TWI267327B - Printed circuit board having improved differential vias - Google Patents

Printed circuit board having improved differential vias

Info

Publication number
TWI267327B
TWI267327B TW94119211A TW94119211A TWI267327B TW I267327 B TWI267327 B TW I267327B TW 94119211 A TW94119211 A TW 94119211A TW 94119211 A TW94119211 A TW 94119211A TW I267327 B TWI267327 B TW I267327B
Authority
TW
Taiwan
Prior art keywords
vias
differential vias
differential
circuit board
printed circuit
Prior art date
Application number
TW94119211A
Other languages
Chinese (zh)
Other versions
TW200644748A (en
Inventor
Yu-Hsu Lin
Shang-Tsang Yeh
Chuan-Bing Li
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94119211A priority Critical patent/TWI267327B/en
Application granted granted Critical
Publication of TWI267327B publication Critical patent/TWI267327B/en
Publication of TW200644748A publication Critical patent/TW200644748A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A printed circuit board has improved differential vias for improving signal transmission characteristic by reducing differential vias crosstalk. The printed circuit board includes a plurality of groups of differential vias, a plurality of signal traces corresponding to the differential vias, and a plurality of layers electrically connected with each other by the signal traces. Each group of differential vias has a first pair of differential vias and a second pair of differential vias. Each of the first and second pairs of differential vias comprises two vias. A line linking the centers of the two vias of the first pair of differential vias is perpendicularly bisected by a line linking the centers of the two vias of the second pair of differential vias.
TW94119211A 2005-06-10 2005-06-10 Printed circuit board having improved differential vias TWI267327B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94119211A TWI267327B (en) 2005-06-10 2005-06-10 Printed circuit board having improved differential vias

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94119211A TWI267327B (en) 2005-06-10 2005-06-10 Printed circuit board having improved differential vias

Publications (2)

Publication Number Publication Date
TWI267327B true TWI267327B (en) 2006-11-21
TW200644748A TW200644748A (en) 2006-12-16

Family

ID=38191830

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94119211A TWI267327B (en) 2005-06-10 2005-06-10 Printed circuit board having improved differential vias

Country Status (1)

Country Link
TW (1) TWI267327B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106385764A (en) * 2016-11-25 2017-02-08 湖南长城银河科技有限公司 Printed circuit board with optimized testing through hole arrangement and testing method thereof
TWI622330B (en) * 2014-12-17 2018-04-21 鴻富錦精密工業（武漢）有限公司 Printed circuit board and electronic device applying the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6034279B2 (en) * 2013-11-29 2016-11-30 京セラ株式会社 Wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622330B (en) * 2014-12-17 2018-04-21 鴻富錦精密工業（武漢）有限公司 Printed circuit board and electronic device applying the same
CN106385764A (en) * 2016-11-25 2017-02-08 湖南长城银河科技有限公司 Printed circuit board with optimized testing through hole arrangement and testing method thereof

Also Published As

Publication number Publication date
TW200644748A (en) 2006-12-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees