TWI266593B - Loop-type heat-dissipating module - Google Patents

Loop-type heat-dissipating module

Info

Publication number
TWI266593B
TWI266593B TW94123157A TW94123157A TWI266593B TW I266593 B TWI266593 B TW I266593B TW 94123157 A TW94123157 A TW 94123157A TW 94123157 A TW94123157 A TW 94123157A TW I266593 B TWI266593 B TW I266593B
Authority
TW
Taiwan
Prior art keywords
loop
module
type heat
dissipating module
evaporator
Prior art date
Application number
TW94123157A
Other languages
Chinese (zh)
Other versions
TW200704351A (en
Inventor
Tay-Jian Liu
Chao-Nien Tung
Chuen-Shu Hou
Chih-Hao Yang
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94123157A priority Critical patent/TWI266593B/en
Application granted granted Critical
Publication of TWI266593B publication Critical patent/TWI266593B/en
Publication of TW200704351A publication Critical patent/TW200704351A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A loop-type heat-dissipating module is disclosed, which includes a heat transfer loop and a fixing cover attached to the loop. The loop includes, in serials, an evaporator, an outgoing duct for transferring vapor, a condenser and an incoming duct for transferring condensate. The cover includes a fixing plate for securing the evaporator of the loop, and an air-guiding member extending from one end of the fixing plate for receiving the condenser of the loop. Thus, all parts of the module are incorporated together to form a thin and compact profile, which can satisfy the cooling requirements of thin-type electronic devices and facilitate the mounting or dismounting of the module to or from the electronic devices.
TW94123157A 2005-07-08 2005-07-08 Loop-type heat-dissipating module TWI266593B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94123157A TWI266593B (en) 2005-07-08 2005-07-08 Loop-type heat-dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94123157A TWI266593B (en) 2005-07-08 2005-07-08 Loop-type heat-dissipating module

Publications (2)

Publication Number Publication Date
TWI266593B true TWI266593B (en) 2006-11-11
TW200704351A TW200704351A (en) 2007-01-16

Family

ID=38191616

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94123157A TWI266593B (en) 2005-07-08 2005-07-08 Loop-type heat-dissipating module

Country Status (1)

Country Link
TW (1) TWI266593B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394030B (en) * 2006-12-22 2013-04-21 Foxconn Tech Co Ltd Thermal module and electronic apparatus incorporating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394030B (en) * 2006-12-22 2013-04-21 Foxconn Tech Co Ltd Thermal module and electronic apparatus incorporating the same

Also Published As

Publication number Publication date
TW200704351A (en) 2007-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees