER) 142、Υ-閘(Y_gate)143、 與Din/Dout緩衝器(Din/Dout BUFFER)143。半導體記憶體The cell array memory shown in Fig. 1GA to Fig. 1GD can write the human area 11GA and the higher speed writing area I: at a lower speed. As mentioned above, the low-speed write area u〇A can be the main cell storage target, which can be written in standard and/or lower-speed programming, and can be written in full incremental step pulse program (ISPP). Among them, and/or not allowed to over-type 3 also - as described above, 'higher-speed writing area Ugb can be reserved cell storage range' can be written in a faster program, which can be reduced in increments The step pulse program (ISPP) is written to it and can be written to it with a click, and/or allowed to be over-programmed. In one embodiment, the 'memory driver 140 may include an X-decoder or column decoder 14 for column control and a Y-decoder- or row decoder for line control, where γ_ The decoder or row decoder includes a page buffer (PAGE BUFFER) 142, a _-gate (Y_gate) 143, and a Din/Dout buffer (Din/Dout BUFFER) 143. Semiconductor memory
衣置100亦可包括整個控制電路,其包括程式控制ι2〇與 字元線電壓產生器(WORD LINE VOLTAGE GENERATOR) 146以及程式終止電路(Rp〇GRAM FINISHED(P/F) CIRCUIT)145。程式控制 120 包括狀態暫 存為(STATUS REGISTER) ’此狀態暫存器持續追蹤全部的 工作。一範例字元線電壓產生器146在圖14A中有更詳細 的敘述。 圖14A繪示為依本發明一實施例,圖13之字元線電 壓產生為146之示意圖。在實施例中,字元線電壓產生器 23 1267864 16693pif.doc 146可包括訊號控制邏輯(SIGNAL CONTROL LOGIC) 200、振盪器(OSCILLATOR) 210、參考電壓產生器 (REFERENCE VOLTAGE GENERATOR) 220、分壓器 (VOLTAGE DIVIDER) 230 、比較器(COMPARATOR) 240、以及充電幫浦(CHARGE PUMP) 250。如所示的,訊 號控制邏輯200可提供步進訊號(STEP SIGNAL), STEP—CNTL[5 ·· 0]給分壓器230。分壓器230可產生可變 的準位訊號(VARIABLE LEVEL SIGNAL)Vdvd,此準位訊 • 號Vdvd可連同由參考電壓產生器220所供給的參考訊號 (REFERENCE SIGNAL) Vref —起供給比較器240。比較器 - 240比較Vdvd與Vref二電壓,並將比較結果COMP提供 給充電幫浦250作為產生想要的電壓Vpgm之用。然後可 經由X-解碼器141提供此Vpgm給胞陣列記憶體11〇。 圖14B繪示為依本發明一實施例,實現圖μα之分壓 器230之示意圖。如所示的,分壓器230可被實現為具有 電晶體邏輯(TRANSISTOR LOGIC),此電晶體邏輯以訊號 φ 控制邏輯200所提供的步進訊號STEP一CNTL[5 ·· 0]為基 礎,產生增量步進電壓,諸如圖6A到圖6C以及圖9A到 圖9C的Vpgml到Vpgm5等電壓。 圖14C繪示為依本發明一實施例,實現圖14a之比較 器240之示意圖。如所示的,比較器24〇在來自振盪器21〇 的訊號OSC控制之下,將來自分壓器230之電壓Vdvd與 來自參考電壓產生器220之電壓Vref作比較,並輸出比較 訊號COMP給充電幫浦250。The garment 100 can also include the entire control circuit including a program control WORD LINE VOLTAGE GENERATOR 146 and a program termination circuit (Rp 〇 GRAM FINISHED (P/F) CIRCUIT) 145. Program Control 120 includes Status Staging as (STATUS REGISTER)' This status register keeps track of all work. An example word line voltage generator 146 is described in more detail in Figure 14A. Figure 14A is a diagram showing the generation of the word line voltage of Figure 13 in accordance with an embodiment of the present invention. In an embodiment, the word line voltage generator 23 1267864 16693pif.doc 146 may include a SIGNAL CONTROL LOGIC 200, an OSCILLATOR 210, a reference voltage generator (REFERENCE VOLTAGE GENERATOR) 220, and a voltage divider. (VOLTAGE DIVIDER) 230, comparator (COMPARATOR) 240, and charging pump (CHARGE PUMP) 250. As shown, the signal control logic 200 can provide a step signal (STEP SIGNAL), STEP - CNTL [5 · · 0] to the voltage divider 230. The voltage divider 230 can generate a VARIABLE LEVEL SIGNAL Vdvd, which can be supplied to the comparator 240 along with a reference signal (REFERENCE SIGNAL) Vref supplied from the reference voltage generator 220. . The comparator - 240 compares the Vdvd and Vref voltages and supplies the comparison result COMP to the charging pump 250 for generating the desired voltage Vpgm. This Vpgm can then be provided to the cell array memory 11 via the X-decoder 141. Figure 14B is a schematic diagram of a voltage divider 230 of the Figure μ, in accordance with an embodiment of the present invention. As shown, the voltage divider 230 can be implemented to have a transistor logic (TRANSISTOR LOGIC) based on the step signal STEP-CNTL[5 ·· 0] provided by the signal φ control logic 200. An incremental step voltage is generated, such as voltages of Vpgml to Vpgm5 of FIGS. 6A to 6C and FIGS. 9A to 9C. Figure 14C is a schematic diagram of the implementation of the comparator 240 of Figure 14a, in accordance with an embodiment of the present invention. As shown, the comparator 24, under the control of the signal OSC from the oscillator 21, compares the voltage Vdvd from the voltage divider 230 with the voltage Vref from the reference voltage generator 220, and outputs a comparison signal COMP for charging. Pump 250.
24 !267864 16693pif.d〇c 模式:=:=诏繪示為依本發明-實施例,雙程式化 (或較慢‘式工:來=二中f :,巧可以以標準 包括·# 作木舄入軚準胞貧料。如繪示的,這可 入標準標準胞資料、寫人此標準胞㈣之位址、寫 繪示的以及執行標準(或較慢的)程式工作。如所 或其他批41 可載人旗標、控制旗標、標誌、、控制標誌'、 誌、或:他二:丄寫入此旗標、控制旗標、標該'、控制標 誌、制貝就位址,寫入此旗標、控制旗標、標 或其他控制資訊,並執行較快程式工作。 Μ * = 5 Α的範例中’這缸作被分開並且用二個別的 此標準(或較慢的)程式工作_以及較快的程 (奸斗此—安排的好處是在可以個別執行的標準 (次奴k的)程式與較快程式中提供彈性。 來dm中所示的’首切標準(或較慢的)程式工作 貧料。如繪示的,這可包括載入標準胞資料 D)、寫人此標準胞資料的位址(WRITE ADDRESS)、 ^及寫入此標準胞資料(WRITE DATA)。如繪示的,接下 二可載入旗標、控制旗標、標誌、、控制標認、或其他控制 =(LOAD)」寫人此旗標、控制旗標、標諸、、控制標諸、 或八他控制資訊之位址(WRITE ADDRESS),W及寫入此 旗標、控制旗標、標諸、㈣標誌、、或其他控織 rite DATA) 〇 、在圖15Β的範例中,標準(或較慢的)程式與較快的程 弋可用共同命令U〇h/20h)來一起執行(Β〇ΤΗ24 !267864 16693pif.d〇c mode: =:=诏 is shown as according to the invention - an embodiment, double stylized (or slower 'work: come = two f:, can be made by standard include · # The raft enters the quasi-poor material. As shown, this can be entered into the standard standard cell data, the address of the standard cell (4), the written and executed standard (or slower) program. Or other batches of 41 can carry people's flags, control flags, signs, and control signs ', Zhi, or: he two: 丄 write this flag, control flag, mark the ', control mark, the shell is in place Address, write this flag, control flag, standard or other control information, and perform faster program work. Μ * = 5 Α In the example, 'this cylinder is divided and used two separate standards (or slower) Program work _ and faster process (scarf this - the advantage of the arrangement is to provide flexibility in the standard and sub-programs that can be executed individually. The 'cutting standard' shown in dm (or slower) program work poor. As shown, this can include loading standard cell data D), writing the address of this standard cell data (WRITE A DDRESS), ^ and write this standard cell data (WRITE DATA). As shown, the next two can be loaded with flags, control flags, flags, control flags, or other controls = (LOAD) write The flag, control flag, standard, control, or WRITE ADDRESS, and the writing of the flag, control flag, standard, (4) mark, or Other control rite DATA) 〇 In the example in Figure 15Β, the standard (or slower) program and the faster program can be executed together with the common command U〇h/20h) (Β〇ΤΗ
25 1267864 16693pif.doc PROGRAM)。這樣安排的好處是可以縮短整個程式化的時25 1267864 16693pif.doc PROGRAM). The advantage of this arrangement is that it can shorten the entire stylized time.
本發明的實施例可為半導體裝置。本發明的實施例可 為非依電性記憶體。本發明的實施例可為快閃記憶體。本 發明的實施例可為NAND或NOR快閃記憶體。本發明的 實施例可應用於單一準位胞(SINGLE LEVE]L ,/或多重準位胞(MULTILEVEL CELL) (MLC)。本發明的 貫施例可應用於大量儲存應用與/或碼記憶體應用。 本發明的實施例稱旗標、控制旗標、標誌、控制標誌、 或一確認旗標為控制資訊形式的範例,吾人可用與標準資 料不同的寫入方法與/或比標準資料還快的寫入方法來寫 入這些控制資訊形式。 1 本發明之實施例將字元線電壓增量,但習知技藝者都 了解可利肖其他技φ。本發狀實施例將字场電壓增量 四次。習知技藝者較偏好的是,四為一任意數且實際上可 改變而仍在本發明的範圍之中。 在本發明的實施例中,字元線電壓包括程式電壓 (RPOGRAM VOLTAGE)與驗證電壓(νΕ·γ VOLTAGE),但習知技藝者皆知可利用其他電壓。 雖然本發明之實施例都已敘述了相關之範例電壓盘範 例歷時(DURATION),但習知技藝者皆知可更改這些電壓 的每一個(包括先前技術所提及的值)而仍不違背本^明之 範圍與精神。 $ 雖然本發明之實施例都已敘述了相關之確定的電壓, 26 1267864 16693pif.doc 但習知技藝者皆知亦可更改或固定這些電壓的每一個的 值。例如:可以實現增量步進脈衝程式化(Ispp)為具有初 始電壓VL與N程式化步驟(PROGRAMMING STEPs),這 裡,N為整數;並且可以實現其他脈衝程式化為具有初始 電壓VH與Μ程式化步驟,這裡,μ為小於n的整數。再 者,VH可大於、小於、或等於Vl。 在另一實施例中,可以實現增量步進脈衝程式化(ISpp) 為具有初始電壓VL與N程式化步驟,這裡,N為整數, 籲 並且咼速程式化(HIGH-SPEED PROGRAMMING)包含具 有初始電壓VH與Μ程式化步驟的降低的增量步進脈衝程 式化(REDUCED INCREMENT STEP PULSE PROGRAMMING) (RISPP),這裡,Vh>Vl,並且 M 為 i <M<N這樣的整數。再者,vH可大於、小於、或等於 VL。 在其他範例中,高速程式化的初始電壓VH可為固定 的。在其他範例中,高速程式化工作的初始電壓VH需視 Φ 此較低速程式化工作的最後電壓vL而定。 雖然本發明的實施例已敘述為使用邏輯狀態仏001(:: STATE)“低”(“[(^’’碘“高”^扭如^但是習知技藝者 都會了解這些邏輯狀態都是可替換的,而不會背離本發明 的範圍與精神。 雖然本發明的實施例已敘述為包括NM〇s與PM〇s 電晶體,但是習知技藝者都會了解可使用其他任何電路的 實施’而不會背離本發明的範圍與精神。 27 1267864 16693pif.doc 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明’任何熟習此技藝者,在不脫離本發明之精神 和範圍内’當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1繪示為字元線電壓Embodiments of the invention may be semiconductor devices. Embodiments of the invention may be non-electrical memory. Embodiments of the invention may be flash memory. Embodiments of the invention may be NAND or NOR flash memory. Embodiments of the present invention are applicable to a single locating cell (SINGLE LEVE) L, and/or a multi-level cell (MULTILEVEL CELL) (MLC). The embodiments of the present invention can be applied to mass storage applications and/or code memories. The embodiment of the present invention refers to a flag, a control flag, a flag, a control flag, or an acknowledgement flag as an example of a control information form. We can use a different writing method than the standard data and/or faster than the standard data. The writing method is used to write these control information forms. 1 Embodiments of the present invention increase the word line voltage, but those skilled in the art are aware of other techniques. The present embodiment increases the word field voltage. It is preferred that the skilled artisan prefers that four is an arbitrary number and can actually be changed while still being within the scope of the invention. In an embodiment of the invention, the word line voltage includes a program voltage (RPOGRAM). VOLTAGE) and verification voltage (νΕ·γ VOLTAGE), but other voltages are known to those skilled in the art. Although the examples of the present invention have been described with respect to the example voltage panel sample duration (DURATION), the skilled artisan Knowable to change Each of these voltages (including the values mentioned in the prior art) does not depart from the scope and spirit of the present invention. Although the embodiments of the present invention have described the associated determined voltage, 26 1267864 16693pif.doc It is well known to those skilled in the art that the value of each of these voltages can also be changed or fixed. For example, incremental stepping can be implemented (Ispp) with initial voltage VL and N stylization steps (PROGRAMMING STEPs), here, N It is an integer; and other pulses can be implemented to have an initial voltage VH and a Μ stylization step, where μ is an integer less than n. Furthermore, VH can be greater than, less than, or equal to V1. In another embodiment, Incremental stepping pulse stylization (ISpp) can be implemented with initial voltage VL and N stylization steps, where N is an integer, and the HIGH-SPEED PROGRAMMING contains the initial voltage VH and the stylized REDUCED INCREMENT STEP PULSE PROGRAMMING (RISPP), where Vh > Vl, and M is an integer such as i < M < N. Furthermore, vH can In other examples, the high-speed stylized initial voltage VH can be fixed. In other examples, the initial voltage VH of the high-speed stylized operation needs to be regarded as the final of the lower-speed stylized work. The voltage vL is determined. Although the embodiment of the present invention has been described as using the logic state 仏001(:: STATE) "low" ("[(^'' iodine "high" ^ ^ ^ ^ ^ but the skilled artisan will understand these The logic states are all interchangeable without departing from the scope and spirit of the invention. Although the embodiments of the present invention have been described as including NM〇s and PM〇s transistors, those skilled in the art will appreciate that any other circuit implementation can be used without departing from the scope and spirit of the invention. 27 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The scope of protection of the present invention is therefore defined by the scope of the appended claims. [Simple diagram of the figure] Figure 1 shows the word line voltage
Vw〇RD LINE(例如:0V)、讀取 電壓(READ VOLTAGE) VREAD、以及去程式化(或抹除的) 胞與程式化胞的胞電壓分佈Vth等之間的關係示意圖。 圖2A與圖2B繪示為先前技術增量步進脈衝程式 (ISPPs)二範例之不意圖。 圖3繪示為先前技術過度程式化問題之示意圖。 圖4A繪示為成功完成確認標德之範例示意圖,而圖 4B繪示為未成功完成確認標誌之範例示意圖。 圖5A繪示為先前技術標準胞程式化與確認胞程式 化,以及先前技術標準胞程式化時間與確認胞程式化時間 之示意圖。 圖5B繪示為先前技術標準胞程式化與確認胞程式化 寫入記憶體位置的範例示意圖。 圖6A、圖6B、圖6C繪示為依本發明之實施例,對 旗標、控制旗仏、彳示4、控制標諸、或其他控制資訊以及 胞資料,使用不同的進行程式化方法之示意圖。 圖7A與圖7B繪示為本發明實施例與先前技術比較之 不意圖。 圖8A與圖8B綠示為依本發明實施例之方法之流程 28 1267864 16693pif.doc 圖。 圖9A到圖9D繪示為依本發明再一實施例,使用二不 同程式化方法之示意圖。 圖10A到圖1〇D繪示為依本發明一實施例,胞陣列之 示意圖。 圖緣示為依本發明之實施例,各胞陣列區域的主 要欄位與預留攔位更加詳細之示意圖。A schematic diagram of the relationship between Vw〇RD LINE (for example: 0V), read voltage (READ VOLTAGE) VREAD, and deprogrammed (or erased) cells and the cell voltage distribution Vth of the programmed cell. 2A and 2B are schematic illustrations of prior art incremental stepping pulse programs (ISPPs). FIG. 3 is a schematic diagram showing the problem of over-staging in the prior art. FIG. 4A is a schematic diagram showing an example of successfully completing the confirmation flag, and FIG. 4B is a schematic diagram showing an example of not successfully completing the confirmation flag. Figure 5A is a schematic diagram showing prior art standard cell programming and validation cell programming, as well as prior art standard cell programming time and confirming cell programming time. Figure 5B is a diagram showing an example of prior art standard cell programming and acknowledging cell programming memory locations. 6A, 6B, and 6C illustrate different methods for performing a stylization method on a flag, a control flag, a display 4, a control flag, or other control information and cell data according to an embodiment of the present invention. schematic diagram. 7A and 7B are diagrams for comparison with the prior art according to an embodiment of the present invention. 8A and 8B are diagrams showing the flow of a method according to an embodiment of the present invention. 28 1267864 16693pif.doc. 9A-9D are schematic diagrams showing the use of two different stylization methods in accordance with still another embodiment of the present invention. 10A through 1D are schematic views of a cell array in accordance with an embodiment of the present invention. The figure is shown as a more detailed schematic diagram of the main fields and reserved blocks of each cell array region in accordance with an embodiment of the present invention.
圖11B繪不為依本發明一實施例,寫入一 NAND快閃 胞陣列之流程圖。 圖12A與圖12B繪示為依本發明其他實施例,圖8a 與圖8B更普遍的方法之流程圖。 圖13繪不為依本發明一實施例,半導體記憶體裝置之 示意圖。 圖14A繪示為依本發明一實施例,圖13之半導體記 憶體裝置之字元線電壓產生器之示意圖。 σ 圖14Β繪示為依本發明一實施例,圖14Α之字元線帝 壓產生器之分壓器之示意圖。 V % 圖14C繪不為依本發明一實施例,圖14A之字元 壓產生器之比較器之示意圖。 ~ ’雙程式化 圖15A與圖15B繪示為依本發明之實施例 模式工作之二時序圖。 需知這些’是試圖解釋本發明之實施例之方法盘壯 置之-般特性,其都是為了這些實施例之敘述之用。衣 這些圖並非絲定尺寸’並且可能不會很精確的反映^ 29 1267864 16693pif.doc 予的實施例的特性,並且不應被解釋為— 之範圍中各實施例各項值之範圍或特性^或限制本發明 特別的是,各層或區域之相對厚度與位置可 確之故而予以減低或誇大。再者,當層直接組成於參 或基質之上,或組成於其他覆蓋於參考層上之層或圖形^ 上時,層會被認為是組成於其他層或基質的“上面,,。乂 【主要元件符號說明】Figure 11B depicts a flow diagram for writing a NAND flash cell array in accordance with an embodiment of the present invention. 12A and 12B are flow diagrams of a more general method of FIGS. 8a and 8B in accordance with other embodiments of the present invention. Figure 13 is a schematic illustration of a semiconductor memory device in accordance with one embodiment of the present invention. Figure 14A is a schematic diagram of a word line voltage generator of the semiconductor memory device of Figure 13 in accordance with an embodiment of the present invention. σ Figure 14 is a schematic diagram of a voltage divider of the word line voltage generator of Figure 14 in accordance with an embodiment of the present invention. V % Figure 14C is a schematic illustration of a comparator of the word voltage generator of Figure 14A, in accordance with an embodiment of the present invention. ~ 'Double Stylization Figure 15A and Figure 15B show two timing diagrams of mode operation in accordance with an embodiment of the present invention. It is to be understood that these are intended to be illustrative of the general nature of the method of the embodiments of the present invention, which are intended to be illustrative of the embodiments. These figures are not of a sizing size and may not reflect the characteristics of the embodiments of the invention, and should not be construed as a range or characteristic of the values of the various embodiments in the range. The invention is particularly limited in that the relative thickness and position of the layers or regions may be reduced or exaggerated. Furthermore, when the layer is directly formed on the substrate or the substrate, or is formed on other layers or patterns covering the reference layer, the layer is considered to be "on the other layer or matrix". Main component symbol description]
S210、S220、S230、S240、S250、S260、S270、S280、 S610、S620、S630、S640、S650、S660、S670、S680、10、 30、50、70、90、120、140、160、130、150、170、190 : 流程圖步驟S210, S220, S230, S240, S250, S260, S270, S280, S610, S620, S630, S640, S650, S660, S670, S680, 10, 30, 50, 70, 90, 120, 140, 160, 130, 150, 170, 190: Flow chart steps
VwORDLINE :字元線電壓 VREAD :讀取電壓 110A :較低速寫入區域 110B :較高速寫入區域 X-DEC · X-解碼器 100 :半導體記憶體裝置 110 :胞陣列記憶體 120 :程式控制 140 :記憶體驅動器 141 :列解碼器 142 :頁緩衝器 143 : Y-閘 144 : Din/Dout 緩衝器 30 1267864 16693pif.doc 145 :程式終止電路 146 :字元線電壓產生器 200 :訊號控制邏輯 210 :振盪器 220 :參考電壓產生器 230 :分壓器 240 :比較器 250 :充電幫浦VwORDLINE : word line voltage VREAD : read voltage 110A : lower speed write area 110B : higher speed write area X-DEC · X-decoder 100 : semiconductor memory device 110 : cell array memory 120 : program control 140: memory driver 141: column decoder 142: page buffer 143: Y-gate 144: Din/Dout buffer 30 1267864 16693pif.doc 145: program termination circuit 146: word line voltage generator 200: signal control logic 210: Oscillator 220: Reference Voltage Generator 230: Voltage Divider 240: Comparator 250: Charging Pump
Vpgm :字元線電壓 STEP_CNTL[5 ·· 0] ··步進訊號Vpgm: word line voltage STEP_CNTL[5 ·· 0] ··stepping signal
Vref ··參考訊號Vref ··reference signal
Vdvd :準位訊號 31Vdvd: Level signal 31
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KR1020040031883A KR100632940B1 (en) | 2004-05-06 | 2004-05-06 | Non-volatile semiconductor memory device capable of changing program cycle time |
US10/998,987 US7660159B2 (en) | 2004-05-06 | 2004-11-30 | Method and device for programming control information |
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TWI421687B (en) * | 2007-02-09 | 2014-01-01 | Toshiba Kk | Semiconductor memory system includes a plurality of semiconductor memory devices |
TWI457929B (en) * | 2006-09-12 | 2014-10-21 | Sandisk Technologies Inc | Non-volatile memory and method for linear estimation of initial programming voltage |
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SG130988A1 (en) | 2005-09-29 | 2007-04-26 | Trek 2000 Int Ltd | Portable data storage device incorporating multiple flash memory units |
KR100706816B1 (en) * | 2006-03-10 | 2007-04-12 | 삼성전자주식회사 | Nonvolatile memory device and program method thereof capable of improving program speed |
KR100824203B1 (en) * | 2007-04-03 | 2008-04-21 | 주식회사 하이닉스반도체 | Method for programming flash memory device |
KR101397549B1 (en) * | 2007-08-16 | 2014-05-26 | 삼성전자주식회사 | Non-volatile semiconductor memory device and system capable of fast rogramming and read method thereof |
JP5395167B2 (en) * | 2008-06-12 | 2014-01-22 | サンディスク テクノロジィース インコーポレイテッド | Nonvolatile memory and method for correlated multi-pass programming |
KR101798013B1 (en) * | 2010-12-30 | 2017-11-16 | 삼성전자주식회사 | Method of programming a nonvolatile memory device |
JP5777991B2 (en) * | 2011-09-22 | 2015-09-16 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
JP2022040515A (en) | 2020-08-31 | 2022-03-11 | ウィンボンド エレクトロニクス コーポレーション | Flash memory and programming method |
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KR100259972B1 (en) * | 1997-01-21 | 2000-06-15 | 윤종용 | Non-volatile semiconductor memory device with more than two storage states per memory cell |
KR100332950B1 (en) * | 1998-04-10 | 2002-08-21 | 삼성전자 주식회사 | Non-volatile semiconductor memory device with signle-bit and multi-bit modes of operation and method for perporming programming and reading operations therein |
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