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Application filed by Hon Hai Prec Ind Co LtdfiledCriticalHon Hai Prec Ind Co Ltd
Priority to TW94130348ApriorityCriticalpatent/TWI267328B/en
Application grantedgrantedCritical
Publication of TWI267328BpublicationCriticalpatent/TWI267328B/en
Publication of TW200714150ApublicationCriticalpatent/TW200714150A/en
Printing Elements For Providing Electric Connections Between Printed Circuits
(AREA)
Abstract
The invention relates to a printed circuit board having improved vias for improving signal integrity. The printed circuit board includes a first layer, a second layer, a third layer and a via. The via includes a drill hole, a first pad and a second pad. The first pad is arranged at the first layer, and the second pad is arranged at the second layer. The drill hole is transversely defined through the first layer and the second layer. A circular hole is defined in the third layer corresponding to the second pad.
TW94130348A2005-09-052005-09-05Printed circuit board having improved vias
TWI267328B
(en)